CN104270111A - Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure - Google Patents

Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure Download PDF

Info

Publication number
CN104270111A
CN104270111A CN201410446509.9A CN201410446509A CN104270111A CN 104270111 A CN104270111 A CN 104270111A CN 201410446509 A CN201410446509 A CN 201410446509A CN 104270111 A CN104270111 A CN 104270111A
Authority
CN
China
Prior art keywords
bus
nickel dam
coil
magnetic core
dielectric constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410446509.9A
Other languages
Chinese (zh)
Inventor
王世山
虞振洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing University of Aeronautics and Astronautics
Delta Electronics Shanghai Co Ltd
Original Assignee
Nanjing University of Aeronautics and Astronautics
Delta Electronics Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing University of Aeronautics and Astronautics, Delta Electronics Shanghai Co Ltd filed Critical Nanjing University of Aeronautics and Astronautics
Priority to CN201410446509.9A priority Critical patent/CN104270111A/en
Publication of CN104270111A publication Critical patent/CN104270111A/en
Pending legal-status Critical Current

Links

Landscapes

  • Filters And Equalizers (AREA)

Abstract

The invention discloses a bus type EMI (Electro-Magnetic Interference) filter having a common-mode inductance enhancing structure. The bus type EMI filter comprises a linear capacitance bus integrated module, a U-shaped magnetic core, an I-shaped magnetic core and a coil, wherein the linear capacitance bus integrated module comprises six layers of nickel, three layers of high-dielectric-constant materials and two layers of copper which are stacked according to a certain sequence, so that a bus and differential-mode and common-mode capacitors are integrated; two magnetic columns of the U-shaped magnetic core are wound with symmetrically-wound coils, and a whole magnetic circuit is enclosed through the I-shaped magnetic core, thereby constructing a common-mode inductor; a differential-mode inductor is constructed by a leakage inductor; and the whole structure sleeves the linear capacitance bus integrated module. Compared with a conventional EMI filter, the bus type EMI filter has the advantages that the EMI filter is combined with the bus, so that space is saved; through an integrated structure, influences of parasitic parameters are reduced; and an EMI filter scheme which can be applied to high power density and has excellent high-frequency performance is provided.

Description

A kind of common mode inductance strengthens the bus type electromagnetic interface filter of structure
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of bus type electromagnetic interface filter.
Background technology
Electromagnetic interface filter is one of effective means suppressing Switching Power Supply Conducted Electromagnetic Interference.Along with improving constantly of power inverter operating frequency and power density, make power inverter towards miniaturized, integrated, high frequency future development, this has higher requirement to the volume of electromagnetic interface filter and performance.Traditional discrete type electromagnetic interface filter inductance, electric capacity are separated, and space availability ratio is lower, parasitic parameter is comparatively large, and high frequency performance is poor, and therefore, the integrated of electromagnetic interface filter becomes following development trend.
(CPES, Center for Power Electronic System) has core status in the research in this field in current American Electric Power electronics research center, represents the main flow direction of power electronics integration field research to a certain extent.CPES once proposed a kind of plane electromagnetic interface filter of module based on rectangle " LC " (LC) integration module, but in rectangle LC integration module, electric current, at wire right angle corner place skewness, have impact on the performance of filter, also causes it not to be suitable for large-power occasions.There has been proposed the plane electromagnetic interface filter of annular LC integration module afterwards, efficiently solve the problem that wire right angle corner place CURRENT DISTRIBUTION is uneven, but in order to provide enough common mode inductances, whole LC integration module is all placed in a tank shape magnetic core, be unfavorable for dispersing of heat, also inapplicable in large-power occasions.In order to adapt to large-power occasions, CPES proposes bus type electromagnetic interface filter bus and electromagnetic interface filter combined, on the basis of bus, by superimposed multilayer material, achieve electric capacity integrated, but due to the linear structure of bus, the equivalence number of turn is 1 circle, common mode inductance is difficult to reach requirement, on this basis, people are had to propose to put multiple magnetic core outside to improve common mode inductance, but, multiple magnetic core can increase bus type electromagnetic interface filter spatial volume on the one hand, on the other hand because the number of turn is 1 circle, put the increasing degree of common mode inductance after magnetic core limited, the power electronic equipment that common mode disturbances is larger is difficult to meet common mode inductance requirement, limit its range of application.
This seminar proposes a kind of novel bus type electromagnetic interface filter on this basis, can be good at integrated common mode inductance, makes bus type electromagnetic interface filter be suitable for more occasion.
Summary of the invention
Technical problem to be solved by this invention is the defect for background technology, provides a kind of bus type electromagnetic interface filter providing larger difference, common mode inductance, can be suitable for power inverter occasion widely.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
Common mode inductance strengthens a bus type electromagnetic interface filter for structure, comprises linear pattern electric capacity bus integration module and wound core inductor module, wherein:
Described wound core inductor module is made up of U-shaped magnetic core, the first coil, the second coil and I type magnetic core, and described first coil, the second coil winding-direction are identical and be enclosed within two magnetic posts of U-shaped magnetic core respectively; Described U-shaped magnetic core and I type magnetic core composition closed magnetic circuit;
A port of described first coil, a port of the second coil are connected with two bus ports of linear pattern electric capacity bus integration module one end respectively; Two bus ports of the described linear pattern electric capacity bus integration module other end and another port of the first coil 103, another port of the second coil form the input/output end port of described bus type electromagnetic interface filter;
The inductance of described wound core inductor module is common mode inductance, leakage inductance is differential mode inductance;
Described wound core inductor module is enclosed within described linear pattern electric capacity bus integration module.
The further prioritization scheme of bus type electromagnetic interface filter of structure is strengthened as a kind of common mode inductance of the present invention, described linear pattern electric capacity bus integration module comprises 11 layer material structures, be respectively from ground floor to eleventh floor: the first nickel dam, the first high dielectric constant material layer, the second nickel dam, the first layers of copper, the 3rd nickel dam, the second high dielectric constant material layer, the 4th nickel dam, the second layers of copper, the 5th nickel dam, third high dielectric constant material layer, the 6th nickel dam, total with the second high dielectric constant material layer of layer 6 for symmetry axis is symmetrical;
Described first layers of copper, the second layers of copper are the bus of ON operation electric current;
Described first nickel dam, the first high dielectric constant material layer, the second nickel dam form common mode capacitance;
Described 5th nickel dam, third high dielectric constant material layer, the 6th nickel dam form common mode capacitance;
Described 3rd nickel dam, the second high dielectric constant material layer, the 4th nickel dam form differential mode capacitor;
Described first nickel dam, the 6th nickel dam operationally ground connection.
Strengthen the further prioritization scheme of bus type electromagnetic interface filter of structure as a kind of common mode inductance of the present invention, each high dielectric constant material layer described adopts ceramic material.
Strengthen the further prioritization scheme of bus type electromagnetic interface filter of structure as a kind of common mode inductance of the present invention, described ceramic material is BaTiO 3or CaCu 3ti 4o 12.
The present invention adopts above technical scheme compared with prior art, has following technique effect:
1. with traditional electromagnetic interface filter and the separated difference of bus, this seminar proposes bus type electromagnetic interface filter electromagnetic interface filter and bus combined, and can reduce volume, improves power density;
2. coiling on overcoat magnetic core, effectively can increase inductance, makes up the defect of linear structure inductance deficiency, can meet the designing requirement of all kinds of power inverter.
Accompanying drawing explanation
Fig. 1 is bus type electromagnetic interface filter Standard figure of the present invention;
Fig. 2 is bus type electromagnetic interface filter cathetus type structural section figure of the present invention;
Fig. 3 is bus type electromagnetic interface filter line graph of the present invention;
Fig. 4 is the circuit diagram of bus type electromagnetic interface filter of the present invention.
In figure, 101 is U-shaped magnetic core, 102 is linear pattern electric capacity bus integration module, 103 is the first coil, 104 is the second coil, 105 is I type magnetic core, 201,203,205,207,209,211 the first to ground the 6th nickel dam is respectively, 202,206,210 the first to third high dielectric constant material layer is respectively, 204 is the first layers of copper, and 208 is the second layers of copper, and 301,302 is two ports of the first coil, 305,306 is two ports of the second coil, and 303,304,307,308 is four ports of linear pattern electric capacity bus integration module.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:
Example as shown in Figure 1, the invention discloses the bus type electromagnetic interface filter that a kind of common mode inductance strengthens structure, comprise linear pattern electric capacity bus integration module 102 and wound core inductor module, wherein, described wound core inductor module is made up of U-shaped magnetic core 101, first coil 103, second coil 104 and I type magnetic core 105, and the first coil 103,104 is around to identical and be enclosed within two magnetic posts of U-shaped magnetic core 101; The inductance of whole wound core inductor module is common mode inductance, leakage inductance is differential mode inductance.
As the sectional view of the sandwich construction of Fig. 2 linear pattern electric capacity bus integration module.Sandwich construction is nickel 201, pottery 202, nickel 203, copper 204, nickel 205, pottery 206, nickel 207, copper 208, nickel 209, pottery 210, nickel 211 from top to bottom.Its median generatrix is copper 204 and copper 208, nickel 201 and nickel 211 ground connection.In order to simplified design, the consistent size of total same material.When high-frequency electromagnetic interference signal and operating current are flowed into by bus, according to kelvin effect, the nickel dam that hf interference current in single bus can be tending towards both sides flows through, again according to proximity effect, the nickel dam that the hf interference current passing into two buses can be tending towards between it flows through, because the resistivity of nickel is greater than copper, high-frequency interferencing signal easierly in nickel dam can be converted into ardent thus is consumed; And low frequency operation electric current is easier flows through from copper, be not easily consumed, thus achieve the effect that operating current is separated with noise current.Owing to there is high dielectric constant ceramic material 202,206 and 210, the electric capacity between two buses is differential mode capacitor, differential mode interference current reflection can be returned source; Electric capacity between bus and edge nickel dam is common mode capacitance, common-mode interference current can be transferred to the earth.
As Fig. 3 be as described in the line graph of bus type electromagnetic interface filter.Wherein bus port 303 and 304 linked by coil port 301 and 305 distribution wire, when total regards a two-port network as, one of them port is 302 and 306 of coil, and another port is bus 307 and 308, and its approximate equivalent circuit ignoring parasitic parameter and electricresistance effect is as Fig. 4.
Described bus type electromagnetic interface filter parameters can be obtained by following formula: suppose that linear pattern electric capacity bus integration module ceramic thickness is d, width is w, and relative dielectric constant is ε r, the net sectional area of magnetic core is A, and equivalent magnetic circuit length is l, and the number of turn of coil is N, and relative permeability is μ r, then poor, common mode capacitance is
C CM 1 = C CM 1 = C DM = ϵ 0 ϵ r wl d
ε in formula 0for dielectric constant of air; Common mode inductance is
L CM 1 = L CM 1 = μ 0 μ r N 2 A l
μ in formula 0for permeability of vacuum.
Describe example of the present invention in detail above, but should be appreciated that embodiments of the present invention are not limited in this, this example only understands the present invention for helping.Various variation instance made for the present invention, all should be within the scope of the present invention.Scope of patent protection of the present invention should have appending claims to limit.

Claims (4)

1. common mode inductance strengthens a bus type electromagnetic interface filter for structure, it is characterized in that, comprises linear pattern electric capacity bus integration module (102) and wound core inductor module, wherein:
Described wound core inductor module is made up of U-shaped magnetic core (101), the first coil (103), the second coil (104) and I type magnetic core (105), and described first coil (103), the second coil (104) are around to identical and be enclosed within two magnetic posts of U-shaped magnetic core (101) respectively; Described U-shaped magnetic core (101) and I type magnetic core (105) composition closed magnetic circuit;
A port (301) of described first coil (103), a port (305) of the second coil (104) are connected with two bus ports (303,304) of linear pattern electric capacity bus integration module (102) one end respectively; Two bus ports (307,308) of described linear pattern electric capacity bus integration module (102) other end and another port (302) of the first coil (103), another port (306) of the second coil (104) form the input/output end port of described bus type electromagnetic interface filter;
The inductance of described wound core inductor module is common mode inductance, leakage inductance is differential mode inductance;
Described wound core inductor module is enclosed within described linear pattern electric capacity bus integration module (102).
2. common mode inductance according to claim 1 strengthens the bus type electromagnetic interface filter of structure, it is characterized in that, described linear pattern electric capacity bus integration module (102) comprises 11 layer material structures, be respectively from ground floor to eleventh floor: the first nickel dam (201), first high dielectric constant material layer (202), second nickel dam (203), first layers of copper (204), 3rd nickel dam (205), second high dielectric constant material layer (206), 4th nickel dam (207), second layers of copper (208), 5th nickel dam (209), third high dielectric constant material layer (210), 6th nickel dam (211), total with the second high dielectric constant material layer (206) of layer 6 for symmetry axis is symmetrical,
The bus that described first layers of copper (204), the second layers of copper (208) are ON operation electric current;
Described first nickel dam (201), the first high dielectric constant material layer (202), the second nickel dam (203) form common mode capacitance;
Described 5th nickel dam (209), third high dielectric constant material layer (210), the 6th nickel dam (211) form common mode capacitance;
Described 3rd nickel dam (205), the second high dielectric constant material layer (206), the 4th nickel dam (207) form differential mode capacitor;
Described first nickel dam (201), the 6th nickel dam (211) operationally ground connection.
3. common mode inductance according to claim 2 strengthens the bus type electromagnetic interface filter of structure, it is characterized in that, each high dielectric constant material layer described adopts ceramic material.
4. common mode inductance according to claim 3 strengthens the bus type electromagnetic interface filter of structure, and it is characterized in that, described ceramic material is BaTiO 3or CaCu 3ti 4o 12.
CN201410446509.9A 2014-09-03 2014-09-03 Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure Pending CN104270111A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410446509.9A CN104270111A (en) 2014-09-03 2014-09-03 Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410446509.9A CN104270111A (en) 2014-09-03 2014-09-03 Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure

Publications (1)

Publication Number Publication Date
CN104270111A true CN104270111A (en) 2015-01-07

Family

ID=52161612

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410446509.9A Pending CN104270111A (en) 2014-09-03 2014-09-03 Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure

Country Status (1)

Country Link
CN (1) CN104270111A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653299A (en) * 2016-11-24 2017-05-10 华为技术有限公司 Filtering inductor and EMC circuit
CN108832868A (en) * 2018-08-29 2018-11-16 北斗航天汽车(北京)有限公司 Electric machine controller integrates busbar and busbar assembly method
US10349549B2 (en) 2016-10-25 2019-07-09 General Electric Company Electrically shielded direct current link busbar
CN111446902A (en) * 2020-04-30 2020-07-24 西安电子科技大学 AC-DC coupling integrated EMI filter for motor driving system
US11757421B2 (en) 2021-09-01 2023-09-12 Ge Aviation Systems Llc Circuit and method for an electrical filter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130049918A1 (en) * 2011-08-25 2013-02-28 Futurewei Technologies, Inc. Common Mode Choke Apparatus and Method
CN103390484A (en) * 2013-07-04 2013-11-13 南京航空航天大学 EMI (Electro-Magnetic Interference) filter
CN103578691A (en) * 2012-07-26 2014-02-12 浙江海利普电子科技有限公司 Choke and electro magnetic interference (EMI) filter circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130049918A1 (en) * 2011-08-25 2013-02-28 Futurewei Technologies, Inc. Common Mode Choke Apparatus and Method
CN103578691A (en) * 2012-07-26 2014-02-12 浙江海利普电子科技有限公司 Choke and electro magnetic interference (EMI) filter circuit
CN103390484A (en) * 2013-07-04 2013-11-13 南京航空航天大学 EMI (Electro-Magnetic Interference) filter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
徐晨琛,王世山: "将工作与噪声电流分离的母线型滤波器单元开发", 《南京航空航天大学学报》 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10349549B2 (en) 2016-10-25 2019-07-09 General Electric Company Electrically shielded direct current link busbar
CN106653299A (en) * 2016-11-24 2017-05-10 华为技术有限公司 Filtering inductor and EMC circuit
CN108832868A (en) * 2018-08-29 2018-11-16 北斗航天汽车(北京)有限公司 Electric machine controller integrates busbar and busbar assembly method
CN111446902A (en) * 2020-04-30 2020-07-24 西安电子科技大学 AC-DC coupling integrated EMI filter for motor driving system
CN111446902B (en) * 2020-04-30 2022-09-06 西安电子科技大学 AC-DC coupling integrated EMI filter for motor driving system
US11757421B2 (en) 2021-09-01 2023-09-12 Ge Aviation Systems Llc Circuit and method for an electrical filter

Similar Documents

Publication Publication Date Title
CN104270111A (en) Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure
CN101854152B (en) Planar electromagnetic interference (EMI) filter integration module consisting of circular printed circuit board (PCB) wire turns
JP5540912B2 (en) Multilayer filter
CN103997311B (en) 3-D full integration EMI filter based on planar coupling inductor
CN102307043B (en) High-performance integrated electromagnetic interference (EMI) filter
CN205666116U (en) High -frequency transformer , high frequency components and parts and communication terminal device
US20190260343A1 (en) Lc filter
KR101408505B1 (en) Common mode filter and manufacturing method thereof
CN101409137A (en) Planar EMI filter
CN102446898A (en) Integrated circuit on-chip inductor structure with multiple substrate shielding layers
CN103413997B (en) Vertical interdigital LTCC band pass filter
CN102738124B (en) Novel fractal pattern grounding shield structure
CN103986436A (en) Planar EMI filter integrating common mode inductors, differential mode inductors and differential mode capacitors
KR102524009B1 (en) Hybrid inductive device
EP2037465A1 (en) Double LC-tank structure
CN102594284B (en) Plane electro-magnetic interference (EMI) filter formed by multi-coil integrated LC unit
CN103065765A (en) Planer Electro Magnetic Interference (EMI) filter based on overlapped interleaved windings
CN202996476U (en) Stacked staggered winding based planar EMI (electro-magnetic interference) filter
CN202996475U (en) Integrated EMI (electro-magnetic interference) filter for improving noise suppression performance by optimizing grounding winding layout
CN104022749A (en) Laminated type EMI filter
CN103236824B (en) Optimize ground connection winding layout to improve the integrated EMI filter of noise suppressed performance
CN103986437B (en) Double ground plane electromagnetic interface filters
JP5578440B2 (en) Differential transmission line
CN115021698A (en) Capacitor and inductor odd and even layer layered stacked resonator
CN209948952U (en) Power supply double-circuit filter

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20150107

RJ01 Rejection of invention patent application after publication