CN102394325B - L frequency band LTCC band pass filter - Google Patents
L frequency band LTCC band pass filter Download PDFInfo
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- CN102394325B CN102394325B CN201110181356.6A CN201110181356A CN102394325B CN 102394325 B CN102394325 B CN 102394325B CN 201110181356 A CN201110181356 A CN 201110181356A CN 102394325 B CN102394325 B CN 102394325B
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Abstract
An L frequency band LTCC band pass filter comprises five layers of medium substrates and six layers of metal layers. A bottom layer is a grounding metal layer. A top layer is an input output layer. Over-travel high impedance strip lines of the second and the third layers form an inductor L2 and an inductor L3 which are connected to the input output layer of the first layer through metal through holes of the third layer. Metal discs of a fourth layer and a fifth layer form a capacitor C2 and a capacitor C3. And the capacitor C2 and the capacitor C3 are connected to the inductors of the second and the third layers through the metal through holes of the second layer so as to form a series connection relation. The metal disc of the fifth layer and the grounding metal layer form a capacitor C1. Simultaneously, two stages of high impedance lines of the fourth and the fifth layers are connected with each other through the metal through holes so as to form an inductor L1 and are connected to ground so as to form a grounded inductor. By using the filter, parameter sensitivity of the filter can be reduced; a requirement to a processing technology can be reduced and a finished products rate can be effectively increased.
Description
Technical field
The present invention relates to a kind of band pass filter, particularly a kind of L frequency range LTCC (LTCC) band pass filter.
Background technology
Microwave band-pass filter is the critical component that microwave is penetrated system, along with the design and simulation technology of microwave circuit and the development of technique in recent years, miniaturization demand to radio system is also more and more higher, and the miniaturization of filter stands in the breach especially, how to ensure that the volume that reduces as much as possible filter under certain performance index becomes the major issue that compact radio frequency system need to solve.LTCC technology is the multi-layer ceramics technology that development in recent years is got up, and utilizes this technology can realize the three-dimensional structure that traditional ceramics substrate process cannot be realized.Use LTCC Technology design microwave passive component to there is very large flexibility.How to make full use of the advantage of LTCC technique, by rational deployment, determine the structure of filter.And make design have certain stability, the success rate that still can ensure product within the scope of necessary mismachining tolerance is a key issue of LTCC design of filter.
At home and abroad there is no at present open source literature and report this technology.
Summary of the invention
Technology of the present invention is dealt with problems: overcome the deficiencies in the prior art, a kind of L frequency range LTCC (LTCC) band pass filter is provided, this L frequency band LTCC band pass filter, structure is very compact, reduce the Parameter sensitivity of filter, thereby reduce the requirement to processing technology, effectively improved the rate of finished products of product.
Technical solution of the present invention: a kind of L frequency band LTCC band pass filter, it is characterized in that: described band pass filter is LTCC sandwich construction, formed by five layers of medium substrate (1-5) and six layers of metal level (11-16), wherein the bottom is ground metal layer (16), ground floor medium substrate (1) is top layer, is printed with 50 ohmage microstrip line metal levels as input and output layer, the upper high impedance band line metal level (27) of printing of second layer medium substrate (2) and the upper high impedance band line (28) of printing of the 3rd layer of medium substrate (3) form inductance L 2 and L3 by the metallic vias (21) on second layer medium substrate (2) and the metallic vias (23) on the 3rd layer of medium substrate (3) respectively, L2 is connected to the input 50 ohmage microstrip lines (32) of ground floor medium substrate (1) by the side metallic vias (22) on second layer medium substrate (2) simultaneously, L3 by with second layer medium substrate (2) on symmetrical another side metallic vias (34) of side metallic vias (22) be connected to the output 50 ohmage microstrip lines (33) of ground floor medium substrate (1), the upper metal disc (29) of printing of the 4th layer of medium substrate (4) and the upper metal disc (31) of printing of layer 5 medium substrate (5) form respectively capacitor C 2 and C3, capacitor C 2 and C3 are connected to inductance L 2, L3 by the metallic vias (21) on second layer medium substrate (2), form series relationship, metal disc (31) on layer 5 medium substrate (5) and ground metal layer (16) form capacitor C 1, the upper high impedance band line (30) of printing of the 4th layer of medium substrate (4) is connected by metallic vias (24,26) respectively with the upper high impedance band line (25) of printing of layer 5 medium substrate (5) simultaneously, form inductance L 1, L1 is connected to ground metal layer (16) by the metallic vias (26) on layer 5 medium substrate (5), forms grounded inductor.
The present invention's advantage is compared with prior art:
(1) the present invention is by structure layout type cleverly, make the structure of filter very compact, reduced the Parameter sensitivity of filter simultaneously, thereby reduce the requirement to processing technology, effectively improved the rate of finished products of product, the present invention can be widely applied in Radio-Frequency Wireless Communication system.
(2) C1 of the present invention and C2 share an electric capacity disc, make three parallel-plates form a ground connection shunt capacitance, and a series capacitance, makes structure more compact.
(3) capacitor C 2, the C3 in the present invention do not have grounding path, solved the problem of stray capacitance over the ground of series capacitance.
(4) two transmission zeros of the present invention can independently be controlled, and apply this character and can raise the efficiency largely in design process.This product design thinking is easy to be generalized to the LTCC filter of other frequency ranges, for the design of LTCC filter provides a kind of new design template.
Brief description of the drawings
Fig. 1 is basic circuit diagram of the present invention;
Fig. 2 is the simulation curve of principle of the invention circuit;
Fig. 3 is principle of the invention circuit equivalent circuit 1;
Fig. 4 is principle of the invention circuit equivalent circuit 2;
Fig. 5 is principle of the invention circuit, a simulation result, measured result correlation curve.
Embodiment
As shown in Figure 1, the present invention is the three rank band pass filters with pair of transmission zeros, comprise the LC parallel resonator of two earths, the LC parallel resonator of two series connection is controlled separately respectively a transmission zero, uses this characteristic to increase work efficiency in design process.
The input of the input of filter and capacitor C 1, C2 and inductance L 1, L2, the output head grounding of C1, L1, the output of C2, L2 is connected with the input of C3, L3, and the output of C3, L3 and another are connected with the output of filter to the input of C1, L1.Due to the shunt circuit on series winding branch road, in the time of parallel resonance, the transmission admittance of whole circuit is 0, so two loops form two transmission zeros that can independently control.
Fig. 2 has provided the simulation curve of schematic circuit, and in figure, S11 is return loss plot, and S21 is transmission coefficient curve.As seen from the figure, under the prerequisite that meets same passband, the existence of the outer transmission zero of band can effectively improve the precipitous degree of attenuation outside a channel within the scope of allocated frequency band.
As shown in Figure 3,4, the structure that the present invention realizes Fig. 1 circuit theory is that LTCC sandwich construction is made up of five layers of medium substrate 1-5 and ground metal layer 11-16, a kind of L frequency band LTCC band pass filter, it is characterized in that: described band pass filter is LTCC sandwich construction, be made up of five layers of medium substrate 1,2,3,4,5 and six layers of metal level 11,12,13,14,15,16, wherein the bottom is ground metal layer 16.Ground floor medium substrate 1 is top layer, is printed with input and output 50 ohmage microstrip line metal levels as input and output layer, comprising input 50 ohmage microstrip lines 32 and output 50 ohmage microstrip lines 33.The high impedance band line 28 of printing on the high impedance band line metal level 27 of printing on second layer medium substrate 2 and the 3rd layer of medium substrate 3 forms inductance L 2 and L3 by the metallic vias 23 on the metallic vias 21 on second layer medium substrate 2 and the 3rd layer of medium substrate 3 respectively, by the side metallic vias 22 on second layer medium substrate 2, (this metallic vias in figure extends through the end to L2 simultaneously, in fact also can not extend through the end) be connected to the input 50 ohmage microstrip lines 32 of ground floor medium substrate 1, L3 by with second layer medium substrate 2 on the metallic vias 34 of another side metallic vias 22 symmetries be connected to the output 50 ohmage microstrip lines 33 of ground floor medium substrate 1, the metal disc 31 of printing on the metal disc 29 of printing on the 4th layer of medium substrate 4 and layer 5 medium substrate 5 forms respectively capacitor C 2 and C3, capacitor C 2 and C3 are connected to inductance L 2, L3 by the metallic vias 21 on second layer medium substrate 2, form series relationship, metal disc 31 and ground metal layer 16 on layer 5 medium substrate 5 form capacitor C 1, the high impedance band line 30 of simultaneously printing on the 4th layer of medium substrate 4 is connected by metallic vias 24,26 respectively with the high impedance band line 25 of printing on layer 5 medium substrate 5, form inductance L 1, L1 is connected to ground metal layer 16 by the metallic vias 26 on layer 5 medium substrate 5, forms grounded inductor.
C1 of the present invention and C2 share a metal disc, make three metal disc form a ground connection shunt capacitance, a series capacitance, and this spline structure is more compact.Capacitor C 2, C3 do not have grounding path, have solved the problem of stray capacitance over the ground of series capacitance.So layout can reduce the parasitic capacitance between stray capacitance over the ground and the different electric capacity disc of two series capacitances.The mutual dislocation of arranging of inductance, does not have overlapping region, has reduced the mutual inductance effect between inductance.
Each medium substrate layer material in the present invention uses Ferro A6 type LTCC Ceramic Substrate Material, relative dielectric constant 6.1, and the conduction band thickness after sintering is 0.096mm.It is silver that all metal levels use material, 8 microns of thickness.The impedance of high impedance band line is 100 ohm.Whole filter is of a size of 6mm*9mm*1mm.
Filter center frequency 1.3GHz, bandwidth 240MHz, passband respectively has pair of transmission zeros up and down for improving the selectivity characteristic of filter.In given frequency band range, stopband attenuation is greater than 20dB.By the test that uses the present invention to design the product obtaining to 300, the rate of finished products of product is 100%.
Fig. 5 has provided schematic circuit, a simulation result, measured result correlation curve.Wherein fine line is schematic circuit simulation curve, and dotted line is HFSS all-wave electromagnetic-field simulation curve, and heavy line is measured curve.S11 is return loss plot, and S21 is transmission coefficient curve.As seen from the figure, in given stopband, the attenuation outside a channel of this filter is greater than 25dB, then in given free transmission range, the return loss of filter is greater than 18dB and three kinds of simulation results are very good in consistent manner, has absolutely proved the validity of layout of the present invention.
To sum up, it is little that the present invention has size, and performance is good, compact conformation, and rate of finished products is high, is convenient to the advantage of mass production, can be widely used in wireless radiofrequency system.
Claims (2)
1. a L frequency band LTCC band pass filter, it is characterized in that: described band pass filter is LTCC sandwich construction, by ground floor medium substrate (1), second layer medium substrate (2), the 3rd layer of medium substrate (3), the 4th layer of medium substrate (4), layer 5 medium substrate (5), first layer metal layer (11), second layer metal layer (12), three-layer metal layer (13), the 4th layer of metal level (14), layer 5 metal level (15) and ground metal layer (16) form, wherein the bottom is ground metal layer (16), ground floor medium substrate (1) is top layer, be printed with 50 ohmage microstrip line metal levels as input and output layer, the upper high impedance band line metal level (27) of printing of second layer medium substrate (2) and upper the second high impedance band line (28) printed of the 3rd layer of medium substrate (3) form inductance L 2 and inductance L 3 by the 3rd metallic vias (23) on the first metallic vias (21) on second layer medium substrate (2) and the 3rd layer of medium substrate (3) respectively, inductance L 2 is connected to the input 50 ohmage microstrip lines (32) of ground floor medium substrate (1) by side the second metallic vias (22) on second layer medium substrate (2) simultaneously, inductance L 3 by with second layer medium substrate (2) on symmetrical another side the 6th metallic vias (34) of side the second metallic vias (22) be connected to the output 50 ohmage microstrip lines (33) of ground floor medium substrate (1), upper the first metal disc (29) printed of the 4th layer of medium substrate (4) and upper the second metal disc (31) printed of layer 5 medium substrate (5) form respectively capacitor C 2 and capacitor C 3, by the first metallic vias (21) on second layer medium substrate (2), capacitor C 2 forms in parallel with inductance L 2, capacitor C 3 is in parallel with inductance L 3 formation, and realizes the series relationship of these two unit in parallel by this first metallic vias (21), the second metal disc (31) on layer 5 medium substrate (5) and ground metal layer (16) form capacitor C 1, one end of upper the first high impedance band line (25) printed of layer 5 medium substrate (5) is connected and is formed inductance L 1 by upper the second high impedance band line (30) printed of the 4th metallic vias (24) and the 4th layer of medium substrate (4) simultaneously, the other end is connected to ground metal layer (16) by the 5th metallic vias (26), makes inductance L 1 form grounded inductor.
2. L frequency band LTCC band pass filter according to claim 1, is characterized in that: the impedance of described all high impedance band lines is 100 ohm.
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| CN201110181356.6A CN102394325B (en) | 2011-06-30 | 2011-06-30 | L frequency band LTCC band pass filter |
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| CN201110181356.6A CN102394325B (en) | 2011-06-30 | 2011-06-30 | L frequency band LTCC band pass filter |
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| CN102394325B true CN102394325B (en) | 2014-08-27 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103378387B (en) * | 2013-07-02 | 2015-07-29 | 华南理工大学 | Based on the Wide stop bands LTCC band pass filter of frequency selectivity coupling technique |
| CN103986438A (en) * | 2014-05-23 | 2014-08-13 | 南京理工大学 | Laminated plate type filter |
| CN104409802B (en) * | 2014-09-13 | 2017-03-15 | 南京理工大学 | The self-supported I/Q orthogonal filters of miniature microwave and millimeter wave |
| CN108493529B (en) * | 2018-03-12 | 2019-08-16 | 深圳飞特尔科技有限公司 | Double frequency filter |
| CN108666720B (en) * | 2018-03-27 | 2019-12-10 | 中国电子科技集团公司第五十五研究所 | Miniaturized ultra-wideband common mode noise suppression circuit |
| CN108768332A (en) * | 2018-06-29 | 2018-11-06 | 广东风华高新科技股份有限公司 | A kind of ceramic filter suitable for 5G communications |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2747713Y (en) * | 2004-09-17 | 2005-12-21 | 达方电子股份有限公司 | Band-pass filter |
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| TWI229974B (en) * | 2004-01-07 | 2005-03-21 | Darfon Electronics Corp | Diplexer and multi-layered diplexer |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2747713Y (en) * | 2004-09-17 | 2005-12-21 | 达方电子股份有限公司 | Band-pass filter |
Non-Patent Citations (4)
| Title |
|---|
| 《A Modified Chebyshev Bandpass Filter with Attenuation Poles in the Stopband 》;Jeong-Soo Lim and Dong Chul Park;《IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》;19970630;第45卷(第6期);第898-904页 * |
| Jeong-Soo Lim and Dong Chul Park.《A Modified Chebyshev Bandpass Filter with Attenuation Poles in the Stopband 》.《IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》.1997,第45卷(第6期), |
| 傅焕展等.附加传输零点的层叠式LTCC 带通滤波器设计.《元器件与应用》.2008,第158-160页. |
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