CN216600234U - Heat dissipation moisture-proof type multilayer hard circuit board - Google Patents
Heat dissipation moisture-proof type multilayer hard circuit board Download PDFInfo
- Publication number
- CN216600234U CN216600234U CN202122912401.2U CN202122912401U CN216600234U CN 216600234 U CN216600234 U CN 216600234U CN 202122912401 U CN202122912401 U CN 202122912401U CN 216600234 U CN216600234 U CN 216600234U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- size
- heat dissipation
- plate
- board body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a heat-dissipation and moisture-proof multilayer hard circuit board which comprises a circuit board body, wherein a heat-dissipation through hole is reserved on the outer side of the circuit board body, a sealing ring is fixedly mounted at the upper end of the circuit board body, an outer protection plate is fixedly mounted at the upper end of the sealing ring, an air hole is reserved at the upper end of the outer protection plate, a limiting plate is fixedly mounted in the circuit board body, a component mounting groove is formed in the limiting plate, a connecting screen plate is fixedly mounted in the component mounting groove, a positioning groove is formed in the sealing ring, a flow guide groove is fixedly mounted at the lower end of the connecting screen plate, a connecting groove is formed in the outer protection plate, and a water-absorbing layer plate is fixedly mounted in the connecting groove. This heat dissipation moisture-proof type multilayer stereoplasm circuit board, the simple structure of whole product, the work of using that can be better not only can increase the result of use of circuit board, can also increase the application scope of circuit board, and the cost when help reduction product uses.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a heat-dissipation moisture-proof multilayer hard circuit board.
Background
The rapid development of the information electronic industry in China provides a good market environment for the rapid development of printed circuit boards, the continuous increase of the yield of electronic products such as electronic communication equipment, electronic computers, household appliances and the like provides powerful power for the rapid increase of the printed circuit boards, the circuit boards mainly comprise bonding pads, through holes, mounting holes, leads, components, connectors, filling, electrical boundaries and the like, the circuit boards enable the circuits to be more miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, the circuit panel only exists as an effective experimental tool, printed circuit boards have become an absolutely dominant position in the electronics industry, and have been increasingly smaller in size, lower in cost, and higher in performance, therefore, the printed circuit board still keeps strong vitality in the development process of future electronic products.
However, common stereoplasm circuit board is producing in the existing market, and when using, its self radiating effect is not good, easily when using, leads to the heat to pile up on the circuit board, influences the normal use of circuit board, also can increase the energy consumption of circuit board when using to current damp-proof effect of circuit board self is relatively poor, and the high humid environment of unable adaptation has restricted the application scope of circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat-dissipation moisture-proof multilayer hard circuit board, which aims to solve the problems that the prior art has poor heat dissipation effect and easily causes heat accumulation on the circuit board.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a heat dissipation dampproofing type multilayer stereoplasm circuit board, includes the circuit board body, the outside reservation of circuit board body has the heat dissipation through-hole, the upper end fixed mounting of circuit board body has the sealing washer, the upper end fixed mounting of sealing washer has outer guard plate, the upper end reservation of outer guard plate has the bleeder vent, this internal fixed mounting of circuit board has the limiting plate, set up the component mounting groove in the limiting plate, fixed mounting has connection otter board in the component mounting groove, the constant head tank has been seted up in the sealing washer, connection otter board's lower extreme fixed mounting has the guiding gutter, set up the spread groove in the outer guard plate, fixed mounting has the plywood that absorbs water in the spread groove.
Preferably, the symmetry is provided with seven groups of heat dissipation through-holes on the circuit board body, and communicates each other between heat dissipation through-hole and the guiding gutter to the size of guiding gutter and the mutual adaptation of connecting the net plate size, the mutual adaptation of size of connecting the net plate size and component mounting groove.
Preferably, the sealing washer is rectangle structural design, and the size of sealing washer and the mutual adaptation of spacer plate size to the spacer plate size is less than the size of circuit board body, the size of circuit board body and the mutual adaptation of outer protective plate size.
Preferably, four groups of air holes are symmetrically formed in the outer protection plate, and two air holes are symmetrically formed in the outer protection plate relative to the circuit board body.
Preferably, the size of spread groove and the size of the plywood that absorbs water mutual adaptation, and the plywood that absorbs water is the design of rectangle structure.
Preferably, the size of the water absorption layer plate is larger than that of the connecting net plate, and the size of the flow guide groove and the size of the heat dissipation through hole are matched with each other.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the heat dissipation moisture-proof multilayer hard circuit board, the internal heat dissipation holes capable of helping heat dissipation are added, so that heat dissipation work can be better performed when the heat dissipation moisture-proof multilayer hard circuit board is used, heat accumulation on the circuit board is reduced, and energy consumption during work is helped to be reduced;
2. according to the heat dissipation moisture-proof multilayer hard circuit board, the external moisture-proof protective layer is added, and when the heat dissipation moisture-proof multilayer hard circuit board is used, moisture can be reduced from entering the circuit board through absorption of the water absorption layer, so that the heat dissipation moisture-proof multilayer hard circuit board can be used better, and the application range of the circuit board is enlarged;
3. this heat dissipation moisture-proof type multilayer stereoplasm circuit board, the simple structure of whole product, the work of using that can be better not only can increase the result of use of circuit board, can also increase the application scope of circuit board, and the cost when help reduction product uses.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the split structure of the present invention;
FIG. 3 is a schematic view of the internal structure of the present invention.
In the figure: 1. a circuit board body; 2. a heat dissipating through hole; 3. a seal ring; 4. an outer protective plate; 5. air holes are formed; 6. a limiting plate; 7. an element mounting groove; 8. connecting the screen plate; 9. positioning a groove; 10. a diversion trench; 11. connecting grooves; 12. a water-absorbing laminate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a heat-dissipation moisture-proof multilayer hard circuit board comprises a circuit board body 1, a heat-dissipation through hole 2 is reserved on the outer side of the circuit board body 1, a sealing ring 3 is fixedly installed at the upper end of the circuit board body 1, an outer protection plate 4 is fixedly installed at the upper end of the sealing ring 3, a vent hole 5 is reserved at the upper end of the outer protection plate 4,
referring to fig. 2, a limiting plate 6 is fixedly installed in the circuit board body 1, a component mounting groove 7 is formed in the limiting plate 6, a connecting screen plate 8 is fixedly installed in the component mounting groove 7, a positioning groove 9 is formed in the sealing ring 3,
referring to fig. 3, a flow guide groove 10 is fixedly installed at the lower end of the connection screen plate 8, a connection groove 11 is formed in the outer protection plate 4, a water absorption layer plate 12 is fixedly installed in the connection groove 11, seven groups of heat dissipation through holes 2 are symmetrically arranged on the circuit board body 1, the heat dissipation through holes 2 are communicated with the flow guide groove 10, the size of the flow guide groove 10 is matched with the size of the connection screen plate 8, and the size of the connection screen plate 8 is matched with the size of the element installation groove 7;
seven groups of heat dissipation through holes 2 are symmetrically arranged on the circuit board body 1, the heat dissipation through holes 2 are communicated with the diversion trenches 10, the sizes of the diversion trenches 10 are matched with the size of the connecting screen plate 8, and the size of the connecting screen plate 8 is matched with the size of the element mounting groove 7;
the sealing ring 3 is designed to be of a rectangular structure, the size of the sealing ring 3 is matched with that of the limiting plate 6, the size of the limiting plate 6 is smaller than that of the circuit board body 1, and the size of the circuit board body 1 is matched with that of the outer protection plate 4;
four groups of air holes 5 are symmetrically arranged on the outer protection plate 4, and two air holes are symmetrically arranged on the outer protection plate 4 relative to the circuit board body 1;
the size of the connecting groove 11 is matched with that of the water-absorbing layer plate 12, and the water-absorbing layer plate 12 is designed to be a rectangular structure;
the size of the water absorption layer plate 12 is larger than that of the connecting screen plate 8, and the size of the flow guide groove 10 is matched with that of the heat dissipation through hole 2.
The working principle is as follows: at first, inside component mounting groove 7 is installed to the electronic component that will need to install, fixed mounting's work is connected to constant head tank 9 and limiting plate 6 on the rethread sealing washer 3, later rethread constant head tank 9 carries out fixed mounting, install outer guard plate 4 again, accomplish after fixed, install the circuit board through wire and corresponding equipment, when using, can carry out radiating work through bleeder vent 5 and heat dissipation through-hole 2, can also carry out damp-proofing work through sealing washer 3, also can absorb water through the plywood 12 that absorbs water except that damp work, the simple structure of whole product, the work of using that can be better, not only can increase the result of use of circuit board, can also increase the application scope of circuit board, help reduces the cost when the product uses.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a heat dissipation moisture-proof type multilayer stereoplasm circuit board, includes the circuit board body, its characterized in that: the utility model discloses a circuit board, including circuit board body, fixed mounting has the sealing washer in the outside reservation of circuit board body, the upper end fixed mounting of circuit board body has outer guard plate, the upper end reservation of outer guard plate has the bleeder vent, this internal fixed mounting of circuit board has the limiting plate, seted up the component mounting groove in the limiting plate, fixed mounting has the connection otter board in the component mounting groove, the constant head tank has been seted up in the sealing washer, the lower extreme fixed mounting of connection otter board has the guiding gutter, the spread groove has been seted up in the outer guard plate, fixed mounting has the plywood that absorbs water in the spread groove.
2. The heat dissipation moisture-proof multilayer hard circuit board according to claim 1, characterized in that: the symmetry is provided with seven groups of heat dissipation through-holes on the circuit board body, and communicates each other between heat dissipation through-hole and the guiding gutter to the size of guiding gutter and the mutual adaptation of connecting the net plate size, the mutual adaptation of size of connecting the net plate size and component mounting groove.
3. The heat dissipation moisture-proof multilayer hard circuit board according to claim 1, characterized in that: the sealing washer is rectangle structural design, and the size of sealing washer and the mutual adaptation of spacer plate size to the spacer plate size is less than the size of circuit board body, the size of circuit board body and the mutual adaptation of outer protective plate size.
4. The heat dissipation moisture-proof multilayer hard circuit board according to claim 1, characterized in that: four groups of air holes are symmetrically formed in the outer protection plate, and two outer protection plates are symmetrically arranged on the circuit board body.
5. The heat dissipation moisture-proof multilayer hard circuit board according to claim 1, characterized in that: the size of spread groove and the mutual adaptation of the plywood size that absorbs water, and the plywood that absorbs water is the design of rectangle structure.
6. The heat dissipation moisture-proof multilayer hard circuit board according to claim 1, characterized in that: the size of the water absorbing layer plate is larger than that of the connecting net plate, and the size of the flow guide groove and the size of the heat dissipation through hole are matched with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122912401.2U CN216600234U (en) | 2021-11-20 | 2021-11-20 | Heat dissipation moisture-proof type multilayer hard circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122912401.2U CN216600234U (en) | 2021-11-20 | 2021-11-20 | Heat dissipation moisture-proof type multilayer hard circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600234U true CN216600234U (en) | 2022-05-24 |
Family
ID=81649677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122912401.2U Active CN216600234U (en) | 2021-11-20 | 2021-11-20 | Heat dissipation moisture-proof type multilayer hard circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600234U (en) |
-
2021
- 2021-11-20 CN CN202122912401.2U patent/CN216600234U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216600234U (en) | Heat dissipation moisture-proof type multilayer hard circuit board | |
| CN202121492U (en) | Power source and power source casing thereof | |
| CN105207609B (en) | A kind of intelligent wiring box of ventilation and heat | |
| CN218123406U (en) | Power device and power equipment | |
| CN211240293U (en) | Aluminum base material force calculation board | |
| CN110933923B (en) | Modular but diversion installation shield cover | |
| CN213462466U (en) | Circuit board with strippable heat-conducting glue | |
| CN210403721U (en) | Low-voltage aluminum grid double-layer chip structure | |
| CN201629939U (en) | Solid-state hard disk | |
| CN210379021U (en) | Battery protection board | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN208001413U (en) | A kind of six tube controller structure of electric vehicle | |
| CN206932465U (en) | A kind of porous heat dissipation type circuit board | |
| CN219395127U (en) | Flexible multilayer board easy to radiate heat | |
| CN212183801U (en) | Multilayer printed wiring board with heat dissipation function | |
| CN221227838U (en) | High-efficiency heat dissipation driving plate capable of improving space utilization rate | |
| CN214172412U (en) | High-integration intelligent power module, electric control assembly and air conditioner | |
| CN208985983U (en) | A kind of anti-tampering integrated circuit | |
| CN211656523U (en) | Heat dissipation type PCB board | |
| CN212587483U (en) | High-heat-dissipation semiconductor product and electronic product | |
| CN203134775U (en) | Embedding type power module | |
| CN108323129B (en) | Radiating structure of power device | |
| CN212463622U (en) | PCB circuit board convenient to installation electric capacity | |
| CN221177809U (en) | STB circuit board of explosion-proof structure | |
| CN216930507U (en) | Driver monitoring machine box small in size and convenient to radiate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |