CN216435686U

CN216435686U - High-temperature high-humidity multi-pin box type alternating current film capacitor

Info

Publication number: CN216435686U
Application number: CN202123078619.9U
Authority: CN
Inventors: 陈益珊; 陈伟伟; 许航
Original assignee: Youpu Electronics Suzhou Co ltd
Current assignee: Youpu Electronics Suzhou Co ltd
Priority date: 2021-12-09
Filing date: 2021-12-09
Publication date: 2022-05-03
Anticipated expiration: 2031-12-09

Abstract

The utility model discloses a high-temperature high-humidity multi-pin box type alternating current thin film capacitor, which comprises a capacitor body and connecting pins symmetrically arranged at the bottom of the capacitor body, wherein a placing mechanism is arranged outside the capacitor body; the placing mechanism comprises a bottom plate, a frame plate and a top cover, cushion blocks are arranged at four corners of the upper surface of the bottom plate and are respectively arranged at four corners of the bottom of the capacitor body, and a filling cavity is arranged between the inside of the frame plate and the capacitor body. The outer box of whole condenser adopts the mode that can dismantle, splice to constitute, can splice according to the concatenation order in process of production to pour into epoxy resin into at the concatenation in-process, reduced the degree of difficulty of pouring into of filler between capacitor body and the box body, reduce production technology's the degree of difficulty, improve production efficiency.

Description

High-temperature high-humidity multi-pin box type alternating current film capacitor

Technical Field

The utility model relates to a condenser technical field especially relates to high temperature and high humidity many pins box-type AC film capacitor.

Background

The capacitor is a capacitor formed by two closely-spaced conductors insulated from each other, and is one of a large number of electronic components used in electronic devices, and is widely applied to the aspects of isolation of direct current and alternating current, coupling, bypass, filtering, tuning loop, energy conversion, control and the like in circuits.

According to the chinese patent that patent number is CN211858426U for the publication, the utility model provides a box-type film capacitor relates to the condenser field, including the core, the cladding of the core outside has the sealing layer, the cladding of the sealing layer outside has the moisture absorption layer, the cladding of the moisture absorption layer outside has the embedment layer, the embedment layer outside cover has the box body, the core is connected with the pin that runs through the box body and extend to the box body outside. In the utility model, the core body is prevented from being affected with damp by the sealing fit of multiple layers with different effects, and the service life of the core body is prolonged; secondly, the shell of the capacitor is made of polytetrafluoroethylene plastic, so that the capacitor has higher strength, and the shell made of tetrafluoroethylene is matched with the multilayer protection made of epoxy resin, so that the high temperature resistance of the capacitor is improved, and the applicability of the capacitor is stronger; and finally, a sealing sleeve is arranged at the joint of the shell and the pin, so that the sealing property of the joint of the pin and the shell is ensured. But be provided with sealing layer, hygroscopic layer and potting layer between above-mentioned capacitor core and the box body respectively, and the box body structure adopts the structure of integration to make and forms, has certain difficulty in the in-process of actual production.

Therefore, a high temperature and high humidity multi-pin box type ac thin film capacitor is needed to solve this problem.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides a high temperature and high humidity many pins box-type AC film capacitor, the outer box of whole condenser adopts the mode that can dismantle, splice to constitute, can splice according to the concatenation order in process of production to pour into epoxy resin into at the concatenation in-process, reduced the degree of difficulty of pouring into of filler between capacitor body and the box body, reduce the degree of difficulty of production technology, improve production efficiency.

In order to solve the technical problem, the utility model provides a following technical scheme: the high-temperature high-humidity multi-pin box type alternating current thin film capacitor comprises a capacitor body and connecting pins symmetrically arranged at the bottom of the capacitor body, wherein a placement mechanism is arranged outside the capacitor body;

the placing mechanism comprises a bottom plate, a frame plate and a top cover, cushion blocks are arranged at four corners of the upper surface of the bottom plate and are respectively arranged at four corners of the bottom of the capacitor body, and a filling cavity is arranged between the inside of the frame plate and the capacitor body.

As a preferred technical scheme of the utility model, the even array of deckle board lateral wall has radiating fin, and radiating fin is close to a lateral wall of deckle board and evenly is provided with the heat conduction post, the heat conduction post runs through and contacts in deckle board and tip and capacitor body lateral wall.

As an optimal technical scheme of the utility model, the draw-in groove has been seted up to the cushion upper surface, four turnings of capacitor body bottom are located four respectively in the draw-in groove.

As an optimized technical scheme of the utility model, the mounting groove with frame plate bottom looks adaptation is seted up to the bottom plate upper surface.

As an optimal technical scheme of the utility model, the top cap lower surface is provided with the fixture block with the inside looks adaptation of deckle board.

As an optimized technical scheme of the utility model, the slot with connection pin looks adaptation is seted up to the bottom plate.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is:

1. the outer box of the whole capacitor is formed in a detachable and splicing mode, splicing can be performed according to a splicing sequence in the production process, and epoxy resin is filled in the splicing process, so that the filling difficulty of fillers between the capacitor body and the box body is reduced, the difficulty of a production process is reduced, and the production efficiency is improved;

2. the capacitor working process generates heat, so that the temperature of the heat conduction column rises, the heat is transferred to the radiating fins through the heat conduction column, the temperature of the radiating fins rises, and the contact area between the radiating fins and the outside air is large, so that the temperature reduction speed of the radiating fins is increased, the heat generated by the working of the capacitor body is rapidly led out, and the radiating effect of the capacitor is improved.

Drawings

Fig. 1 is a schematic view of the top-view explosion structure of the present invention;

fig. 2 is a schematic view of the bottom-up explosion structure of the present invention;

fig. 3 is a schematic perspective view of the frame plate of the present invention;

fig. 4 is a schematic view of the assembly of the capacitor body and the bottom plate of the present invention;

FIG. 5 is a schematic view of the structure at A of FIG. 2 according to the present invention;

FIG. 6 is a schematic view of the structure of FIG. 3B according to the present invention;

fig. 7 is a schematic structural diagram of the point C in fig. 4 according to the present invention.

Wherein: 1. a capacitor body; 2. connecting pins; 3. a base plate; 4. a frame plate; 5. a top cover; 6. cushion blocks; 7. a heat dissipating fin; 8. a heat-conducting column; 9. a card slot; 10. mounting grooves; 11. a clamping block; 12. and (4) a slot.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the invention easy to understand, the invention is further explained below with reference to the specific embodiments, but the following embodiments are only the preferred embodiments of the invention, not all. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in fig. 1-7, the high temperature and high humidity multi-pin box type ac film capacitor comprises a capacitor body 1 and connecting pins 2 symmetrically arranged at the bottom of the capacitor body 1, wherein a placement mechanism is arranged outside the capacitor body 1;

the placing mechanism comprises a bottom plate 3, a frame plate 4 and a top cover 5, wherein cushion blocks 6 are arranged at four corners of the upper surface of the bottom plate 3, the cushion blocks 6 are respectively arranged at four corners of the bottom of the capacitor body 1, and a filling cavity is arranged between the interior of the frame plate 4 and the capacitor body 1;

place condenser body 1 on bottom plate 3, it is corresponding with cushion 6 with four turnings in condenser body 1 bottom, on arranging bottom plate 3 in with framed panel 4 after that, add epoxy in framed panel 4, epoxy is with condenser body 1's bottom and lateral wall cladding, cover top cap 5 at framed panel 4 top after that, the epoxy that will overflow from between top cap 5 and framed panel 4 erases totally, gap between with framed panel 4 and bottom plate 3 and top cap 5 is sealed through the sealing colloid after that, outer box adoption of whole condenser is dismantled, the mode of concatenation constitutes, can splice according to the concatenation order in process of production, and pour into epoxy at the concatenation in-process, the degree of difficulty of pouring into of filler between condenser body 1 and the box body has been reduced, reduce the degree of difficulty of production technology, improve production efficiency.

In other embodiments, the outer side wall of the frame plate 4 is uniformly arrayed with the heat dissipation fins 7, and one side wall of the heat dissipation fins 7 close to the frame plate 4 is uniformly provided with the heat conduction columns 8, and the heat conduction columns 8 penetrate through the frame plate 4 and the end parts of the heat conduction columns are contacted with the outer side wall of the capacitor body 1;

the condenser working process produces the heat, makes 8 temperature of heat conduction post risees, transmits heat to radiating fin 7 through heat conduction post 8, makes radiating fin 7's temperature rise, because the area of contact between radiating fin 7 and the outside air is bigger, improves the speed that radiating fin 7 temperature descends to derive the heat that 1 work of capacitor body produced rapidly, improved the radiating effect of condenser.

In other embodiments, the upper surface of the cushion block 6 is provided with the clamping grooves 9, and four corners of the bottom of the capacitor body 1 are respectively positioned in the four clamping grooves 9; in the draw-in groove 9 was put into to condenser body 1 bottom, improved the stability between condenser body 1 and the cushion 6, avoided connecting pin 2 to bear with the bottom plate 3 between the extrusion.

In other embodiments, the upper surface of the bottom plate 3 is provided with a mounting groove 10 matched with the bottom of the frame plate 4; the bottom of the frame plate 4 is arranged in the mounting groove 10, and then a gap between the frame plate and the frame plate is sealed through sealant, so that the connection sealing performance between the bottom plate 3 and the frame plate 4 is improved.

In other embodiments, the lower surface of the top cover 5 is provided with a fixture block 11 matched with the inside of the frame plate 4; the clamping block 11 is clamped with the frame plate 4, so that the matching firmness between the top cover 5 and the frame plate 4 is improved.

In other embodiments, the bottom plate 3 is provided with a slot 12 adapted to the connection pin 2; the connecting pins 2 are aligned to the slots 12, the capacitor body 1 is assembled on the bottom plate 3, and after the assembly is completed, the connecting pins 2 and the slots 12 are sealed through sealant, so that the sealing effect is improved.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

It should be noted that, the electric components in the present application, such as the power unit, the first motor, the second motor, and the like, are all connected to the external controller, and the external controller is the prior art, and the present application does not improve the present application, so that it is not necessary to disclose the specific model, the circuit structure, and the like of the external controller, and the integrity of the present application is not affected.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. High temperature and high humidity many pins box-type exchanges film capacitor, set up in connecting pin (2) of capacitor body (1) bottom including capacitor body (1) and symmetry, its characterized in that: a placing mechanism is arranged outside the capacitor body (1);

the placing mechanism comprises a bottom plate (3), a frame plate (4) and a top cover (5), cushion blocks (6) are arranged at four corners of the upper surface of the bottom plate (3), the cushion blocks (6) are respectively arranged at four corners of the bottom of the capacitor body (1), and a filling cavity is formed between the inner part of the frame plate (4) and the capacitor body (1).

2. The high temperature and high humidity multi-pin box type ac thin film capacitor as claimed in claim 1, wherein: the capacitor is characterized in that radiating fins (7) are uniformly arrayed on the outer side wall of the frame plate (4), heat-conducting columns (8) are uniformly arranged on one side wall, close to the frame plate (4), of the radiating fins (7), and the heat-conducting columns (8) penetrate through the frame plate (4) and contact the end part of the outer side wall of the capacitor body (1).

3. The high temperature and high humidity multi-pin box type ac thin film capacitor as claimed in claim 1, wherein: clamping grooves (9) are formed in the upper surface of the cushion block (6), and four corners of the bottom of the capacitor body (1) are located in the four clamping grooves (9) respectively.

4. The high temperature and high humidity multi-pin box type ac thin film capacitor as claimed in claim 1, wherein: the upper surface of the bottom plate (3) is provided with a mounting groove (10) matched with the bottom of the frame plate (4).

5. The high temperature and high humidity multi-pin box type ac thin film capacitor as claimed in claim 1, wherein: the lower surface of the top cover (5) is provided with a clamping block (11) matched with the interior of the frame plate (4).

6. The high temperature and high humidity multi-pin box type ac thin film capacitor as claimed in claim 1, wherein: the bottom plate (3) is provided with a slot (12) matched with the connecting pin (2).