CN221239173U - Heat dissipation mechanism and projection equipment - Google Patents

Abstract

The embodiment of the utility model relates to the technical field of projection equipment and discloses a heat dissipation mechanism and projection equipment, wherein the heat dissipation mechanism comprises a heat dissipation fin assembly, a buffer piece and a fan, and the heat dissipation fin assembly is used for being connected with a part to be cooled so as to absorb heat of the part to be cooled; the buffer piece is provided with a communication groove, the radiating fin assembly is arranged in the communication groove, and the radiating fin assembly is at least partially exposed at one end of the communication groove; the fan is mounted on a side of the buffer member facing away from the fin assembly, and the fan is at least partially exposed to the other end of the communication groove. Through the mode, the embodiment of the utility model can reduce the transmission of vibration generated when the fan operates to the radiating fin assembly, thereby being beneficial to reducing the shaking risk of the projection equipment.

Description

Heat dissipation mechanism and projection equipment

Technical Field

The embodiment of the utility model relates to the technical field of projection equipment, in particular to a heat dissipation mechanism and projection equipment.

Background

The heat dissipation mechanism in the projection device generally comprises a fan and a heat dissipation fin assembly, wherein the heat dissipation fin assembly is connected with a heating component in the projection device, and the fan is arranged on the heat dissipation fin assembly to blow and dissipate heat of the heat dissipation fin assembly.

In the implementation process of the embodiment of the utility model, the inventor finds that: the fan is easy to vibrate in the operation process, the fan is directly installed on the radiating fin assembly, the radiating fin is easy to vibrate, and then projection equipment is easy to shake, so that user experience is affected.

Disclosure of utility model

The technical problem to be solved by the embodiment of the utility model is to provide the radiating mechanism and the projection equipment, which can reduce the transmission of vibration generated during the operation of the fan to the radiating fin assembly, thereby being beneficial to reducing the shaking risk of the projection equipment.

In order to solve the technical problems, one technical scheme adopted by the embodiment of the utility model is as follows: the heat dissipation mechanism comprises a heat dissipation fin assembly, a buffer piece and a fan, wherein the heat dissipation fin assembly is used for being connected with a part to be dissipated so as to absorb heat of the part to be dissipated; the buffer piece is provided with a communication groove, the radiating fin assembly is arranged in the communication groove, and the radiating fin assembly is at least partially exposed at one end of the communication groove; the fan is mounted on a side of the buffer member facing away from the fin assembly, and the fan is at least partially exposed to the other end of the communication groove.

Optionally, the heat sink assembly is provided with a clamping portion, the buffer member is provided with a clamping groove, and the clamping portion is clamped in the clamping groove.

Optionally, the buffer piece is further provided with an installation part, and the installation part is provided with a clamping table; the fan is provided with the mounting hole, and the installation department is pegged graft in the mounting hole, and the joint is in the fan behind the cassette passing the mounting hole.

Optionally, the number of the installation parts is multiple, the installation parts are distributed in a rectangular shape, and the installation parts are all provided with clamping tables; the fan is provided with a plurality of mounting holes, a mounting part is inserted into one mounting hole, and a clamping table passes through one mounting hole and is then clamped with the fan so as to fix the fan on the buffer piece.

Optionally, the heat sink assembly includes a heat pipe and a heat sink, a first end of the heat pipe is connected with the heat sink, a second end of the heat pipe is connected with the component to be cooled, and the heat pipe is used for conducting heat of the component to be cooled to the heat sink.

Optionally, the first end of the heat conducting pipe penetrates through the radiating fin, the second end of the heat conducting pipe is connected with the part to be radiated, the heat conducting pipe is bent and extended, an accommodating space is formed between the first end and the other end of the heat conducting pipe in the first direction, and the buffer piece and the fan are both located in the accommodating space.

Optionally, the number of the cooling fins is multiple, the cooling fins are arranged at intervals, and the heat conducting pipe penetrates through the cooling fins.

In order to solve the technical problems, another technical scheme adopted by the embodiment of the utility model is as follows: the heat conducting pipe in the heat dissipation mechanism is connected with the part to be dissipated so as to conduct heat of the part to be dissipated to the radiating fin.

Optionally, the component to be cooled includes a housing and a circuit board, and the circuit board is mounted on the housing; the heat dissipation mechanism further comprises a mounting frame, the second end of the heat conduction pipe is connected with the mounting frame, the surface of the mounting frame, deviating from the heat conduction pipe, is abutted with the circuit board, and the mounting frame is fixed to the shell.

Optionally, the heat dissipation mechanism further comprises a buffer pad, the buffer pad is located between the mounting frame and the shell, and the mounting frame and the buffer pad are fixed to the part to be dissipated through screws.

The embodiment of the utility model has the beneficial effects that: in comparison with the prior art, the buffer piece is arranged on the radiating fin assembly, the fan is arranged on one side, deviating from the radiating fin assembly, of the buffer piece, vibration generated when the fan operates is absorbed through the buffer piece, and therefore vibration transmission of the fan to the radiating fin assembly can be reduced, further, the risk of shaking of projection equipment is reduced, and user experience is guaranteed.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.

FIG. 1 is a schematic view of a projection apparatus according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of an exploded state of a projection device provided in an embodiment of the present utility model;

FIG. 3 is a schematic view of an exploded view of a fin assembly according to an embodiment of the present utility model at a first viewing angle;

FIG. 4 is a schematic view of a fin assembly according to an embodiment of the present utility model at a second view angle;

FIG. 5 is a schematic view of a buffer provided in an embodiment of the present utility model;

Fig. 6 is a schematic view of a buffer and a fan provided in an embodiment of the present utility model.

Detailed Description

In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," and the like as used in this specification, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

In addition, the technical features mentioned in the different embodiments of the utility model described below can be combined with one another as long as they do not conflict with one another.

Referring to fig. 1 and 2, the projection apparatus 1000 includes a heat dissipation mechanism 100 and a component 200 to be heat dissipated, the component 200 to be heat dissipated includes a housing 11 and a circuit board 12, the circuit board 12 is fixed to the housing 11, the heat dissipation mechanism 100 is mounted on the housing 11, and the heat dissipation mechanism 100 is connected to the circuit board 12, and the heat dissipation mechanism 100 is used for dissipating heat from the circuit board 12. The housing 11 is further used for accommodating other parts (not shown in the drawings) of the projection device 1000, wherein the circuit board 12 is easy to generate heat during operation, and the heat generated by the circuit board 12 needs to be conducted out in time, otherwise, the circuit board 12 is easy to burn out, so that the heat dissipation mechanism 100 dissipates heat to the circuit board 12, thereby being beneficial to ensuring that the circuit board 12 can normally operate.

For the heat dissipation mechanism 100 described above, referring to fig. 1 and 2, the heat dissipation mechanism 100 includes: a heat sink assembly 2, a bumper 3 and a fan 4. The heat sink assembly 2 is connected to the circuit board 12, and the heat sink assembly 2 is used for conducting heat generated by the circuit board 12. The buffer piece 3 is installed in the fin subassembly 2, and the fan 4 is installed in one side that the buffer piece 3 deviates from the fin subassembly 2, and the fan 4 is used for blowing to the fin subassembly 2 to accelerate the radiating efficiency of fin subassembly 2, vibration that the buffer piece 3 produced when can absorbing fan 4 operation, thereby can reduce the vibration transmission of fan 4 to the fin subassembly 2, and then can reduce the rocking that projection equipment 1000 produced because of the vibration of fan 4, thereby guarantee user's experience.

It should be noted that, the surface area of the heat sink assembly 2 is larger than the surface area of the circuit board 12, so that the heat dissipation effect is greatly improved by conducting the heat generated by the circuit board 12 to the heat sink assembly 2 and simultaneously blowing the heat sink assembly 2 by the fan 4.

For the above-mentioned heat sink assembly 2, referring to fig. 1 to 4, the heat sink assembly 2 includes the heat sink 21 and the heat conducting tube 22, the heat conducting tube 22 is bent and extended, and the first end 221 of the heat conducting tube 22 is connected to the heat sink 21, the second end 222 of the heat conducting tube 22 is connected to the circuit board 12, and the heat conducting tube 22 is used for conducting the heat generated by the circuit board 12 to the heat sink 21. Since the heat conductive pipe 22 is folded and extended, the accommodating space 5 is provided between the first end 221 and the other end of the heat conductive pipe 22 in the first direction X, the buffer member 3 is mounted on the heat sink 21, and both the buffer member 3 and the fan 4 are located in the accommodating space 5 in the first direction X, so that the fan 4 can blow air from below the heat sink 21 to the heat sink 21, and the air blown by the fan 4 flows out from the side of the heat sink 21 away from the circuit board 12, thereby realizing heat dissipation to the heat sink 21. In this embodiment, the fan 4 is disposed in the accommodating space 5 between the first end 221 and the other end of the heat conducting tube 22, and the air blown by the fan 4 takes away the heat of the heat dissipating fin 21 and then is blown out from the side of the heat dissipating fin 21 away from the circuit board 12, so that the effect of affecting the heat dissipation effect of the heat dissipating plate caused by the air blown by the fan 4 blowing onto the circuit board 12 after passing through the heat dissipating fin 21 can be avoided, and the heat dissipation efficiency of the heat dissipation mechanism 100 can be guaranteed.

Further, the number of the fins 21 is plural, the plural fins 21 are arranged at intervals, and the distance between every adjacent two fins 21 is the same. The first ends 221 of the heat pipes 22 are disposed through all the heat sinks 21, so that the heat pipes 22 can conduct heat generated by the circuit board 12 to the plurality of heat sinks 21. In the present embodiment, by providing a plurality of fins 21, the surface area of the fin assembly 2 is increased, and the heat radiation efficiency of the fin assembly 2 is improved.

In some embodiments, the distance between each adjacent two fins 21 may also be different.

Further, the number of the heat conducting pipes 22 is plural, the heat conducting pipes 22 are all bent, the first ends 221 of the heat conducting pipes 22 are all penetrating through all the heat dissipation fins 21, the second ends 222 of the heat conducting pipes 22 are all connected with the circuit board 12, and the heat conducting pipes 22 are commonly used for transferring heat of the circuit board 12 to the heat dissipation fins 21. In this embodiment, the plurality of heat pipes 22 are used to conduct heat to the plurality of heat dissipation fins 21, so that the heat transfer efficiency of the heat can be improved, and the heat generated by the circuit board 12 can be timely conducted to the plurality of heat dissipation fins 21, which is beneficial to improving the heat dissipation efficiency of the heat dissipation mechanism 100.

In some embodiments, the heat conducting tube 22 and the heat sink 21 are made of copper, which has good heat conducting performance and high rigidity, and can support the fan 4 and the buffer member 3. It should be noted that, the materials of the heat conducting tube 22 and the heat dissipating fin 21 are not limited to copper materials, and may be made of other materials, such as aluminum, so long as the heat conducting tube 22 and the heat dissipating fin 21 have good heat conducting property and can support the fan 4 and the heat dissipating fin 21.

For the above-described cushion member 3, referring to fig. 2, 5 and 6, the cushion member 3 is provided with the communication groove 31, the card groove 32 and the mounting portion 33. The communication groove 31 penetrates the buffer member 3, the plurality of cooling fins 21 are exposed to one end of the communication groove 31, and the fan 4 is exposed to the other end of the communication groove 31, so that wind blown out by the fan 4 can be blown onto the plurality of cooling fins 21 through the communication groove 31, thereby taking away heat of the cooling fins 21. The clamping groove 32 is arranged on the side wall of the buffer member 3, and the clamping groove 32 is communicated with the communicating groove 31. The heat sink 21 located at the outermost side is provided with a clamping portion 211, and the clamping portion 211 is clamped in the clamping groove 32, so that the buffer member 3 and the heat sink assembly 2 are fixed. The mounting portion 33 is used for mounting and fixing the fan 4.

Further, the number of the clamping grooves 32 is plural, a part of the clamping grooves 32 are arranged on the first side wall 34 of the buffer member 3, a part of the clamping grooves 32 are arranged on the second side wall 35 of the buffer member 3, and the first side wall 34 is opposite to the second side wall 35. The two heat sinks 21 located at the outermost sides are provided with a plurality of clamping parts 211, and one clamping part 211 is clamped in one clamping groove 32 so as to fix the heat sink assembly 2 and the buffer 3. In the present embodiment, the plurality of engaging portions 211 are engaged with the plurality of engaging grooves 32, respectively, so that the stability of the fixation between the damper 3 and the fin assembly 2 can be improved.

Further, the fin assembly 2 further includes a connection piece 23, one end of each of the plurality of fins 21 is connected to the connection piece 23, and the connection piece 23 is used for fixing the plurality of fins 21 to each other. It should be noted that the material of the connecting piece 23 may be the same as that of the heat sink 21, so that the connecting piece 23 also has a heat dissipation effect, thereby improving the heat dissipation efficiency of the heat dissipation mechanism 100.

Further, the buffer 3 is further provided with a partition 36, the partition 36 partitions the communication groove 31 into a first groove 311 and a second groove 312, the plurality of fins 21 are at least partially accommodated in the first groove 311, and the fan 4 is at least partially accommodated in the second groove 312. The partition 36 is provided with a through hole 361, one end of the through hole 361 is communicated with the first slot body 311, the other end of the through hole 361 is communicated with the second slot body 312, the plurality of cooling fins 21 are at least partially exposed to one end of the through hole 361, and the fan 4 is at least partially exposed to the other end of the through hole 361, so that wind blown out by the fan 4 passes through the through hole 361 and flows out of the opening of the first slot body 311 after vertical to the plurality of cooling fins 21.

Further, referring to fig. 2, 4, 5 and 6, the buffer member 3 is made of plastic or silica gel, and the buffer member 3 is flexible, when the fin assembly 2 is mounted on the buffer member 3, the two fins 21 located at the outermost side are both abutted with the surface of the partition 36 facing the first slot 311, and the plurality of clamping portions 211 are respectively clamped in the plurality of clamping grooves 32, so that the fixation between the buffer member 3 and the fin assembly 2 is realized. It should be noted that, since the buffer member 3 has flexibility, when a sufficient force (for example, a force greater than 100 newtons) is applied to the buffer member 3, the buffer member 3 may be deformed, so that the plurality of heat dissipation fins 21 may be placed in the first groove 311 first, then the first side wall 34 of the buffer member 3 is pulled towards a direction away from the second groove 312 by force, so that the first side wall 34 is deformed, and the clamping groove 32 on the first side wall 34 is clamped with the clamping portion 211 on the heat dissipation fin 21 located at the outermost side, so that the clamping portion 211 on the heat dissipation fin 21 located at the outermost side is clamped with the clamping groove 32 on the first side wall 34. Similarly, the second side wall 35 of the buffer 3 is pulled in a direction away from the second groove 312 by force, so that the second side wall 35 is deformed, and the locking groove 32 on the second side wall 35 is locked with the locking portion 211 on the other outermost heat sink 21, thereby locking and fixing the locking portion 211 on the other outermost heat sink 21 and the locking groove 32 on the second side wall 35, and further fixing the buffer 3 and the heat sink assembly 2.

Further, one end of the mounting portion 33 is connected to a surface of the partition portion 36 facing the second groove 312, and the other end of the mounting portion 33 extends in a direction away from the first groove 311. The mounting portion 33 is provided with a clamping table 331, the fan 4 is provided with a mounting hole 41, the mounting portion 33 is inserted into the mounting hole 41, and the clamping table 331 passes through the mounting hole 41 and is then clamped to the first surface 42 of the fan 4, so that the fan 4 is fixed to the buffer 3. It should be noted that the diameter of the clamping table 331 is larger than the diameter of the mounting hole 41, and because the buffer member 3 is flexible, that is, the clamping table 331 has flexibility, the clamping table 331 can pass through the mounting hole 41. In this embodiment, since the buffer member 3 is flexible, when the fan 4 vibrates, the buffer member 3 can absorb the vibration of the fan 4, so as to reduce the transmission of the vibration to the heat sink assembly 2 and further reduce the transmission of the vibration to the housing 11.

Further, the clamping table 331 is provided with a guide slope 3311, and during the process of passing the clamping table 331 through the mounting hole 41, the inner wall of the mounting hole 41 may gradually slide along the guide slope 3311 so that the clamping table 331 passes through the mounting hole 41.

In some embodiments, the number of the mounting portions 33 is plural, one end of each of the plurality of mounting portions 33 is connected to the partition 36, one mounting portion 33 is provided with a clamping table 331, the fan 4 is provided with a plurality of mounting holes 41, one mounting portion 33 is inserted into one mounting hole 41, and one clamping table 331 is clamped with the fan 4 after passing through one mounting hole 41, so as to fix the fan 4 to the buffer 3. In the present embodiment, by providing a plurality of mounting portions 33 and mounting holes 41, the stability of the fixation between the fan 4 and the damper 3 can be improved.

In some embodiments, referring to fig. 2, the heat dissipation mechanism 100 further includes a mounting bracket 7 and a cushion 8. The second ends 222 of the plurality of heat conducting pipes 22 are fixed on the mounting frame 7 through laser welding, the surface of the mounting frame 7, which is away from the heat conducting pipes 22, is abutted against the circuit board 12, heat generated by the circuit board 12 is conducted to the plurality of heat conducting pipes 22 through the mounting frame 7, and the plurality of heat conducting pipes 22 conduct the heat to the plurality of cooling fins 21. The mounting bracket 7 is fixed in shell 11 through screw (not shown) to separate through blotter 8 between mounting bracket 7 and the shell 11, the blotter 8 can cushion the vibration of fin subassembly 2 and mounting bracket 7, reduces vibration transmission to the installation shell, thereby can reduce projection equipment's rocking, guarantees user's experience. In this embodiment, through setting up blotter 8 between mounting bracket 7 and shell 11, that is to say, set up two-layer buffer structure from fan 4 to shell 11 between, greatly reduced the risk that the vibration that fan 4 produced was conducted to shell 11, further reduced projection equipment and appear rocking the risk, guaranteed user's experience.

In some embodiments, the mounting 7 is made of aluminum.

In some embodiments, the number of cushioning pads 8 is plural, and a plurality of cushioning pads 8 are disposed between the mounting frame 7 and the housing 11. By providing a plurality of cushion pads 8, the vibration damping effect can be improved.

In the embodiment of the utility model, the buffer piece 3 is arranged on the radiating fin assembly 2, the fan 4 is arranged on one side of the buffer piece 3 away from the radiating fin assembly 2, and vibration generated when the fan 4 runs is absorbed by the buffer piece 3, so that the vibration of the fan 4 is reduced and transmitted to the radiating fin assembly 2, further the risk of shaking of the projection equipment is reduced, and the user experience is ensured.

The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.

Claims (10)

1. A heat dissipation mechanism, comprising:

the radiating fin assembly is used for being connected with the part to be radiated so as to absorb heat of the part to be radiated;

the buffer piece is provided with a communication groove, the radiating fin assembly is arranged in the communication groove, and the radiating fin assembly is at least partially exposed at one end of the communication groove;

and a fan mounted on a side of the buffer member facing away from the fin assembly, and at least partially exposed to the other end of the communication groove.

2. The heat dissipation mechanism as recited in claim 1, wherein,

The radiating fin assembly is provided with a clamping part, the buffer piece is provided with a clamping groove, and the clamping part is clamped in the clamping groove.

3. The heat dissipation mechanism as recited in claim 1, wherein,

The buffer piece is also provided with an installation part, and the installation part is provided with a clamping table;

the fan is provided with a mounting hole, the mounting part is inserted into the mounting hole, and the clamping table passes through the mounting hole and then is clamped with the fan.

4. The heat dissipation mechanism as recited in claim 3, wherein,

The number of the mounting parts is multiple, the mounting parts are distributed in a rectangular shape, and clamping tables are arranged on the mounting parts;

The fan is provided with a plurality of mounting holes, one mounting part is inserted into one mounting hole, and one clamping table passes through one mounting hole and then is clamped with the fan, so that the fan is fixed on the buffer piece.

5. The heat dissipating mechanism of any one of claims 1 to 4,

The radiating fin assembly comprises a heat conducting pipe and radiating fins, wherein the first end of the heat conducting pipe is connected with the radiating fins, the second end of the heat conducting pipe is connected with the to-be-radiated component, and the heat conducting pipe is used for conducting heat of the to-be-radiated component to the radiating fins.

6. The heat dissipation mechanism as recited in claim 5, wherein,

The first end of the heat conduction pipe penetrates through the radiating fin, the second end of the heat conduction pipe is connected with the part to be radiated, the heat conduction pipe is bent and extended, an accommodating space is formed between the first end and the other end of the heat conduction pipe in the first direction, and the buffer piece and the fan are both located in the accommodating space.

7. The heat dissipation mechanism as recited in claim 5, wherein,

The number of the radiating fins is multiple, the radiating fins are arranged at intervals, and the heat conduction pipe penetrates through the radiating fins.

8. A projection apparatus comprising a member to be heat-dissipated and the heat dissipating mechanism according to any one of claims 5 to 7, wherein a heat pipe in the heat dissipating mechanism is connected to the member to be heat-dissipated to conduct heat of the member to be heat-dissipated to the heat dissipating fin.

9. The projection device of claim 8, wherein the projection device is configured to,

The component to be cooled comprises a shell and a circuit board, and the circuit board is arranged on the shell;

The heat dissipation mechanism further comprises a mounting frame, the second end of the heat conduction pipe is connected with the mounting frame, the mounting frame faces away from the surface of the heat conduction pipe and is abutted to the circuit board, and the mounting frame is fixed to the shell.

10. The projection device of claim 9, wherein the projection device is configured to,

The heat dissipation mechanism further comprises a buffer cushion, wherein the buffer cushion is located between the mounting frame and the shell, and the mounting frame and the buffer cushion are fixed on the part to be dissipated through screws.