CN103413997B - Vertical interdigital LTCC band pass filter - Google Patents
Vertical interdigital LTCC band pass filter Download PDFInfo
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- CN103413997B CN103413997B CN201310332949.7A CN201310332949A CN103413997B CN 103413997 B CN103413997 B CN 103413997B CN 201310332949 A CN201310332949 A CN 201310332949A CN 103413997 B CN103413997 B CN 103413997B
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Abstract
The invention discloses a kind of vertical interdigital LTCC band pass filter, comprise ceramic substrate, upper surface metallic walls, lower surface metal wall and side metallic walls, five layers of strip line layer and up and down metallic walls two ends co-planar waveguide input/output port.The present invention have band roomy, frequency selectivity good, harmonic responses good, circuit structure is simple, three-dimensional integrated level is high, electromagnetism interference characteristic is excellent, the outstanding advantages such as controllability is good, rate of finished products is high.This product is applicable to communication with radar system, and being particularly useful for has in the electronic system of rigors volume, weight, performance, reliability.
Description
Technical field
The present invention relates to a kind of filter, particularly relate to a kind of vertical interdigital band pass filter based on LTCC.
Background technology
Along with the development of science and technology, in many application such as space flight and aviation or electronic warfare, Medium-bandwidth all can be needed to the band pass filter of large bandwidth (25%-50%), frequency range covers 2-20GHz.Meanwhile, the miniaturization of system to device is had higher requirement, and circuits get is compact, and such as the appearance of LTCC Technology of new manufacturing process well meets this requirement.Plane parallel coupling line microstrip bandpass filter adopts narrow limit to be coupled, although easily make, but area occupied is larger, increasingly mature along with LTCC technique, LTCC technology is utilized to make coupling line can greatly reduce its area occupied to Z dimension (adopting broadside coupled) is integrated, broadside coupled owing to adopting, stiffness of coupling is applicable to more greatly making broadband filter.Vertical interdigital structure is interdigitated compared to plane will have more advantage in overall filter size.
Prior art is compared, and adopts low-temperature co-burning ceramic material and 3 D stereo is integrated and novel coupled line structure unit due to the present invention, and its remarkable advantage is: (1) passband internal loss is low; (2) be with roomy; (3) owing to adopting novel coupled line structure unit, substantially reduce the height of filter, thus volume greatly reduces; (4) owing to adopting closed shielding box structure, anti-electromagnetic interference capability is strong, externally without electromagnetic interference; (5) LTCC technique makes electrical property temperature stability high; (6) circuit realiration structure is simple; (7) electrical property consistency is good, can realize producing in enormous quantities.
Summary of the invention
The object of the present invention is to provide the vertical interdigital band pass filter based on LTCC that high-performance, volume are little, structure is simple, reliability is high, cost is low, easy to use.
The technical scheme realizing the object of the invention is: a kind of vertical interdigital LTCC band pass filter, comprise ceramic substrate, the upper and lower surface of ceramic substrate and side metallic walls, input tap, ground floor resonant element, ground floor ground striplines, second layer resonant element, second layer ground striplines, second layer ground striplines, third layer resonant element, third layer ground striplines, third layer ground striplines, 4th layer of resonant element, 4th layer of ground striplines, 4th layer of ground striplines, export tap, layer 5 resonant element and layer 5 ground striplines and the input of upper and lower surface metallic walls two ends co-planar waveguide, output port.First to the 5th strip line layer is upper and lower symmetrical structure, and square crossing is placed between upper and lower surface metallic walls.Every one deck resonant element one end is unsettled, a termination side metallic walls.
Accompanying drawing explanation
Fig. 1 is the structure chart of vertical interdigital LTCC band pass filter of the present invention.
Fig. 2 is the structural representation of the ground floor strip line layer of vertical interdigital LTCC band pass filter of the present invention.
Fig. 3 is the structural representation of the second layer strip line layer of vertical interdigital LTCC band pass filter of the present invention.
Fig. 4 is the structural representation of the third layer strip line layer of vertical interdigital LTCC band pass filter of the present invention.
Fig. 5 is the three-dimensional full-wave simulation performance curve of vertical interdigital LTCC band pass filter of the present invention.
embodiment:
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Composition graphs 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, the present invention is a kind of vertical interdigital LTCC band pass filter based on LTCC, comprise ceramic substrate S, upper surface metallic walls G1, lower surface metal wall G2, side metallic walls G3, input port P1, output port P2, input tap T1, ground floor resonant element L1, ground floor ground striplines X1, second layer resonant element L2, second layer ground striplines X2, second layer ground striplines X3, third layer resonant element L3, third layer ground striplines X4, third layer ground striplines X5, 4th layer of resonant element L4, 4th layer of ground striplines X6, 4th layer of ground striplines X7, export tap T2, layer 5 resonant element L5 and layer 5 ground striplines X8.First to the 5th strip line layer is upper and lower symmetrical structure, and square crossing is placed between upper and lower surface metallic walls.Every one deck resonant element one end is unsettled, a termination side metallic walls.
Composition graphs 1, Fig. 2, Fig. 3, Fig. 4, the present invention is a vertical interdigital LTCC band pass filter, comprise input tap (T1), ground floor resonant element (L1), ground floor ground striplines (X1), second layer resonant element (L2), second layer ground striplines (X2), second layer ground striplines (X3), third layer resonant element (L3), third layer ground striplines (X4), third layer ground striplines (X5), 4th layer of resonant element (L4), 4th layer of ground striplines (X6), 4th layer of ground striplines (X7), export tap (T2), layer 5 resonant element (L5) and layer 5 ground striplines (X8) all adopt LTCC (LTCC) technique to realize.Ground floor resonant element (L1), second layer resonant element (L2), third layer resonant element (L3), the 4th layer of resonant element (L4) and layer 5 resonant element (L5) adopt distributed constant to realize parallel resonance and adopt coupled modes realization Energy Transfer between layers.
Composition graphs 1, Fig. 2, Fig. 3, Fig. 4, the present invention is a kind of vertical interdigital LTCC band pass filter, ground floor resonant element L1, second layer resonant element L2, third layer resonant element L3, the 4th layer of resonant element L4 and the open end of layer 5 resonant element L5 and the distance of side metallic walls very little, and the length difference of each resonant element is few, thus improves Out-of-band rejection performance.Meanwhile, the length of resonant element and centre frequency are inversely proportional to.Centre frequency can be changed by the length changing resonant element.The distance of tap T1, T2 and earth terminal is t, regulates t value to adjust matched load, thus can regulate return loss.
Composition graphs 1, Fig. 2, Fig. 3, Fig. 4, the present invention is a kind of vertical interdigital LTCC band pass filter, ground floor ground striplines X1, second layer ground striplines X2 and X3, third layer ground striplines X4 and X5, the 4th layer of ground striplines X6 and X7, layer 5 ground striplines X8 have gap respectively and between each layer resonant element, the stiffness of coupling between resonance level can be weakened, reduce filter volume.The stiffness of coupling between resonance level can be controlled by width K1, K2, the K3 adjusting gap.Gap width increase causes the coupling between resonance level to strengthen, and the width of passband is also corresponding to broaden.
Vertical interdigital LTCC band pass filter of the present invention, its operation principle is summarized as follows: the wideband microwave signal of input arrives ground floor resonant element L1 through input port P1, microwave signal in described broadband microwave signal near ground floor resonant element L1 resonance frequency enters and produces resonance (one-tenth Low ESR, signal by), microwave signal near non-ground floor resonant element L1 resonance frequency (becomes high impedance by ground floor resonant element L1 distributed capacitance with distributed inductance ground connection, signal can't pass), realize first order filtering.The signal energy of ground floor by Space Coupling to second layer resonant element L2, microwave signal in described broadband microwave signal near second layer resonant element L2 resonance frequency enters and produces resonance (one-tenth Low ESR, signal by), microwave signal near non-second layer resonant element L2 resonance frequency (becomes high impedance by second layer resonant element L2 distributed capacitance with distributed inductance ground connection, signal can't pass), realize second level filtering.The signal energy of the second layer by Space Coupling to third layer resonant element L3, microwave signal in described broadband microwave signal near third layer resonant element L3 resonance frequency enters and produces resonance (one-tenth Low ESR, signal by), microwave signal near non-third layer resonant element L3 resonance frequency (becomes high impedance by third layer resonant element L3 distributed capacitance with distributed inductance ground connection, signal can't pass), realize third level filtering.The signal energy of third layer by Space Coupling to the 4th layer of resonant element L4, microwave signal in described broadband microwave signal near the 4th layer of resonant element L4 resonance frequency enters and produces resonance (one-tenth Low ESR, signal by), microwave signal near non-4th layer of resonant element L4 resonance frequency (becomes high impedance by the 4th layer of resonant element L4 distributed capacitance with distributed inductance ground connection, signal can't pass), realize fourth stage filtering.The signal energy of four layers by Space Coupling to layer 5 resonant element L5, microwave signal in described broadband microwave signal near layer 5 resonant element L5 resonance frequency enters and produces resonance (one-tenth Low ESR, signal by), microwave signal near non-layer 5 resonant element L5 resonance frequency (becomes high impedance by layer 5 resonant element L5 distributed capacitance with distributed inductance ground connection, signal can't pass), realize level V filtering.Finally export from output port P2, thus realize microwave filtering function.
Vertical interdigital LTCC band pass filter of the present invention is of a size of 4.6mm × 1.85mm × 2.26mm, its performance can be as can be seen from Figure 5, pass band width is 3.8GHz ~ 6.1GHz, logical in-band insertion loss is less than 2.2dB, return loss is better than 15dB, lower sideband suppresses to be better than 40dB, and upper sideband suppresses to be better than 40dB.
Claims (2)
1. a vertical interdigital LTCC band pass filter, is characterized in that: comprise ceramic substrate (S), upper surface metallic walls (G1), lower surface metal wall (G2), side metallic walls (G3), input port (P1), output port (P2), from top to down five layers of parallel strip line layer difference called after first to the 5th strip line layer; Wherein upper surface metallic walls (G1) is the metal level printed at the upper surface of ceramic substrate (S), lower surface metal wall (G2) is the metal level printed at the lower surface of ceramic substrate (S), and side metallic walls (G3) is the metallic walls in the printing of the side of ceramic substrate (S); First to the 5th strip line layer is intermediate layer with third layer is upper and lower symmetrical structure, and square crossing is placed between upper and lower surface metallic walls; First strip line layer forms by inputting tap (T1), ground floor resonant element (L1) and ground striplines (X1); Second strip line layer is made up of second layer resonant element (L2), ground striplines (X2) and ground striplines (X3); 3rd strip line layer is made up of third layer resonant element (L3), ground striplines (X4) and ground striplines (X5); 4th strip line layer is made up of the 4th layer of resonant element (L4), ground striplines (X6) and ground striplines (X7); 5th strip line layer forms by exporting tap (T2), layer 5 resonant element (L5) and ground striplines (X8); Every one deck resonant element one end is unsettled, a termination side metallic walls.
2. vertical interdigital LTCC band pass filter according to claim 1, it is characterized in that: input tap (T1), ground floor resonant element (L1), ground floor ground striplines (X1), second layer resonant element (L2), second layer ground striplines (X2), second layer ground striplines (X3), third layer resonant element (L3), third layer ground striplines (X4), third layer ground striplines (X5), 4th layer of resonant element (L4), 4th layer of ground striplines (X6), 4th layer of ground striplines (X7), export tap (T2), layer 5 resonant element (L5) and layer 5 ground striplines (X8) all adopt LTCC (LTCC) technique to realize, ground floor resonant element (L1), second layer resonant element (L2), third layer resonant element (L3), the 4th layer of resonant element (L4) and layer 5 resonant element (L5) adopt distributed constant to realize parallel resonance and adopt coupled modes realization Energy Transfer between layers.
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| CN201310332949.7A CN103413997B (en) | 2013-08-01 | 2013-08-01 | Vertical interdigital LTCC band pass filter |
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| CN201310332949.7A CN103413997B (en) | 2013-08-01 | 2013-08-01 | Vertical interdigital LTCC band pass filter |
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| CN103413997A CN103413997A (en) | 2013-11-27 |
| CN103413997B true CN103413997B (en) | 2015-11-04 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167576B (en) * | 2014-08-27 | 2016-07-06 | 中国舰船研究设计中心 | A kind of big bandwidth small size periodic unit frequency-selective surfaces structure |
| CN104218280B (en) * | 2014-09-12 | 2016-08-24 | 南京理工大学 | A kind of miniature three-dimensional bimodulus high-performance narrow band filter |
| CN106410334A (en) * | 2015-07-28 | 2017-02-15 | 中兴通讯股份有限公司 | Filter and filtering method |
| CN108768332A (en) * | 2018-06-29 | 2018-11-06 | 广东风华高新科技股份有限公司 | A kind of ceramic filter suitable for 5G communications |
| CN109150130A (en) * | 2018-08-06 | 2019-01-04 | 电子科技大学 | A kind of inductive type bandpass filter |
| CN109743035A (en) * | 2018-12-24 | 2019-05-10 | 瑞声精密制造科技(常州)有限公司 | LTCC bandpass filter |
| CN113922027A (en) * | 2021-11-04 | 2022-01-11 | 苏州市博海元件电子科技有限公司 | High-suppression dielectric filter |
Citations (3)
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| CN102064368A (en) * | 2010-08-12 | 2011-05-18 | 华东交通大学 | LTCC wide-stop band band-pass filter |
| CN102136615A (en) * | 2011-01-10 | 2011-07-27 | 西安交通大学 | LTCC-based miniaturized X-wave band band-pass filter |
| CN102386464A (en) * | 2011-11-03 | 2012-03-21 | 华南理工大学 | Double-frequency band elimination filter |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064368A (en) * | 2010-08-12 | 2011-05-18 | 华东交通大学 | LTCC wide-stop band band-pass filter |
| CN102136615A (en) * | 2011-01-10 | 2011-07-27 | 西安交通大学 | LTCC-based miniaturized X-wave band band-pass filter |
| CN102386464A (en) * | 2011-11-03 | 2012-03-21 | 华南理工大学 | Double-frequency band elimination filter |
Non-Patent Citations (1)
| Title |
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| 微型半集总LTCC蓝牙带通滤波器研究;戴永胜等;《南京理工大学学报》;20130430;全文 * |
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