CN215855870U - Novel expansion heat dissipation gum fixed band - Google Patents
Novel expansion heat dissipation gum fixed band Download PDFInfo
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- CN215855870U CN215855870U CN202121936451.8U CN202121936451U CN215855870U CN 215855870 U CN215855870 U CN 215855870U CN 202121936451 U CN202121936451 U CN 202121936451U CN 215855870 U CN215855870 U CN 215855870U
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- base material
- heat dissipation
- expansion heat
- gum
- substrate
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Abstract
The utility model belongs to the field of back glue, and particularly relates to a novel expansion heat dissipation back glue fixing belt which comprises a base material, wherein a through groove is formed in the base material, a wave absorbing plate is wrapped in the base material, a plurality of uniformly distributed convex blocks are arranged on the upper surface and the lower surface of the base material, bonding layers are arranged on the surfaces of the convex blocks, and lining paper is bonded on the surfaces of the bonding layers. According to the utility model, the upper surface and the lower surface of the base material are respectively provided with the plurality of bumps which are made of the same material as the base material, and the surface of each bump is coated with the bonding layer of the polyester film, so that the base material is not divided into the upper surface and the lower surface, and can be used on both surfaces.
Description
Technical Field
The utility model relates to the field of back glue, in particular to a novel expansion heat dissipation back glue fixing belt.
Background
The back adhesive is one of the common adhesive tapes, and is commonly used for connecting and fixing electronic components and circuit boards. But current gum is film shape structure usually, leads to gum and electronic components and circuit board close fitting together, not only makes not being used for radiating space between electronic components and the circuit board, and the later stage is dismantled electric element from the circuit board in addition, is difficult to get off attached to the gum on electric element and circuit board, and current gum function singleness leads to the suitability more and more poor simultaneously. Therefore, improvements are needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a novel expansion heat dissipation gum fixing band, which solves the problems that the existing gum causes no gap for heat dissipation between an electronic component and a circuit board, the electrical component is difficult to remove the gum attached to the electrical component and the circuit board after being detached from the circuit board, and the existing gum has single function.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel expansion heat dissipation gum fixed band, includes the substrate, logical groove has been seted up to the inside of substrate, the inside cladding of substrate has the wave absorbing plate, the upper and lower surface of substrate all is provided with a plurality of evenly distributed's lug, the surface of lug is provided with the tie coat, the surface bonding of tie coat has the slip sheet.
Preferably, the number of the through grooves is four, and the four through grooves are uniformly distributed on the base material.
Preferably, the number of the wave absorbing plates is two, and the two wave absorbing plates are symmetrically distributed on the base material.
Preferably, the bonding layer is a polyester film, and the thickness of the bonding layer is 0.5 mm.
Preferably, the lining paper is silicone oil paper, and the thickness of the lining paper is 0.5 mm.
Preferably, the base material is PE foam, the thickness of the base material is 2mm, and the base material and the bump are made of the same material.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the upper surface and the lower surface of the base material are respectively provided with the plurality of bumps which are made of the same material as the base material, and the surface of each bump is coated with the bonding layer of the polyester film, so that the base material is not divided into the upper surface and the lower surface, and can be used on both surfaces.
2. According to the utility model, the four through grooves with the same aperture are designed on the basis of the base material, so that the base material has a good shock absorption effect, and the two wave absorbing plates are arranged in the base material, so that the interference of clutter on an electric element is reduced, and the anti-electromagnetic interference performance of the base material is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a side cross-sectional view of the present invention;
fig. 3 is a front view of the present invention.
In the figure: 1. a substrate; 2. a through groove; 3. a wave absorbing plate; 4. a bump; 5. a bonding layer; 6. interleaving paper.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a novel expansion heat dissipation back adhesive fixing band comprises a substrate 1, a through groove 2 is formed in the substrate 1, a wave absorbing plate 3 is wrapped in the substrate 1, a plurality of bumps 4 are uniformly distributed on the upper surface and the lower surface of the substrate 1, a bonding layer 5 is arranged on the surface of each bump 4, and a lining paper 6 is bonded on the surface of each bonding layer 5.
Referring to fig. 1, 2 and 3, the number of the through grooves 2 is four, and the four through grooves 2 are uniformly distributed on the substrate 1. The through grooves 2 enable the base material 1 to have a good cushioning effect.
Referring to fig. 1, 2 and 3, the number of the wave-absorbing plates 3 is two, and the two wave-absorbing plates 3 are symmetrically distributed on the substrate 1. The wave absorbing plate 3 can effectively reduce the interference of noise waves to the electric elements.
Referring to fig. 1, 2 and 3, the adhesive layer 5 is a polyester film, and the thickness of the adhesive layer 5 is 0.5 mm. The polyester film has good insulation, large adhesive force, high temperature resistance and good solvent resistance, and is suitable for the application in the electronic industry.
Referring to fig. 1, 2 and 3, the lining paper 6 is silicone oil paper, and the thickness of the lining paper 6 is 0.5 mm. The interleaving paper 6 functions to isolate the adhesive layer 5 from the outside.
Referring to fig. 1, 2 and 3, the substrate 1 is PE foam, the thickness of the substrate 1 is 2mm, and the substrate 1 and the bumps 4 are made of the same material. The substrate 1 and the bumps 4 form an integral structure.
The specific implementation process of the utility model is as follows: when the shock-absorbing lining paper is used, the lining paper 6 on one surface is torn off, the bonding layer 5 on one surface is exposed, the current surface is adhered to the circuit board, a palm applies certain pressure to the surface, which is used for tearing off the lining paper 6, to enable the bonding layer 5 to be better adhered to the circuit board, the lining paper 6 on the other surface is torn off, the electrical element is adhered to the bonding layer 5 exposed outside at the moment, because the two surfaces of the base material 1 are both provided with the plurality of lugs 4 which are made of the same material as the base material 1, the electrical element can be erected, a gap is reserved between the electrical element and the circuit board, the bonding area between the electrical element and the circuit board is reduced while the electrical element is well radiated, the base material 1 is convenient to be shoveled when the electrical element is dismounted in the later period, and the four through grooves 2 with the same aperture on the base material 1 can enable the base material 1 to have good shock-absorbing effect, and further enable the shock-absorbing effect to act on the electrical element, and the two wave absorbing plates 3 on the substrate 1 can effectively reduce the interference of noise waves on the electric elements.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a novel inflation heat dissipation gum fixed band, includes substrate (1), its characterized in that: the interior of substrate (1) has been seted up and has been led to groove (2), the inside cladding of substrate (1) has wave-absorbing plate (3), the upper and lower surface of substrate (1) all is provided with a plurality of evenly distributed's lug (4), the surface of lug (4) is provided with tie coat (5), the surface bonding of tie coat (5) has slip sheet (6).
2. The novel expansion heat dissipation gum fixing band of claim 1, wherein: the number of the through grooves (2) is four, and the four through grooves (2) are uniformly distributed on the base material (1).
3. The novel expansion heat dissipation gum fixing band of claim 1, wherein: the number of the wave absorbing plates (3) is two, and the two wave absorbing plates (3) are symmetrically distributed on the base material (1).
4. The novel expansion heat dissipation gum fixing band of claim 1, wherein: the adhesive layer (5) is a polyester film, and the thickness of the adhesive layer (5) is 0.5 mm.
5. The novel expansion heat dissipation gum fixing band of claim 1, wherein: the lining paper (6) is silicone oil paper, and the thickness of the lining paper (6) is 0.5 mm.
6. The novel expansion heat dissipation gum fixing band of claim 1, wherein: the base material (1) is PE foam, the thickness of the base material (1) is 2mm, and the base material (1) and the bump (4) are made of the same material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121936451.8U CN215855870U (en) | 2021-08-18 | 2021-08-18 | Novel expansion heat dissipation gum fixed band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121936451.8U CN215855870U (en) | 2021-08-18 | 2021-08-18 | Novel expansion heat dissipation gum fixed band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215855870U true CN215855870U (en) | 2022-02-18 |
Family
ID=80240597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121936451.8U Active CN215855870U (en) | 2021-08-18 | 2021-08-18 | Novel expansion heat dissipation gum fixed band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215855870U (en) |
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2021
- 2021-08-18 CN CN202121936451.8U patent/CN215855870U/en active Active
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