CN216218290U - Flexible circuit board with splicing structure and convenient installation - Google Patents

Flexible circuit board with splicing structure and convenient installation Download PDF

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Publication number
CN216218290U
CN216218290U CN202122711833.7U CN202122711833U CN216218290U CN 216218290 U CN216218290 U CN 216218290U CN 202122711833 U CN202122711833 U CN 202122711833U CN 216218290 U CN216218290 U CN 216218290U
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China
Prior art keywords
circuit board
heat dissipation
flexible circuit
protective shell
spring
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CN202122711833.7U
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Chinese (zh)
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李峰
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Shenzhen Fuyuansheng Technology Co ltd
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Shenzhen Fuyuansheng Technology Co ltd
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Abstract

The utility model provides a flexible circuit board with a splicing structure and convenient installation, which belongs to the technical field of circuit boards, wherein a damping mechanism is fixedly arranged at the bottom of a protective shell, a heat dissipation mechanism is arranged in the protective shell, a flexible circuit board body is fixedly arranged on the surface of the heat dissipation mechanism, a fixed plate is attached to the top of the flexible circuit board body, waterproof silica gel layers are fixedly arranged on the tops of the protective shell and the fixed plate, a ball plunger is fixedly arranged on one side of the protective shell, a plunger hole is formed in the other side of the protective shell, a first spring is fixedly arranged in the plunger hole, and one end, far away from the inner wall of the plunger hole, of the first spring is fixedly connected with a baffle plate. Through the heat dissipation fins, the first heat dissipation hole and the second heat dissipation hole, heat generated when the circuit board operates can be cooled.

Description

Flexible circuit board with splicing structure and convenient installation
Technical Field
The utility model relates to the field of circuit boards, in particular to a flexible circuit board with a splicing structure and convenient installation.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, and the FPC circuit board is called as a flexible circuit board, and the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, and is used for the flexible circuit board better, so that the flexible circuit board is innovated and designed, and the flexible circuit board plays an important role in the development of the circuit board.
The current circuit board, because it does not have mosaic structure, installation operation is comparatively complicated to performance to this circuit board causes the influence, and because it does not have buffer structure, thereby can not guarantee the sound degree of the interior outer structure of this circuit board, can not satisfy people's operation requirement, current device can produce the heat when using moreover, and the unable rapid cooling of these heats mostly will exert an influence to the life of circuit board.
SUMMERY OF THE UTILITY MODEL
In order to remedy the above-mentioned shortcomings, the present invention provides a flexible circuit board with a splicing structure for easy mounting, which overcomes or at least partially solves the above-mentioned technical problems.
The utility model is realized by the following steps:
the utility model provides a flexible circuit board with a splicing structure and convenient installation, which comprises a protective shell, wherein a damping mechanism is fixedly installed at the bottom of the protective shell, a heat dissipation mechanism is installed inside the protective shell, a flexible circuit board body is fixedly installed on the surface of the heat dissipation mechanism, a fixed plate is arranged on the top of the flexible circuit board body in an attached mode, waterproof silica gel layers are fixedly installed on the tops of the protective shell and the fixed plate, a ball plunger is fixedly installed on one side of the protective shell, a plunger hole is formed in the other side of the protective shell, a first spring is fixedly installed inside the plunger hole, and one end, far away from the inner wall of the plunger hole, of the first spring is fixedly connected with a baffle.
Through the inside second spring and the mutual cooperation of third spring of damper, can realize buffering the lift of roof, can improve the shock attenuation performance of circuit board, and mutually support through bulb plunger and plunger hole, stopper and spacing groove mutually support, can realize the concatenation to the multiunit circuit board, thereby can reduce the complexity of circuit board installation operation, simple and easy installation, can improve the performance of circuit board, through the inside heat radiation fins of heat dissipation mechanism, first louvre and second louvre mutually support, can cool off the heat that produces when the circuit board moves, can protect the circuit board to a certain extent, can prolong the life of circuit board.
In a preferred scheme, damper includes the set casing, set casing fixed mounting is in the protective housing bottom, set casing inner wall fixed mounting has the second spring, the second spring is kept away from set casing inner wall one end fixedly connected with roof.
In a preferred scheme, roof bottom fixedly connected with bracing piece and third spring respectively, can realize the installation to second spring, bracing piece and third spring through the set casing, the bracing piece is kept away from roof one end and is run through the set casing outer wall, third spring fixed mounting can realize carrying out the shock attenuation to the protective housing through the bracing piece between roof and set casing, can realize carrying out the shock attenuation to the protective housing under the effect that second spring and third spring mutually supported to the realization protects the circuit board.
In a preferred scheme, heat dissipation mechanism includes first louvre, first louvre is seted up in the protective housing bottom, the protective housing inner wall is located first louvre and sets up a fixed mounting and has heat dissipation silica gel layer, can realize cooling the heat that the flexible circuit board body produced when moving through heat dissipation silica gel layer, can realize discharging the heat that conducts when cooling the flexible circuit board body to the heat dissipation silica gel layer through first louvre, flexible circuit board body fixed mounting is in heat dissipation silica gel layer surface.
In a preferred scheme, a second heat dissipation hole is formed in one side of the protective shell, heat dissipation fins are fixedly mounted at the position, located at the opening position of the second heat dissipation hole, of the outer wall of the protective shell, and the flexible circuit board body can be cooled through the heat dissipation fins.
From the above, one kind has mosaic structure easy to assemble's flexible circuit board, including the protective housing, protective housing bottom fixed mounting has damper, protective housing internally mounted has heat dissipation mechanism, heat dissipation mechanism fixed surface installs the flexible circuit board body, the laminating of flexible circuit board body top is provided with the fixed plate, the equal fixed mounting in protective housing and fixed plate top has the waterproof silica gel layer, protective housing one side fixed mounting has the bulb plunger, the plunger hole has been seted up to the protective housing opposite side, the inside fixed mounting in plunger hole has first spring, plunger hole inner wall one end fixedly connected with baffle is kept away from to first spring. According to the flexible circuit board with the splicing structure and convenient to install, the second spring is matched with the third spring, the shock absorption performance of the circuit board can be improved, the ball plunger is matched with the plunger hole, the limiting block is matched with the limiting groove, the circuit boards can be spliced, and heat generated when the circuit board runs can be cooled through the mutual matching of the heat dissipation fins, the first heat dissipation holes and the second heat dissipation holes in the heat dissipation mechanism.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a perspective view provided by an embodiment of the present invention;
FIG. 2 is a first partial perspective view provided by an embodiment of the present invention;
FIG. 3 is a second partial perspective view provided by an embodiment of the present invention;
FIG. 4 is a third partial perspective view provided by an embodiment of the present invention;
FIG. 5 is a fourth partial perspective view provided by an embodiment of the present invention;
fig. 6 is a front cross-sectional view of a damping mechanism according to an embodiment of the present invention.
In the figure: 101. a protective shell; 102. a flexible circuit board body; 103. a fixing plate; 104. a waterproof silica gel layer; 105. a ball plunger; 106. a plunger hole; 107. a first spring; 108. a baffle plate; 109. a groove; 110. mounting grooves; 111. mounting a plate; 112. a limiting block; 113. a limiting groove; 114. bolt holes; 200. a damping mechanism; 201. a stationary case; 202. a second spring; 203. a top plate; 204. a support bar; 205. a third spring; 300. a heat dissipation mechanism; 301. a first heat dissipation hole; 302. a heat dissipation silica gel layer; 303. a second heat dissipation hole; 304. and heat dissipation fins.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Examples
Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a flexible circuit board with mosaic structure easy to assemble, including protective housing 101, protective housing 101 bottom fixed mounting has damper 200, protective housing 101 internally mounted has heat dissipation mechanism 300, heat dissipation mechanism 300 fixed surface installs flexible circuit board body 102, the laminating of flexible circuit board body 102 top is provided with fixed plate 103, protective housing 101 and the equal fixed mounting in fixed plate 103 top have waterproof silica gel layer 104, protective housing 101 one side fixed mounting has bulb plunger 105, plunger hole 106 has been seted up to protective housing 101 opposite side, the inside fixed mounting in plunger hole 106 has first spring 107, plunger hole 106 inner wall one end fixedly connected with baffle 108 is kept away from to first spring 107.
The inside recess 109 of having seted up of protective housing 101, the equal fixed mounting of heat dissipation mechanism 300 and flexible circuit board body 102 is in recess 109, mounting groove 110 has been seted up to the recess 109 opening part, the equal fixed mounting in fixed plate 103 both sides has mounting panel 111, mounting groove 110 matches the setting with mounting panel 111, protective housing 101 one side fixed mounting has stopper 112, spacing groove 113 has been seted up to protective housing 101 one side, stopper 112 matches the setting with spacing groove 113, stopper 112 all sets up to four with spacing groove 113, bolt hole 114 has all been seted up to stopper 112 and spacing groove 113 inside, the bolt is installed to bolt hole 114 internal thread, be connected through the bolt between stopper 112 and the spacing groove 113.
Through the inside second spring 202 and the mutual cooperation of third spring 205 of damper 200, can realize cushioning the lift of roof 203, can improve the shock attenuation performance of circuit board, and mutually support with plunger hole 106 through bulb plunger 105, stopper 112 and spacing groove 113 mutually support, can realize the concatenation to the multiunit circuit board, thereby can reduce the complexity of circuit board installation operation, simple and easy installation, can improve the performance of circuit board, through the inside heat radiation fins 304 of heat dissipation mechanism 300, first louvre 301 and second louvre 303 mutually support, can cool off the heat that produces when the circuit board moves, can protect the circuit board to a certain extent, can prolong the life of circuit board.
Damping mechanism 200 includes set casing 201, set casing 201 fixed mounting is in protective housing 101 bottom, set casing 201 inner wall fixed mounting has second spring 202, set casing 201 inner wall one end fixedly connected with roof 203 is kept away from to second spring 202, roof 203 bottom is fixedly connected with bracing piece 204 and third spring 205 respectively, can realize second spring 202 through set casing 201, bracing piece 204 and third spring 205's installation, roof 203 one end is kept away from to bracing piece 204 runs through set casing 201 outer wall, third spring 205 fixed mounting is between roof 203 and set casing 201, can realize the support to protective housing 101 through bracing piece 204, can realize carrying out the shock attenuation to protective housing 101 under the effect of second spring 202 and third spring 205 mutually supporting, thereby realize protecting the circuit board.
The heat dissipation mechanism 300 comprises a first heat dissipation hole 301, the first heat dissipation hole 301 is formed in the bottom of the protective shell 101, the inner wall of the protective shell 101 is located at the position where the first heat dissipation hole 301 is formed and is fixedly provided with a heat dissipation silica gel layer 302, heat generated when the flexible circuit board body 102 operates can be cooled through the heat dissipation silica gel layer 302, heat conducted when the flexible circuit board body 102 is cooled through the heat dissipation silica gel layer 302 can be discharged through the first heat dissipation hole 301, the flexible circuit board body 102 is fixedly arranged on the surface of the heat dissipation silica gel layer 302, a second heat dissipation hole 303 is also formed in one side of the protective shell 101, the outer wall of the protective shell 101 is located at the position where the second heat dissipation hole 303 is formed and is fixedly provided with heat dissipation fins 304, and the flexible circuit board body 102 can be cooled through the heat dissipation fins 304.
Specifically, this flexible circuit board with mosaic structure easy to assemble's working process or theory of operation do: when the device is used, a user installs the heat dissipation silica gel layer 302 in the groove 109, then installs the circuit board on the surface of the heat dissipation silica gel layer 302, then mutually matches the installation groove 110 and the installation plate 111, fixes the fixing plate 103 in the groove 109 to fix the circuit board, then fixes the waterproof silica gel layer 104 on the surfaces of the protective shell 101 and the fixing plate 103, when a plurality of groups of circuit boards need to be spliced, the user can splice the plurality of groups of circuit boards through the ball plunger 105, the plunger hole 106, the limiting block 112 and the limiting groove 113 respectively, the service performance of the device can be improved, when the device is used for the circuit board, the user can start the heat dissipation fins 304, the heat generated by the circuit board can be discharged through the mutual matching of the first heat dissipation hole 301, the heat dissipation silica gel layer 302, the second heat dissipation hole 303 and the heat dissipation fins 304, and simultaneously the circuit board can be cooled, the temperature of the circuit board is reduced, so that the service life of the circuit board can be prolonged, when the device is used, once the device is collided, the top plate 203 is controlled to ascend and descend under the action of the supporting rod 204, the second spring 202 and the third spring 205 can be respectively extruded or stretched while the top plate 203 ascends and descends, and a certain damping effect can be achieved on the device.
It should be noted that the heat dissipation fins 304 are devices or apparatuses existing in the prior art or devices or apparatuses that can be realized by the prior art, and the power supply, the specific composition and the principle thereof are clear to those skilled in the art, and therefore, detailed descriptions thereof are omitted.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A flexible circuit board with a splicing structure and convenient installation comprises a protective shell (101), it is characterized in that a damping mechanism (200) is fixedly arranged at the bottom of the protective shell (101), the heat dissipation mechanism (300) is arranged in the protective shell (101), the surface of the heat dissipation mechanism (300) is fixedly provided with the flexible circuit board body (102), the top of the flexible circuit board body (102) is provided with a fixing plate (103) in an attaching way, the tops of the protective shell (101) and the fixing plate (103) are both fixedly provided with a waterproof silica gel layer (104), a ball plunger (105) is fixedly arranged on one side of the protective shell (101), a plunger hole (106) is formed in the other side of the protective shell (101), a first spring (107) is fixedly installed inside the plunger hole (106), and a baffle plate (108) is fixedly connected to one end, far away from the inner wall of the plunger hole (106), of the first spring (107).
2. The flexible circuit board with the splicing structure and convenient to mount according to claim 1, wherein the shock absorption mechanism (200) comprises a fixed shell (201), the fixed shell (201) is fixedly mounted at the bottom of the protective shell (101), a second spring (202) is fixedly mounted on the inner wall of the fixed shell (201), and a top plate (203) is fixedly connected to one end, far away from the inner wall of the fixed shell (201), of the second spring (202).
3. The flexible circuit board with the splicing structure for facilitating installation according to claim 2, wherein a support rod (204) and a third spring (205) are fixedly connected to the bottom of the top plate (203), respectively, one end of the support rod (204) far away from the top plate (203) penetrates through the outer wall of the fixed shell (201), and the third spring (205) is fixedly installed between the top plate (203) and the fixed shell (201).
4. The flexible circuit board with the splicing structure and convenient installation according to claim 1, wherein the heat dissipation mechanism (300) comprises a first heat dissipation hole (301), the first heat dissipation hole (301) is formed in the bottom of the protective shell (101), a heat dissipation silica gel layer (302) is fixedly installed at the position, where the first heat dissipation hole (301) is formed, of the inner wall of the protective shell (101), and the flexible circuit board body (102) is fixedly installed on the surface of the heat dissipation silica gel layer (302).
5. The flexible circuit board with the splicing structure convenient to mount as claimed in claim 4, wherein a second heat dissipation hole (303) is further formed in one side of the protective shell (101), and a heat dissipation fin (304) is fixedly mounted on the outer wall of the protective shell (101) at the position where the second heat dissipation hole (303) is formed.
6. The flexible circuit board with the splicing structure and convenient to mount according to claim 5, wherein a groove (109) is formed in the protective shell (101), the heat dissipation mechanism (300) and the flexible circuit board body (102) are both fixedly mounted in the groove (109), an installation groove (110) is formed in an opening of the groove (109), installation plates (111) are both fixedly mounted on two sides of the fixed plate (103), and the installation groove (110) and the installation plates (111) are arranged in a matching manner.
7. The flexible circuit board with the splicing structure convenient to mount according to claim 1, wherein a limiting block (112) is fixedly mounted on one side of the protective shell (101), a limiting groove (113) is formed in one side of the protective shell (101), the limiting block (112) and the limiting groove (113) are arranged in a matched manner, and the number of the limiting block (112) and the number of the limiting groove (113) are four.
8. The flexible circuit board with the splicing structure convenient to mount according to claim 7, wherein bolt holes (114) are formed in the limiting block (112) and the limiting groove (113), bolts are mounted in the bolt holes (114) through internal threads, and the limiting block (112) is connected with the limiting groove (113) through the bolts.
CN202122711833.7U 2021-11-08 2021-11-08 Flexible circuit board with splicing structure and convenient installation Active CN216218290U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122711833.7U CN216218290U (en) 2021-11-08 2021-11-08 Flexible circuit board with splicing structure and convenient installation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122711833.7U CN216218290U (en) 2021-11-08 2021-11-08 Flexible circuit board with splicing structure and convenient installation

Publications (1)

Publication Number Publication Date
CN216218290U true CN216218290U (en) 2022-04-05

Family

ID=80905453

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122711833.7U Active CN216218290U (en) 2021-11-08 2021-11-08 Flexible circuit board with splicing structure and convenient installation

Country Status (1)

Country Link
CN (1) CN216218290U (en)

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