CN107887356A - A kind of high-efficiency radiator for closed structure high heat flux device - Google Patents
A kind of high-efficiency radiator for closed structure high heat flux device Download PDFInfo
- Publication number
- CN107887356A CN107887356A CN201710947362.5A CN201710947362A CN107887356A CN 107887356 A CN107887356 A CN 107887356A CN 201710947362 A CN201710947362 A CN 201710947362A CN 107887356 A CN107887356 A CN 107887356A
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- closed structure
- liquid
- heat
- pipeline
- radiating fin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of high-efficiency radiator for closed structure high heat flux device, it includes liquid metals pipeline and radiating fin, the liquid metals pipeline is filled with flowable liquid metals through in the radiating fin in the liquid metals pipeline.Also include transfer tube, the transfer tube is arranged on the liquid metals pipeline and for driving the liquid metal flow in liquid metals pipeline.The present invention makes liquid metal self-loopa cold drawing using processing modes such as monoblock cast or welding, and heat sink, heat sink, radiating fin, liquid metal pipeline are integrated, and farthest reduces system thermal resistance, and heat transfer efficiency is high；Liquid metal has the thermal conductivity far above water, air and many nonmetal mediums, therefore the relatively conventional water cooling of liquid metal heat radiation device can realize more efficient heat transportation and limit heat-sinking capability.
Description
Technical field
The invention belongs to technical field of heat dissipation, more particularly to a kind of collection liquid metal, forced air cooling device, transfer tube and one
The low energy consumption of body cold drawing, small size, high reliability novel efficient heat radiator.
Background technology
At present, as the raising of electronic functionalities, the integrated level and heat flow density of its device are also being obviously improved.Merely
Use forced air cooling can not meet thermal design index, and heater members need to be fixed on by liquid using traditional cold scheme of liquid
On cold plate, heat is effectively taken away by the liquid energy of flow.But the pact of traditional cold required secondary cooling device space of liquid
Shu Changchang turns into its restrictive design factor, while also brings along and managed under low temperature between energy consumption increase, traditional liquid low-temperature receiver and equipment
The problem of road connects.
Especially since the particularity of application environment, many electronic equipment requirements are using closed structure design and external world's tide
Wet, mould, salt fog air exclusion, thus can not with traditional fan directly to device radiating, it is necessary to heat sinking technology, by device
Heat is lasting, it is quick, efficiently export at equipment cover plate radiating fin, then cover plate fin is provided at a high speed, the stable gas of orientation
Stream, heat is distributed into equipment surrounding air.
In consideration of it, the present inventor provides a kind of high-efficiency radiator for closed structure high heat flux device,
It can effectively solve the problem that above-mentioned technical problem, obtain good radiating effect.
The content of the invention
It is an object of the invention to provide a kind of high-efficiency radiator for closed structure high heat flux device, it uses liquid
Body metal is circulated, and heat transfer efficiency is high and safe and reliable.
For the above-mentioned purpose, the present invention provides a kind of high-efficiency radiator for closed structure high heat flux device, its
Including liquid metals pipeline and radiating fin, the liquid metals pipeline is through in the radiating fin, and the liquid
Flowable liquid metals is filled with body metallic conduit.
The described high-efficiency radiator for closed structure high heat flux device, in addition to transfer tube, the transfer tube
It is arranged on the liquid metals pipeline and for driving the liquid metal flow in liquid metals pipeline.
The described high-efficiency radiator for closed structure high heat flux device, in addition to heat sink, the heat sink
Below the radiating fin.
The described high-efficiency radiator for closed structure high heat flux device, in addition to heat sink, the heat absorption
Device is located at below the heat sink and is used for the heat for absorbing closed structure heat-generating components inside.
The described high-efficiency radiator for closed structure high heat flux device, wherein the liquid metal pipeline, dissipate
Hot fin, heat sink and heat sink pass through monoblock cast or welded shaping.
The described high-efficiency radiator for closed structure high heat flux device, in addition to air blast cooling device, it is described
Forced air cooling device is arranged at the side of radiating fin and for cooling to radiating fin.
The described high-efficiency radiator for closed structure high heat flux device, wherein the forced air cooling device is recommended
But it is not limited to Piezoelectric Ceramic Fan.
The described high-efficiency radiator for closed structure high heat flux device, wherein the liquid metal is at room temperature
The metal of liquid can be presented.
The described high-efficiency radiator for closed structure high heat flux device, wherein the liquid metal be gallium, mercury,
Gallium base bianry alloy, gallium based multicomponent alloy, gallium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy.
The described high-efficiency radiator for closed structure high heat flux device, wherein：The transfer tube be electromagnetic pump,
Mechanical pump, piezoelectric pump or electrowetting pump.
The beneficial effects of the invention are as follows：
1st, liquid metal self-loopa cold drawing, heat sink, radiating fin are made using processing modes such as monoblock cast or welding
Piece, liquid metal pipeline are integrated, and farthest reduce system thermal resistance, and heat transfer efficiency is high；
2nd, liquid metal is not easy to evaporate, and is not easy to reveal, safe and non-toxic, and physico-chemical property is stable, easily reclaims, be it is a kind of very
The flow working medium of safety, it is ensured that the efficient, long-term of cooling system, stable operation.Present invention design liquid metal self-loopa
Pipe-line system is located at outside cover plate, prevented liquid leakage flow to device interior cause PCB short circuit danger；
3rd, liquid metal has the thermal conductivity far above water, air and many nonmetal mediums, therefore liquid metal heat radiation
The relatively conventional water cooling of device can realize more efficient heat transportation and limit heat-sinking capability；
4th, the high conductance attribute of liquid metal makes it to use the electromagnetic pump driving without any moving component, drive efficiency
Height, noiseless, energy consumption is low, thus performance is more reliable and more stable；
5th, provide cooling air-flow using forced air cooling device and blow to fin, ensure the smaller premise of radiator overall dimensions
Under improve the cooling effectiveness of fin.Air-flow only blows to fin, does not blow to device interior, therefore equipment can be set using closed structure
Meter and external world's humidity, mould, salt fog air exclusion.
Brief description of the drawings
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.Wherein：
Fig. 1 is the fundamental diagram according to the high-efficiency radiator of the present invention；
Fig. 2 is the top view according to the high-efficiency radiator of the present invention；
Fig. 3 is the stereogram according to the high-efficiency radiator of the present invention；
Fig. 4 is the side view according to the high-efficiency radiator of the present invention.
In the accompanying drawings, identical part uses identical reference.Accompanying drawing is not according to the ratio of reality.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
First, as shown in figure 1, it provides a kind of high efficiency and heat radiation for closed structure high heat flux device for the present invention
The fundamental diagram of device.The present invention operation principle be：Liquid metals pipeline 12 forms a loop and it is filled with liquid
Body metal, be provided with liquid metals pipeline 12 for absorb closed structure heat-generating components inside heat heat sink 11,
For driving the transfer tube 2 of liquid metal flow and radiating fin 13 and heat sink for being radiated to liquid metals
14.When the liquid metals in liquid metals pipeline 12 is absorbed to heat from heat sink 11, radiating fin 13 and heat sink 14
Liquid metals is radiated jointly.In addition, the wherein side of the radiating fin 13 and heat sink 14 is additionally provided with and forces wind
Device for cooling 3, for being radiated, being cooled to radiating fin 13 and heat sink 14, further strengthen the radiating effect to liquid metals
Fruit.
Specifically, as shown in Figures 2 to 4, high-efficiency radiator of the invention comprises at least：Liquid metal self-loopa integration
Cold drawing 1, transfer tube 2 and forced air cooling device 3.Wherein, the liquid metal self-loopa cold drawing 1 includes heat sink 11, liquid
Body metallic conduit 12, radiating fin 13 and heat sink 14, especially as shown in Fig. 2 the liquid metals pipeline 12 can use appoint
What shape bending is extended through in the radiating fin 13, and the heat sink 14 is positioned at the lower section of radiating fin 13, institute
Heat sink 11 is stated positioned at the lower section of heat sink 14 and is used for the heat for absorbing closed structure heat-generating components inside.
Preferably, the shape of the liquid metals pipeline 12 needs to design according to structure design, and titanium alloy can be selected in pipeline
The metallic conduits such as pipe, stainless steel tube, copper pipe.
Wherein, liquid metal self-loopa integration cold drawing 1 can use the processing modes such as monoblock cast or welding to absorb heat and fill
Put 11, liquid metal pipeline 12, radiating fin 13 and heat sink 14 to be made of one, so as to maximize reduction system thermal resistance.Wherein,
The structure of liquid metal self-loopa integration cold drawing 1 can derive as diversified forms such as cover plate, cavitys.
The transfer tube 2 is arranged on the liquid metals pipeline 12, and for driving in liquid metals pipeline 12
Liquid metal flow.Preferably, the transfer tube 2 is electromagnetic pump, mechanical pump, piezoelectric pump or electrowetting pump, but not limited to this.
In addition, the forced air cooling device 3 may be disposed at the side of radiating fin 13, for being dropped to radiating fin 13
Temperature, so as to cool to the liquid metals of liquid metals pipeline 12.Preferably, the forced air cooling device 3 is piezoelectric ceramics
Fan, but not limited to this.High from reliability, energy consumption is low, and noise is small and physical dimension is small, the flexible forced air cooling of mounting means
Device, pointedly it is laid out according to the specific constructive form of equipment to reach maximum radiating efficiency.
The liquid metal is gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, the gallium base that liquid can be presented at room temperature
Alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy.It should be noted that traditional liquid cooling heat radiation system makes radiating tube using pump
In coolant (water or organic solution) circulate and radiated.However, the liquid metal of flowing, which has, is far above nonmetallic stream
The thermal conductivity of body, therefore, water is substituted using liquid metal in theory, high heat-sinking capability can be obtained.The present invention utilizes drive
Dynamic pump 2 drives liquid metal flows to complete Heat transmission, and efficiency of thermal transfer is controlled by liquid metal flux.
The present invention has gathered the advantages of liquid metal high-efficiency heat conduction technology and forced air cooling heat loss through convection technology, with reference to advanced
Technique, devise a set of low energy consumption, small size, high reliability novel efficient heat radiator.The technical scheme is that：Fully profit
With the high thermal conductivity and mobility of liquid metal, using the liquid metal in transfer tube driving pipeline, a self-loopa heat is formed
Measure transport system, liquid metal continuously by device work caused by heat taken to from heat sink at radiating fin,
Forced air cooling device provides high speed, the steady air flow of orientation blows to fin, and the heat in fin is distributed into surrounding air, from
And the temperature of liquid metal in pipeline is reduced, the liquid metal after cooling flows to heat sink again, such iterative cycles, continues
Constantly heat is taken away from chip, reaches the effect for reducing device temperature.
In summary, the advantage of the invention is that：
1st, using the processing modes such as monoblock cast or welding make liquid metal self-loopa cold drawing, heat sink, heat sink,
Radiating fin, liquid metal pipeline are integrated, and farthest reduce system thermal resistance, and heat transfer efficiency is high；
2nd, liquid metal is not easy to evaporate, and is not easy to reveal, safe and non-toxic, and physico-chemical property is stable, easily reclaims, be it is a kind of very
The flow working medium of safety, it is ensured that the efficient, long-term of cooling system, stable operation.Present invention design liquid metal self-loopa
Pipe-line system is located at outside cover plate, prevented liquid leakage flow to device interior cause PCB short circuit danger；
3rd, liquid metal has the thermal conductivity far above water, air and many nonmetal mediums, therefore liquid metal heat radiation
The relatively conventional water cooling of device can realize more efficient heat transportation and limit heat-sinking capability；
4th, the high conductance attribute of liquid metal makes it to use the electromagnetic pump driving without any moving component, drive efficiency
Height, noiseless, energy consumption is low, thus performance is more reliable and more stable；
5th, provide cooling air-flow using forced air cooling device and blow to fin, ensure the smaller premise of radiator overall dimensions
Under improve the cooling effectiveness of fin.Air-flow only blows to fin, does not blow to device interior, therefore equipment can be set using closed structure
Meter and external world's humidity, mould, salt fog air exclusion.
Although by reference to preferred embodiment, invention has been described, is not departing from the situation of the scope of the present invention
Under, various improvement can be carried out to it and part therein can be replaced with equivalent.Especially, as long as being rushed in the absence of structure
Prominent, the every technical characteristic being previously mentioned in each embodiment can combine in any way.The invention is not limited in text
Disclosed in specific embodiment, but all technical schemes including falling within the scope of the appended claims.
Claims (10)
- A kind of 1. high-efficiency radiator for closed structure high heat flux device, it is characterised in that：Including liquid metals pipeline And radiating fin, the liquid metals pipeline are filled in the liquid metals pipeline through in the radiating fin There is flowable liquid metals.
- 2. the high-efficiency radiator according to claim 1 for closed structure high heat flux device, it is characterised in that：Also Including transfer tube, the transfer tube is arranged on the liquid metals pipeline and for driving the liquid in liquid metals pipeline Metal flow.
- 3. the high-efficiency radiator according to claim 1 for closed structure high heat flux device, it is characterised in that：Also Including heat sink, the heat sink is located at below the radiating fin.
- 4. the high-efficiency radiator according to claim 3 for closed structure high heat flux device, it is characterised in that：Also Including heat sink, the heat sink is located at below the heat sink and is used for the heat for absorbing closed structure heat-generating components inside Amount.
- 5. the high-efficiency radiator according to claim 4 for closed structure high heat flux device, it is characterised in that：Institute State liquid metal pipeline, radiating fin, heat sink and heat sink and pass through monoblock cast or welded shaping.
- 6. the high-efficiency radiator according to claim 1 for closed structure high heat flux device, it is characterised in that：Also Including air blast cooling device, the forced air cooling device is arranged at the side of radiating fin and for being dropped to radiating fin Temperature.
- 7. the high-efficiency radiator according to claim 6 for closed structure high heat flux device, it is characterised in that：It is excellent Selection of land, the forced air cooling device are Piezoelectric Ceramic Fan.
- 8. the high-efficiency radiator according to claim 1 for closed structure high heat flux device, it is characterised in that：Institute It is the metal that liquid can be presented at room temperature to state liquid metal.
- 9. the high-efficiency radiator according to claim 8 for closed structure high heat flux device, it is characterised in that：Institute It is gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, gallium-base alloy, bismuth-base alloy, mercury-base alloy or sodium potassium to state liquid metal Alloy.
- 10. the high-efficiency radiator according to claim 1 for closed structure high heat flux device, it is characterised in that： The transfer tube is electromagnetic pump, mechanical pump, piezoelectric pump or electrowetting pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947362.5A CN107887356B (en) | 2017-10-12 | 2017-10-12 | A kind of radiator for closed structure high heat flux density device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947362.5A CN107887356B (en) | 2017-10-12 | 2017-10-12 | A kind of radiator for closed structure high heat flux density device |
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| Publication Number | Publication Date |
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| CN107887356A true CN107887356A (en) | 2018-04-06 |
| CN107887356B CN107887356B (en) | 2019-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710947362.5A Active CN107887356B (en) | 2017-10-12 | 2017-10-12 | A kind of radiator for closed structure high heat flux density device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462162A (en) * | 2018-12-12 | 2019-03-12 | 云南电网有限责任公司电力科学研究院 | A kind of liquid metal heat radiation device |
| CN111629566A (en) * | 2020-06-12 | 2020-09-04 | 北京无线电测量研究所 | Piezoelectric driving liquid phase temperature equalizing device |
| CN113202714A (en) * | 2021-04-15 | 2021-08-03 | 恒大恒驰新能源汽车研究院(上海)有限公司 | Lighting device, heat dissipation assembly and driving pump |
| CN116581094A (en) * | 2023-05-10 | 2023-08-11 | 东莞宜安科技股份有限公司 | Liquid metal heat abstractor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203038911U (en) * | 2013-01-07 | 2013-07-03 | 北京依米康散热技术有限公司 | Heat radiation device based on liquid metal |
| CN104136873A (en) * | 2012-02-21 | 2014-11-05 | 华为技术有限公司 | Cooling system and method for cooling a heat generating unit |
| CN105914189A (en) * | 2016-04-20 | 2016-08-31 | 中国科学院理化技术研究所 | Micro-fluidic chip heat abstractor |
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2017
- 2017-10-12 CN CN201710947362.5A patent/CN107887356B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104136873A (en) * | 2012-02-21 | 2014-11-05 | 华为技术有限公司 | Cooling system and method for cooling a heat generating unit |
| CN203038911U (en) * | 2013-01-07 | 2013-07-03 | 北京依米康散热技术有限公司 | Heat radiation device based on liquid metal |
| CN105914189A (en) * | 2016-04-20 | 2016-08-31 | 中国科学院理化技术研究所 | Micro-fluidic chip heat abstractor |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462162A (en) * | 2018-12-12 | 2019-03-12 | 云南电网有限责任公司电力科学研究院 | A kind of liquid metal heat radiation device |
| CN111629566A (en) * | 2020-06-12 | 2020-09-04 | 北京无线电测量研究所 | Piezoelectric driving liquid phase temperature equalizing device |
| CN111629566B (en) * | 2020-06-12 | 2022-08-16 | 北京无线电测量研究所 | Piezoelectric driving liquid phase temperature equalizing device |
| CN113202714A (en) * | 2021-04-15 | 2021-08-03 | 恒大恒驰新能源汽车研究院(上海)有限公司 | Lighting device, heat dissipation assembly and driving pump |
| CN116581094A (en) * | 2023-05-10 | 2023-08-11 | 东莞宜安科技股份有限公司 | Liquid metal heat abstractor |
| CN116581094B (en) * | 2023-05-10 | 2024-04-12 | 东莞宜安科技股份有限公司 | Liquid metal heat abstractor |
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| Publication number | Publication date |
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| CN107887356B (en) | 2019-10-15 |
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