CN108880207A - High-power 3D integrated form three-phase electromagnetic interface filter - Google Patents
High-power 3D integrated form three-phase electromagnetic interface filter Download PDFInfo
- Publication number
- CN108880207A CN108880207A CN201810845164.2A CN201810845164A CN108880207A CN 108880207 A CN108880207 A CN 108880207A CN 201810845164 A CN201810845164 A CN 201810845164A CN 108880207 A CN108880207 A CN 108880207A
- Authority
- CN
- China
- Prior art keywords
- phase
- winding
- magnetic core
- common mode
- horizontal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004804 winding Methods 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 238000004080 punching Methods 0.000 claims abstract description 17
- 239000003989 dielectric material Substances 0.000 claims abstract description 14
- 239000003990 capacitor Substances 0.000 claims abstract description 13
- 238000003475 lamination Methods 0.000 claims abstract description 11
- 238000002955 isolation Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 13
- 229910002113 barium titanate Inorganic materials 0.000 claims description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 6
- 230000037431 insertion Effects 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002707 nanocrystalline material Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/12—Arrangements for reducing harmonics from ac input or output
- H02M1/126—Arrangements for reducing harmonics from ac input or output using passive filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2876—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Filters And Equalizers (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses a kind of high-power 3D integrated form three-phase electromagnetic interface filters.It includes three-phase plane common mode inductance (1) and three plate common mode capacitances (2).Inductance includes four layer plane magnetic cores (11a, 11b, 11c, 11d), two groups of horizontal windings of three-phase (12a, 12b), the vertical winding of three-phase (13) and ceramic substrate (14)；Horizontal winding (12a, 12b) is located at the magnetic core upper surface (11a) and the lower surface magnetic core (11d), and every layer of magnetic core is equipped with two rows of concentric holes, and the vertical winding of three-phase (13) is located in through-hole；Ceramic substrate (14) is as isolation.Each capacitor includes dielectric material (21), insulating supporting (22) and punching type conductor layer (23), and three capacitance structures are identical, and lamination is attached to the side formation 3D interconnection architecture of inductance.Compared with prior art, the present invention reducing volume, Insertion Loss performance is improved, can be used for vehicle-mounted motor driven systems.
Description
Technical field
The invention belongs to technical field of electronic devices more particularly to a kind of 3D integrated form three-phase alternating current electromagnetic interface filters, can use
In vehicle-mounted motor driven systems.
Background technique
Passive three-phase exchange electromagnetic interface filter is usually to be made of components such as discrete inductance, capacitor and resistance, can be to a certain
Secondary or multiple harmonic forms low impedance path, to have the function that inhibit higher hamonic wave.
Traditional passive three-phase exchanges electromagnetic interface filter, using the component arrangement mode of discrete, this arrangement mode by
In the coupling being limited between each device, the factors such as the distribution parameter of device and installation site, there are geometric dimensions greatly, space
The disadvantage that utilization rate is low, power density is low, device coupled relation is complicated and randomness is strong.Especially answered in the high-power of hundreds of kW
With in occasion, these disadvantages are more obvious.
It is insufficient in order to solve traditional passive electromagnetic interface filter, the power density of passive electromagnetic interface filter is further increased, it is domestic
Outer numerous scholars study the integrated and passive electromagnetic interface filter of 3D of passive electromagnetic interface filter, propose some new knots
Structure, wherein：
The Chen Rengang of University of Virginia proposes a kind of planar integrated magnetic electromagnetic interface filter structure at first, i.e., flat using rectangle
Face lc unit loop construction realizes the planarization of electromagnetic interface filter, which possesses preferable high frequency characteristics, while volume ratio passes
Structure of uniting reduces 30%, substantially increases power density.However in the filter construction, electric current punishes cloth not in right angle corner
Uniformly, its conductive area is caused to be less than cross-sectional area, so as to cause alternating-current resistance.Pcb board due to constituting plane LC structure is adopted
It is the ceramic material of high dielectric constant, characteristic can change with temperature and frequency, cause under electromagnetic interface filter performance
Drop.
Professor Ferreira of TU Delft Polytechnics also proposed the electromagnetic interface filter of 3-D.By using identical
The element of height allows the element of electromagnetic interface filter to be layering, and takes full advantage of its space.This structure reduces
Coupling between component, parasitic parameter is small, high frequency characteristics is improved.But this kind of structure is still using discrete
Formula component, and using surface-mount type component, it may not apply in high-power system.
Professor Yang Yugang of Liaoning Project Technology University also proposed a kind of novel stacked crisscross parallel planar parasitic
Integrated EMI filter structure realizes the integrated of electromagnetic interface filter using high-performance copper-clad laminate.Experiment shows this novel
Although integrated EMI filter reduce 53% than the electromagnetic interface filter volume that traditional discrete element forms.But the filter of this filter
Wave performance is not greatly improved, and higher insertion loss cannot be maintained in wider frequency section.
It is mostly above for low-power system, at present for large power supply system to the research of Planar integration electromagnetic interface filter
The inhibition for electromagnetic interference of uniting, mainly there is the following two kinds means：
One is utilized in the mode of coiling on annular common mode magnetic core to increase common mode inductance amount, presses down to common mode interference
System.Due to being realized by the way of manual coiling, the parasitic parameter that will lead to device is difficult to control this common mode inductance, and
For large-power occasions, cable diameter is very big, and coiling is difficult.
Second is that increase inductance by the way of being socketed unlimited filtering magnet ring on cable, thus boostfiltering device
Insertion loss.This mode will increase the volume of filter, cause power density low, while the difficulty that radiates, and magnet ring fever is tight
Weight.
Summary of the invention
It is an object of the invention in view of the above shortcomings of the prior art, provide a kind of high-power 3D integrated form three-phase EMI
Filter reduces the volume of filter to promote the insertion loss performance of high power filter, reduces the coupling between device, mentions
The consistency of high parameter improves the heat-sinking capability of filter.
To achieve the above object, high-power 3D integrated form three-phase electromagnetic interface filter of the invention, including three-phase plane common mode
Inductance 1 and three plate common mode capacitances 2, it is characterised in that：
The three-phase plane common mode inductance 1, including be overlapped up and down four layer plane magnetic cores (11a, 11b, 11c, 11d),
Two groups of horizontal windings of three-phase (12a, 12b), the vertical winding of three-phase (13) and the ceramic substrate (14) separated up and down, four layer plane magnetic
Two rows of concentric holes are equipped on core；First group of horizontal winding of three-phase (12a) is located at the upper surface of the first planar magnetic core (11a), and second
The group horizontal winding of three-phase (12b) is located at the lower surface of fourth plane magnetic core (11d), and the vertical winding of three-phase (13) is located at four layer planes
In the through-hole of magnetic core, so that winding is mutually surrounded with magnetic core；Between magnetic core and winding, pass through insulation pottery between winding and winding
Porcelain substrate (14) isolation.
Three plate 2 structures of common mode capacitance are identical, and each capacitor includes dielectric material 21, insulating supporting 22 and punching
Pressure type conductor layer 23；These three plate 2 laminations of common mode capacitance are attached to the side of three-phase plane common mode inductance 1, and pass through punching
Pressure type conductor layer 23 and three-phase plane common mode inductance 1, which are realized, to be electrically connected, and 3D interconnection architecture is formed.
Further, the soft magnetism material with different characteristics is respectively adopted in the four layer planes magnetic core 11a, 11b, 11c, 11d
Material, and each layer carries out permutation and combination according to design requirement in any way.
Further, the horizontal winding 12 of the three-phase and the vertical winding 13 of the three-phase, in the first upper surface planar magnetic core 11a
At each lead to the hole site of the lower surface fourth plane magnetic core 11d, respectively correspondence is attached each phase.
Further, the ceramic substrate 14, the two groups of horizontal component 142a separated including vertical portion 141 and up and down,
142b, vertical portion 141 are the tubular shell covered on the vertical winding 13 of three-phase, and first group of horizontal component 142a is to be provided with groove
Flat structure, lamination is placed in the first upper surface planar magnetic core 11a, and the horizontal winding 12a of first group of three-phase is embedded in the groove
Interior, second group of horizontal component 142b is also out that reeded flat structure, lamination are placed in fourth plane magnetic core 11d following table
Face, the horizontal winding 12b of second group of three-phase is in the groove.
Further, the dielectric material 21 of each capacitor is all made of barium-titanate material of the dielectric constant 3000~6000, and
Conductive coating is coated on barium-titanate material surface.
Further, dielectric material 21 is clipped among two layers of punching type conductor 23, and passes through the protrusion in punching type conductor layer
Elastic slice elastic compression joint, which is in contact with the conductive coating that dielectric material surface sprays realizes electrical connection.
Compared with prior art, the present invention having the following advantages that：
1. the present invention has difference since the four layer plane magnetic cores being overlapped up and down to three-phase plane common mode inductance use
The soft magnetic material of characteristic carries out permutation and combination in any way, so that magnetic conductivity is able to maintain in ideal in very wide frequency band
Range, increase common mode inductance amount, broadened the frequency range of high insertion loss.
2. of the invention due to being equipped with two rows of concentric holes on four layer plane magnetic cores and the horizontal winding of three-phase is flat positioned at first
The vertical winding of three-phase is located in the through-hole of four layer plane magnetic cores by the upper surface of face magnetic core and the lower surface of fourth plane magnetic core,
So that winding is mutually surrounded with magnetic core, the flexibility of magnetic Circuit Design, Er Qieke can be not only improved while guaranteeing heat-sinking capability
The multiplication for realizing inductance in a limited space, reduces the volume of electromagnetic interface filter.
3. the present invention is due to being all made of ceramic substrate between winding and winding and be isolated between magnetic core and winding, further
Improve the heat-sinking capability of filter.
4. of the invention be made of due to each capacitor dielectric material, insulating supporting and punching type conductor layer, so to medium
Material plays the role of buffering and protection.
5. the present invention passes through since three plate common mode capacitance laminations are attached to the side of three-phase plane common mode inductance
Punching type conductor layer and three-phase plane common mode inductance, which are realized, to be electrically connected, and 3D interconnection type framework is formed, and is reduced between device
Coupling, further improves the insertion loss of filter.
6. the present invention filters EMI due to the winding using planar magnetic core peace plate type capacitance and horizontal and vertical part
Device is integrated, and is convenient for mechanization production, and then can control the distribution parameter in filter, improves product parameters consistency.
Detailed description of the invention
Fig. 1 is circuit diagram of the invention；
Fig. 2 is overall structure figure of the invention；
Fig. 3 is the explosive view of Fig. 2 of the present invention；
Fig. 4 is the winding structure figure of core sandwich and three-phase windings in the present invention；
Fig. 5 is the overall structure figure of three-phase plane common mode inductance in the present invention；
Fig. 6 is the integrated model figure of each plate capacitor in the present invention；
Fig. 7 is the relative position figure of three plate common mode capacitances and three-phase plane common mode inductance in the present invention.
Specific embodiment
To describe the technical solutions in the embodiments of the present invention more clearly, with reference to the accompanying drawings and examples to the present invention
It is described further.
Referring to Fig.1, high-power 3D integrated form three-phase electromagnetic interface filter circuit of the invention, including three-phase plane common mode electricity
Sense 1 and three plate common mode capacitances 2, each phase self-induction L of three-phase plane common mode inductance 1CMSeries connection enters in main circuit, respectively
Corresponding plane common mode capacitance CYIt connects between main circuit and ground, LCMWith CYThe low-pass filter for constituting anti-Γ type, to making an uproar
Acoustical signal forms low impedance path and passes through the low impedance path when noise signal flows through the filter from U, V, W triple line
It is filtered out, without being transferred to U ', V ', W ' phase line side.
Referring to Fig. 2 and Fig. 3, the three-phase plane common mode inductance 1 of the invention includes four layer plane magnetic cores being overlapped up and down
11a, 11b, 11c, 11d, the horizontal winding 12a of two separated up and down group three-phase, the vertical winding 13 of 12b, three-phase and ceramic substrate 14.
Wherein ceramic substrate 14 includes vertical portion ceramic substrate 141 and two groups of horizontal component ceramic substrates 142a, 142b.Entire three-phase
The structural relation of plane common mode inductance 1 is from top to bottom：The horizontal winding 12a of first group of three-phase, first group of horizontal component ceramics
Substrate 142a, four layer plane magnetic core 11a, 11b, 11c, 11d being overlapped up and down, second group of horizontal component ceramic substrate 142b, three
Mutually vertical 141, second groups of winding 13, vertical portion ceramic substrate horizontal winding 12b of three-phase.
Three plate common mode capacitances 2 include three capacitors on corresponding U, V, W three-phase, each capacitor from left to right
Including dielectric material 21, insulating supporting 22 and punching type conductor layer 23.
Referring to Fig. 4, the four layer plane magnetic core 11a, 11b, 11c being overlapped up and down, 11d use the soft magnetism of different characteristics
Material, wherein the first planar magnetic core 11a uses MnZn ferrite material, the second planar magnetic core 11b uses nickel-zinc-ferrite material,
Third planar magnetic core 11c and fourth plane magnetic core 11d uses nanocrystalline material, is equipped on four layer plane magnetic cores two rows of concentric
Hole；The horizontal winding 12a of first group of three-phase is located at the upper surface of the first planar magnetic core 11a, and the horizontal winding 12b of second group of three-phase is located at
The lower surface of fourth plane magnetic core 11d, the vertical winding 13 of three-phase is located in the through-hole of four layer plane magnetic cores, so that winding and magnetic core
Mutually surround.Each phase of the horizontal winding 12a of first group of three-phase and each phase top of the vertical winding 13 of the three-phase exist
Correspondence is attached at each lead to the hole site of first upper surface planar magnetic core 11a；The horizontal winding 12b's of second group of three-phase
Each phase bottom end of each phase and the vertical winding 13 of the three-phase is at each lead to the hole site of the lower surface fourth plane magnetic core 11d
Correspondence is attached.
Referring to Fig. 5, it is isolated by ceramic insulating substrate 14 between magnetic core and winding, between winding and winding.Wherein
The vertical portion 141 of ceramic insulating substrate is to cover outside the tubular shell on the vertical winding 13 of three-phase, the of ceramic insulating substrate
One group of horizontal component 142a is to open reeded flat structure, and lamination is placed in the upper surface of the first planar magnetic core 11a, first
The group horizontal winding 12a of three-phase is in the groove；Second group of horizontal component 142b of ceramic insulating substrate is also out reeded
Flat structure, lamination are placed in the lower surface of fourth plane magnetic core 11d, and the horizontal winding 12b of second group of three-phase is embedded in the groove
It is interior.The horizontal winding 12a of first group of three-phase is equipped with leading-out terminal B.
Referring to Fig. 6, barium titanate material of the dielectric material 21 of each plate capacitor using dielectric constant 3000~6000
Material, and in barium-titanate material surface spraying silver paste as conductive coating.In each punching type conductor layer 23 of plate capacitor
There is the elastic slice of protrusion, dielectric material 21 is clipped among two layers of punching type conductor 23, and passes through the raised bullet in punching type conductor layer
Piece elastic compression joint, be in contact by raised elastic slice with the conductive coating that dielectric material surface sprays realization electrical connection, any one
The punching type conductor layer 23 of layer is equipped with leading-out terminal A.
Referring to Fig. 7, three plate 2 laminations of common mode capacitance are attached to the side of three-phase plane common mode inductance 1, and pass through punching
The leading-out terminal A of pressure type conductor layer 23 is connected with the leading-out terminal B of the horizontal winding 12a of first group of three-phase, realizes electrical connection, shape
At 3D interconnection architecture.
Above description is only example of the present invention, does not constitute any limitation of the invention, it is clear that for
It, all may be without departing substantially from the principle of the invention, structure after having understood the content of present invention and principle for one of skill in the art
In the case where, carry out various modifications and change in form and details, but these modifications and variations based on inventive concept
Still within the scope of the claims of the present invention.
Claims (6)
1. a kind of high-power 3D integrated form three-phase electromagnetic interface filter, including three-phase plane common mode inductance (1) and three it is plate total
Mould capacitor (2), it is characterised in that：
The three-phase plane common mode inductance (1), including be overlapped up and down four layer plane magnetic cores (11a, 11b, 11c, 11d), on
Two groups of horizontal windings of three-phase (12a, 12b), the vertical winding of three-phase (13) and the ceramic substrate (14) of lower separation, four layer plane magnetic cores
On be equipped with two rows of concentric holes；First group of horizontal winding of three-phase (12a) is located at the upper surface of the first planar magnetic core (11a), and second group
The horizontal winding of three-phase (12b) is located at the lower surface of fourth plane magnetic core (11d), and the vertical winding of three-phase (13) is located at four layer plane magnetic
In the through-hole of core, so that winding is mutually surrounded with magnetic core；Pass through insulating ceramics between magnetic core and winding, between winding and winding
Substrate (14) isolation.
Three plate common mode capacitance (2) structures are identical, each capacitor include dielectric material (21), insulating supporting (22) and
Punching type conductor layer (23)；These three plate common mode capacitance (2) laminations are attached to the side of three-phase plane common mode inductance (1),
And realized and be electrically connected by punching type conductor layer (23) and three-phase plane common mode inductance (1), form 3D interconnection architecture.
2. filter as described in claim 1, which is characterized in that the four layer planes magnetic core (11a, 11b, 11c, 11d) point
Cai Yong not be with the soft magnetic material of different characteristics, and each layer carries out permutation and combination according to design requirement in any way.
3. filter as described in claim 1, which is characterized in that it is described up and down separate two groups of horizontal windings of three-phase (12) with
The vertical winding of three-phase (13), in each of the first planar magnetic core upper surface (11a) and the lower surface fourth plane magnetic core (11d)
At lead to the hole site, respectively correspondence is attached each phase.
4. filter as described in claim 1, which is characterized in that the ceramic substrate (14), including vertical portion (141)
The two groups of horizontal components (142a, 142b) separated up and down, vertical portion (141) are the pipe covered on the vertical winding of three-phase (13)
Shape shell, first group of horizontal component (142a) are to open reeded flat structure, and lamination is placed in the first planar magnetic core (11a)
Upper surface, for first group of horizontal winding of three-phase (12a) in the groove, second group of horizontal component (142b) is also reeded to open
Flat structure, lamination are placed in the lower surface fourth plane magnetic core (11d), and second group of horizontal winding of three-phase (12b) is recessed embedded in this
In slot.
5. filter as described in claim 1, which is characterized in that the dielectric material (21) of each capacitor is all made of dielectric constant
Conductive coating is coated in 3000~6000 barium-titanate material, and on barium-titanate material surface.
6. filter as described in claim 1, which is characterized in that dielectric material (21) is clipped in two layers of punching type conductor layer (23)
Centre, and by the raised elastic slice elastic compression joint in punching type conductor layer, which leads with what dielectric material surface sprayed
Electroplated layer, which is in contact, realizes electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845164.2A CN108880207B (en) | 2018-07-27 | 2018-07-27 | High-power 3D integrated three-phase EMI filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845164.2A CN108880207B (en) | 2018-07-27 | 2018-07-27 | High-power 3D integrated three-phase EMI filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108880207A true CN108880207A (en) | 2018-11-23 |
| CN108880207B CN108880207B (en) | 2020-04-07 |
Family
ID=64306130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810845164.2A Active CN108880207B (en) | 2018-07-27 | 2018-07-27 | High-power 3D integrated three-phase EMI filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108880207B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109559868A (en) * | 2018-11-30 | 2019-04-02 | 北京航天微电科技有限公司 | A kind of high power plate electromagnetic interface filter |
| CN110335755A (en) * | 2019-08-02 | 2019-10-15 | 北斗航天汽车（北京）有限公司 | The water cooling thin-film capacitor and electric machine controller of integrated safety filter capacitor |
| CN111292950A (en) * | 2019-12-30 | 2020-06-16 | 电子科技大学 | Method for manufacturing embedded magnetic core miniaturized three-dimensional inductor and inductor |
| CN111446902A (en) * | 2020-04-30 | 2020-07-24 | 西安电子科技大学 | AC-DC coupling integrated EMI filter for motor driving system |
| CN112332653A (en) * | 2020-10-28 | 2021-02-05 | 西安电子科技大学 | 3D integrated EMI filter based on multistage CL circuit |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2458707Y (en) * | 2000-12-12 | 2001-11-07 | 台达电子工业股份有限公司 | Voltage power general inductive apparatus |
| CN2743949Y (en) * | 2004-10-15 | 2005-11-30 | 珠海科德电子有限公司 | Difference mode/common mode integrated inductor |
| CN103065765A (en) * | 2012-12-15 | 2013-04-24 | 华南理工大学 | Planer Electro Magnetic Interference (EMI) filter based on overlapped interleaved windings |
| CN103986437A (en) * | 2014-05-08 | 2014-08-13 | 南京航空航天大学 | Double-grounded plane EMI filter |
| CN103997311A (en) * | 2014-06-09 | 2014-08-20 | 西安电子科技大学 | 3-D full integration EMI filter based on planar coupling inductor |
-
2018
- 2018-07-27 CN CN201810845164.2A patent/CN108880207B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2458707Y (en) * | 2000-12-12 | 2001-11-07 | 台达电子工业股份有限公司 | Voltage power general inductive apparatus |
| CN2743949Y (en) * | 2004-10-15 | 2005-11-30 | 珠海科德电子有限公司 | Difference mode/common mode integrated inductor |
| CN103065765A (en) * | 2012-12-15 | 2013-04-24 | 华南理工大学 | Planer Electro Magnetic Interference (EMI) filter based on overlapped interleaved windings |
| CN103986437A (en) * | 2014-05-08 | 2014-08-13 | 南京航空航天大学 | Double-grounded plane EMI filter |
| CN103997311A (en) * | 2014-06-09 | 2014-08-20 | 西安电子科技大学 | 3-D full integration EMI filter based on planar coupling inductor |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109559868A (en) * | 2018-11-30 | 2019-04-02 | 北京航天微电科技有限公司 | A kind of high power plate electromagnetic interface filter |
| CN110335755A (en) * | 2019-08-02 | 2019-10-15 | 北斗航天汽车（北京）有限公司 | The water cooling thin-film capacitor and electric machine controller of integrated safety filter capacitor |
| CN111292950A (en) * | 2019-12-30 | 2020-06-16 | 电子科技大学 | Method for manufacturing embedded magnetic core miniaturized three-dimensional inductor and inductor |
| CN111446902A (en) * | 2020-04-30 | 2020-07-24 | 西安电子科技大学 | AC-DC coupling integrated EMI filter for motor driving system |
| CN111446902B (en) * | 2020-04-30 | 2022-09-06 | 西安电子科技大学 | AC-DC coupling integrated EMI filter for motor driving system |
| CN112332653A (en) * | 2020-10-28 | 2021-02-05 | 西安电子科技大学 | 3D integrated EMI filter based on multistage CL circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108880207B (en) | 2020-04-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108880207A (en) | High-power 3D integrated form three-phase electromagnetic interface filter | |
| CN104851579B (en) | Printed circuit board and the method for manufacturing inductive devices | |
| CN107046366B (en) | Supply convertor and preparation method thereof | |
| CN106971828B (en) | Board-like transformer and the adapter with the transformer and charger | |
| CN207082424U (en) | Board-like transformer and adapter and charger with the transformer | |
| CN103997311B (en) | 3-D full integration EMI filter based on planar coupling inductor | |
| CN105846032A (en) | Low-loss crossed laminated type LTCC Wilkinson power divider | |
| CN106716634A (en) | High frequency component | |
| CN104851969A (en) | Piezoelectric ceramic inductor and integrated inductor comprising piezoelectric ceramic inductor | |
| CN205545171U (en) | Stromatolite formula high pass filter | |
| CN202695101U (en) | Assembled planar transformer | |
| CN104270111A (en) | Bus type EMI (Electro-Magnetic Interference) filter having common-mode inductance enhancing structure | |
| CN106450630B (en) | Miniaturized high-inhibition multilayer balun | |
| CN102594284B (en) | Plane electro-magnetic interference (EMI) filter formed by multi-coil integrated LC unit | |
| CN107528560B (en) | Filtering component of laser positioning system | |
| CN103780216B (en) | The whole plane electromagnetic interface filter integrated morphology that a kind of circular flat PCB coupling inductance is constituted | |
| CN104022749A (en) | Laminated type EMI filter | |
| CN103956984A (en) | Multilayer structure body with filtering performance | |
| CN104979606A (en) | Interval type bus filter layered structure | |
| CN206471205U (en) | A kind of adjustable flat surface transformer | |
| Li et al. | A sandwich structure for cost-effective printed-circuit-board wireless power resonator | |
| CN204668359U (en) | Piezoelectric ceramic inductor and the integrated inductor comprising this piezoelectric ceramic inductor | |
| CN103986437B (en) | Double ground plane electromagnetic interface filters | |
| CN207368989U (en) | A kind of laser orientation system filtering unit | |
| CN106373733B (en) | A kind of adjustable flat surface transformer and its manufacture method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |