CN102647166A - Inductance-capacitance module for forming plane EMI (Electric-Magnetic Interference) filter - Google Patents
Inductance-capacitance module for forming plane EMI (Electric-Magnetic Interference) filter Download PDFInfo
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- CN102647166A CN102647166A CN2012101132884A CN201210113288A CN102647166A CN 102647166 A CN102647166 A CN 102647166A CN 2012101132884 A CN2012101132884 A CN 2012101132884A CN 201210113288 A CN201210113288 A CN 201210113288A CN 102647166 A CN102647166 A CN 102647166A
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Abstract
The invention relates to a filter module, in particular to an inductance-capacitance module for forming a plane EMI (Electric-Magnetic Interference) filter. A second common mode integrated LC structure layer is distributed between a leakage sensing layer and a third common mode inductance layer, and is connected with the leakage sensing layer and the third common mode inductance layer by a guide line; and insulation coatings are sprayed on a first common mode integrated LC structure layer and the second common mode integrated LC structure layer. The invention provides the inductance-capacitance module for forming the plane EMI filter, in the structure, a spiral coil is arranged on one surface of a base plate, made of ceramic, and copper is plated on the other whole surface of the base plate for grounding. Compared with an LC unit formed by a PCB (Printed Circuit Board) two surfaces of which are provided with spiral coils, the inductance-capacitance module has the advantages that the influence on the impedance of a common mode capacitor caused by the staggering of the spiral coils in the original structure can be weakened effectively, the symmetry of the impedance of the common mode capacitor is ensured, meanwhile, the grounding impedance is reduced greatly, the processing is simpler, and the effectiveness of the decoupling design is ensured.
Description
Technical field
The present invention relates to a kind of filter module, relate in particular to a kind of LC module that constitutes planar EMI filter.
Background technology
Electromagnetic interface filter is a passive device of effectively blocking the economic and reliable of Conducted Electromagnetic Interference delivering path.Have under the desirable impedance symmetry prerequisite at the hypothesis filter circuit, the common decoupling zero of traditional E MI filter is poor, common-mode filter two parts, studies separately and designs to both then.Actual filter circuit impedance symmetry is difficult to be guaranteed, even the lead-in wire layout of printed circuit board (PCB) is symmetrical fully on how much, the impedance of passive component itself is asymmetric also to be the factor that can not be ignored.Circuit impedance is asymmetric to cause the mutual conversion between poor, the common-mode noise easily, and this makes traditional Decoupling design method lose efficacy, and promptly the actual filter effect of filter does not reach design object.
Summary of the invention
The present invention is directed to above-mentioned deficiency a kind of LC module that constitutes planar EMI filter is provided.
The present invention adopts following technical scheme technical solution problem:
A kind of LC module that constitutes planar EMI filter of the present invention comprises kettle type magnetic core, first differential mode capacitor, the first common mode inductance layer, the second common mode inductance layer, sense drop ply, the 3rd common mode inductance layer, the 4th common mode inductance layer, second differential mode capacitor, gland; Described kettle type magnetic core becomes round recessed shape and circle centre position that projection piece is set; Kettle type magnetic core is upwards placed first differential mode capacitor, the first common mode inductance layer, the second common mode inductance layer, sense drop ply, the 3rd common mode inductance layer, the 4th common mode inductance layer, second differential mode capacitor and gland successively from the bottom and each parts all sprays insulating barrier, links to each other through lead between the above-mentioned parts; Also comprise the integrated LC structure sheaf of first common mode, the integrated LC structure sheaf of second common mode; The integrated LC structure sheaf of described first common mode is arranged between the second common mode inductance layer and the sense drop ply and through lead and the second common mode inductance layer and sense drop ply and links to each other, the integrated LC structure sheaf of second common mode be arranged in feel between drop ply and the 3rd common mode inductance layer and through lead with feel drop ply and the 3rd common mode inductance layer and link to each other; Integrated LC structure sheaf of first common mode and the integrated LC structure sheaf of second common mode all spray insulating barrier.
The LC module of formation planar EMI filter of the present invention, integrated LC structure sheaf of described first common mode or the integrated LC structure sheaf of second common mode comprise helical coil, pcb board, copper sheet; Described pcb board an end face arrange that the helical coil other end arranges copper sheet.
Beneficial effect
The present invention provides a kind of LC module that constitutes planar EMI filter, and this structure is that substrate simultaneously is a helical coil with the pottery, and another side all covers copper and is used for ground connection; Compare by the integrated lc unit that two-sided helical coil pcb board constitutes with tradition; Can effectively weaken the influence of the dislocation of helical coil in the original structure, guarantee the symmetry of common mode capacitance impedance, reduce impedance ground simultaneously greatly the common mode capacitance impedance; Processing becomes simpler, has guaranteed the validity of Decoupling design.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the structural representation of the integrated LC structure sheaf of common mode among Fig. 1;
Fig. 3 A is the integrated lc unit parallel connection of the present invention.
Fig. 3 B is the present invention's parallel connection lc unit equivalence lumped-parameter circuit.
Fig. 4 A original structure has the lc unit profile of " little dislocation ".
Fig. 4 B new construction has " little dislocation " integrated lc unit profile.
Embodiment
Below in conjunction with description of drawings to further explain of the present invention:
As shown in the figure: a kind of LC module that constitutes planar EMI filter comprises kettle type magnetic core 201, the first differential mode capacitors 202; The integrated LC structure sheaf 205 of the first common mode inductance layer, 203, the second common mode inductance layers, 204, the first common mode; Integrated LC structure sheaf 207, the three common mode inductance layers 208 of sense drop ply 206, the second common modes; The 4th common mode inductance layer 209, the second differential mode capacitor 210, gland;
201 one-tenth round recessed shapes of kettle type magnetic core and circle centre position are provided with projection piece; Kettle type magnetic core 201 is upwards placed first differential mode capacitor 202, the first common mode inductance layer 203, the second common mode inductance layer 204, sense drop ply 206, the 3rd common mode inductance layer 208, the 4th common mode inductance layer 209, second differential mode capacitor 210 and gland successively from the bottom and each parts all sprays insulating barrier, links to each other through lead between the above-mentioned parts.
The integrated LC structure sheaf 205 of first common mode is arranged between the second common mode inductance layer 204 and the sense drop ply 206 and through lead and the second common mode inductance layer 204 and sense drop ply 206 and links to each other, the integrated LC structure sheaf 207 of second common mode be arranged in feel between drop ply 206 and the 3rd common mode inductance layer 208 and through lead with feel drop ply 206 and the 3rd common mode inductance layer 208 and link to each other; Integrated LC structure sheaf 205 of first common mode and the integrated LC structure sheaf 207 of second common mode all spray insulating barrier.
Integrated LC structure sheaf 205 of first common mode and the integrated LC structure sheaf 207 of second common mode comprise helical coil 211, pcb board 212, copper sheet 213; Described pcb board 212 an end face arrange that helical coil 211 other ends arrange copper sheet 213.
The present invention provides the integrated LC of new construction basic composition unit as planar EMI filter, and the integrated LC of this new construction comprises ceramic substrate 212, helical coil 211, copper layer 213.Common-mode filter can be realized (Fig. 3 A) through two integrated lc unit parallel connections, as AC and A
1C
1Connect input source, BC and B
1C
1Point connects load, can equivalence be a low pass filter structure (Fig. 3 B).The planar EMI filter of the integrated LC of new construction comprises 201, two differential mode capacitors 202 of a kettle type magnetic core and 203,204,208 and 209, two integrated lc units 205 of new construction of 210, four common mode inductances and 207, one leakage inductance layers 206 (Fig. 1).
The number of turn of the integrated lc unit one deck of new construction coil does
N 1, conductor width does
t 1, pcb board thickness does
d 1, the number of turn of single common mode inductance does
N 2, the magnetic circuit area of kettle type magnetic core does
A e, the length of magnetic path does
l e, magnetic permeability does
μ r
Each layer of integrated EMI filter be about leakage inductance layer symmetry, the coming to the same thing of the right and left.In left-half, two common mode inductance layers are connected with the forward coupling of integrated LC structure and are constituted the common-battery sense, and its size is:
Integrated LC structure layer capacitance is as common mode capacitance:
In the formula,
l 1Total length for integrated LC structure single layer coil lead.
The original integrated lc unit in annular plane that proposes of this seminar is by being made up of two-sided pcb board; The semicircle PCB that the levels planar spiral winding is increased by a plurality of radiuses respectively successively winds the line end to end and constitutes, and actual mismachining tolerance can cause integrated lc unit ceramic substrate both sides helical coil dislocation Δ
l(Fig. 4 A) solves it to the influence of common mode capacitance value through setting up its numerical model, and deviation is:
In the formula,
C Y Be the common mode capacitance value that does not misplace;
Be the common mode capacitance value after the dislocation.
For new construction lc unit (Fig. 4 B)
C Y≈
C 1+
C 2+
C 3+
C 4
Through setting up both numerical models, solve helical coil dislocation Δ
lIt influences the common mode capacitance value; Can know that the coil dislocation is prone to cause common mode capacitance value deviation, the integrated lc unit processing of new construction is simpler, can effectively weaken the influence that the coil dislocation produces; More be prone to realize the symmetry of common mode capacitance impedance, guaranteed the validity of Decoupling design.
Describe an instantiation of the present invention above in detail, but should be appreciated that execution mode of the present invention is not limited in this, this instance only is used for helping to understand the present invention.To the various variation instance that the present invention did, all should be within the scope of the present invention.Scope of patent protection of the present invention should have appending claims to limit.
Claims (2)
1. a LC module that constitutes planar EMI filter comprises kettle type magnetic core (201), first differential mode capacitor (202); The first common mode inductance layer (203), the second common mode inductance layer (204), sense drop ply (206); The 3rd common mode inductance layer (208); The 4th common mode inductance layer (209), second differential mode capacitor (210), gland; Described kettle type magnetic core (201) becomes round recessed shape and circle centre position that projection piece is set; Kettle type magnetic core (201) is upwards placed first differential mode capacitor (202), the first common mode inductance layer (203), the second common mode inductance layer (204), sense drop ply (206), the 3rd common mode inductance layer (208), the 4th common mode inductance layer (209), second differential mode capacitor (210) and gland successively from the bottom and each parts all sprays insulating barrier, links to each other through lead between the above-mentioned parts; It is characterized in that: also comprise the integrated LC structure sheaf of first common mode (205), the integrated LC structure sheaf of second common mode (207); The integrated LC structure sheaf of described first common mode (205) is arranged between the second common mode inductance layer (204) and sense drop ply (206) and through lead and links to each other with the second common mode inductance layer (204) and sense drop ply (206), the integrated LC structure sheaf of second common mode (207) be arranged in feel between drop ply (206) and the 3rd common mode inductance layer (208) and through lead with feel drop ply (206) and the 3rd common mode inductance layer (208) and link to each other; The integrated LC structure sheaf of first common mode (205) all sprays insulating barrier with the integrated LC structure sheaf of second common mode (207).
2. the LC module of formation planar EMI filter according to claim 1; It is characterized in that: the integrated LC structure sheaf of the integrated LC structure sheaf of described first common mode (205) or second common mode (207) comprises helical coil (211); Pcb board (212), copper sheet (213); Described pcb board (212) an end face arrange that helical coil (211) other end arranges copper sheet (213).
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101132884A CN102647166A (en) | 2012-04-18 | 2012-04-18 | Inductance-capacitance module for forming plane EMI (Electric-Magnetic Interference) filter |
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| CN2012101132884A CN102647166A (en) | 2012-04-18 | 2012-04-18 | Inductance-capacitance module for forming plane EMI (Electric-Magnetic Interference) filter |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103780216A (en) * | 2014-01-24 | 2014-05-07 | 南京航空航天大学 | Whole-plane EMI filter integrated structure composed of round-plane PCB coupling inductors |
| CN103986437A (en) * | 2014-05-08 | 2014-08-13 | 南京航空航天大学 | Double-grounded plane EMI filter |
| CN103986436A (en) * | 2014-05-08 | 2014-08-13 | 南京航空航天大学 | Planar EMI filter integrating common mode inductors, differential mode inductors and differential mode capacitors |
| CN108872401A (en) * | 2018-08-27 | 2018-11-23 | 中南大学 | A kind of electromagnetic acoustic shear wave transducer resistant to high temperatures, wear-resisting and preparation method thereof |
| CN110098817A (en) * | 2018-01-29 | 2019-08-06 | 意法半导体(图尔)公司 | Common-mode filter |
| CN117411308A (en) * | 2023-12-13 | 2024-01-16 | 深圳大学 | Hybrid filter circuit structure and hybrid filter planar magnetic integration method |
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| CN1330429A (en) * | 2000-06-26 | 2002-01-09 | 株式会社村田制作所 | Resonator, wave filter, duplexer and communication equipment |
| US20060077646A1 (en) * | 2004-10-11 | 2006-04-13 | Samsung Electro-Mechanics Co., Ltd. | Combined varistor and LC filter device |
| CN101854152A (en) * | 2010-04-30 | 2010-10-06 | 南京航空航天大学 | Planar electromagnetic interference (EMI) filter integration module consisting of circular printed circuit board (PCB) wire turns |
| CN101860337A (en) * | 2010-06-17 | 2010-10-13 | 南京航空航天大学 | EMI filter module based on magnetic integration |
| CN102136828A (en) * | 2010-12-24 | 2011-07-27 | 南京航空航天大学 | Cylinder wall type electromagnetic interference (EMI) filter consisting of spiral flat coil |
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2012
- 2012-04-18 CN CN2012101132884A patent/CN102647166A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1330429A (en) * | 2000-06-26 | 2002-01-09 | 株式会社村田制作所 | Resonator, wave filter, duplexer and communication equipment |
| US20060077646A1 (en) * | 2004-10-11 | 2006-04-13 | Samsung Electro-Mechanics Co., Ltd. | Combined varistor and LC filter device |
| CN101854152A (en) * | 2010-04-30 | 2010-10-06 | 南京航空航天大学 | Planar electromagnetic interference (EMI) filter integration module consisting of circular printed circuit board (PCB) wire turns |
| CN101860337A (en) * | 2010-06-17 | 2010-10-13 | 南京航空航天大学 | EMI filter module based on magnetic integration |
| CN102136828A (en) * | 2010-12-24 | 2011-07-27 | 南京航空航天大学 | Cylinder wall type electromagnetic interference (EMI) filter consisting of spiral flat coil |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103780216A (en) * | 2014-01-24 | 2014-05-07 | 南京航空航天大学 | Whole-plane EMI filter integrated structure composed of round-plane PCB coupling inductors |
| CN103780216B (en) * | 2014-01-24 | 2016-08-31 | 南京航空航天大学 | The whole plane electromagnetic interface filter integrated morphology that a kind of circular flat PCB coupling inductance is constituted |
| CN103986437A (en) * | 2014-05-08 | 2014-08-13 | 南京航空航天大学 | Double-grounded plane EMI filter |
| CN103986436A (en) * | 2014-05-08 | 2014-08-13 | 南京航空航天大学 | Planar EMI filter integrating common mode inductors, differential mode inductors and differential mode capacitors |
| CN103986437B (en) * | 2014-05-08 | 2017-06-13 | 南京航空航天大学 | Double ground plane electromagnetic interface filters |
| CN110098817A (en) * | 2018-01-29 | 2019-08-06 | 意法半导体(图尔)公司 | Common-mode filter |
| CN110098817B (en) * | 2018-01-29 | 2024-05-28 | 意法半导体(图尔)公司 | Common mode filter |
| CN108872401A (en) * | 2018-08-27 | 2018-11-23 | 中南大学 | A kind of electromagnetic acoustic shear wave transducer resistant to high temperatures, wear-resisting and preparation method thereof |
| CN108872401B (en) * | 2018-08-27 | 2023-11-10 | 中南大学 | High-temperature-resistant and wear-resistant electromagnetic ultrasonic transverse wave transducer and manufacturing method thereof |
| CN117411308A (en) * | 2023-12-13 | 2024-01-16 | 深圳大学 | Hybrid filter circuit structure and hybrid filter planar magnetic integration method |
| CN117411308B (en) * | 2023-12-13 | 2024-04-02 | 深圳大学 | Hybrid filter circuit structure and hybrid filter planar magnetic integration method |
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Application publication date: 20120822 |