CN219042093U - Outer layer half pressfitting printed circuit board - Google Patents

Abstract

The utility model discloses an outer layer semi-pressing printed circuit board, which relates to the field of circuit boards, and comprises a lower layer circuit board, wherein a fixing component comprises a thread seat and fixing screws, a heat radiating component comprises a heat conducting sheet, a heat radiating plate and heat radiating fins, anti-collision protection sleeves are arranged on two side surfaces of the lower layer circuit board and the upper layer circuit board, the shock absorbing component comprises a damper, a guide rod, a shock absorbing spring, an extrusion seat and an extrusion sleeve, elastic spherical bulges are arranged on the surfaces of the shock absorbing component.

Description

Outer layer half pressfitting printed circuit board

Technical Field

The utility model relates to the field of circuit boards, in particular to an outer layer half-press-fit printed circuit board.

Background

The printed circuit board is an important electronic component, is a support body of the electronic component and is a carrier for electric connection of the electronic component, in large-scale electronic equipment, in order to reduce the space for installing the circuit board, the circuit board is arranged into a double-layer structure, an upper layer circuit board and a lower layer circuit board are fixed by adopting screws, after the electronic equipment is used for a long time, if the screws are fixed to loose, the upper layer circuit board and the lower layer circuit board are rubbed and collided mutually to cause the circuit board to be damaged when vibration is generated in the using process of the electronic equipment, and therefore, the utility model of the outer layer half-press-fit printed circuit board is necessary to solve the problems.

Disclosure of Invention

The utility model aims to provide an outer layer half-press-fit printed circuit board so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an outer half pressfitting printed circuit board, includes the lower floor's circuit board, the upper circuit board is installed to the upper end of lower floor's circuit board the four corners department of lower floor's circuit board and upper circuit board all is provided with fixed subassembly, fixed subassembly includes screw seat and set screw, the upper surface of lower floor's circuit board and upper circuit board all is provided with two sets of radiator unit, two sets of radiator unit bilateral symmetry sets up, radiator unit includes conducting strip, heating panel and fin, the anticollision protective sheath is all installed to the both sides face of lower floor's circuit board and upper circuit board, the surface of lower floor's circuit board and upper circuit board is provided with multiunit damper assembly, damper assembly includes attenuator, guide bar, damping spring, extrusion seat and extrusion cover, damper assembly's surface mounting has elasticity spherical arch.

Preferably, the lower surface mounting of screw seat is in the upper surface four corners department of lower floor's circuit board, the screw hole has all been seted up to the four corners department of upper circuit board, set screw passes the screw hole spiro union in the inside of screw seat.

Preferably, the heat conducting fin is mounted on the upper surfaces of the lower circuit board and the upper circuit board, the heat radiating plate is mounted on the outer side surface of the heat conducting fin, and the heat radiating fin is mounted on the outer side surface of the heat radiating plate.

Preferably, the damper is mounted on the upper surface of the lower circuit board, the guide rod is movably connected inside the damper, and the upper surface of the guide rod is mounted on the lower surface of the upper circuit board.

Preferably, the damping springs are arranged in a plurality of groups, the damping springs are arranged in a circumferential array, the lower ends of the damping springs are fixed on the upper surface of the damper, the upper ends of the damping springs are fixed on the lower surface of the extrusion seat, the upper surface of the extrusion seat is provided with a positioning groove, the extrusion sleeve is arranged on the surface of the guide rod, and the extrusion sleeve is inserted into the positioning groove.

Preferably, the elastic spherical bulges are arranged in a plurality of groups, the elastic spherical bulges are arranged in a circumferential array, the outer side faces of the elastic spherical bulges are arranged on the side walls of the positioning grooves, the outer side faces of the extrusion sleeves are provided with clamping grooves, and the elastic spherical bulges are clamped in the clamping grooves.

The utility model has the technical effects and advantages that:

1. through the arrangement of the fixing component and the heat dissipation component, the fixing screw penetrates through the threaded hole and is in threaded connection with the threaded seat, the upper circuit board is fixed at the upper end of the lower circuit board, a multi-layer structure is formed, in the use process, generated heat is guided through the heat conducting fin, the heat is transferred to the heat dissipation plate to realize rapid heat dissipation, and meanwhile, secondary heat dissipation is formed through the heat dissipation fin, the heat is dissipated outwards, and the use quality of the lower circuit board and the upper circuit board is guaranteed;

2. through setting up damper, screw thread seat appears not hard up with set screw's connection in the use, and the guide bar slides in the inside of attenuator when electronic equipment rocks, and extrusion sleeve exerts pressure to the extrusion seat simultaneously and acts on, makes damping spring atress, under damping spring's elastic action, effectively slows down the vibrations effect that produces, avoids producing friction collision between lower floor's circuit board and the upper circuit board simultaneously, simple structure is fit for promoting.

Drawings

FIG. 1 is a schematic view of the structure of an outer half-press printed circuit board according to the present utility model.

Fig. 2 is a schematic diagram of a connection structure between a fixing component and a heat dissipating component according to the present utility model.

FIG. 3 is a schematic view of a shock absorbing assembly according to the present utility model.

FIG. 4 is a schematic illustration of the normal cross-section connection of the shock absorbing assembly of the present utility model.

In the figure: 1. a lower layer circuit board; 2. an upper layer circuit board; 3. a fixing assembly; 301. a screw seat; 302. a fixing screw; 4. a heat dissipation assembly; 401. a heat conductive sheet; 402. a heat dissipation plate; 403. a heat radiation fin; 5. an anti-collision protective sleeve; 6. a shock absorbing assembly; 601. a damper; 602. a guide rod; 603. a damping spring; 604. extruding a base; 605. extruding the sleeve; 7. elastic spherical bulge.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides an outer layer half-press fit printed circuit board as shown in fig. 1-4, which comprises a lower circuit board 1, wherein the upper end of the lower circuit board 1 is provided with a plurality of groups of shock absorption components 6, each shock absorption component 6 comprises a damper 601, a guide rod 602, a shock absorption spring 603, an extrusion seat 604 and an extrusion sleeve 605, the upper surfaces of the lower circuit board 1 and the upper circuit board 2 are respectively provided with two groups of heat dissipation components 4, the two groups of heat dissipation components 4 are symmetrically arranged left and right, each heat dissipation component 4 comprises a heat conducting fin 401, a heat dissipation plate 402 and heat dissipation fins 403, the two side surfaces of the lower circuit board 1 and the upper circuit board 2 are respectively provided with a plurality of groups of shock absorption components 6, each shock absorption component 6 comprises a damper 601, a guide rod 602, a shock absorption spring 603 and an extrusion seat 604, and an extrusion sleeve 605, and the surfaces of each shock absorption component 6 are provided with elastic spherical protrusions 7.

The lower surface mounting of screw seat 301 is in the upper surface four corners department of lower floor's circuit board 1, and the screw hole has all been seted up to the four corners department of upper circuit board 2, and set screw 302 passes the screw hole spiro union in the inside of screw seat 301, and set screw 302 passes the screw hole spiro union in screw seat 301, fixes upper circuit board 2 in the upper end of lower floor's circuit board 1, forms multilayer structure.

The heat conducting fin 401 is installed on the upper surfaces of the lower circuit board 1 and the upper circuit board 2, the heat radiating plate 402 is installed on the outer side surface of the heat conducting fin 401, the heat radiating fins 403 are installed on the outer side surface of the heat radiating plate 402, in the using process, generated heat is guided through the heat conducting fin 401, the heat is transferred to the heat radiating plate 402 to realize rapid heat radiation, meanwhile, secondary heat radiation is formed through the heat radiating fins 403, the heat is outwards radiated, and the using quality of the lower circuit board 1 and the upper circuit board 2 is guaranteed.

The upper surface at lower floor's circuit board 1 is installed to the attenuator 601, and guide bar 602 swing joint is in the inside of attenuator 601, and the upper surface mounting of guide bar 602 is at the lower surface of upper circuit board 2, and when the connection of screw 301 and set screw 302 appears becoming flexible in the use, and electronic equipment rocks, and guide bar 602 slides in the inside of attenuator 601, effectively slows down the vibrations that produce.

The damping springs 603 are provided with a plurality of groups, the damping springs 603 are arranged in a circumferential array, the lower ends of the damping springs 603 are fixed on the upper surface of the damper 601, the upper ends of the damping springs 603 are fixed on the lower surface of the extrusion seat 604, the upper surface of the extrusion seat 604 is provided with a positioning groove, the extrusion sleeve 605 is arranged on the surface of the guide rod 602, the extrusion sleeve 605 is inserted into the positioning groove, when the guide rod 602 moves in the damper 601, the extrusion sleeve 605 applies pressure to the extrusion seat 604, so that the damping springs 603 are stressed, and the generated vibration effect is further slowed down under the elastic effect of the damping springs 603.

The elastic spherical bulges 7 are provided with a plurality of groups, the elastic spherical bulges 7 are arranged in a circumferential array, the outer side faces of the elastic spherical bulges 7 are arranged on the side walls of the positioning grooves, the outer side faces of the extrusion sleeves 605 are provided with clamping grooves, the elastic spherical bulges 7 are clamped in the clamping grooves, when the upper circuit board 2 is arranged at the upper end of the lower circuit board 1, the extrusion sleeves 605 are inserted into the extrusion seats 604, so that the elastic spherical bulges 7 are propped against the inner walls of the clamping grooves, and the overall stability is improved.

Working principle: when the device is used, the fixing screw 302 passes through the threaded hole and is in threaded connection with the threaded seat 301, the upper circuit board 2 is fixed at the upper end of the lower circuit board 1, a multi-layer structure is formed, in the use process, the heat generated is guided by the heat conducting fin 401, the heat is transferred to the heat dissipation plate 402 to realize quick heat dissipation, meanwhile, the heat is formed to be secondarily dissipated through the heat dissipation fins 403, the heat is dissipated outwards, the use quality of the lower circuit board 1 and the upper circuit board 2 is guaranteed, when the threaded seat 301 and the fixing screw 302 are connected in the use process, looseness occurs, the guide rod 602 slides in the damper 601 when the electronic equipment shakes, the extruding sleeve 605 applies pressure to the extruding seat 604, the shock absorbing spring 603 is stressed, the generated shock absorbing effect is effectively slowed down under the elastic effect of the shock absorbing spring 603, meanwhile, friction collision is avoided between the lower circuit board 1 and the upper circuit board 2, and the device is simple in structure and suitable for popularization.

Claims (6)

1. The utility model provides an outer half pressfitting printed circuit board, includes lower floor's circuit board (1), its characterized in that: the upper circuit board (2) is installed to the upper end of lower floor's circuit board (1) the four corners department of lower floor's circuit board (1) and upper circuit board (2) all is provided with fixed subassembly (3), fixed subassembly (3) are including screw seat (301) and set screw (302), lower floor's circuit board (1) all is provided with two sets of radiator unit (4) with the upper surface of upper circuit board (2), two sets of radiator unit (4) bilateral symmetry sets up, radiator unit (4) include conducting strip (401), heating panel (402) and radiating fin (403), anticollision protective sheath (5) are all installed to the both sides face of lower floor's circuit board (1) and upper circuit board (2), the surface of lower floor's circuit board (1) and upper circuit board (2) is provided with multiunit damper unit (6), damper unit (6) include attenuator (601), guide bar (602), damper spring (603), extrusion seat (604) and extrusion sleeve (605), spherical protruding (7) of damper unit (6) surface mounting has.

2. The outer layer half-laminated printed circuit board as claimed in claim 1, wherein: the lower surface mounting of screw seat (301) is in the upper surface four corners department of lower floor's circuit board (1), screw hole has all been seted up in the four corners department of upper circuit board (2), set screw (302) pass screw hole spiro union in the inside of screw seat (301).

3. The outer layer half-laminated printed circuit board as claimed in claim 1, wherein: the heat conducting fin (401) is arranged on the upper surfaces of the lower circuit board (1) and the upper circuit board (2), the heat radiating plate (402) is arranged on the outer side surface of the heat conducting fin (401), and the heat radiating fin (403) is arranged on the outer side surface of the heat radiating plate (402).

4. The outer layer half-laminated printed circuit board as claimed in claim 1, wherein: the damper (601) is arranged on the upper surface of the lower circuit board (1), the guide rod (602) is movably connected inside the damper (601), and the upper surface of the guide rod (602) is arranged on the lower surface of the upper circuit board (2).

5. The outer layer half-laminated printed circuit board as claimed in claim 4, wherein: damping spring (603) are provided with the multiunit, and the multiunit damping spring (603) are circumference array setting, the lower extreme of damping spring (603) is fixed at the upper surface of attenuator (601), and the upper end of damping spring (603) is fixed at the lower surface of extrusion seat (604), the constant head tank has been seted up to the upper surface of extrusion seat (604), extrusion cover (605) are installed on the surface of guide bar (602), and extrusion cover (605) are pegged graft in the constant head tank.

6. The outer layer half-laminated printed circuit board as claimed in claim 5, wherein: the elastic spherical bulges (7) are arranged in a plurality of groups, the elastic spherical bulges (7) are arranged in a circumferential array, the outer side faces of the elastic spherical bulges (7) are arranged on the side walls of the positioning grooves, the outer side faces of the extrusion sleeves (605) are provided with clamping grooves, and the elastic spherical bulges (7) are clamped in the clamping grooves.

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