CN216360142U - Novel buffering foam - Google Patents
Novel buffering foam Download PDFInfo
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- CN216360142U CN216360142U CN202122154464.6U CN202122154464U CN216360142U CN 216360142 U CN216360142 U CN 216360142U CN 202122154464 U CN202122154464 U CN 202122154464U CN 216360142 U CN216360142 U CN 216360142U
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Abstract
The utility model discloses novel buffering foam which comprises an upper heat-conducting silica gel layer, a static removing layer, an electromagnetic shielding layer, a foam layer, a lower heat-conducting silica gel layer, an adhesion layer and a plurality of temperature color changing adhesive tapes, wherein the foam layer comprises a first buffer layer and a second buffer layer, and a honeycomb-shaped buffer structure is arranged between the first buffer layer and the second buffer layer. The temperature color-changing adhesive tape is arranged to convert the temperature change of the foam body into visible temperature change which is fed back to people in time, so that the temperature condition of the adhered electronic element can be observed quickly by personnel conveniently, the intuition is strong, the position of the adhered electronic element damaged due to overhigh temperature can be known quickly, and the follow-up maintenance is facilitated; through setting up first buffer layer, second buffer layer and cellular buffer structure constitution multiple buffering and inhale the structure of shaking, the cotton buffering of novel buffering bubble that improves greatly absorbs the performance and the effect of assaulting, provides better buffering protection for being adhered electronic component.
Description
Technical Field
The utility model relates to the technical field of foam structures, in particular to novel buffering foam.
Background
With the rapid development of electronic products, the performance requirements of the electronic products are more and more strict, the buffer foam is widely applied to the electronic products, the existing buffer foam is mainly made by heating and adhering common PU foam and hot melt adhesive together through a mold, and EVA or PE foam is taken as a base material, one side or two sides of the base material are coated with solvent-type pressure-sensitive adhesive, and then release paper is compounded to manufacture the buffer foam. Has the functions of sealing, buffering and damping.
However, the buffering foam only has the functions of sealing and absorbing vibration, and has less functionality, so that the effects of eliminating electromagnetic waves and resisting static electricity are not achieved, the pollution to the environment is not thoroughly eliminated, the influence of static electricity on electronic elements is reduced, electromagnetic waves radiated by high-power elements in electronic equipment also threaten sensitive parts in electronic products, generate resonance and the like, and the service performance of the adhered electronic elements is influenced; the existing buffering foam only plays a buffering role through the loose structure of the existing buffering foam, but the buffering and vibration absorption effects are poor, the buffering and protection effects on the adhered electronic element are poor, and the adhered electronic element is easily damaged by external force factors; the existing buffering foam has poor heat conduction and heat dissipation performance, is easy to cause temperature accumulation, and can influence an adhered electronic element when the temperature is too high; the cotton no temperature prompt facility that has the buffering bubble, can't audio-visual knowing fast whether appear high temperature by adhesion electronic component, need closely contact or observe just can know, can't give people the temperature feedback through the mode of visual vision at once, the high temperature can lead to electronic component to damage, the accident takes place easily, there is certain potential safety hazard, and when electronic component leads to the damage because of the high temperature to need to be changed and maintained, can't know that electronic component fast because of the high position that leads to damaging of high temperature, influence the maintenance time.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a to present technique not enough, provide a novel buffering bubble is cotton.
The technical scheme adopted by the utility model for realizing the purpose is as follows:
the utility model provides a novel buffering bubble is cotton including the cotton body of bubble, the cotton body of bubble is including the heat conduction silica gel layer, destatic layer, electromagnetic shield layer, the cotton layer of bubble, lower heat conduction silica gel layer and adhesion layer in the range upon range of setting in proper order, it is equipped with many temperature adhesive tape that discolours to go up the heat conduction silica gel layer, go up the heat conduction silica gel layer and be equipped with the heat conduction structure down between the heat conduction silica gel layer, the heat conduction structure includes that a plurality of heat conduction spliced poles and both sides side connect the heat conduction piece, and is a plurality of the heat conduction spliced pole all is equipped with spiral buffer structure, two the heat conduction piece is connected to the avris is equipped with buffer structure one, the electromagnetic shield layer is equipped with reflection configuration, the cotton layer of bubble includes first buffer layer and second buffer layer, be equipped with cellular buffer structure between first buffer layer and the second buffer layer.
The improved structure comprises a static removing layer, an electromagnetic shielding layer and a foam layer, wherein the static removing layer, the electromagnetic shielding layer and the foam layer are provided with a plurality of through holes, the thickness of the foam layer is 3-8mm, the first buffer layer and the second buffer layer are respectively composed of an upper buffer layer and a lower buffer layer, the upper buffer layer and the lower buffer layer are provided with mutually staggered buffering bulges on opposite surfaces, the buffering bulges are of hemispherical structures, and the buffering bulges of the upper buffer layer are mutually staggered with the buffering bulges of the lower buffer layer.
The improved structure comprises an upper heat conduction silica gel layer, a lower heat conduction silica gel layer, a plurality of heat conduction connecting columns, a spiral buffer structure and a through hole, wherein the thickness of the upper heat conduction silica gel layer and the thickness of the lower heat conduction silica gel layer are both 0.5-2mm, the plurality of heat conduction connecting columns are respectively arranged in the through hole, one ends of the heat conduction connecting columns are connected with the bottom surface of the upper heat conduction silica gel layer, the other ends of the heat conduction connecting columns are connected with the upper surface of the lower heat conduction silica gel layer, the spiral buffer structure is arranged on the outer side surface of each heat conduction connecting column, and heat conduction filler is arranged between each heat conduction connecting column and the through hole.
The further improvement is that the thickness of the static removing layer is 0.5-1mm, the static removing layer is provided with a net structure, and conductive metal powder is doped into the net structure.
The improved electromagnetic shielding layer is 0.8-1.6mm thick, the electromagnetic shielding layer comprises a magnesium phenolic resin layer and a filler layer, the reflecting structure is arranged in the filler layer, and the reflecting structure comprises a plurality of grooves with cross sections of trapezoidal structures.
The improved structure comprises an adhesion layer, wherein the thickness of the adhesion layer is 1-1.5mm, the adhesion layer is provided with a plurality of grooves, the grooves are formed in the bottom of the adhesion layer, a plurality of first through holes are formed in the grooves, a plurality of contact heat-conducting blocks are arranged on a lower heat-conducting silica gel layer, a plurality of spiral-structure-connected heat-conducting columns are arranged on the contact heat-conducting blocks, the contact heat-conducting blocks are arranged in the grooves respectively, and the spiral-structure-connected heat-conducting columns penetrate through the first through holes respectively.
Further improvement is made, the adhesion layer is including gluing impressed watermark buffer portion by force and gluing parcel portion weakly, glue the impressed watermark buffer portion by force and distribute on the inboard surface in the bottom edge of adhesion layer, glue the impressed watermark buffer portion by force and be equipped with wavy impressed watermark, wavy impressed watermark upper surface covers the glue film.
The improved structure is characterized in that the weak adhesion wrapping part is arranged in the middle of the strong adhesion embossing buffering part, the surface of the weak adhesion wrapping part is provided with a glue dispensing area, and a plurality of glue dispensing points with small round dot structures are arranged in the glue dispensing area.
The improved structure is characterized in that the upper heat-conducting silica gel layer, the static removing layer, the electromagnetic shielding layer, the foam layer, the lower heat-conducting silica gel layer and the adhesion layer are sequentially adhered and fixed into a whole through the adhesive from top to bottom.
The improved structure is characterized in that the cross section of the first buffer structure is wavy, the head end of the first buffer structure is connected with the side of the upper heat-conducting silica gel layer, and the tail end of the lower heat-conducting silica gel layer is connected with the side of the lower heat-conducting silica gel layer.
The utility model has the beneficial effects that: according to the utility model, the multifunctional functions of high heat conduction, static elimination, electromagnetic interference resistance, buffer protection and the like are realized by arranging the upper heat-conducting silica gel layer, the static elimination layer, the electromagnetic shielding layer, the foam layer and the lower heat-conducting silica gel layer, so that the functionality is increased, and the comprehensive protection is provided for the adhered electronic element; the temperature color-changing adhesive tape formed by adopting the temperature color-changing material is used for converting the temperature change of the foam body into visible color change and feeding back the color change to people in time, the color change can be generated along with the rise of the temperature, so that the temperature condition of an adhered electronic element can be conveniently and quickly observed by the personnel, the influence of overhigh temperature on the adhered electronic element is prevented, the intuitiveness is strong, the position of the adhered electronic element damaged due to overhigh temperature can be quickly known, and the subsequent maintenance is convenient; the multi-buffering and vibration-absorbing structure is formed by arranging the first buffering structure, the first buffering layer, the second buffering layer, the honeycomb-shaped buffering structure and the strong glue embossing buffering part, so that the performance and effect of buffering and absorbing impact of novel buffering foam are greatly improved, and better buffering protection is provided for adhered electronic elements; the upper heat-conducting silica gel layer, the heat-conducting connecting column and the lower heat-conducting silica gel layer are arranged to provide heat transfer efficiency, and the direct contact area between the electronic component and the adhered electronic component is increased by combining the plurality of contact heat-conducting blocks, so that the heat transfer efficiency is increased, and the heat dissipation performance is improved; the novel buffering foam has the static removing function by arranging the static removing layer, and the reticular structure is arranged to improve the stress of the static removing layer, prevent the conductive metal powder from being unevenly distributed due to carrying or extrusion, influence the uniformity of static removing protection of the static removing layer and ensure the static removing effect of the static removing layer; the reflection structure is used for improving the electromagnetic reflectivity of the electromagnetic shielding layer, so that the electromagnetic shielding layer has strong, stable and reliable electromagnetic shielding performance, and the electromagnetic shielding requirement is improved.
The utility model is further described with reference to the following detailed description and accompanying drawings.
Drawings
Fig. 1 is a schematic view of the overall structure of the novel buffer foam of the present embodiment;
FIG. 2 is a schematic view of the bottom structure of the novel buffer foam of the present embodiment;
FIG. 3 is an exploded view of the novel buffer foam of the present embodiment;
fig. 4 is a schematic cross-sectional view of the electromagnetic shielding layer of the present embodiment;
FIG. 5 is a schematic cross-sectional view of the foam layer of the present embodiment;
FIG. 6 is a schematic cross-sectional view of the first buffer layer and the second buffer layer of the present embodiment;
fig. 7 is a schematic front view of the lower heat conductive silicone layer of the present embodiment.
Detailed Description
The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.
In the embodiment, referring to fig. 1 to 7, a novel buffer foam 1 comprises a foam body 2, wherein the foam body 2 comprises an upper heat-conducting silica gel layer 3, a static removing layer 4, an electromagnetic shielding layer 5, a foam layer 6, a lower heat-conducting silica gel layer 7 and an adhesion layer 8 which are sequentially stacked, the upper heat-conducting silica gel layer 3 is provided with a plurality of temperature color-changing adhesive tapes 9, the temperature color-changing adhesive tapes 9 are made of temperature color-changing materials, the temperature color-changing adhesive tapes 9 are used for converting the temperature change of the foam body 2 into visible and timely feeding back to people, the temperature color-changing adhesive tapes 9 can also generate color change along with the rise of temperature, so that the people can rapidly observe the temperature condition of an adhered electronic element, the influence of the overhigh temperature on the adhered electronic element is prevented, the intuitiveness of prompting is improved, and the position of the adhered electronic element damaged by the overhigh temperature can be rapidly known, be convenient for maintain, go up heat conduction silica gel layer 3 and be equipped with heat conduction structure 10 down between the heat conduction silica gel layer 7, heat conduction structure 10 includes that a plurality of heat conduction spliced poles 100 and both sides side are connected heat conduction piece 101, and is a plurality of heat conduction spliced pole 100 all is equipped with spiral buffer structure 1000, two heat conduction piece 101 is connected to the avris and is equipped with buffer structure 1010, two the cross section of buffer structure 1010 is wavy shape, two the head end of buffer structure 1010 with the avris of going up heat conduction silica gel layer 3 is connected, two the tail end of buffer structure 1010 with the avris of heat conduction silica gel layer 7 is connected down, electromagnetic shield 5 is equipped with reflection structure 50, bubble cotton layer 6 includes first buffer layer 60 and second buffer layer 61, be equipped with cellular buffer structure 62 between first buffer layer 60 and the second buffer layer 61.
The antistatic layer 4, the electromagnetic shielding layer 5 and the foam layer 6 are provided with a plurality of through holes, the thickness of the foam layer 6 is 3-8mm, the first buffer layer 60 and the second buffer layer 61 are both composed of an upper buffer layer 600 and a lower buffer layer 601, the opposite surfaces of the upper buffer layer 600 and the lower buffer layer 601 are both provided with buffer bulges 6000 which are mutually staggered, the buffer bulges 6000 are hemispherical structures, the buffer bulges 6000 of the upper buffer layer 600 and the buffer bulges 6000 of the lower buffer layer 601 are mutually staggered, gaps are reserved between the adjacent buffer bulges 6000, when pressure or impact force is generated, the buffer bulges 6000 can be embedded into the gaps on the other side to generate a buffer effect and provide a buffer protection effect, the first buffer layer 60, the second buffer layer 61 and the honeycomb buffer structure 62 are used for forming the foam layer 6 with a multi-buffer protection structure, greatly improve the performance of the foam layer 6 for absorbing impact and greatly improve the buffer protection performance of the novel buffer foam 1.
Go up heat conduction silica gel layer 3 and down the thickness of heat conduction silica gel layer 7 be 0.5-2mm, and is a plurality of heat conduction spliced pole 100 sets up respectively in the through-hole, heat conduction spliced pole 100 one end with the bottom surface of going up heat conduction silica gel layer 3 is connected, heat conduction spliced pole 100 the other end with the upper surface of heat conduction silica gel layer 7 is connected down, spiral buffer structure 1000 sets up on the 100 lateral surfaces of heat conduction spliced pole, be equipped with heat conduction filler between heat conduction spliced pole 100 and the through-hole, it is a plurality of heat conduction spliced pole 100 is used for improving heat conduction efficiency to improve heat transfer efficiency, improve the radiating effect, spiral buffer structure 1000 is used for providing the buffering and inhales the effect of shaking, prevents to appear because of the condition that external force leads to damaging by adhesion electronic component.
The thickness of the antistatic layer 4 is 0.5-1mm, the antistatic layer 4 is provided with a net-shaped structure 40, conductive metal powder is doped into the net-shaped structure 40, the net-shaped structure 40 is used for improving the stress of the antistatic layer 4, and meanwhile, the situation that the conductive metal powder is not uniformly distributed due to carrying or extrusion is prevented from occurring, the uniformity of antistatic protection of the antistatic layer 4 is influenced, and the antistatic performance of the antistatic layer 4 is guaranteed.
The thickness of the electromagnetic shielding layer 5 is 0.8-1.6mm, the electromagnetic shielding layer 5 comprises a magnesium phenolic resin layer 51 and a packing layer 52, the reflection structure 50 is arranged in the packing layer 52, the reflection structure 50 comprises a plurality of grooves with cross sections of trapezoidal structures, the packing layer 52 is a filling layer formed by mixing zeolite powder, graphite powder and nickel powder, the reflection structure 50 is used for improving the electromagnetic reflectivity, and the electromagnetic shielding layer 5 is used for providing strong, stable and reliable electromagnetic shielding performance and improving the electromagnetic shielding requirement.
The thickness of the adhesion layer 8 is 1-1.5mm, the adhesion layer 8 is provided with a plurality of grooves 80, the grooves 80 are formed in the bottom of the adhesion layer 8, the grooves 80 are provided with a plurality of first through holes, the lower heat-conducting silica gel layer 7 is provided with a plurality of contact heat-conducting blocks 70, the contact heat-conducting blocks 70 are provided with a plurality of spiral structure connection heat-conducting columns 71, the contact heat-conducting blocks 70 are respectively arranged in the grooves 80, the spiral structure connection heat-conducting columns 71 respectively penetrate through the first through holes, the contact heat-conducting blocks 70 are used for improving the direct contact area of the adhered electronic elements, so that the heat transfer efficiency is improved, the heat dissipation performance is improved, and the spiral structure connection heat-conducting columns 71 are used for providing a certain buffer protection effect.
The upper heat-conducting silica gel layer 3, the destaticizing layer 4, the electromagnetic shielding layer 5, the foam layer 6, the lower heat-conducting silica gel layer 7 and the adhesion layer 8 are sequentially adhered and fixed into a whole through the adhesive from top to bottom.
According to the utility model, the multifunctional functions of high heat conduction, static elimination, electromagnetic interference resistance, buffer protection and the like are realized by arranging the upper heat-conducting silica gel layer, the static elimination layer, the electromagnetic shielding layer, the foam layer and the lower heat-conducting silica gel layer, so that the functionality is increased, and the comprehensive protection is provided for the adhered electronic element; the temperature color-changing adhesive tape formed by adopting the temperature color-changing material is used for converting the temperature change of the foam body into visible color change and feeding back the color change to people in time, the color change can be generated along with the rise of the temperature, so that the temperature condition of an adhered electronic element can be conveniently and quickly observed by the personnel, the influence of overhigh temperature on the adhered electronic element is prevented, the intuitiveness is strong, the position of the adhered electronic element damaged due to overhigh temperature can be quickly known, and the subsequent maintenance is convenient; the multi-buffering and vibration-absorbing structure is formed by arranging the first buffering structure, the first buffering layer, the second buffering layer, the honeycomb-shaped buffering structure and the strong glue embossing buffering part, so that the performance and effect of buffering and absorbing impact of novel buffering foam are greatly improved, and better buffering protection is provided for adhered electronic elements; the upper heat-conducting silica gel layer, the heat-conducting connecting column and the lower heat-conducting silica gel layer are arranged to provide heat transfer efficiency, and the direct contact area between the electronic component and the adhered electronic component is increased by combining the plurality of contact heat-conducting blocks, so that the heat transfer efficiency is increased, and the heat dissipation performance is improved; the novel buffering foam has the static removing function by arranging the static removing layer, and the reticular structure is arranged to improve the stress of the static removing layer, prevent the conductive metal powder from being unevenly distributed due to carrying or extrusion, influence the uniformity of static removing protection of the static removing layer and ensure the static removing effect of the static removing layer; the reflection structure is used for improving the electromagnetic reflectivity of the electromagnetic shielding layer, so that the electromagnetic shielding layer has strong, stable and reliable electromagnetic shielding performance, and the electromagnetic shielding requirement is improved.
The present invention is not limited to the above embodiments, and other novel cushion foams obtained by using the same or similar structure or device as the above embodiments of the present invention are within the protection scope of the present invention.
Claims (10)
1. The utility model provides a novel buffering bubble is cotton which characterized in that: novel buffering bubble is cotton including the cotton body of bubble, the cotton body of bubble is including range upon range of setting gradually go up heat conduction silica gel layer, destaticization layer, electromagnetic shield layer, the cotton layer of bubble, heat conduction silica gel layer and adhesion layer down, it is equipped with many temperature adhesive tape that discolours to go up the heat conduction silica gel layer, it is equipped with the heat conduction structure to go up between heat conduction silica gel layer and the lower heat conduction silica gel layer, the heat conduction structure includes that a plurality of heat conduction spliced poles and both sides side connect the conducting block, and is a plurality of the heat conduction spliced pole all is equipped with spiral buffer structure, two the heat conduction block is connected to the avris is equipped with buffer structure one, the electromagnetic shield layer is equipped with reflection configuration, the cotton layer of bubble includes first buffer layer and second buffer layer, be equipped with cellular buffer structure between first buffer layer and the second buffer layer.
2. The novel buffer foam according to claim 1, characterized in that: the antistatic layer, the electromagnetic shielding layer and the foam layer are provided with a plurality of through holes, the thickness of the foam layer is 3-8mm, the first buffer layer and the second buffer layer are respectively composed of an upper buffer layer and a lower buffer layer, the upper buffer layer and the lower buffer layer are provided with mutually staggered buffering protrusions on opposite surfaces, the buffering protrusions are of hemispherical structures, and the buffering protrusions of the upper buffer layer are mutually staggered with the buffering protrusions of the lower buffer layer.
3. The novel buffer foam according to claim 2, characterized in that: the thickness of the upper heat-conducting silica gel layer and the thickness of the lower heat-conducting silica gel layer are both 0.5-2mm, the plurality of heat-conducting connecting columns are respectively arranged in the through holes, one ends of the heat-conducting connecting columns are connected with the bottom surface of the upper heat-conducting silica gel layer, the other ends of the heat-conducting connecting columns are connected with the upper surface of the lower heat-conducting silica gel layer, the spiral buffer structures are arranged on the outer side surfaces of the heat-conducting connecting columns, and heat-conducting fillers are arranged between the heat-conducting connecting columns and the through holes.
4. The novel buffer foam according to claim 3, wherein: the thickness of the static electricity removing layer is 0.5-1mm, the static electricity removing layer is provided with a net-shaped structure, and conductive metal powder is doped into the net-shaped structure.
5. The novel buffer foam according to claim 4, wherein: the thickness of the electromagnetic shielding layer is 0.8-1.6mm, the electromagnetic shielding layer comprises a magnesium phenolic resin layer and a filler layer, the reflecting structure is arranged in the filler layer, and the reflecting structure comprises a plurality of grooves with cross sections of trapezoidal structures.
6. The novel buffer foam according to claim 5, wherein: the thickness of adhesion layer is 1-1.5mm, the adhesion layer is equipped with a plurality of recesses, and is a plurality of the recess sets up the bottom of adhesion layer, and is a plurality of the recess all is equipped with a plurality of through-holes one, heat conduction silica gel layer is equipped with many contact heat conduction blocks down, and is many the contact heat conduction block all is equipped with a plurality of helical structure and connects the heat conduction post, and is many the contact heat conduction block sets up respectively in the recess, helical structure connects the heat conduction post and passes respectively through-hole one.
7. The novel buffer foam according to claim 6, wherein: the adhesion layer includes glues impressed watermark buffer portion by force and glues parcel portion weakly, it distributes on the inboard surface in the bottom edge of adhesion layer to glue impressed watermark buffer portion by force, it is equipped with the wave formula impressed watermark to glue the impressed watermark buffer portion by force, surface covering glue film on the wave formula impressed watermark.
8. The novel buffer foam according to claim 7, wherein: the weakly-adhesive wrapping part is arranged in the middle of the strongly-adhesive embossing buffer part, the surface of the weakly-adhesive wrapping part is provided with an adhesive dispensing area, and a plurality of adhesive dispensing points with small dot structures are arranged in the adhesive dispensing area.
9. The novel buffer foam according to claim 8, wherein: go up heat conduction silica gel layer, destatic layer, electromagnetic shield layer, bubble cotton layer, heat conduction silica gel layer and adhesion layer from top to bottom loop through the sticking agent laminating and fix an organic whole down.
10. The novel buffer foam of claim 9, wherein: and the cross section of the first buffer structure is wavy, the head end of the first buffer structure is connected with the side of the upper heat-conducting silica gel layer, and the tail end of the lower heat-conducting silica gel layer is connected with the side of the lower heat-conducting silica gel layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122154464.6U CN216360142U (en) | 2021-09-07 | 2021-09-07 | Novel buffering foam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122154464.6U CN216360142U (en) | 2021-09-07 | 2021-09-07 | Novel buffering foam |
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| Publication Number | Publication Date |
|---|---|
| CN216360142U true CN216360142U (en) | 2022-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122154464.6U Active CN216360142U (en) | 2021-09-07 | 2021-09-07 | Novel buffering foam |
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| CN (1) | CN216360142U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117641717A (en) * | 2024-01-24 | 2024-03-01 | 荣耀终端有限公司 | Heat conduction piece and electronic equipment |
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2021
- 2021-09-07 CN CN202122154464.6U patent/CN216360142U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117641717A (en) * | 2024-01-24 | 2024-03-01 | 荣耀终端有限公司 | Heat conduction piece and electronic equipment |
| CN117641717B (en) * | 2024-01-24 | 2024-05-17 | 荣耀终端有限公司 | Heat conduction piece and electronic equipment |
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