CN205488435U - Miniature L frequency channel stromatolite broadband band -pass filter - Google Patents
Miniature L frequency channel stromatolite broadband band -pass filter Download PDFInfo
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- CN205488435U CN205488435U CN201521051017.6U CN201521051017U CN205488435U CN 205488435 U CN205488435 U CN 205488435U CN 201521051017 U CN201521051017 U CN 201521051017U CN 205488435 U CN205488435 U CN 205488435U
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Abstract
The utility model relates to a miniature L frequency channel stromatolite broadband band -pass filter, including surface mounting's input port with output port, first ground port, second ground port, the tertiary resonance circuit, first ground plate, second ground plate and the U font trap that input the inductance, export the inductance, constitute by first order resonance circuit, second level resonance circuit and third level resonance circuit. Input port through first perpendicular through -hole with the input inductance links to each other. Output port pass through the perpendicular through -hole of second with the output inductance links to each other. The utility model has the characteristics of small, the reliability is high, simple structure is compact, the yield is high, frequency characteristic is excellent, the out of band rejection degree is high, the processing uniformity is high, can realize mass production.
Description
Technical field
This utility model relates to wave filter technology field, is specifically related to a kind of miniature L frequency range lamination broadband band-pass filter.
Background technology
LTCC (LTCC) technology uses 3-D stacks technique, it is possible to be embedded in ceramic substrate by passive element, it is also possible to active component is mounted on substrate surface and makes passive/active integrated functional module.Three dimensional structure, hierarchical design, integral sintered, provide a kind of reliable and stable, small size, high performance Electronic Packaging form for device.Compared to LC wave filter, cavity body filter, dielectric filter, LTCC wave filter has that volume is little, lightweight, stable performance, concordance high.
The broadband band-pass filter of laminated process designed frequently with lumped parameter resonance circuit in the past, broadside coupled structure, the resonant panel of adjacent level is distributed in upper and lower layer, every grade of resonant panel vertical through hole is connected to ground, form electric capacity, inductance respectively, have for improve Out-of-band rejection degree, be commonly incorporated into trap circuit.Structure as shown in Figure 4 understands, and this broadband band-pass filter is made up of input conductor 2, output conductor 3, resonant panel 4, through hole 5 and floor 1.In regulation, the relative area of bottom crown can change the coupling of adjacent level, thus adjusts bandwidth, but regulation parameter is few, very flexible.In order to obtain bigger electric capacity, inductance, it has to increase area or the length of vertical through hole of resonant panel, make wave filter volume be significantly increased, be unfavorable for the miniaturization of device, the advantage of LTCC laminated process do not given full play of.
The signal end of wave filter guides to top layer and bottom frequently with the mode that side prints, and owing to LTCC wave filter volume is the least, reaches grade, draws tap terminals and only has the several millimeter of zero point especially, and when printing in side, yield rate is low, and product reliability is the highest.
Utility model content
The purpose of this utility model is to provide a kind of miniature L frequency range lamination broadband band-pass filter, this band filter has that volume is little, reliability is high, simple and compact for structure, yield rate is high, frequency characteristic is excellent, Out-of-band rejection degree is high, processing concordance high, can realize producing in enormous quantities.
For achieving the above object, this utility model have employed techniques below scheme:
A kind of miniature L frequency range lamination broadband band-pass filter, including surface-pasted input port and output port, the first ground port, the second ground port, inputs inductance, outputting inductance, the three grades of resonance circuits, the first earth plate, the second earth plate and the U-shaped trap circuit that are made up of first order resonance circuit, second level resonance circuit and third level resonance circuit.Described input port is connected with described input inductance by the first vertical through hole.Described output port is connected with described outputting inductance by the second vertical through hole.
Described first order resonance circuit includes the first resonant element, the first loading capacitance circuit and the first series inductance circuit from up to down set gradually.Described second level resonance circuit includes bottom-up the second resonant element, the second loading capacitance circuit and the second series inductance circuit set gradually.Described third level resonance circuit includes the 3rd resonant element, the 3rd loading condenser network and the 3rd series inductance circuit from up to down set gradually.
Described first resonant element and described 3rd resonant element are symmetrical arranged and are distributed in same layer.Described second resonant element is positioned at described first resonant element and the last layer of described 3rd resonant element.Described first loading capacitance circuit and the described 3rd loads condenser network and is symmetrical arranged and is distributed in same layer.Described U-shaped trap circuit and described first loading capacitance circuit and the described 3rd load condenser network and are positioned at same layer, and described U-shaped trap circuit is connected on described first loading capacitance circuit and the described 3rd and loads between condenser network.The two ends of described U-shaped trap circuit are connected with the second ground port.
Described first resonant element is connected in series with described input inductance.Described first resonant element is connected with described first series inductance circuit by the 3rd vertical through hole.Described first series inductance circuit is connected with described second earth plate by the 4th vertical through hole.Described 3rd resonant element is connected in series with described outputting inductance.Described 3rd resonant element is connected with described 3rd series inductance circuit by the 5th vertical through hole.Described 3rd series inductance circuit is connected with described second earth plate by sextuple clear opening.Described second earth plate is connected with described second ground port.Described second resonant element is connected with described second series inductance circuit by the 7th vertical through hole.Described second series inductance circuit is connected with described first earth plate by the 8th vertical through hole.Described first earth plate is connected with described first ground port.
Further, described first resonant element, the second resonant element and the 3rd resonant element all use stepped impedance strip line (SIR structure) to realize.Described first loading capacitance circuit, the second loading capacitance circuit and the 3rd load condenser network and all use capacity plate antenna to realize.Described first series inductance circuit, the second series inductance circuit, the 3rd series inductance circuit all use snakelike inductance to realize.
Further, conductive material all it is filled with in described first vertical through hole, the second vertical through hole, the 3rd vertical through hole, the 4th vertical through hole, the 5th vertical through hole, sextuple clear opening, the 7th vertical through hole and the 8th vertical through hole.Described conductive material is the combination of any one or more in Ag, Pd, Au, Ag/Pd.
Compared to the prior art, this utility model uses multilamellar LTCC technique and 3 D stereo integrated technology, three grades of resonance circuits are distributed in different layers, every grade of resonance circuit is respectively adopted the snakelike inductance of SIR structures in series (i.e. the resonant element of every grade of resonance circuit and inductive circuit are in series), this can not only realize, in the case of equal dielectric constant, significantly reducing the volume of element；The degree of coupling between resonant element can also be accurately changed by the spacing between the height of the upper and lower resonance circuit of adjustment or SIR structure resonance unit.This utility model can also be used for the design of narrow band filter, by changing area or the length of snakelike inductance coil of loading capacitance circuit, it is possible to be extremely easily achieved the regulation of resonant frequency.Every grade of resonance circuit in this utility model all uses half lump semi structure, and this, while reducing resonance circuit size, can guarantee that the insertion loss that passband is smooth and relatively low.In this utility model, the trap circuit that first order resonance circuit is constituted with third level resonance circuit and U-shaped band wire, attenuation pole can be obtained at nearly passband, obtain the band filter that intermediate zone is precipitous.In this utility model, the signal exit of wave filter described in the utility model is connected with input, output port by vertical through hole, improves the reliability of port.This utility model has that volume is little, reliability is high, simple and compact for structure, yield rate is high, frequency characteristic is excellent, Out-of-band rejection degree is high, processing concordance high, can realize producing in enormous quantities.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model L frequency range lamination broadband band-pass filter；
Fig. 2 is the schematic cross-section of this utility model L frequency range lamination broadband band-pass filter；
Fig. 3 be this utility model L frequency range lamination broadband band-pass filter scattered color parameter (i.e. S parameter, S11 be input reflection coefficient, S21 be forward transmission coefficient) characteristic curve；
Fig. 4 is the structural representation of conventional lamination broadband band-pass filter.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is described further:
A kind of L frequency range lamination broadband band-pass filter as Figure 1-Figure 2, including surface-pasted 50 ohmage input port a1, surface-pasted 50 ohmage output port a2, the first ground port b1, the second ground port b2, input inductance c1, outputting inductance c2, three grades of resonance circuits (s1, s2, s3), the first earth plate e1, the second earth plate e2 and U-shaped trap circuit u.Wherein, 50 ohmage input port a1 use the first vertical through hole d1 to be connected with input inductance c.50 ohmage output port a2 and outputting inductance c2 use the second vertical through hole d2 to be connected.All being filled with conductive material in first vertical through hole and the second vertical through hole, described conductive material is the combination of any one or more in Ag, Pd, Au, Ag/Pd.
Described three grades of resonance circuits include first order resonance circuit s1, second level resonance circuit s2, third level resonance circuit s3.Described first order resonance circuit s1 is made up of the first resonant element s11, the first loading capacitance circuit s12 and the first series inductance circuit s13.Described second level resonance circuit s2 is made up of second level resonant element s21, the second loading capacitance circuit s22 and the second series inductance circuit s23.Described third level resonance circuit s3 is made up of third level resonant element s31, the 3rd loading condenser network s32 and the 3rd series inductance circuit s33.Every grade of resonance circuit all uses half lump semi structure, patterned layer totally three layers, is followed successively by from top to bottom: ground floor resonant element is realized by stepped impedance strip line, second layer loading capacitance circuit is realized by capacity plate antenna, third layer series inductance circuit is realized by snakelike inductance.First order resonance circuit s1 and third level resonance circuit s3 symmetric arrays, on the same layer, second level resonance circuit s2 reversed arrangement and s1, s3 are distributed in adjacent layer in distribution.Patterned layer uses print process, and the material of patterned layer uses the combination of any one or more in conductive material Ag, Pd, Au, Ag/Pd.Each stacking is put, obtaining a laminated body after integral sintered, surface-pasted 50 ohmage input port a1, output port a2, the first ground port b1 and the second ground port b2 all use print process and rear firing technique to be formed, and these ports are by Ag/Pd, the material compositions such as Au, Ni.
Described first resonant element s11 and described 3rd resonant element s31 is symmetrical arranged and is distributed in same layer；Described second resonant element s21 is positioned at described first resonant element s11 and the last layer of described 3rd resonant element s31.Described first loading capacitance circuit s12 and the described 3rd loads condenser network s32 and is symmetrical arranged and is distributed in same layer.Described U-shaped trap circuit u and described first loading capacitance circuit s12 and the described 3rd loads condenser network s32 and is positioned at same layer, and described U-shaped trap circuit u is connected on described first loading capacitance circuit s12 and the described 3rd and loads between condenser network s32.The two ends of described U-shaped trap circuit u are connected with the second ground port b2.
Described first resonant element s11 is connected in series with described input inductance c1.Described first resonant element s11 is connected with described first series inductance circuit s13 by the 3rd vertical through hole d3.Described first series inductance circuit s13 is connected with described second earth plate e2 by the 4th vertical through hole d4.Described 3rd resonant element s31 is connected in series with described outputting inductance c2.Described 3rd resonant element s31 is connected with described 3rd series inductance circuit s33 by the 5th vertical through hole d5.Described 3rd series inductance circuit s33 is connected with described second earth plate e2 by sextuple clear opening d6.Described second earth plate e2 is connected with described second ground port b2.Described second resonant element s21 is connected with described second series inductance circuit s23 by the 7th vertical through hole d7.Described second series inductance circuit s23 is connected with described first earth plate e1 by the 8th vertical through hole d8.Described first earth plate e1 is connected with described first ground port b1.
Described first resonant element s11, the second resonant element s21 and the 3rd resonant element s31 all use stepped impedance strip line to realize.Described first loading capacitance circuit s12, the second loading capacitance circuit s22 and the 3rd load condenser network s32 and all use capacity plate antenna to realize.Described first series inductance circuit s13, the second series inductance circuit s23, the 3rd series inductance circuit s33 all use snakelike inductance to realize.
Conductive material all it is filled with in described first vertical through hole d1, the second vertical through hole d2, the 3rd vertical through hole d3, the 4th vertical through hole d4, the 5th vertical through hole d5, sextuple clear opening d6, the 7th vertical through hole d7 and the 8th vertical through hole d8；Described conductive material is the combination of any one or more in Ag, Pd, Au, Ag/Pd.
L frequency range lamination broadband band-pass filter described in the utility model uses multilamellar LTCC technique to realize, and its low-temperature co-burning ceramic material and plain conductor sinter at a temperature of about 850 DEG C and form, have extreme high reliability and temperature stability.And owing to the structure of L frequency range lamination broadband band-pass filter described in the utility model uses 3 D stereo integrated and multilayer folding structure, it is possible to make the volume of wave filter significantly reduce.L frequency range lamination broadband band-pass filter described in the utility model uses dielectric constant to be 7.8, and dielectric loss angle tangent is the ceramic material of 0.002, and preferably implementing volume is 5.3mm × 2mm × 1.3mm.The performance of L frequency range lamination broadband band-pass filter described in the utility model can be found out from simulation curve Fig. 3, this filter passband is from 1.6Ghz to 2.2Ghz, logical in-band insertion loss is respectively less than 1dB, and Out-of-band rejection is better than-25dB at 0.8Ghz and 3Ghz, can be better than-40dB at 3.1Ghz.
Embodiment described above is only to be described preferred implementation of the present utility model; not scope of the present utility model is defined; on the premise of without departing from this utility model design spirit; various deformation that the technical solution of the utility model is made by those of ordinary skill in the art and improvement, all should fall in the protection domain that this utility model claims determine.
Claims (3)
1. a miniature L frequency range lamination broadband band-pass filter, it is characterised in that: include surface-pasted input port (a1) and output port (a2), the first ground port (b1), the second ground port (b2), input inductance (c1), outputting inductance (c2), the three grades of resonance circuits being made up of first order resonance circuit (s1), second level resonance circuit (s2) and third level resonance circuit (s3), the first earth plate (e1), the second earth plate (e2) and U-shaped trap circuit (u)；Described input port (a1) is connected with described input inductance (c1) by the first vertical through hole (d1)；Described output port (a2) is connected with described outputting inductance (c2) by the second vertical through hole (d2)；
Described first order resonance circuit (s1) includes the first resonant element (s11), the first loading capacitance circuit (s12) and the first series inductance circuit (s13) from up to down set gradually；Described second level resonance circuit (s2) includes bottom-up the second resonant element (s21), the second loading capacitance circuit (s22) and the second series inductance circuit (s23) set gradually；Described third level resonance circuit (s3) includes the 3rd resonant element (s31), the 3rd loading condenser network (s32) and the 3rd series inductance circuit (s33) from up to down set gradually；
Described first resonant element (s11) and described 3rd resonant element (s31) are symmetrical arranged and are distributed in same layer；Described second resonant element (s21) is positioned at described first resonant element (s11) and the last layer of described 3rd resonant element (s31)；Described first loading capacitance circuit (s12) and the described 3rd loads condenser network (s32) and is symmetrical arranged and is distributed in same layer；Described U-shaped trap circuit (u) and described first loading capacitance circuit (s12) and the described 3rd load condenser network (s32) and are positioned at same layer, and described U-shaped trap circuit (u) is connected on described first loading capacitance circuit (s12) and the described 3rd and loads between condenser network (s32)；The two ends of described U-shaped trap circuit (u) are connected with the second ground port (b2)；
Described first resonant element (s11) is connected in series with described input inductance (c1)；Described first resonant element (s11) is connected with described first series inductance circuit (s13) by the 3rd vertical through hole (d3)；Described first series inductance circuit (s13) is connected with described second earth plate (e2) by the 4th vertical through hole (d4)；Described 3rd resonant element (s31) is connected in series with described outputting inductance (c2)；Described 3rd resonant element (s31) is connected with described 3rd series inductance circuit (s33) by the 5th vertical through hole (d5)；Described 3rd series inductance circuit (s33) is connected with described second earth plate (e2) by sextuple clear opening (d6)；Described second earth plate (e2) is connected with described second ground port (b2)；Described second resonant element (s21) is connected with described second series inductance circuit (s23) by the 7th vertical through hole (d7)；Described second series inductance circuit (s23) is connected with described first earth plate (e1) by the 8th vertical through hole (d8)；Described first earth plate (e1) is connected with described first ground port (b1).
One the most according to claim 1 miniature L frequency range lamination broadband band-pass filter, it is characterised in that: described first resonant element (s11), the second resonant element (s21) and the 3rd resonant element (s31) all use stepped impedance strip line to realize；
Described first loading capacitance circuit (s12), the second loading capacitance circuit (s22) and the 3rd load condenser network (s32) and all use capacity plate antenna to realize；
Described first series inductance circuit (s13), the second series inductance circuit (s23), the 3rd series inductance circuit (s33) all use snakelike inductance to realize.
One the most according to claim 1 miniature L frequency range lamination broadband band-pass filter, it is characterised in that: all it is filled with conductive material in described first vertical through hole (d1), the second vertical through hole (d2), the 3rd vertical through hole (d3), the 4th vertical through hole (d4), the 5th vertical through hole (d5), sextuple clear opening (d6), the 7th vertical through hole (d7) and the 8th vertical through hole (d8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051017.6U CN205488435U (en) | 2015-12-16 | 2015-12-16 | Miniature L frequency channel stromatolite broadband band -pass filter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051017.6U CN205488435U (en) | 2015-12-16 | 2015-12-16 | Miniature L frequency channel stromatolite broadband band -pass filter |
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| Publication Number | Publication Date |
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| CN205488435U true CN205488435U (en) | 2016-08-17 |
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| CN201521051017.6U Withdrawn - After Issue CN205488435U (en) | 2015-12-16 | 2015-12-16 | Miniature L frequency channel stromatolite broadband band -pass filter |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552491A (en) * | 2015-12-16 | 2016-05-04 | 中国电子科技集团公司第四十三研究所 | Miniature L-band laminated broadband bandpass filter |
| CN109301407A (en) * | 2018-10-22 | 2019-02-01 | 深圳振华富电子有限公司 | Lamination sheet type bandpass filter |
-
2015
- 2015-12-16 CN CN201521051017.6U patent/CN205488435U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552491A (en) * | 2015-12-16 | 2016-05-04 | 中国电子科技集团公司第四十三研究所 | Miniature L-band laminated broadband bandpass filter |
| CN105552491B (en) * | 2015-12-16 | 2018-04-03 | 中国电子科技集团公司第四十三研究所 | A kind of miniature L frequency ranges lamination broadband band-pass filter |
| CN109301407A (en) * | 2018-10-22 | 2019-02-01 | 深圳振华富电子有限公司 | Lamination sheet type bandpass filter |
| WO2019158130A1 (en) * | 2018-10-22 | 2019-08-22 | 深圳振华富电子有限公司 | Stacked sheet-type bandpass filter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160817 Effective date of abandoning: 20180403 |