CN219514105U - Shockproof mobile phone motherboard with limit structure - Google Patents

Abstract

The utility model discloses a shockproof mobile phone motherboard with a limiting structure, which relates to the technical field of mobile phone motherboards, and aims to solve the technical problems that the shockproof mobile phone motherboard with the limiting structure is inconvenient to limit and install and has poor heat dissipation effect; the shockproof mobile phone motherboard comprises a mounting plate; the upper end of the mounting plate is provided with two groups of buffer components, the upper end of the buffer components is provided with a lower limit component, the upper end of the lower limit component is provided with a main board main body, the bottom end of the main board main body is provided with a heat-conducting plate, the bottom end of the heat-conducting plate is fixedly provided with an elastic radiating fin, the outer side of the lower limit component is provided with an upper limit component, and the inner side of the mounting plate is provided with a mounting hole; this shockproof mobile phone motherboard with limit structure carries out positioning process to the mainboard main part through the setting of lower spacing subassembly and last spacing subassembly, realizes the spacing installation processing to mobile phone motherboard.

Description

Shockproof mobile phone motherboard with limit structure

Technical Field

The utility model belongs to the technical field of mobile phone mainboards, and particularly relates to a shockproof mobile phone mainboard with a limiting structure.

Background

Nowadays, a mobile phone motherboard is one of the components of a mobile phone, the mobile phone motherboard determines the specification, performance and general functions of the motherboard, for the motherboard, the chipset almost determines the functions of the motherboard, and the mobile phone motherboard is very precise and needs to be protected.

At present, the utility model patent number CN202222429797.X discloses a shockproof mobile phone motherboard with a limit structure, which relates to the technical field of mobile phone motherboards, and comprises a mobile phone case, wherein the top of the mobile phone case is provided with a buffering shockproof limit mechanism, four corners of the bottom of a buffering limit component are fixedly provided with buffer plates, the middle part of the top of the motherboard is fixedly provided with a protection plate, the left side surface and the right side surface of the protection plate are fixedly provided with balance mounting plates, the middle part of the top of the mobile phone case is fixedly provided with a bottom plate, the front end and the rear end of the top of the bottom plate are fixedly provided with connecting iron sheets, the middle parts of the two connecting iron sheet tops are fixedly provided with damping mechanisms, and the damping mechanisms consist of support columns, limit grooves, slide bars, damping columns, limit rings, damping springs, dampers and protection bars. The buffer structure is adopted for vibration reduction, but the mobile phone motherboard is inconvenient to limit and install in the use process, and the heat dissipation effect of the mobile phone motherboard is poor.

Disclosure of Invention

(1) Technical problem to be solved

Aiming at the defects of the prior art, the utility model aims to provide a shockproof mobile phone motherboard with a limiting structure, which aims to solve the technical problems that the mobile phone motherboard is inconvenient to carry out limiting installation treatment and has poor heat dissipation effect in the prior art.

(2) Technical proposal

In order to solve the technical problems, the utility model provides a shockproof mobile phone motherboard with a limiting structure, which comprises a mounting plate; the upper end of mounting panel is provided with buffer unit, buffer unit is provided with two sets of, buffer unit's upper end is provided with spacing subassembly down, spacing subassembly's upper end is provided with the mainboard main part down, the bottom of mainboard main part is provided with the heat-conducting plate, the bottom fixed mounting of heat-conducting plate has the elastic radiating fin, spacing subassembly is provided with in the outside of spacing subassembly down, the mounting hole has been seted up to the inboard of mounting panel.

When the vibration-proof mobile phone main board with the limiting structure is used, the main board main body is positioned through the arrangement of the lower limiting assembly and the upper limiting assembly, limiting installation treatment of the mobile phone main board is achieved, heat dissipation treatment is conducted on the main board main body through the arrangement of the heat conducting plate and the elastic heat radiating fins, buffer vibration reduction treatment is conducted on the main board main body through the arrangement of the buffer assembly, and therefore heat dissipation treatment of the mobile phone main board is achieved.

Further, the inside of buffer module is including the bottom plate, the bottom plate set up in the upper end of mounting panel, the upper end of bottom plate is provided with the attenuator, carries out the installation processing to the attenuator through the setting of bottom plate.

Further, the inside of buffer module is including the roof, the roof set up in the upper end of attenuator, the outside of attenuator is provided with the spring, the upper end of spring with the bottom interconnect of roof carries out buffering shock attenuation processing to lower cassette through the setting of spring.

Further, the inside of lower spacing subassembly is including lower cassette, lower cassette set up in the upper end of roof, lower cassette's upper end fixed mounting has first blotter, carries out positioning process to the mainboard main part through the setting of lower cassette, carries out buffer treatment to the mainboard main part through the setting of first blotter.

Further, the inside of lower spacing subassembly is including the draw-in groove, the draw-in groove set up in the outside of lower cassette, the screw has been seted up to the inboard of draw-in groove, carries out positioning treatment to last cassette through the setting of draw-in groove.

Further, the inside of going up spacing subassembly is including last cassette, go up the cassette set up in the upper end of draw-in groove, go up the cassette with the draw-in groove block is connected, the bottom fixed mounting of going up the cassette has the second blotter, carries out the buffering nursing to the top of mainboard main part through the setting of second blotter.

Further, the inside of going up spacing subassembly is including the crashproof strip, crashproof strip fixed mounting is in go up the outside of cassette, the inboard of crashproof strip is provided with the screw, the screw with screw threaded connection is fixed the position of going up the cassette through the threaded connection of screw and screw, plays crashproof protection through the setting of crashproof strip.

(3) Advantageous effects

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the shockproof mobile phone motherboard with the limiting structure, the main motherboard body is positioned through the arrangement of the lower clamping seat, the main motherboard body is buffered through the arrangement of the first buffer cushion, the position of the upper clamping seat is fixed through the threaded connection of the screw and the screw hole, the buffer nursing is performed above the main motherboard body through the arrangement of the second buffer cushion, the anti-collision protection treatment is performed through the arrangement of the anti-collision strip, and the limiting installation treatment of the mobile phone motherboard is realized;

2. according to the shockproof mobile phone main board with the limiting structure, the main board main body is subjected to heat dissipation through the arrangement of the heat conducting plate and the elastic heat radiating fins, the damper is installed through the arrangement of the bottom plate, and the lower clamping seat is subjected to buffering and shock absorption through the arrangement of the springs, so that the heat dissipation of the mobile phone main board is realized.

Drawings

FIG. 1 is a schematic view of a three-dimensional structure of an embodiment of the present utility model;

FIG. 2 is a schematic view of an expanded structure of an embodiment of the present utility model;

fig. 3 is a schematic view of a cross-section of an embodiment of the present utility model.

The marks in the drawings are: 1. a mounting plate; 2. a buffer assembly; 3. a lower limit assembly; 4. a main board main body; 5. a heat conductive plate; 6. an elastic heat sink; 7. an upper limit assembly; 8. a mounting hole; 9. a bottom plate; 10. a damper; 11. a top plate; 12. a spring; 13. a lower clamping seat; 14. a first cushion pad; 15. a clamping groove; 16. a screw hole; 17. an upper clamping seat; 18. a second cushion pad; 19. a bumper strip; 20. and (5) a screw.

Detailed Description

The embodiment is used for a shockproof mobile phone motherboard with a limiting structure, the perspective structure of the shockproof mobile phone motherboard is shown in fig. 1, the unfolding structure of the shockproof mobile phone motherboard is shown in fig. 2, and the shockproof mobile phone motherboard comprises a mounting plate 1; the upper end of mounting panel 1 is provided with buffer assembly 2, and buffer assembly 2 is provided with two sets of, and buffer assembly 2's upper end is provided with spacing subassembly 3 down, and spacing subassembly 3's upper end is provided with mainboard main part 4 down, and mainboard main part 4's bottom is provided with heat-conducting plate 5, and heat-conducting plate 5's bottom fixed mounting has elastic radiating fin 6, and spacing subassembly 7 is provided with in spacing subassembly 3's the outside down, and mounting hole 8 has been seted up to mounting panel 1's inboard.

For the present embodiment, the shape structure of the mounting board 1 is set according to practical application, for example, the mounting board 1 may be a rectangular structure, an arc structure, a polygonal structure, or the like.

Wherein, buffer assembly 2's inside is including bottom plate 9, and bottom plate 9 sets up in the upper end of mounting panel 1, and the upper end of bottom plate 9 is provided with attenuator 10, carries out the installation to attenuator 10 through the setting of bottom plate 9 and handles, and buffer assembly 2's inside is including roof 11, and roof 11 sets up in the upper end of attenuator 10, and the outside of attenuator 10 is provided with spring 12, and the upper end of spring 12 and the bottom interconnect of roof 11 carry out buffering shock attenuation to lower cassette 13 through the setting of spring 12.

This embodiment is a shockproof mobile phone motherboard for having limit structure, its section structure schematic diagram is as shown in fig. 3, lower limit assembly 3's inside is including lower cassette 13, lower cassette 13 sets up in the upper end of roof 11, lower cassette 13's upper end fixed mounting has first blotter 14, set up through lower cassette 13 carries out positioning process to mainboard main part 4, set up through first blotter 14 carries out buffer process to mainboard main part 4, lower limit assembly 3's inside is including draw-in groove 15, draw-in groove 15 is seted up in the outside of lower cassette 13, screw 16 has been seted up to the inboard of draw-in groove 15, set up through draw-in groove 15 carries out positioning process to last cassette 17.

Simultaneously, the inside of going up spacing subassembly 7 is including last cassette 17, go up cassette 17 and set up in the upper end of draw-in groove 15, go up cassette 17 and draw-in groove 15 block and be connected, go up the bottom fixed mounting of cassette 17 and have second blotter 18, the setting through second blotter 18 carries out the buffering nursing to the top of mainboard main part 4, go up spacing subassembly 7's inside including crashproof strip 19, crashproof strip 19 fixed mounting is in the outside of cassette 17, crashproof strip 19's inboard is provided with screw 20, screw 20 and screw 16 threaded connection, fix the position of going up cassette 17 through screw 20 and screw 16 threaded connection, set up through crashproof strip 19 and play crashproof protection processing.

When the shockproof mobile phone motherboard with limit structure of this technical scheme is used, carry out positioning process to motherboard main part 4 through the setting of lower cassette 13, carry out buffer treatment to motherboard main part 4 through the setting of first blotter 14, fix the position of last cassette 17 through the threaded connection of screw 20 and screw 16, carry out buffer care to the top of motherboard main part 4 through the setting of second blotter 18, play crashproof protection through the setting of crashproof strip 19 and handle, realize the spacing installation to mobile phone motherboard, carry out heat dissipation to motherboard main part 4 through the setting of heat-conducting plate 5 and elastic radiating fin 6, carry out the installation to attenuator 10 through the setting of bottom plate 9, carry out buffer damping process to lower cassette 13 through the setting of spring 12, thereby realized the heat dissipation to mobile phone motherboard.

Claims (7)

1. A shockproof mobile phone motherboard with limit structure, this shockproof mobile phone motherboard includes the mounting panel (1); the novel heat-conducting plate is characterized in that the upper end of the mounting plate (1) is provided with a buffer assembly (2), the buffer assembly (2) is provided with two groups, the upper end of the buffer assembly (2) is provided with a lower limit assembly (3), the upper end of the lower limit assembly (3) is provided with a main plate main body (4), the bottom of the main plate main body (4) is provided with a heat-conducting plate (5), the bottom of the heat-conducting plate (5) is fixedly provided with an elastic radiating fin (6), the outer side of the lower limit assembly (3) is provided with an upper limit assembly (7), and the inner side of the mounting plate (1) is provided with a mounting hole (8).

2. The shockproof mobile phone motherboard with limit structure according to claim 1, characterized in that the buffer assembly (2) comprises a bottom plate (9), the bottom plate (9) is arranged at the upper end of the mounting plate (1), and a damper (10) is arranged at the upper end of the bottom plate (9).

3. The shockproof mobile phone motherboard with limit structure of claim 2, characterized in that, the inside of buffer assembly (2) is including roof (11), roof (11) set up in the upper end of attenuator (10), the outside of attenuator (10) is provided with spring (12), the upper end of spring (12) with the bottom interconnect of roof (11).

4. A shockproof mobile phone motherboard with limit structure as claimed in claim 3, characterized in that, the inside of lower limit assembly (3) includes lower cassette (13), lower cassette (13) set up in the upper end of roof (11), the upper end fixed mounting of lower cassette (13) has first blotter (14).

5. The shockproof mobile phone motherboard with a limiting structure according to claim 4, characterized in that the inside of the lower limiting component (3) comprises a clamping groove (15), the clamping groove (15) is arranged on the outer side of the lower clamping seat (13), and a screw hole (16) is arranged on the inner side of the clamping groove (15).

6. The shockproof mobile phone motherboard with limit structure of claim 5, characterized in that, the inside of last limit assembly (7) is including last cassette (17), go up cassette (17) set up in the upper end of draw-in groove (15), go up cassette (17) with draw-in groove (15) block connection, the bottom fixed mounting of last cassette (17) has second blotter (18).

7. The shockproof mobile phone motherboard with limit structure of claim 6, characterized in that the inside of the upper limit component (7) comprises an anti-collision strip (19), the anti-collision strip (19) is fixedly installed on the outer side of the upper clamping seat (17), a screw (20) is arranged on the inner side of the anti-collision strip (19), and the screw (20) is in threaded connection with the screw hole (16).