CN219351989U

CN219351989U - Multilayer HDI circuit board with inner layers interconnected

Info

Publication number: CN219351989U
Application number: CN202320353695.6U
Authority: CN
Inventors: 李存芝; 黄全国; 雒文博
Original assignee: Shenzhen Jieshuncheng Technology Co ltd
Current assignee: Shenzhen Jieshuncheng Technology Co ltd
Priority date: 2023-03-01
Filing date: 2023-03-01
Publication date: 2023-07-14
Anticipated expiration: 2033-03-01

Abstract

The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which belongs to the technical field of HDI circuit boards and comprises a support frame, wherein a circuit board body is arranged on the inner side of the support frame, fixed pipes are equidistantly arranged on the inner side of the support frame, the inner cavities of the fixed pipes are connected with fixed rods in a sliding manner, the top ends of the fixed pipes penetrate through the fixed pipes and extend to the outer parts of the fixed pipes, and the circuit board body is fixedly connected with the fixed rods through bolts; through setting up fixed pipe, dead lever and damping spring, can cushion the circuit board body through damping spring, reduce the impact force that the circuit board body received, protected the circuit board body, the fixed pipe can protect damping spring simultaneously, avoids when using for a long time, damping spring's surface can adhere to the dust, has guaranteed damping spring's normal use, has avoided damping spring to expose outside simultaneously, has improved damping spring's life.

Description

Multilayer HDI circuit board with inner layers interconnected

Technical Field

The utility model relates to the technical field of HDI circuit boards, in particular to a multilayer HDI circuit board with inner layers interconnected.

Background

The HDI circuit board is an english shorthand of High Density Interconnector, the high-density interconnection (HDI) manufacture is one of the fastest growing fields in the printed circuit board industry, the HDI board (which is a circuit board with high wiring density in the micro blind hole technology, is divided into an inner layer circuit and an outer layer circuit, and internal connection of each layer of circuit is realized by a drilling and metallization method), therefore, the higher the application of the HDI technology, the higher the manufacturing level of the laminated board, the higher-order HDI adopts two, three or more lamination processes, and electroplating hole filling, hole piling, laser direct drilling and the like.

CN217770683U discloses a multilayer HDI circuit board of inlayer interconnection, including the HDI circuit board, a plurality of blind hole has all been opened at HDI circuit board upper end front portion and upper end rear portion, reinforcing apparatus is installed to the HDI circuit board lower extreme, shock attenuation protector is installed jointly to HDI circuit board left end and right-hand member, the mounting panel is installed jointly to shock attenuation protector upper end left part and upper end right-hand member, mounting panel upper end mid-mounting has heat abstractor, the protection curb plate is all installed to mounting panel front end and rear end. According to the multilayer HDI circuit board with the inner layer interconnection, the shock absorption protection device is used for avoiding the damage of the HDI circuit board caused by scratch and vibration, so that the use effect of the multilayer HDI circuit board is improved, the heat dissipation performance of the HDI circuit board is improved through the heat dissipation device and the reinforcing device, and the HDI circuit board has better resistance when being bent through the design of the reinforcing plate.

The above patents also have problems in use, such as: the HDI circuit board is damped through the first spring and the second spring, but the first spring and the second spring are exposed outside, a large amount of dust is easy to adhere to the first spring and the second spring when the HDI circuit board is used for a long time, meanwhile, the adhered dust is easy to reduce the normal use of the first spring and the second spring, so that the normal damping function of the HDI circuit board is affected, and therefore, a multilayer HDI circuit board with interconnected inner layers is needed to be provided.

Disclosure of Invention

The utility model aims to provide a multilayer HDI circuit board with inner layers interconnected, which has the advantage of protecting springs for damping the HDI circuit board, so as to solve the problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an inlayer interconnect's multilayer HDI circuit board, includes the support frame, the inboard of support frame is provided with the circuit board body, the fixed pipe is installed to the inboard equidistance of support frame, the inner chamber sliding connection of fixed pipe has the dead lever, the top of fixed pipe runs through the fixed pipe and extends to the outside of fixed pipe, the circuit board body passes through bolt and dead lever fixed connection, the bottom of fixed pipe inner chamber is connected with damping spring, damping spring's top is connected with the bottom of dead lever, the top of support frame is provided with protection machanism.

Preferably, the support frame comprises a fixing plate and a connecting plate, the connecting plate is fixedly arranged at the center of the top of the fixing plate, the bottom of the fixing tube is connected with one side of the top of the fixing plate, and the fixing plate and the connecting plate are integrally formed.

Preferably, the protection mechanism comprises a top plate, the top plate is fixedly connected with the connecting plate through screws, the front side and the rear side of the top plate are respectively connected with a side plate through screws, and the two sides of the top plate are respectively provided with a heat dissipation mechanism.

Preferably, the heat dissipation mechanism comprises a heat dissipation pipe, the bottom end of the heat dissipation pipe is communicated with the top of the top plate, the inner cavities of the heat dissipation pipe are equidistantly provided with supporting rods, and the inner ends of the supporting rods are connected with heat dissipation fans.

Preferably, damping sliding blocks are arranged at the bottoms of two sides of the fixing rod, sliding grooves are formed in the inner cavities of the fixing pipes and located at corresponding positions of the damping sliding blocks, and the surfaces of the damping sliding blocks are in sliding connection with the inner cavities of the sliding grooves.

Preferably, the surface cover of dead lever is equipped with rubber buffer cover, the bottom of rubber buffer cover is connected with the top of fixed pipe, the surface of dead lever and the inboard sliding connection of rubber buffer cover.

Preferably, the top of the circuit board body is connected with a heat conducting plate, and the top of the heat conducting plate is connected with a heat radiating plate.

Preferably, the shrinkage pool has been seted up at the top of roof, the cooling tube is fixed in the inboard of shrinkage pool, the bottom of cooling tube is uncovered setting, the louvre has been seted up to the top equidistance of cooling tube.

Preferably, the mounting holes are formed in the other side of the top of the fixing plate at equal intervals.

Preferably, protection pads are arranged on two sides of the top of the heat dissipation plate.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, through the arrangement of the fixing tube, the fixing rod and the damping spring, the damping spring can be used for damping the circuit board body, so that the impact force born by the circuit board body is reduced, the circuit board body is protected, meanwhile, the fixing tube can be used for protecting the damping spring, dust is prevented from adhering to the surface of the damping spring when the damping spring is used for a long time, the normal use of the damping spring is ensured, the damping spring is prevented from being exposed outside, and the service life of the damping spring is prolonged.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a right side view of the present utility model;

FIG. 3 is a schematic cross-sectional elevation view of a mounting tube according to the present utility model;

FIG. 4 is a schematic diagram of a cross-sectional front view of a radiator of the present utility model;

fig. 5 is a schematic diagram of a heat dissipating plate according to the present utility model.

In the figure: 1. a support frame; 2. a circuit board body; 3. a fixed tube; 4. a fixed rod; 5. a damping spring; 6. a protective mechanism; 11. a fixing plate; 12. a connecting plate; 61. a top plate; 62. a side plate; 63. a heat dissipation mechanism; 631. a heat radiating pipe; 632. a support rod; 633. a heat dissipation fan; 7. damping slide blocks; 8. a heat conductive plate; 9. and a heat dissipation plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution: the utility model provides a multilayer HDI circuit board that inlayer is interconnected, including support frame 1, the inboard of support frame 1 is provided with circuit board body 2, fixed pipe 3 is installed to the inboard equidistance of support frame 1, the inner chamber sliding connection of fixed pipe 3 has dead lever 4, the top of fixed pipe 3 runs through fixed pipe 3 and extends to the outside of fixed pipe 3, circuit board body 2 passes through bolt and dead lever 4 fixed connection, the bottom of fixed pipe 3 inner chamber is connected with damping spring 5, damping spring 5's top is connected with dead lever 4's bottom, support frame 1's top is provided with protection machanism 6;

through the setting of fixed pipe 3, dead lever 4 and damping spring 5, can carry out the shock attenuation to circuit board body 2 through damping spring 5, reduce the impact force that circuit board body 2 received, protected circuit board body 2, fixed pipe 3 can protect damping spring 5 simultaneously, avoid when long-time use, damping spring 5's surface can adhere to the dust, guaranteed damping spring 5's normal use, avoided damping spring 5 to expose outside simultaneously, improved damping spring 5's life.

Referring to fig. 1-5, the support frame 1 includes fixed plate 11 and connecting plate 12, connecting plate 12 fixed mounting is in the center department at fixed plate 11 top, the bottom of fixed pipe 3 is connected with one side at fixed plate 11 top, fixed plate 11 and connecting plate 12 are integrated into one piece setting, the stable in structure of support frame 1 has been increased, the life of support frame 1 has been increased, protection machanism 6 includes roof 61, roof 61 passes through screw and connecting plate 12 fixed connection, both sides all have curb plate 62 through screw connection around roof 61, the both sides at roof 61 top all are provided with cooling machanism 63, can protect the top and the lateral part of circuit board body 2, the effect of protection has been played.

The radiating mechanism 63 comprises radiating pipes 631, the bottom ends of the radiating pipes 631 are communicated with the top of the top plate 61, struts 632 are arranged in the inner cavities of the radiating pipes 631 at equal intervals, radiating fans 633 are connected to the inner ends of the struts 632, when the radiating mechanism is used, the radiating fans 633 are started by an external controller, the radiating operation can be performed by the operating radiating fans 633, the normal use of the circuit board body 2 is guaranteed, damping sliding blocks 7 are arranged at the bottoms of the two sides of the fixing rod 4, sliding grooves are formed in the inner cavities of the fixing pipes 3 and in the corresponding positions of the damping sliding blocks 7, the surfaces of the damping sliding blocks 7 are in sliding connection with the inner cavities of the sliding grooves, the fixing rods 4 can be limited, the fixing rods 4 are prevented from moving out of the fixing pipes 3, and repeated bouncing of the damping springs 5 can be avoided through the damping sliding blocks 7.

The surface cover of dead lever 4 is equipped with the rubber buffer cover, and the bottom of rubber buffer cover is connected with the top of fixed pipe 3, and the surface of dead lever 4 and the inboard sliding connection of rubber buffer cover, rubber buffer cover can protect circuit board body 2, prevent that circuit board body 2 and fixed pipe 3 from bumping, and the top of circuit board body 2 is connected with heat conduction board 8, and heat conduction board 8's top is connected with heating panel 9, can effectively heat conduction to circuit board body 2 through heat conduction board 8, then dispel through heating panel 9, be convenient for cool down circuit board body 2.

Concave holes are formed in the top of the top plate 61, the radiating pipes 631 are fixed to the inner side of the concave holes, the bottom ends of the radiating pipes 631 are arranged in an open mode, radiating holes are formed in the top of the radiating pipes 631 at equal intervals, the circuit board body 2 is conveniently discharged out of heat, the circuit board body 2 is facilitated to be cooled, mounting holes are formed in the other side of the top of the fixing plate 11 at equal intervals, the device is conveniently fixed, protection pads are arranged on two sides of the top of the radiating plate 9, the circuit board body 2 can be protected, the top of the radiating plate 9 is prevented from colliding with the top plate 61, and accordingly damage is caused to the radiating plate 9.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a multilayer HDI circuit board of inlayer interconnection, includes support frame (1), its characterized in that: the inside of support frame (1) is provided with circuit board body (2), fixed pipe (3) are installed to the inboard equidistance of support frame (1), the inner chamber sliding connection of fixed pipe (3) has dead lever (4), the top of fixed pipe (3) runs through fixed pipe (3) and extends to the outside of fixed pipe (3), circuit board body (2) pass through bolt and dead lever (4) fixed connection, the bottom of fixed pipe (3) inner chamber is connected with damping spring (5), the top and the bottom of dead lever (4) of damping spring (5) are connected, the top of support frame (1) is provided with protection machanism (6).

2. The multilayer HDI circuit board of claim 1 wherein: the support frame (1) comprises a fixing plate (11) and a connecting plate (12), wherein the connecting plate (12) is fixedly arranged at the center of the top of the fixing plate (11), the bottom of the fixing tube (3) is connected with one side of the top of the fixing plate (11), and the fixing plate (11) and the connecting plate (12) are integrally formed.

3. The multilayer HDI circuit board of claim 2 wherein: the protection mechanism (6) comprises a top plate (61), the top plate (61) is fixedly connected with the connecting plate (12) through screws, side plates (62) are connected to the front side and the rear side of the top plate (61) through screws, and heat dissipation mechanisms (63) are arranged on the two sides of the top plate (61).

4. An inner interconnect multilayer HDI circuit board according to claim 3, wherein: the heat dissipation mechanism (63) comprises a heat dissipation pipe (631), the bottom end of the heat dissipation pipe (631) is communicated with the top of the top plate (61), a supporting rod (632) is installed in the inner cavity of the heat dissipation pipe (631) at equal intervals, and the inner end of the supporting rod (632) is connected with a heat dissipation fan (633).

5. The multilayer HDI circuit board of claim 4 wherein: damping slide blocks (7) are arranged at the bottoms of two sides of the fixing rod (4), sliding grooves are formed in the inner cavities of the fixing pipes (3) and located at corresponding positions of the damping slide blocks (7), and the surfaces of the damping slide blocks (7) are in sliding connection with the inner cavities of the sliding grooves.

6. The multilayer HDI circuit board of claim 5 wherein: the surface cover of dead lever (4) is equipped with rubber buffer cover, the bottom of rubber buffer cover is connected with the top of fixed pipe (3), the surface of dead lever (4) and the inboard sliding connection of rubber buffer cover.

7. The multilayer HDI circuit board of claim 6 wherein: the top of circuit board body (2) is connected with heat conduction board (8), the top of heat conduction board (8) is connected with heating panel (9).

8. The multilayer HDI circuit board of claim 7 wherein: shrinkage pool has been seted up at the top of roof (61), cooling tube (631) are fixed in the inboard of shrinkage pool, the bottom of cooling tube (631) is open setting, the louvre has been seted up to the top equidistance of cooling tube (631).

9. The multilayer HDI circuit board of claim 8 wherein: mounting holes are formed in the other side of the top of the fixing plate (11) at equal intervals.

10. The multilayer HDI circuit board of claim 9 wherein: protection pads are arranged on two sides of the top of the heat radiation plate (9).