CN216274440U - Novel ceramic plate vertical electroplating protection clamp - Google Patents
Novel ceramic plate vertical electroplating protection clamp Download PDFInfo
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- CN216274440U CN216274440U CN202122676286.3U CN202122676286U CN216274440U CN 216274440 U CN216274440 U CN 216274440U CN 202122676286 U CN202122676286 U CN 202122676286U CN 216274440 U CN216274440 U CN 216274440U
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Abstract
A novel ceramic plate vertical electroplating protection clamp comprises a clamp main body and rubber coating clamps, wherein the clamp main body is in a plate shape, the clamp main body is a copper-clad plate with the thickness of 2-5 mm, 2-8 rectangular electroplating through grooves are formed in the clamp main body, the length of each electroplating through groove is 5-15 mm less than that of a ceramic plate to be processed, the width of each electroplating through groove is 5-15 mm less than that of the ceramic plate to be processed, each electroplating through groove is provided with a plurality of rubber coating clamps in a matching manner, and the rubber coating clamps are used for clamping the ceramic plate placed on the electroplating through grooves and the clamp main body together; still be provided with supplementary centre gripping in the anchor clamps main part and lead to the groove, supplementary centre gripping leads to the groove setting and is being electroplated between leading to the groove two adjacent, and the length that supplementary centre gripping led to the groove equals the length on adjacent limit that adjacent electroplating led to the groove, and the width that supplementary centre gripping led to the groove is more than or equal to 30 mm. The utility model has low cost and can be repeatedly used, and effectively solves the problem of high rejection rate of the ceramic substrate in the vertical electroplating process.
Description
Technical Field
The utility model belongs to the technical field of ceramic circuit board production, and particularly relates to a novel ceramic plate vertical electroplating protection clamp.
Background
Compared with other PCBs, the ceramic circuit board is calculated as a substitute of the old generation substrate, and can perfectly replace a metal substrate and a transparent substrate. The ceramic circuit board has the characteristics of high heat transfer, high insulating layer, stronger thermal deformation pairing index and the like, so the ceramic circuit board becomes a robber in the lighting lamp industry with high power.
However, the ceramic substrate is brittle and has a small material size (the maximum size is only 140mm 240mm), when the conventional vertical electroplating production line is used for electrically thickening a plate and plating copper and tin, a fixing bolt clamping device is adopted, the ceramic substrate is easily damaged due to the fact that the hanger screw is screwed too tightly, and the hanger screw is screwed too loosely and easily falls off, so that the ceramic substrate is difficult to process and has a high rejection rate.
Therefore, a novel ceramic plate vertical electroplating protection clamp needs to be designed.
Disclosure of Invention
The utility model aims to provide a novel ceramic plate vertical electroplating protection clamp to solve the problems that the existing ceramic substrate is difficult to process and has high rejection rate in the background technology.
In order to achieve the purpose, the utility model provides a novel ceramic plate vertical electroplating protection clamp which comprises a clamp main body and an encapsulating clamp, wherein the clamp main body is plate-shaped, the clamp main body is a copper-clad plate with the thickness of 2-5 mm, 2-8 rectangular electroplating through grooves are formed in the clamp main body, the length of each electroplating through groove is 5-15 mm less than that of a ceramic plate to be processed, the width of each electroplating through groove is 5-15 mm less than that of the ceramic plate to be processed, a plurality of encapsulating clamps are arranged in each electroplating through groove in a matched mode, and the encapsulating clamps are used for clamping the ceramic plate placed on the electroplating through grooves and the clamp main body together;
still be provided with supplementary centre gripping in the anchor clamps main part and lead to the groove, supplementary centre gripping leads to the groove setting and leads to between the groove at two adjacent electroplates, and the length that the groove was led to supplementary centre gripping equals the length on adjacent limit that the groove was led to adjacent electroplating, and the width that the groove was led to supplementary centre gripping more than or equal to 30mm, supplementary centre gripping lead to the groove and are used for making things convenient for package plastic clip to carry out the centre gripping.
In a specific embodiment, the clamp main body is further provided with a ceramic plate depth control clamping groove with the depth of 0.4-1.0 mm along the thickness direction on one side plate surface of the copper-clad plate around each electroplating through groove position, when the length of the ceramic plate to be processed is A and the width of the ceramic plate is B, the length of the ceramic plate depth control clamping groove is A, and the width of the ceramic plate depth control clamping groove is B.
In a specific embodiment, each electroplating through groove is matched with four encapsulating clamps, and the four encapsulating clamps are respectively clamped on four rectangular edges of the electroplating through groove.
In a specific embodiment, the copper-clad plate is an FR-4 copper-clad plate.
In a specific embodiment, the adhesive-coated clip is a non-conductive acid and alkali resistant adhesive-coated clip.
In a specific embodiment, four rectangular electroplating through grooves are formed in the clamp body.
In a specific embodiment, an edge auxiliary clamping groove is further formed in the edge of the plate of the clamp body, and the edge auxiliary clamping groove is also used for facilitating clamping of the rubber-coated clamp.
In a specific embodiment, the distance between the electroplating through groove and the plate edge of the clamp body is greater than or equal to 22 mm.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model relates to a low-cost reusable ceramic substrate vertical electroplating protection device, which effectively solves the problem of high rejection rate of a ceramic substrate in a vertical electroplating process.
In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic view of a clamp body according to one embodiment of the present invention;
FIG. 2 is a schematic illustration of a pinch-off according to one embodiment of the present invention;
wherein, 1, the clamp main body; 2. wrapping a rubber clamp; 11. electroplating through grooves; 12. an auxiliary clamping through groove; 13. the ceramic plate is depth-controlled and clamped into the groove; 14. the edge assists in gripping the slot.
Detailed Description
Embodiments of the utility model will be described in detail below with reference to the drawings, but the utility model can be implemented in many different ways, which are defined and covered by the claims.
The utility model provides a novel ceramic plate vertical electroplating protection clamp which comprises a clamp main body 1 and an encapsulating clamp 2, wherein the clamp main body 1 is plate-shaped, the clamp main body 1 is a copper-clad plate with the thickness of 2-5 mm, 2-8 rectangular electroplating through grooves 11 are arranged in the clamp main body 1, the length of each electroplating through groove 11 is 5-15 mm less than that of a ceramic plate to be processed, the width of each electroplating through groove 11 is 5-15 mm less than that of the ceramic plate to be processed, each electroplating through groove 11 is provided with a plurality of encapsulating clamps 2 in a matching manner, and each encapsulating clamp 2 is used for clamping the ceramic plate placed on the electroplating through groove and the clamp main body 1 together;
still be provided with supplementary centre gripping in anchor clamps main part 1 and lead to groove 12, supplementary centre gripping leads to groove 12 and sets up between two adjacent electroplating through groove 11, and the length that supplementary centre gripping led to groove 12 equals the length on adjacent limit that the groove 11 was led to adjacent electroplating, and the width more than or equal to 30mm that supplementary centre gripping led to groove 12, and supplementary centre gripping leads to groove 12 and is used for making things convenient for package plastic clip 2 to carry out the centre gripping.
Anchor clamps main part 1 still is provided with the ceramic plate accuse deep card that the degree of depth along thickness direction is 0.4 ~ 1.0mm on every electroplates one side face of leading to groove 11 position copper-clad plate all around and goes into groove 13, and when the length of waiting to process the ceramic plate was A, the width was B, and the length that the ceramic plate accuse deep card goes into groove 13 is A, and the width that the ceramic plate accuse deep card goes into groove 13 is B.
Every electroplating is led to groove 11 and is matchedly provided with four package glue clamps 2, and four package glue clamps 2 centre gripping are led to four rectangle edges of groove 11 at electroplating respectively.
The copper-clad plate is an FR-4 copper-clad plate.
The rubber coating clamp 2 is a non-conductive acid and alkali resistant rubber coating clamp.
Four rectangular electroplating through grooves 11 are formed in the clamp body 1.
The edge of the plate of the clamp body 1 is also provided with an edge auxiliary clamping groove 14, and the edge auxiliary clamping groove 14 is also used for facilitating clamping of the rubber coating clamp 2.
The distance between the electroplating through groove 11 and the plate edge of the clamp body 1 is more than or equal to 22 mm.
The jig body 1 is preferably made of an FR-4 copper clad plate with a thickness of 2mm, and the common electroplating through grooves 11 have the dimensions of 101 × 101mm, 114 × 114mm and 120 × 120mm, and the specific dimensions are selected according to the size of the ceramic plate.
The ceramic substrate is placed in the area of the electroplating through groove 11, the ceramic plate depth control clamping groove 13 is clamped, and the four sides of the electroplating through groove 11 are fixed by the glue wrapping clamps 2. The whole clamp body 1 adopts copper-clad plate outer layer copper to conduct electricity, can provide protection, support and conducting effect for the ceramic substrate, and effectively solves the problems of plate loss and cylinder falling in the vertical electroplating of the ceramic substrate.
The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions and substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (8)
1. A novel ceramic plate vertical electroplating protection clamp is characterized by comprising a clamp main body (1) and rubber coating clamps (2), wherein the clamp main body (1) is plate-shaped, the clamp main body (1) is a copper-clad plate with the thickness of 2-5 mm, 2-8 rectangular electroplating through grooves (11) are formed in the clamp main body (1), the length of each electroplating through groove (11) is 5-15 mm less than that of a ceramic plate to be processed, the width of each electroplating through groove (11) is 5-15 mm less than that of the ceramic plate to be processed, a plurality of rubber coating clamps (2) are arranged in each electroplating through groove (11) in a matching mode, and the rubber coating clamps (2) are used for clamping the ceramic plates placed on the electroplating through grooves and the clamp main body (1) together;
still be provided with supplementary centre gripping in anchor clamps main part (1) and lead to groove (12), supplementary centre gripping leads to groove (12) and sets up between two adjacent electroplating through groove (11), and the length that supplementary centre gripping led to groove (12) equals the length on adjacent limit that adjacent electroplating led to groove (11), and the width more than or equal to 30mm that supplementary centre gripping led to groove (12), and supplementary centre gripping leads to groove (12) and is used for making things convenient for package to glue and press from both sides (2) and carry out the centre gripping.
2. The novel ceramic plate vertical electroplating protection clamp according to claim 1, wherein a ceramic plate depth control clamping groove (13) with the depth of 0.4-1.0 mm in the thickness direction is further formed in the clamp body (1) on one side of the copper-clad plate around each electroplating through groove (11), when the length of a ceramic plate to be processed is A and the width of the ceramic plate to be processed is B, the length of the ceramic plate depth control clamping groove (13) is A, and the width of the ceramic plate depth control clamping groove (13) is B.
3. The novel ceramic plate vertical electroplating protection clamp as claimed in claim 1, wherein each electroplating through groove (11) is provided with four encapsulating clamps (2) in a matching manner, and the four encapsulating clamps (2) are respectively clamped on four rectangular edges of the electroplating through groove (11).
4. The novel ceramic plate vertical plating protection clamp of claim 1, wherein the copper-clad plate is an FR-4 copper-clad plate.
5. The novel ceramic plate vertical electroplating protection clamp according to claim 1, wherein the rubber coating clamp (2) is a non-conductive acid and alkali resistant rubber coating clamp.
6. The novel ceramic plate vertical plating protection jig as claimed in claim 1, wherein four rectangular plating through grooves (11) are provided in the jig main body (1).
7. The novel ceramic plate vertical electroplating protection clamp according to claim 1, characterized in that an edge auxiliary clamping groove (14) is further formed in the plate edge of the clamp body (1), and the edge auxiliary clamping groove (14) is also used for facilitating clamping of the rubber coating clamp (2).
8. The novel ceramic plate vertical plating protection clamp according to claim 1, characterized in that the distance between the plating through groove (11) and the plate edge of the clamp body (1) is greater than or equal to 22 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122676286.3U CN216274440U (en) | 2021-11-02 | 2021-11-02 | Novel ceramic plate vertical electroplating protection clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122676286.3U CN216274440U (en) | 2021-11-02 | 2021-11-02 | Novel ceramic plate vertical electroplating protection clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216274440U true CN216274440U (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122676286.3U Active CN216274440U (en) | 2021-11-02 | 2021-11-02 | Novel ceramic plate vertical electroplating protection clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216274440U (en) |
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2021
- 2021-11-02 CN CN202122676286.3U patent/CN216274440U/en active Active
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