CN219146018U - Multilayer circuit board with shockproof base - Google Patents
Multilayer circuit board with shockproof base Download PDFInfo
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- CN219146018U CN219146018U CN202223406819.7U CN202223406819U CN219146018U CN 219146018 U CN219146018 U CN 219146018U CN 202223406819 U CN202223406819 U CN 202223406819U CN 219146018 U CN219146018 U CN 219146018U
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- circuit board
- radiating fins
- connecting rod
- mounting
- limiting
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Abstract
The utility model discloses a multilayer circuit board with a shockproof base, which relates to the technical field of logistics equipment, and aims to solve the technical problems that the circuit board is wrapped in a shell, heat dissipation of the circuit board is affected, the heat dissipation is not fast, the circuit board is scalded for a long time, and normal use of the circuit board is easily affected; the circuit board mounting assemblies are arranged on the outer sides of the upper circuit board and the lower circuit board, first radiating fins which are uniformly distributed are arranged on the left side of the limiting assembly, second radiating fins are arranged on the right side of the limiting assembly, and a third connecting rod is fixedly arranged on the inner side of the limiting assembly; the circuit board can transfer heat of the circuit board more quickly through the arrangement of the first radiating fins and the second radiating fins, and the radiating effect is better.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a multilayer circuit board with a shockproof base.
Background
Nowadays, with the continuous development of science and technology, the application of the circuit board in electronic equipment is also more and more widespread, the performance of the circuit board is also greatly improved, and in order to meet the equipment requirement, the circuit board also combines a plurality of layers of circuit boards from a single layer, so that more electronic elements are distributed on the circuit board at the same time, and the requirements on vibration prevention, heat dissipation and the like are higher when the circuit board is used.
Therefore, the utility model of patent number CN202122855526.6 discloses a circuit board with shockproof effect, including shockproof shell, dust cover, circuit board body and damping device, shockproof shell is square cavity structure, the inside circuit board body that is equipped with of shockproof shell, the circuit board body is fixed with the shockproof shell through damping device, the shockproof shell bottom is equipped with the shock pad, the shock pad is glued fixedly with the shockproof shell, the shockproof shell top is equipped with the dust cover, dust cover and shockproof shell fixed connection, this circuit board passes through damping device with the circuit board fixed in the shockproof shell, shock that the shockproof shell receives is reduced through the shock pad to the shockproof shell bottom, damping device further reduces the shock that the shockproof shell produced the circuit board, the shock-proof capacity of circuit board has effectively been improved, simultaneously the circuit board is not contacted with the shockproof shell, make circuit board and air contact in a large scale, increase circuit board heat dissipation capacity. But circuit board parcel in this scheme is inside the casing, because the shell that takes precautions against earthquakes only has partial region to be equipped with the louvre, and the inside air velocity of flow of casing is slower, influences the heat dissipation of circuit board, after the air temperature in the shell that takes precautions against earthquakes risees, can lead to the circuit board heat dissipation not fast, has for a long time the circuit board can send out scalding, influences its normal use easily.
Therefore, aiming at the problem that the heat dissipation of the circuit board is not rapid, the problem needs to be solved so as to improve the service scene of the circuit board.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the utility model aims to provide a multilayer circuit board with a shockproof base, which aims to solve the technical problems that the circuit board is wrapped in a shell, heat dissipation of the circuit board is affected, the heat dissipation is not fast, the circuit board is scalded for a long time, and the normal use of the circuit board is easily affected in the prior art.
(2) Technical proposal
In order to solve the technical problems, the utility model provides a multilayer circuit board with a shockproof base, which comprises an upper layer circuit board, a lower layer circuit board arranged on the lower side of the upper layer circuit board, limit assemblies arranged on the left and right sides of the upper layer circuit board and the lower layer circuit board, and a shock absorption supporting assembly arranged on the lower side of the limit assemblies; the circuit board comprises an upper circuit board and a lower circuit board, wherein a circuit board installation assembly is arranged on the outer side of the upper circuit board, first radiating fins are uniformly distributed on the left side of the limiting assembly, second radiating fins are arranged on the right side of the limiting assembly, a third connecting rod is fixedly arranged on the inner side of the limiting assembly, and grooves corresponding to the first radiating fins and the second radiating fins are formed in the surface of the third connecting rod.
When the circuit board of the technical scheme is used, an upper circuit board and a lower circuit board are firstly respectively installed on different circuit board installation components, after the circuit board installation components fixed by the lower circuit board and the circuit board installation components fixed by the upper circuit board are sequentially fixed on a limiting component and are fixed by bolts, after the circuit board is fixed, a first radiating fin and a second radiating fin are installed on a third connecting rod on the inner side of the limiting component, after the circuit board is installed, the whole circuit board is fixed at a position required to be installed in equipment, and then the upper circuit board and the lower circuit board are connected with a connecting wire or an interface of the equipment; the heat of the circuit board can be transferred out more quickly through the arrangement of the first radiating fins and the second radiating fins, the radiating effect is better, vibration of the whole circuit board can be reduced in the running process of equipment through the arrangement of the damping support component, so that the pulling degree between the circuit board and the electric connecting wire is reduced, the connection part of the circuit board and the electric connecting wire is prevented from being damaged, the position of the circuit board installation component can be adjusted through the arrangement of the limiting component, the distance between two groups of circuit boards is adjusted according to the specification of the electronic component on the circuit board, and mutual collision of the electronic components is avoided.
Further, the shock attenuation supporting component is including supporting the base, support base upside fixed mounting has the telescopic link, telescopic link evenly distributed is in support the base upside, through the setting of base, conveniently install whole circuit board in the position that needs the installation.
Still further, the telescopic link outside is equipped with elastic element, telescopic link upside fixed mounting has the backup pad, the backup pad with the logical groove has been seted up on support base surface, through the mutual cooperation between telescopic link and the elastic element, can play certain cushioning effect, protection circuit board better.
Still further, circuit board installation component includes first mounting panel, first mounting panel right side is equipped with the second mounting panel, first mounting panel with the inboard fixedly connected with head rod of second mounting panel, through the setting of head rod, can be with first mounting panel and second mounting panel interconnect together.
Still further, the head rod front side is equipped with the second connecting rod, first mounting panel with second mounting panel outside fixed mounting has the stopper, the stopper outside is equipped with the installation piece, through the setting of stopper, can place whole circuit board installation component on spacing subassembly.
Still further, spacing subassembly includes first bracing piece, first bracing piece rear side is equipped with the second bracing piece, third connecting rod fixed mounting first bracing piece with the second bracing piece is inboard, can fix the third connecting rod through first bracing piece and second bracing piece.
Still further, the spacing groove has been seted up on first bracing piece with the second bracing piece surface, evenly distributed's mounting hole has been seted up in the spacing groove outside, through mutually supporting between mounting hole and the installation piece, can be with fixing the installation piece on first bracing piece and second bracing piece.
(3) Advantageous effects
Compared with the prior art, the utility model has the beneficial effects that: the circuit board can transfer heat of the circuit board more quickly through the arrangement of the first radiating fins and the second radiating fins, the heat dissipation effect is better, vibration of the whole circuit board can be reduced in the running process of equipment through the arrangement of the damping support assembly, so that the pulling degree between the circuit board and the electric connecting wire is reduced, the connection part of the circuit board and the electric connecting wire is prevented from being damaged, the position of the circuit board mounting assembly can be adjusted through the arrangement of the limiting assembly, and the distance between the two groups of circuit boards is adjusted according to the specification of electronic components on the circuit board, so that heat dissipation is facilitated more and mutual collision of the electronic components can be avoided.
Drawings
FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a shock absorbing support assembly according to an embodiment of the present utility model;
fig. 3 is a schematic structural view of a circuit board mounting assembly according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a limiting component in an embodiment of the circuit board of the present utility model.
The marks in the drawings are: 1. an upper layer circuit board; 2. a lower layer circuit board; 3. a circuit board mounting assembly; 4. a limit component; 5. a shock absorbing support assembly; 6. a first heat radiating fin; 7. a second heat radiating fin; 8. a third connecting rod; 9. a groove; 10. a support base; 11. a support plate; 12. a telescopic rod; 13. an elastic element; 14. a first mounting plate; 15. a second mounting plate; 16. a first connecting rod; 17. a second connecting rod; 18. a limiting block; 19. a mounting block; 20. a first support bar; 21. a second support bar; 22. a limit groove; 23. and (5) mounting holes.
Detailed Description
The structural schematic diagram of the multilayer circuit board with the shockproof base is shown in fig. 1, and the circuit board comprises an upper layer circuit board 1, a lower layer circuit board 2 arranged on the lower side of the upper layer circuit board 1, limit components 4 arranged on the left side and the right side of the upper layer circuit board 1 and the lower layer circuit board 2, and a shock absorption supporting component 5 arranged on the lower side of the limit components 4; the circuit board mounting assembly 3 is arranged on the outer side of the upper circuit board 1 and the outer side of the lower circuit board 2, the first radiating fins 6 which are uniformly distributed are arranged on the left side of the limiting assembly 4, the second radiating fins 7 are arranged on the right side of the limiting assembly 4, a third connecting rod 8 is fixedly arranged on the inner side of the limiting assembly 4, and grooves 9 corresponding to the first radiating fins 6 and the second radiating fins 7 are formed in the surface of the third connecting rod 8.
For the present embodiment, the model and specification of the upper layer wiring board 1 and the lower layer wiring board 2 may be set as needed.
The damping support assembly 5 comprises a support base 10, telescopic rods 12 are fixedly mounted on the upper side of the support base 10, the telescopic rods 12 are uniformly distributed on the upper side of the support base 10, elastic elements 13 are arranged on the outer side of the telescopic rods 12, a support plate 11 is fixedly mounted on the upper side of the telescopic rods 12, through grooves are formed in the rear side of the support plate 11 and the surface of the support base 10, the circuit board mounting assembly 3 comprises a first mounting plate 14, a second mounting plate 15 is arranged on the right side of the first mounting plate 14, a first connecting rod 16 is fixedly connected to the inner side of the first mounting plate 14, a second connecting rod 17 is arranged on the front side of the first connecting rod 16, a limiting block 18 is fixedly mounted on the outer side of the first mounting plate 14, a mounting block 19 is arranged on the outer side of the second mounting plate 15, the limiting assembly 4 comprises a first supporting rod 20, a second supporting rod 21 is fixedly mounted on the rear side of the first supporting rod 20 and the inner side of the second supporting rod 21, a limiting block 22 is uniformly distributed on the outer side of the first supporting rod 20 and the second supporting rod 21, and limiting grooves 23 are formed in the outer side of the limiting block 22. The elastic element 13 is a spring, the type of which can be set as desired.
The schematic structure of the damping support component of the circuit board is shown in fig. 2, the schematic structure of the circuit board installation component is shown in fig. 3, and the schematic structure of the limit component is shown in fig. 4.
It should be noted here that the number and distribution of the units of the telescopic link 12 can be set as required.
When the circuit board of the technical scheme is used, the upper circuit board 1 and the lower circuit board 2 are firstly respectively installed on different circuit board installation components 3, the upper circuit board 1 and the lower circuit board 2 are fixed on the first installation board 14 and the second installation board 15 through bolts, after the installation is finished, the circuit board installation components 3 fixed by the lower circuit board 2 and the circuit board installation components 3 fixed by the upper circuit board 2 are sequentially fixed on the limiting components 4, the limiting blocks 18 can be arranged on the inner sides of the limiting grooves 22, the installation blocks 19 are fixed on the first supporting rods 20 and the second supporting rods 21 through bolts, after the fixing is finished, the first radiating fins 6 and the second radiating fins 7 are installed on the third connecting rods 8 on the inner sides of the limiting components 4, after the installation is finished, the whole circuit board is fixed at a position required to be installed in equipment, and then the upper circuit board 1 and the lower circuit board 2 are mutually connected with connecting wires or interfaces of the equipment.
Claims (7)
1. The multilayer circuit board with the shockproof base comprises an upper layer circuit board, a lower layer circuit board arranged on the lower side of the upper layer circuit board, limit assemblies arranged on the left side and the right side of the upper layer circuit board and the lower layer circuit board, and a shock absorption supporting assembly arranged on the lower side of the limit assemblies; the circuit board mounting assembly is characterized in that the circuit board mounting assembly is arranged on the outer sides of the upper circuit board and the lower circuit board, first radiating fins which are uniformly distributed are arranged on the left side of the limiting assembly, second radiating fins are arranged on the right side of the limiting assembly, a third connecting rod is fixedly arranged on the inner side of the limiting assembly, and grooves corresponding to the first radiating fins and the second radiating fins are formed in the surface of the third connecting rod.
2. The multilayer circuit board with the shockproof base according to claim 1, wherein the shock absorbing support assembly comprises a support base, telescopic rods are fixedly arranged on the upper side of the support base, and the telescopic rods are uniformly distributed on the upper side of the support base.
3. The multilayer circuit board with the shockproof base according to claim 2, wherein an elastic element is arranged on the outer side of the telescopic rod, a supporting plate is fixedly arranged on the upper side of the telescopic rod, and through grooves are formed in the surfaces of the supporting plate and the supporting base.
4. The multilayer circuit board with vibration-proof base according to claim 3, wherein the circuit board mounting assembly comprises a first mounting plate, a second mounting plate is arranged on the right side of the first mounting plate, and a first connecting rod is fixedly connected to the inner sides of the first mounting plate and the second mounting plate.
5. The multilayer circuit board with the shockproof base according to claim 4, wherein a second connecting rod is arranged on the front side of the first connecting rod, limiting blocks are fixedly arranged on the outer sides of the first mounting plate and the second mounting plate, and mounting blocks are arranged on the outer sides of the limiting blocks.
6. The multi-layer circuit board with the vibration-proof base according to claim 5, wherein the limiting assembly comprises a first supporting rod, a second supporting rod is arranged on the rear side of the first supporting rod, and the third connecting rod is fixedly installed on the inner sides of the first supporting rod and the second supporting rod.
7. The multi-layer circuit board with the shockproof base according to claim 6, wherein limiting grooves are formed in the surfaces of the first supporting rod and the second supporting rod, and uniformly distributed mounting holes are formed in the outer sides of the limiting grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223406819.7U CN219146018U (en) | 2022-12-19 | 2022-12-19 | Multilayer circuit board with shockproof base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223406819.7U CN219146018U (en) | 2022-12-19 | 2022-12-19 | Multilayer circuit board with shockproof base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219146018U true CN219146018U (en) | 2023-06-06 |
Family
ID=86600017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223406819.7U Active CN219146018U (en) | 2022-12-19 | 2022-12-19 | Multilayer circuit board with shockproof base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219146018U (en) |
-
2022
- 2022-12-19 CN CN202223406819.7U patent/CN219146018U/en active Active
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