CN216437812U

CN216437812U - Pump-free cooling device based on thermomagnetic effect

Info

Publication number: CN216437812U
Application number: CN202121856511.5U
Authority: CN
Inventors: 李庆刚; 周权; 郑明凯; 周明涵; 张小梦; 斯超; 韩龙
Original assignee: Zhejiang University of Technology ZJUT
Current assignee: Zhejiang University of Technology ZJUT
Priority date: 2021-08-10
Filing date: 2021-08-10
Publication date: 2022-05-03
Anticipated expiration: 2031-08-10

Abstract

A pump-free cooling device based on thermomagnetic effect comprises a PC pipe, a copper-aluminum composite fin radiator, a red copper block, a permanent magnet, a fan and a carbon nano tube/manganese zinc ferrite nano fluid, wherein a liquid injection hole sealed by a rubber plug is arranged above the red copper block, a porous nano metal layer is arranged inside the red copper block, and the bottom of the red copper block is tightly combined with an electronic chip through a buckle; the inner cavity of the PC tube is communicated with the inner cavity of the red copper block, and carbon nano tube/manganese zinc ferrite nano fluid serving as a heat-conducting medium is arranged in the inner cavity; the permanent magnet is sleeved on the fluid pipeline, and the inner cavity is not contacted with the fluid pipeline but supported by the silicone rubber gasket; the carbon nano tube/manganese zinc ferrite nano fluid flows through the copper-aluminum composite fin radiator, and the copper-aluminum composite fin radiator is positioned in the air outlet direction of the fan. The utility model reduces the equipment cost, the fluid flow can be controlled by the permanent magnet and the temperature, the structure is very simple, and the device can be completely closed.

Description

Pump-free cooling device based on thermomagnetic effect

Technical Field

The utility model relates to a cooling device of an electronic chip, belonging to the technical field of heat exchange.

Background

At present, power electronic equipment is widely applied to various aspects of people's life, in particular to important fields of national defense, military industry, communication and the like. Therefore, stable operation of power electronic equipment plays a significant role, and reliability of the power electronic equipment becomes a focus of much attention today.

Among the many factors that affect the reliability of power electronics, heat dissipation is a critical one. The working temperature of the common power electronic components has a certain limit range, and beyond this range, the performance of the components will be significantly reduced and the components cannot stably work, thereby affecting the reliability of the system operation. With the development of power electronic technology, processing technology and large-scale and ultra-large-scale integrated circuits, the heat dissipation problem of power electronic equipment is receiving more and more attention, especially in the field of high-power application. Therefore, in the product design, a proper heat dissipation mode is selected and reasonable design is carried out, so that the potential of the device is fully exerted, and one of the indispensable important links for improving the reliability of the equipment is realized.

At present, electronic devices are mainly cooled by two modes, namely fan cooling and liquid cooling. Air cooling usually needs the combined action of a plurality of fans, so that the problems of large noise, large volume, common refrigeration effect and the like exist in the practical use, along with the continuous increase of the power of an electronic chip, the cooling effect of air cooling gradually cannot meet the requirement, and liquid cooling is gradually adopted as a main cooling means. At present, a mechanical pump is often used for driving liquid to flow by using power for liquid cooling, but the existing mechanical pump often faces the problems of vibration of moving parts, noise, high power consumption and the like, meanwhile, the liquid water cooling design is complex, the related parts are more, liquid leakage is easily caused, and the electronic chip is damaged. The problem of low heat conductivity coefficient also exists when water is used as a common cooling working medium for liquid cooling, and the advantages of high heat conductivity coefficient, good heat transfer performance and the like of the nanofluid are gradually noticed, so that the water-based heat exchange working medium becomes a novel enhanced heat exchange working medium.

Disclosure of Invention

In order to overcome the defects that the existing mechanical pump often faces noise, leakage and vibration of moving parts, the utility model provides a pump-free cooling device based on thermomagnetic effect, the driving of the mechanical pump is not needed, the equipment cost is reduced, the fluid flow can be controlled by using a permanent magnet and temperature, the energy consumption is not needed, the device does not contain moving parts or electrodes, the structure is very simple, and the device can be completely closed.

The technical scheme adopted by the utility model for solving the technical problems is as follows:

a pump-free cooling device based on thermomagnetic effect comprises a PC pipe, a copper-aluminum composite fin radiator, a red copper block, a permanent magnet, a fan and a carbon nano tube/manganese zinc ferrite nano fluid, wherein a liquid injection hole sealed by a rubber plug is arranged above the red copper block, a porous nano metal layer is arranged inside the red copper block, and the bottom of the red copper block is tightly combined with an electronic chip through a buckle; the inner cavity of the PC tube is communicated with the inner cavity of the red copper block, and carbon nano tube/manganese zinc ferrite nano fluid serving as a heat-conducting medium is arranged in the inner cavity; the permanent magnet is sleeved on the fluid pipeline, and the inner cavity is not contacted with the fluid pipeline but supported by the silicone rubber gasket; the carbon nano tube/manganese zinc ferrite nano fluid flows through the copper-aluminum composite fin radiator, and the copper-aluminum composite fin radiator is positioned in the air outlet direction of the fan.

Further, the purple copper block is a cuboid with an inner hole, and the permanent magnet is cylindrical with the hole.

The carbon nano tube/manganese zinc ferrite nano fluid does not need an external mechanical pump as power, but spontaneously flows by depending on the thermomagnetic effect of the carbon nano tube/manganese zinc ferrite nano fluid. The radiator is a copper-aluminum composite fin, and a fan is applied to the outside of the radiator for cooling.

Furthermore, the interior of the heat conducting end red copper block is a porous nano metal layer, the inner cavity of the heat conducting end red copper block is a sudden expansion pipeline, the inner diameter of the pipeline of the PC pipe entering the red copper block is smaller, and the inner diameter of the red copper block is larger, so that the heat convection of the carbon nano tube/manganese zinc ferrite nanofluid is enhanced.

The nano fluid is carbon nano tube/manganese zinc ferrite nano fluid, the volume fraction of nano particles is 3-5%, the particle size of the nano particles is 10-30nm, and the base liquid of the nano fluid is ethylene glycol.

The utility model has the following beneficial effects:

1) the fluid can flow spontaneously without the driving of a mechanical pump, so that the defects of traditional equipment such as noise, energy consumption and the like are avoided, and the equipment cost is reduced.

2) The fluid flow can be controlled by the permanent magnet and the temperature without energy consumption.

3) The device does not contain moving parts or electrodes, has a very simple structure and can be completely closed.

5) The device has a self-regulating function in that as the thermal load increases, the difference in magnetisation within the fluid increases and the driving force increases, thereby causing the fluid to circulate at a faster rate and transfer heat away from the heat source more quickly.

6) The manganese-zinc ferrite of the temperature-sensitive magnetic fluid has the characteristics of proper Curie temperature and larger thermomagnetic coefficient, the carbon nano tube has high thermal conductivity, the manganese-zinc ferrite is prevented from agglomerating, the grain size of the material is reduced, and the like, the manganese-zinc ferrite is wrapped in the carbon nano tube to form carbon nano tube/manganese-zinc ferrite composite nano particles, and the nanofluid with high magnetization intensity and high thermal conductivity is formed.

7) The porous nano metal layer increases the contact area with the nano fluid and enhances the heat transfer of the chip to the fluid.

8) The finned radiator has small volume, simple structure and good radiating effect.

Drawings

FIG. 1 is a schematic diagram of the overall device structure of the present application

FIG. 2 is a schematic cross-sectional view of a red copper block of the present application

FIG. 3 is a schematic cross-sectional view of a permanent magnet according to the present application

In the figure: 1-a PC tube; 2-PVC90 degree elbow; 3-red copper block; 4-a permanent magnet; 5-steel-aluminum composite fin radiator; 6-a fan; 7-carbon nanotube/manganese zinc ferrite composite nanofluid; 8-silicone rubber gasket; 9-a porous nanometal layer; 10-liquid injection hole.

Detailed Description

The utility model is further described below with reference to the accompanying drawings.

Referring to fig. 1-3, a pumpless cooling device based on thermomagnetic effect comprises a PC pipe 1, a PVC 90-degree elbow 2, a red copper block 3, a permanent magnet 4, a steel-aluminum composite fin radiating pipe 5, a fan 6 and a liquid injection hole 10, wherein the PC pipe 1, the PVC 90-degree elbow 2, the red copper block 3 and the copper-aluminum composite finned pipe 5 jointly form a flow pipeline.

The carbon nano tube surface treated by the concentrated nitric acid needs 4% of mass fraction, the manganese zinc ferrite needs 2% of volume fraction, the manganese zinc ferrite is wrapped on the carbon nano tube, and water is added to be used as base liquid to form nano fluid with the particle size of nano particles being 10-30nm and the volume fraction being 3-5%. The carbon nanotube/manganese zinc ferrite nanofluid 7 combines the advantages of high thermal conductivity and high heat capacity of the carbon nanotubes and proper Curie temperature, large thermal magnetic coefficient and the like of manganese zinc ferrite, and forms the nanocomposite fluid suitable for cooling electronic devices.

The radiating end adopts a steel-aluminum composite fin radiating pipe 5, and the fan 6 is used for radiating. And the diameter of the pipeline of the radiator is larger, so that the radiator can simultaneously play a role of a water tank and contain more fluid. Because the volume flow is certain, the larger the sectional area is, the lower the flow velocity is, and the longer the fluid stays in the radiator, the better cooling effect can be achieved.

As shown in fig. 2, the red copper block 3 has high thermal conductivity, the bottom is a square structure, the exterior is tightly combined with the electronic chip through the fastener, the heat of the electronic chip is transferred to the interior of the red copper block, the interior is provided with a hole, and the porous nano metal layer 9 is tightly contacted with the carbon nano tube/manganese zinc ferrite composite nano material 7, so that the contact area can be increased, and the heat transfer can be enhanced. And a sudden expansion pipe is adopted at the inlet of the red copper block, so that strong disturbance is caused to the fluid, and the convection heat exchange of the fluid is enhanced.

As shown in fig. 3, the PC pipe 1, the permanent magnet 4, and the silicone rubber gasket 8 are included. The carbon nano tube/manganese zinc ferrite nanofluid 7 shows different performances under different magnetic field conditions, the hollow cylindrical galvanized rare earth neodymium iron boron N52 cylindrical perforated permanent magnet 4 is selected for the device, the inner cavity of the permanent magnet 4 is not contacted with a PC pipeline, but a silicone rubber pad is used as a support, and therefore a better action effect is achieved.

The embodiments described in this specification are merely examples of implementations of the inventive concepts, which are intended for illustrative purposes only. The scope of the present invention should not be construed as being limited to the particular forms set forth in the examples, but rather as being defined by the claims and the equivalents thereof which can occur to those skilled in the art upon consideration of the present inventive concept.

Claims

1. A no pump cooling device based on thermomagnetic effect which characterized in that: the device comprises a PC pipe, a copper-aluminum composite fin radiator, a red copper block, a permanent magnet, a fan and a nano fluid, wherein a liquid injection hole sealed by a rubber plug is arranged above the red copper block, a porous nano metal layer is arranged inside the red copper block, and the bottom of the red copper block is tightly combined with an electronic chip through a buckle; the inner cavity of the PC tube is communicated with the inner cavity of the red copper block, and the nano fluid in the inner cavity is used as a heat-conducting medium; the permanent magnet is sleeved on the fluid pipeline, and the inner cavity is not contacted with the fluid pipeline but supported by the silicone rubber gasket; the nanometer fluid flows through the copper-aluminum composite fin radiator, and the copper-aluminum composite fin radiator is positioned in the air outlet direction of the fan.

2. The thermo-magnetic effect based pumpless cooling device of claim 1, wherein: the red copper block is a cuboid with an inner hole, and the permanent magnet is cylindrical with the hole.

3. A pumpless cooling device based on thermomagnetic effect as claimed in claim 1 or 2, characterized in that: the interior of the red copper block is a porous nano metal layer, the inner cavity of the red copper block is a sudden expansion pipeline, the inner diameter of the pipeline for the PC pipe to enter the red copper block is smaller, and the inner diameter of the red copper block is larger, so that the convection heat exchange of the nanofluid is enhanced.