CN213363519U - Metal radiator - Google Patents

Metal radiator Download PDF

Info

Publication number
CN213363519U
CN213363519U CN202021760013.6U CN202021760013U CN213363519U CN 213363519 U CN213363519 U CN 213363519U CN 202021760013 U CN202021760013 U CN 202021760013U CN 213363519 U CN213363519 U CN 213363519U
Authority
CN
China
Prior art keywords
liquid metal
electromagnetic pump
metal
back flow
radiating fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202021760013.6U
Other languages
Chinese (zh)
Inventor
赵奕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Li Neng Innovation Technology Co ltd
Original Assignee
Shenzhen Li Neng Innovation Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Li Neng Innovation Technology Co ltd filed Critical Shenzhen Li Neng Innovation Technology Co ltd
Priority to CN202021760013.6U priority Critical patent/CN213363519U/en
Application granted granted Critical
Publication of CN213363519U publication Critical patent/CN213363519U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a metal radiator, including joint, radiating fin, electromagnetic pump, back flow, circulation case and flexible metal fiber, be equipped with on the joint radiating fin, the last flexible metal fiber that is equipped with of radiating fin, flexible metal fiber inboard is equipped with the circulation case, circulation case upper end is equipped with the back flow, the back flow upper end is equipped with the electromagnetic pump. The utility model discloses a liquid metal radiator dispels the heat, liquid metal has the thermal conductivity that is far above water, air and many non-metallic media, consequently, liquid metal chip radiator tradition water-cooling relatively can realize more efficient heat transport and limit heat-sinking capability, liquid metal's high conductance attribute makes its electromagnetic pump drive that can adopt no any moving part, the drive efficiency is high, the energy consumption is low, and do not have any noise moreover, liquid metal is difficult for evaporating, difficult leakage, it is safe nontoxic, materialization nature is stable.

Description

Metal radiator
Technical Field
The utility model relates to a radiator technical field particularly, relates to a metal radiator.
Background
As the degree of circuit integration advances with the prediction of moore's law, its performance and potential for development are closely related to heat dissipation technology. Although the global scientific and technological industry has successively explored cooling modes such as air cooling, heat pipe, water cooling and derivative technologies thereof, with the large-scale application of devices with higher power density, the traditional cooling technologies are approaching the limit, and metal generally has thermal conductivity far higher than that of non-metal materials, so that the metal has important application in some special occasions. If the computer is generally in the range of the weather temperature, if the liquid metal can be used as the cooling fluid in the temperature range, the computer can be expected to generate good heat dissipation performance. The liquid metal is a eutectic alloy with a low melting point, is liquid at normal temperature, can freely flow like water, but has the characteristics of metal, the heat conduction capability and the specific heat capacity of the metal are far higher than those of traditional heat conduction media such as water, and the metal is a new-generation innovative ideal heat conduction medium. The liquid metal technology is mainly applied to meeting the heat dissipation requirements in the fields of consumer electronics, computer communication, aerospace and the like.
The liquid metal has thermal conductivity far higher than that of water, so that heat in the chip can be taken away quickly and transmitted to the radiating fins in time; meanwhile, the leakage resistance of liquid metal is far better than that of water, and no water boils to generate huge pressure, so that the requirement of future high-performance computer hardware development can be met.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a metal radiator to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a metal radiator, includes joint, radiating fin, electromagnetic pump, back flow, circulation case and flexible metal fiber, be equipped with on the joint radiating fin, the last flexible metal fiber that is equipped with of radiating fin, flexible metal fiber inboard is equipped with the circulation case, circulation case upper end is equipped with the back flow, the back flow upper end is equipped with the electromagnetic pump.
Furthermore, both ends of the joint are provided with first connecting pipes, and the first connecting pipes are fixedly connected with the joint.
Furthermore, the circulation box is communicated with a return pipe, and the return pipe is communicated with the electromagnetic pump.
Furthermore, the electromagnetic pump both ends all are equipped with the second connecting pipe, electromagnetic pump and second connecting pipe intercommunication.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) the utility model relates to a metal radiator, the device adopts the liquid metal radiator to radiate heat, the liquid metal has thermal conductivity far higher than water, air and many non-metallic media, therefore, the liquid metal chip radiator can realize more efficient heat transport and ultimate heat radiation capability compared with the traditional water cooling, the high conductivity property of the liquid metal enables the liquid metal to be driven by an electromagnetic pump without any moving parts, the driving efficiency is high, the energy consumption is low, and no noise exists, the liquid metal is not easy to evaporate and leak, safe and nontoxic, the physicochemical property is stable, the liquid metal is easy to recover, is a very safe flowing working medium, the high efficiency of a heat radiation system can be ensured, the liquid metal is not easy to evaporate and leak, safe and nontoxic, the physicochemical property is stable, the device adopts the radiating fin formed by connecting flexible metal fibers to increase the radiating area, the efficiency of heat dissipation is enhanced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a metal heat sink according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an interior of a metal heat sink according to an embodiment of the present invention.
Reference numerals:
1. a joint; 2. a first connecting pipe; 3. a heat dissipating fin; 4. a second connecting pipe; 5. an electromagnetic pump; 6. a return pipe; 7. a flow-through box; 8. flexible metal fibers.
Detailed Description
The following, with reference to the drawings and the detailed description, further description of the present invention is made:
referring to fig. 1-2, according to the embodiment of the present invention, a metal heat sink includes a joint 1, a heat dissipation fin 3, an electromagnetic pump 5, a return pipe 6, a circulation box 7, and a flexible metal fiber 8, the heat dissipation fin 3 is disposed on the joint 1, the flexible metal fiber 8 is disposed on the heat dissipation fin 3, the circulation box 7 is disposed on the inner side of the flexible metal fiber 8, the return pipe 6 is disposed on the upper end of the circulation box 7, and the electromagnetic pump 5 is disposed on the upper end of the return pipe 6.
Through the above technical scheme of the utility model, connect 1 both ends and all be equipped with first connecting pipe 2, first connecting pipe 2 and connect 1 fixed connection, circulation case 7 and back flow 6 intercommunication, back flow 6 and electromagnetic pump 5 intercommunication, 5 both ends of electromagnetic pump all are equipped with second connecting pipe 4, electromagnetic pump 5 and 4 intercommunications of second connecting pipe.
When in specific application, the utility model relates to a metal radiator, the device adopts a liquid metal radiator to radiate heat, the liquid metal has thermal conductivity far higher than that of water, air and a plurality of non-metal media, therefore, the liquid metal chip radiator can realize more efficient heat transportation and ultimate heat radiation capability compared with the traditional water cooling, the high electrical conductivity property of the liquid metal enables the liquid metal to be driven by an electromagnetic pump 5 without any moving part, the driving efficiency is high, the energy consumption is low, and no noise exists, the liquid metal is not easy to evaporate and leak, safe and non-toxic, the physicochemical property is stable, the liquid metal is easy to recover, is a very safe flowing working medium, the high efficiency of a heat radiation system can be ensured, the liquid metal is not easy to evaporate and leak, safe and non-toxic, the physicochemical property is stable, the device adopts the heat radiation fin 3 formed by connecting flexible metal fibers 8 to increase the heat, the efficiency of heat dissipation is enhanced.
In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (4)

1. The utility model provides a metal radiator, its characterized in that, includes joint (1), radiating fin (3), electromagnetic pump (5), back flow (6), circulation case (7) and flexible metal fiber (8), be equipped with on joint (1) radiating fin (3), be equipped with on radiating fin (3) flexible metal fiber (8), flexible metal fiber (8) inboard is equipped with circulation case (7), circulation case (7) upper end is equipped with back flow (6), back flow (6) upper end is equipped with electromagnetic pump (5).
2. A metal radiator according to claim 1, wherein both ends of the joint (1) are provided with first connecting pipes (2), and the first connecting pipes (2) are fixedly connected with the joint (1).
3. A metal radiator according to claim 1, characterized in that the flow-through tank (7) communicates with a return pipe (6), the return pipe (6) communicating with the electromagnetic pump (5).
4. The metal radiator according to claim 1, wherein the electromagnetic pump (5) is provided with a second connecting pipe (4) at both ends, and the electromagnetic pump (5) is communicated with the second connecting pipe (4).
CN202021760013.6U 2020-08-21 2020-08-21 Metal radiator Active CN213363519U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021760013.6U CN213363519U (en) 2020-08-21 2020-08-21 Metal radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021760013.6U CN213363519U (en) 2020-08-21 2020-08-21 Metal radiator

Publications (1)

Publication Number Publication Date
CN213363519U true CN213363519U (en) 2021-06-04

Family

ID=76146343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021760013.6U Active CN213363519U (en) 2020-08-21 2020-08-21 Metal radiator

Country Status (1)

Country Link
CN (1) CN213363519U (en)

Similar Documents

Publication Publication Date Title
CN100590377C (en) Heat pipe cooling system and its heat transfer connector
CN203523220U (en) Hollow heat pipe radiator
CN103167780A (en) Combined type radiator for power module and combined type radiator assembly
CN103429061A (en) Empty-belly heat pipe radiator
WO2018191834A1 (en) Flat loop heat pipe-based notebook computer cooling system
CN107678524A (en) A kind of chip-cooling system
CN202485512U (en) Tank-channel type vapor chamber type heat pipe heat radiator
CN202352731U (en) Self-driving LED (Light-emitting Diode) radiating device cooled based on liquid metal thermosyphon effect
CN111741646A (en) Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell
CN107887356A (en) A kind of high-efficiency radiator for closed structure high heat flux device
CN207800588U (en) A kind of liquid metal heat radiation device
CN213363519U (en) Metal radiator
CN104125753B (en) The integrated hot expander of cavity type conductor fluid
CN202749364U (en) Annular heat pipe section material superconducting radiator
CN107357397A (en) A kind of novel C PU radiators
CN111664733A (en) Heat radiator combining micro-channel heat exchanger with heat pipe
CN217470614U (en) Breathing type dynamic liquid cooling device for processor
CN101212888B (en) Bionic power driven radiator that simulates cardiac structure
CN2834121Y (en) Remote forced liquid-cooled micro-grooves phase change heat radiation system
CN203083195U (en) Sealed box body imperforated silencing heat dissipating device
CN203131759U (en) Nanofluid superconducting radiator
CN206016995U (en) Stirling thermal engine operating cooler using liquid metal heat radiation
CN201886399U (en) Nano heat pipe type radiator for CPU (central processing unit) of laptop
CN114001571A (en) Closed-loop pulsating heat transfer pipe and heat dissipation heat exchanger
CN207704389U (en) A kind of finned liquid cooling heat radiator

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant