CN213042194U - Chip mounting rack for mounting chip - Google Patents

Chip mounting rack for mounting chip Download PDF

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Publication number
CN213042194U
CN213042194U CN202021014778.5U CN202021014778U CN213042194U CN 213042194 U CN213042194 U CN 213042194U CN 202021014778 U CN202021014778 U CN 202021014778U CN 213042194 U CN213042194 U CN 213042194U
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China
Prior art keywords
mounting
chip
plate
spring
plastic magnetic
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CN202021014778.5U
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Chinese (zh)
Inventor
李丽侠
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Beijing Jiangjiang Intelligent Technology Co ltd
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Beijing Jiangjiang Intelligent Technology Co ltd
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Priority to CN202021014778.5U priority Critical patent/CN213042194U/en
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Abstract

The utility model discloses a chip mounting bracket for installing chip, including backup pad and damping mechanism, the both sides of backup pad up end all are provided with spacing support, the upper end sliding connection mounting panel of spacing support, damping mechanism sets up between backup pad and mounting panel, damping mechanism comprises the first plastics magnetic sheet of a plurality of, a plurality of second plastics magnetic sheet, a plurality of mounting groove, connecting plate, shock attenuation board and the first spring of a plurality of, be provided with the first plastics magnetic sheet of a plurality of on the up end of backup pad, be provided with a plurality of and first plastics magnetic sheet assorted second plastics magnetic sheet on the lower terminal surface of mounting panel, be provided with a plurality of mounting groove on the up end of backup pad. The utility model discloses simple structure, reasonable in design has shock attenuation buffering effect well, increases the reliability of chip installation, protects the array foot of chip, and convenient stability is dismantled in the chip installation simultaneously, convenient subsequent detection and maintenance.

Description

Chip mounting rack for mounting chip
Technical Field
The utility model relates to a chip equipment technical field specifically is a chip mounting bracket for installing chip.
Background
If a Central Processing Unit (CPU) is compared with the heart of the whole computer system, a chip group on a mainboard is the trunk of the whole body, for the mainboard, the chip group almost determines the functions of the mainboard, and further influences the performance of the whole computer system, and the chip group is the soul of the mainboard.
The defects of the prior art are as follows:
the chip is direct on the mainboard that perhaps corresponds with array foot snap-on the circuit board through modes such as electric welding usually, and there is not corresponding shock attenuation buffer structure, and the array foot is impaired easily when leading to the chip to receive external force collision, has reduced the reliability of chip, and chip dismantlement is troublesome simultaneously, is unfavorable for the detection maintenance in later stage.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip mounting bracket for installing chip to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a chip mounting rack for mounting a chip comprises a supporting plate and a vibration damping mechanism, wherein two sides of the upper end surface of the supporting plate are respectively provided with a limiting support, the upper end of the limiting support is slidably connected with a mounting plate, the vibration damping mechanism is arranged between the supporting plate and the mounting plate, the vibration damping mechanism comprises a plurality of first plastic magnetic plates, a plurality of second plastic magnetic plates, a plurality of mounting grooves, a connecting plate, a vibration damping plate and a plurality of first springs, the upper end surface of the supporting plate is provided with a plurality of first plastic magnetic plates, the lower end surface of the mounting plate is provided with a plurality of second plastic magnetic plates matched with the first plastic magnetic plates, the upper end surface of the supporting plate is provided with a plurality of mounting grooves, the lower end surface of the mounting plate is provided with a connecting plate, the lower end of the connecting plate is provided with a vibration damping plate, the two sides of the lower end surface of, the both sides of mounting panel up end all are provided with the fixed plate, the fixed plate is provided with a plurality of second spring on being close to the side of one side in the middle of the mounting panel, the other end of second spring is provided with the arc, be provided with the arc draw-in groove on the side that second spring one side was kept away from to the arc.
Preferably, the limiting bracket is arranged in an inverted L shape.
Preferably, the mounting plate is provided with a plurality of rectangular heat dissipation grooves.
Preferably, the magnetic poles of the adjacent sides of the first plastic magnetic plate and the second plastic magnetic plate are the same.
Preferably, a fixing column is arranged between the first springs on the lower end face of the damping plate, and the lower end of the fixing column is connected with a limiting threaded rod through an internal thread.
Preferably, the number of the second springs is at least two.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a be provided with damping mechanism, damping mechanism sets up between backup pad and mounting panel, and damping mechanism comprises a plurality of first plastics magnetic sheet, a plurality of second plastics magnetic sheet, a plurality of mounting groove, connecting plate, shock attenuation board and a plurality of first spring, through the effect of damping mechanism, has good shock attenuation buffering effect, increases the reliability of chip installation, protects the array foot of chip;
2. the utility model discloses a be provided with a plurality of second spring on the side that the fixed plate is close to one side in the middle of the mounting panel, the other end of second spring is provided with the arc, and the arc is provided with the arc draw-in groove on keeping away from the side of second spring one side, and through the effect of second spring, arc and arc draw-in groove, convenient stability is dismantled in the chip installation, makes things convenient for subsequent detection maintenance.
Drawings
Fig. 1 is an overall perspective view of a chip mounting rack for mounting a chip according to the present invention;
FIG. 2 is a front view of a chip mounting bracket mounting groove and a shock absorbing plate for mounting a chip according to the present invention;
fig. 3 is a side view of the chip mounting bracket fixing plate for mounting a chip of the present invention connected to an arc plate.
In the figure: 1. a support plate; 2. a vibration reduction mechanism; 21. a first plastic magnetic plate; 22. a second plastic magnetic plate; 23. mounting grooves; 24. a connecting plate; 25. a damper plate; 26. a first spring; 3. a limiting bracket; 4. mounting a plate; 41. a rectangular heat sink; 5. a fixing plate; 6. a second spring; 7. an arc-shaped plate; 71. an arc-shaped clamping groove; 8. fixing a column; 81. and (5) limiting a threaded rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a chip mounting rack for mounting a chip comprises a supporting plate 1 and a vibration damping mechanism 2, wherein limiting supports 3 are welded on two sides of the upper end surface of the supporting plate 1, the upper end of each limiting support 3 is connected with a mounting plate 4 in a sliding manner, the vibration damping mechanism 2 is mounted between the supporting plate 1 and the mounting plate 4, the vibration damping mechanism 2 comprises a plurality of first plastic magnetic plates 21, a plurality of second plastic magnetic plates 22, a plurality of mounting grooves 23, a connecting plate 24, a vibration damping plate 25 and a plurality of first springs 26, the plurality of first plastic magnetic plates 21 are mounted on the upper end surface of the supporting plate 1 through bolts, the plurality of second plastic magnetic plates 22 matched with the first plastic magnetic plates 21 are mounted on the lower end surface of the mounting plate 4 through bolts, the plurality of mounting grooves 23 are welded on the upper end surface of the supporting plate 1, the connecting plate 24 is welded on the lower end surface of the mounting plate 4, the vibration, first spring 26 has all been welded to the both sides of terminal surface under the shock attenuation board 25, and fixed plate 5 has all been welded to the both sides of mounting panel 4 up end, installs a plurality of second spring 6 on the side of fixed plate 5 one side near the mounting panel 4 centre, and arc 7 is installed to the other end of second spring 6, has seted up arc draw-in groove 71 on the side of second spring 6 one side is kept away from to arc 7.
Spacing support 3 sets up to falling L shape, is favorable to injecing the position of mounting panel 4, prevents that mounting panel 4 from droing.
The mounting plate 4 is provided with a plurality of rectangular heat dissipation grooves 41, which is beneficial to increasing the circulation efficiency of air and improving the heat dissipation effect.
The adjacent sides of the first plastic magnetic plate 21 and the second plastic magnetic plate 22 have the same magnetic poles, which is beneficial to providing corresponding repulsive acting force for damping.
The welding has fixed column 8 between first spring 26 on the lower terminal surface of shock attenuation board 25, and there is a limit threaded rod 81 fixed column 8's lower extreme through seting up internal thread threaded connection, is favorable to adjusting the absorbing distance of first spring 26, prevents that the distance of first spring 26 deformation is too big.
The number of the second springs 6 is at least two, which is beneficial to ensuring the arc-shaped plate 7 to be evenly stressed and providing enough clamping elasticity.
The working principle is as follows: in this device, be provided with damping mechanism 2, damping mechanism 2 is by the first plastics magnetic sheet 21 of a plurality of, a plurality of second plastics magnetic sheet 22, a plurality of mounting groove 23, connecting plate 24, damping plate 25 and the first spring 26 of a plurality of are constituteed, through first plastics magnetic sheet 21, second plastics magnetic sheet 22, damping plate 25 and first spring 26 carry out the shock attenuation buffering, there is the shock attenuation buffering effect well, increase the reliability of chip installation, protect the array foot of chip, at first press arc 7 to one side of fixed plate 5 when installing the chip simultaneously, block the chip between arc draw-in groove 71, block the chip through the elasticity of second spring 6, through second spring 6, effect of arc 7 and arc draw-in groove 71, the chip mounting is dismantled convenient stable, make things convenient for subsequent detection maintenance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A chip mounting frame for installing chip, includes backup pad (1) and damping mechanism (2), its characterized in that: the damping device is characterized in that limiting supports (3) are arranged on two sides of the upper end face of the supporting plate (1), the upper end of each limiting support (3) is slidably connected with a mounting plate (4), the damping mechanism (2) is arranged between the supporting plate (1) and the mounting plate (4), the damping mechanism (2) is composed of a plurality of first plastic magnetic plates (21), a plurality of second plastic magnetic plates (22), a plurality of mounting grooves (23), a connecting plate (24), a damping plate (25) and a plurality of first springs (26), the upper end face of the supporting plate (1) is provided with a plurality of first plastic magnetic plates (21), the lower end face of the mounting plate (4) is provided with a plurality of second plastic magnetic plates (22) matched with the first plastic magnetic plates (21), the upper end face of the supporting plate (1) is provided with a plurality of mounting grooves (23), the lower end face of the mounting plate (4) is provided with the connecting plate (24), the lower extreme of connecting plate (24) is provided with shock attenuation board (25), the both sides of terminal surface all are provided with first spring (26) under shock attenuation board (25), the both sides of mounting panel (4) up end all are provided with fixed plate (5), be provided with a plurality of second spring (6) on fixed plate (5) are close to the side of mounting panel (4) middle one side, the other end of second spring (6) is provided with arc (7), be provided with arc draw-in groove (71) on the side of second spring (6) one side is kept away from in arc (7).
2. A chip mount for mounting a chip according to claim 1, wherein: the limiting support (3) is arranged to be in an inverted L shape.
3. A chip mount for mounting a chip according to claim 1, wherein: the mounting plate (4) is provided with a plurality of rectangular heat dissipation grooves (41).
4. A chip mount for mounting a chip according to claim 1, wherein: the adjacent sides of the first plastic magnetic plate (21) and the second plastic magnetic plate (22) have the same magnetic poles.
5. A chip mount for mounting a chip according to claim 1, wherein: fixed columns (8) are arranged between the first springs (26) on the lower end face of the damping plate (25), and the lower ends of the fixed columns (8) are connected with limiting threaded rods (81) through threads with internal threads.
6. A chip mount for mounting a chip according to claim 1, wherein: the number of the second springs (6) is at least two.
CN202021014778.5U 2020-06-05 2020-06-05 Chip mounting rack for mounting chip Active CN213042194U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021014778.5U CN213042194U (en) 2020-06-05 2020-06-05 Chip mounting rack for mounting chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021014778.5U CN213042194U (en) 2020-06-05 2020-06-05 Chip mounting rack for mounting chip

Publications (1)

Publication Number Publication Date
CN213042194U true CN213042194U (en) 2021-04-23

Family

ID=75523347

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021014778.5U Active CN213042194U (en) 2020-06-05 2020-06-05 Chip mounting rack for mounting chip

Country Status (1)

Country Link
CN (1) CN213042194U (en)

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