CN216451583U - Improved PCB - Google Patents

Improved PCB Download PDF

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Publication number
CN216451583U
CN216451583U CN202122538674.5U CN202122538674U CN216451583U CN 216451583 U CN216451583 U CN 216451583U CN 202122538674 U CN202122538674 U CN 202122538674U CN 216451583 U CN216451583 U CN 216451583U
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CN
China
Prior art keywords
circuit board
heat
conducting plate
spring
heat dissipation
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CN202122538674.5U
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Chinese (zh)
Inventor
张志勤
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Dongguan Wannianfu Electronics Co ltd
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Dongguan Wannianfu Electronics Co ltd
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Priority to CN202122538674.5U priority Critical patent/CN216451583U/en
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Publication of CN216451583U publication Critical patent/CN216451583U/en
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Abstract

The utility model discloses an improved PCB circuit board, which comprises a circuit board, wherein four mounting holes are arranged on the circuit board in a penetrating manner, a heat dissipation plate is arranged below the circuit board, two limiting plates are arranged above the circuit board, through grooves are arranged on the two limiting plates in a penetrating manner, two baffle plates are arranged above the limiting plates, and sliding rods are fixedly connected to the bottom surfaces of the baffle plates; install a plurality of telescopic links, a plurality of on the top surface of heating panel the extension of telescopic link is served all fixedly connected with heat-conducting plates, heat-conducting plate and circuit board contact, the cover is equipped with the spring on the telescopic link. According to the utility model, by arranging the spring, the telescopic rod and the heat conducting plate, when the circuit board generates heat during working, the heat dissipation of the circuit board can be accelerated by the gap between the circuit board and the heat dissipation plate, and the heat generated by the circuit board is also transferred to the heat conducting plate, so that the heat is transferred to the heat dissipation plate, the heat dissipation of the circuit board is accelerated, and the aging phenomenon of the circuit board is slowed down.

Description

Improved PCB
Technical Field
The utility model relates to the field of circuit boards, in particular to an improved PCB.
Background
The PCB circuit board is also called as a printed circuit board, is a provider of electrical connection of electronic components, has been developed for more than 100 years, is mainly designed by a layout, has the main advantages of greatly reducing errors of wiring and assembly, improving the automation level and the production labor rate, and can be divided into single-layer boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards according to the number of layers of the circuit board.
However, when the PCB is used, the PCB is easily aged due to poor heat dissipation effect of the PCB, and thus the service life of the PCB is shortened.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to an improved PCB to solve at least one of the above problems.
In order to solve the technical problems, the utility model adopts the following technical scheme:
an improved PCB circuit board comprises a circuit board, wherein four mounting holes are formed in the circuit board in a penetrating mode, a heat dissipation plate is arranged below the circuit board, four connecting cylinders are connected to the heat dissipation plate in a sliding mode, two limiting plates are arranged above the circuit board, through grooves are formed in the two limiting plates in a penetrating mode, two baffles are arranged above the limiting plates, sliding rods are fixedly connected to the bottom surfaces of the baffles, the sliding rods sequentially penetrate through the through grooves and the mounting holes and are in threaded connection with the connecting cylinders, and the sliding rods are connected with the circuit board in a sliding mode; install a plurality of telescopic links on the top surface of heating panel, it is a plurality of extension of telescopic link is served all fixedly connected with heat-conducting plate, heat-conducting plate and circuit board contact, the cover is equipped with the spring on the telescopic link, the both ends of spring respectively with heat-conducting plate, heating panel fixed connection.
Preferably, it is a plurality of all fixedly connected with dwang on the top surface of baffle, the dwang is the plastics material.
Preferably, the lower part of the sliding rod is provided with an external thread, and the connecting cylinder is internally provided with an internal thread matched with the external thread.
Preferably, two slide rails are installed on the top surface of the heat dissipation plate, two slide blocks are connected to the slide rails in a sliding mode, and four connecting cylinders are installed on the top surfaces of the four slide blocks respectively.
Preferably, a plurality of copper wires are installed on the circuit board, and a plurality of chips are installed on the circuit board.
Preferably, a protective coating is arranged on the circuit board.
Preferably, the telescopic rod, the spring, the heat conducting plate and the heat radiating plate are all made of aluminum alloy materials.
The utility model has the beneficial effects that:
1. according to the utility model, the spring, the telescopic rod and the heat conducting plate are arranged, so that a gap is formed between the circuit board and the heat radiating plate, when the circuit board generates heat during working, the gap between the circuit board and the heat radiating plate can accelerate the heat radiation of the circuit board, the heat emitted by the circuit board can be transferred to the heat conducting plate, and further the heat is transferred to the heat radiating plate through the telescopic rod and the spring, so that the heat radiation of the circuit board is accelerated, the aging phenomenon of the circuit board is slowed down, and the service life of the circuit board is prolonged.
2. According to the utility model, by arranging the spring, the slide rod, the telescopic rod and the heat conducting plate, when the circuit board encounters collision, vibration and the like, the spring can provide certain buffer for the circuit board, so that the circuit board is prevented from being damaged, and the service cycle of the circuit board is prolonged.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1 according to the present invention;
FIG. 3 is a top view of the present invention;
reference numerals are as follows: 1. a heat dissipation plate; 2. a slide rail; 3. a slider; 4. a connecting cylinder; 5. a circuit board; 6. mounting holes; 7. a limiting plate; 8. a through groove; 9. rotating the rod; 10. a slide bar; 11. an external thread; 12. a telescopic rod; 13. a heat conducting plate; 14. a spring; 15. a copper wire; 16. a chip; 17. a protective coating; 20. and a baffle plate.
Detailed Description
The present invention will be further described with reference to the following detailed description and the accompanying drawings, which are provided for the purpose of illustrating the utility model and are not intended to limit the utility model to the particular embodiments disclosed. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.
Specific embodiments of the present invention are described below with reference to the accompanying drawings.
Examples
As shown in fig. 1-3, an improved PCB comprises a circuit board 5, four mounting holes 6 are formed in the circuit board 5 in a penetrating manner, a heat dissipation plate 1 is arranged below the circuit board 5, four connecting cylinders 4 are slidably connected to the heat dissipation plate 1, two limiting plates 7 are arranged above the circuit board 5, through grooves 8 are formed in the two limiting plates 7 in a penetrating manner, two baffles 20 are arranged above the limiting plates 7, sliding rods 10 are fixedly connected to the bottom surfaces of the baffles 20, the sliding rods 10 sequentially penetrate through the through grooves 8 and the mounting holes 6 and are in threaded connection with the connecting cylinders 4, and the sliding rods 10 are slidably connected with the circuit board 5; install a plurality of telescopic links 12 on the top surface of heating panel 1, all fixedly connected with heat-conducting plate 13 is served in the extension of a plurality of telescopic links 12, and heat-conducting plate 13 and circuit board 5 contact are overlapped on telescopic link 12 and are equipped with spring 14, spring 14's both ends respectively with heat-conducting plate 13, heating panel 1 fixed connection.
In this embodiment, specifically, the top surfaces of the plurality of baffles 20 are all fixedly connected with the rotating rods 9, and the rotating rods 9 are made of plastic; through setting up dwang 9, be convenient for rotate baffle 20, and then be convenient for rotate slide bar 10, and then be convenient for be connected or the separation with connecting cylinder 4 slide bar 10.
In this embodiment, specifically, an external thread 11 is provided on the lower portion of the sliding rod 10, and an internal thread matching with the external thread 11 is provided in the connecting cylinder 4.
In this embodiment, specifically, two sliding rails 2 are installed on the top surface of the heat dissipation plate 1, two sliding blocks 3 are connected to the sliding rails 2 in a sliding manner, and four connecting cylinders 4 are installed on the top surfaces of the four sliding blocks 3 respectively; through setting up slide rail 2 and slider 3, make connecting cylinder 4 can move on heating panel 1 to do benefit to the interval that changes between two connecting cylinders 4 that are located same vertical.
In this embodiment, specifically, the circuit board 5 is mounted with a plurality of copper wires 15, and the circuit board 5 is mounted with a plurality of chips 16.
In this embodiment, specifically, the circuit board 5 is provided with a protective coating 17.
In this embodiment, the telescopic rod 12, the spring 14, the heat conducting plate 13, and the heat dissipating plate 1 are made of aluminum alloy; aluminum alloy is an alloy based on aluminum with a certain amount of other alloying elements added, and is one of light metal materials. The aluminum alloy has the general characteristics of aluminum, and has the specific characteristics of certain alloys due to different types and amounts of added alloying elements, so that the aluminum alloy has higher strength, good casting performance and plastic processing performance, and good heat-conducting performance.
The working principle is as follows: when the circuit board is used specifically, the circuit board 5 is placed on the heat conduction plates 13, the two limiting plates 7 are placed on two sides of the top surface of the circuit board 5 respectively, the mounting hole 6 in the circuit board 5 is located right below the through groove 8, the slide bars 10 sequentially penetrate through the through groove 8 and the mounting hole 6 to extend to the lower side of the circuit board 5, the corresponding connecting cylinders 4 are moved according to the positions of the lower ends of the slide bars 10, the lower ends of the slide bars 10 are located right above the connecting cylinders 4 respectively, and the limiting plates 7 and the slide bars 10 are driven to rotate by rotating the rotating rods 9, so that the slide bars 10 are in threaded connection with the connecting cylinders 4;
when the four sliding rods 10 are respectively connected with the four connecting cylinders 4, the circuit board 5 moves downwards, and then extrudes the heat conducting plate 13 and the spring 14, and the spring 14 pushes the heat conducting plate 13 to move under the influence of the resilience force of the spring 14, so that the heat conducting plate 13 is matched with the limiting plate 7 to clamp the circuit board 5.
Through setting up spring 14, slide bar 10, telescopic link 12, heat-conducting plate 13, when circuit board 5 meets collision, vibration etc., spring 14 can provide certain buffering for circuit board 5, makes circuit board 5 can move along slide bar 10 to avoid circuit board 5 to be damaged, prolonged circuit board 5's life cycle.
Through setting up spring 14, telescopic link 12, heat-conducting plate 13, make and be formed with the space between circuit board 5 and the heating panel 1, when circuit board 5 generates heat when using, the heat dissipation of circuit board 5 can be accelerated to the space between circuit board 5 and the heating panel 1, and the heat that circuit board 5 sent also can be given for heat-conducting plate 13, and then gives heating panel 1 with heat transfer through telescopic link 12 and spring 14 to accelerate the heat dissipation.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (7)

1. An improved generation PCB circuit board, includes circuit board (5), its characterized in that: the circuit board (5) is provided with four mounting holes (6) in a penetrating mode, a heat dissipation plate (1) is arranged below the circuit board (5), the heat dissipation plate (1) is connected with four connecting cylinders (4) in a sliding mode, two limiting plates (7) are arranged above the circuit board (5), through grooves (8) are formed in the two limiting plates (7) in a penetrating mode, two baffles (20) are arranged above the limiting plates (7), sliding rods (10) are fixedly connected to the bottom surfaces of the baffles (20), the sliding rods (10) sequentially penetrate through the through grooves (8) and the mounting holes (6) and are in threaded connection with the connecting cylinders (4), and the sliding rods (10) are connected with the circuit board (5) in a sliding mode; install a plurality of telescopic links (12), a plurality of on the top surface of heating panel (1) the extension of telescopic link (12) is served all fixedly connected with heat-conducting plate (13), heat-conducting plate (13) and circuit board (5) contact, the cover is equipped with spring (14) on telescopic link (12), the both ends of spring (14) respectively with heat-conducting plate (13), heating panel (1) fixed connection.
2. The improved PCB circuit board of claim 1, wherein: a plurality of all fixedly connected with dwang (9) on the top surface of baffle (20), dwang (9) are the plastics material.
3. The improved PCB circuit board of claim 1, wherein: the lower part of the sliding rod (10) is provided with an external thread (11), and the connecting cylinder (4) is internally provided with an internal thread matched with the external thread (11).
4. The improved PCB circuit board of claim 1, wherein: install two slide rails (2) on the top surface of heating panel (1), all sliding connection has two slider (3) on slide rail (2), four connecting cylinder (4) are installed respectively on the top surface of four slider (3).
5. The improved PCB circuit board of claim 1, wherein: install many copper lines (15) on circuit board (5), install a plurality of chips (16) on circuit board (5).
6. The improved PCB circuit board of claim 5, wherein: and a protective coating (17) is arranged on the circuit board (5).
7. The improved PCB circuit board of claim 1, wherein: the telescopic rod (12), the spring (14), the heat conducting plate (13) and the heat radiating plate (1) are all made of aluminum alloy materials.
CN202122538674.5U 2021-10-21 2021-10-21 Improved PCB Active CN216451583U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122538674.5U CN216451583U (en) 2021-10-21 2021-10-21 Improved PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122538674.5U CN216451583U (en) 2021-10-21 2021-10-21 Improved PCB

Publications (1)

Publication Number Publication Date
CN216451583U true CN216451583U (en) 2022-05-06

Family

ID=81349036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122538674.5U Active CN216451583U (en) 2021-10-21 2021-10-21 Improved PCB

Country Status (1)

Country Link
CN (1) CN216451583U (en)

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