CN216982193U - Multilayer printed wiring board with location structure - Google Patents
Multilayer printed wiring board with location structure Download PDFInfo
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- CN216982193U CN216982193U CN202220105711.5U CN202220105711U CN216982193U CN 216982193 U CN216982193 U CN 216982193U CN 202220105711 U CN202220105711 U CN 202220105711U CN 216982193 U CN216982193 U CN 216982193U
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- circuit board
- board main
- main body
- main part
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Abstract
The utility model relates to the technical field of circuit boards, and provides a multilayer printed circuit board with a positioning structure, which comprises a first circuit board main body and a second circuit board main body, wherein the second circuit board main body is arranged at one end of the first circuit board main body, a heat dissipation structure is arranged at the other end of the first circuit board main body, a protection structure is arranged at the corner position of the first circuit board main body, auxiliary structures are arranged at two sides of the inner part of the first circuit board main body, each protection structure comprises a rubber sleeve, a butt joint groove and a top block, the rubber sleeve is arranged at the corner position of the first circuit board main body, and the butt joint groove is formed in the rubber sleeve; according to the utility model, the protection structure is arranged, the rubber sleeve is arranged at each corner of the first circuit board main body, the soft material of the rubber sleeve can play a role of buffering and protecting when the first circuit board main body is impacted, and the problem of damage when the first circuit board main body is impacted can be prevented by protecting the corners of the first circuit board main body.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer printed circuit board with a positioning structure.
Background
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components and devices, and are classified into single-sided boards, double-sided boards, four-layered boards, six-layered boards, and other multilayer printed circuit boards according to the number of layers of the circuit boards.
The circuit board on the market is various nowadays, can satisfy people's user demand basically, but still has certain problem: when the traditional circuit board is transported or used, if the circuit board is collided, the corners of the circuit board are easy to break or deform, so that the circuit board needs to be improved.
Disclosure of Invention
Technical problem to be solved
The utility model aims to provide a multilayer printed circuit board with a positioning structure, which is used for solving the defect that the existing multilayer printed circuit board with the positioning structure is lack of protection on the circuit board.
(II) contents of utility model
In order to solve the technical problems, the utility model provides the following technical scheme: the utility model provides a multilayer printed wiring board with location structure, includes first circuit board main part and second circuit board main part, the one end of first circuit board main part is provided with second circuit board main part, the other end of first circuit board main part is provided with heat radiation structure, the corner position department of first circuit board main part is provided with protective structure, the inside both sides of first circuit board main part are provided with auxiliary structure.
Preferably, protective structure includes rubber sleeve, butt joint groove and kicking block, the rubber sleeve sets up in the corner position department of first circuit board main part, the butt joint groove has been seted up to the inside of rubber sleeve, the inside wall in butt joint groove is fixed with the kicking block. Utilize the rubber sleeve can play the effect of protection to first circuit board main part.
Preferably, the inner diameter of the butt joint groove is larger than the outer diameter of the first circuit board main body, and the rubber sleeve is clamped at the corner position of the first circuit board main body through the butt joint groove.
Preferably, the auxiliary structure includes spacing groove, rubber ring and skid proof block, the inside both sides of first circuit board main part are seted up to the spacing groove, the inside of spacing groove is provided with the rubber ring, the inside wall of rubber ring is fixed with skid proof block.
Preferably, four sets of limiting grooves are arranged, and the limiting grooves are symmetrically distributed about a vertical central axis of the first circuit board main body. The limiting grooves distributed symmetrically can better position the circuit board.
Preferably, the heat radiation structure includes heat conduction silicone grease, heat-conducting plate and radiating fin, heat conduction silicone grease sets up in the one end of first circuit board main part, the one end of heat conduction silicone grease is provided with the heat-conducting plate, the one end of heat-conducting plate is fixed with radiating fin. The circuit board can be better radiated by using the heat-conducting silicone grease, the heat-conducting plate and the radiating fins.
Preferably, the radiating fins are provided with a plurality of groups, and the radiating fins are distributed at one end of the heat conducting plate at equal intervals. The radiating fins distributed at equal intervals can better radiate heat.
(III) advantageous effects
The utility model provides a multilayer printed circuit board with a positioning structure, which has the advantages that:
the rubber sleeve is arranged at each corner of the first circuit board main body through the arrangement of the protection structure, the soft material of the rubber sleeve can play a role in buffering and protecting when the first circuit board main body is impacted, and the problem that the first circuit board main body is damaged when the first circuit board main body is impacted can be prevented through protecting the corners of the first circuit board main body;
the auxiliary structure is arranged, the limiting groove is clamped with the positioning block on the mounting seat, the mounting and fixing position of the circuit board can be positioned by clamping the limiting groove with the positioning block, and the mounting position of the circuit board can be more accurate by positioning the circuit board;
through being provided with heat radiation structure, utilize heat conduction silicone grease, heat-conducting plate and radiating fin to dispel the heat to first circuit board main part and second circuit board main part, through the heat dissipation treatment to first circuit board main part in second circuit board main part, can prevent that it from using for a long time, the temperature from causing the influence to first circuit board main part and second circuit board main part.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is a schematic top cross-sectional view of the present invention;
FIG. 3 is a schematic three-dimensional structure diagram of a positioning structure according to the present invention;
FIG. 4 is a schematic top cross-sectional view of a heat dissipation structure according to the present invention;
fig. 5 is a schematic three-dimensional structure diagram of the protective structure of the present invention.
The reference numerals in the figures illustrate: 1. a first circuit board main body; 2. a second circuit board main body; 3. a protective structure; 301. a rubber sleeve; 302. a butt joint groove; 303. a top block; 4. an auxiliary structure; 401. a limiting groove; 402. a rubber ring; 403. an anti-slip bump; 5. a heat dissipation structure; 501. heat-conducting silicone grease; 502. a heat conducting plate; 503. and (4) radiating fins.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without any inventive step, are within the scope of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the multilayer printed circuit board with a positioning structure provided by the present invention includes a first circuit board main body 1 and a second circuit board main body 2, the second circuit board main body 2 is disposed at one end of the first circuit board main body 1, the heat dissipation structure 5 is disposed at the other end of the first circuit board main body 1, the protection structure 3 is disposed at the corner position of the first circuit board main body 1, and the auxiliary structures 4 are disposed at two sides inside the first circuit board main body 1.
The inner diameter of the butt joint groove 302 is larger than the outer diameter of the first circuit board main body 1, and the rubber sleeve 301 is clamped at the corner position of the first circuit board main body 1 through the butt joint groove 302.
When using this structure, rubber sleeve 301 sets up in 1 each corner of first circuit board main part, and the soft material of rubber sleeve 301 can play the effect of buffer protection when first circuit board main part 1 receives the striking, through the protection to 1 corner of first circuit board main part, can prevent that it from appearing receiving the problem of damaging when the striking.
The auxiliary structure 4 includes a limiting groove 401, a rubber ring 402 and an anti-slip bump 403, the limiting groove 401 is opened on two sides of the first circuit board main body 1, the rubber ring 402 is arranged in the limiting groove 401, and the anti-slip bump 403 is fixed on the inner side wall of the rubber ring 402.
The limiting grooves 401 are provided with four groups, and the limiting grooves 401 are symmetrically distributed about the vertical central axis of the first circuit board main body 1.
When the structure is used, the mounting and fixing positions of the circuit boards can be positioned by clamping the limiting grooves 401 with the positioning blocks on the mounting seat and clamping the limiting grooves 401 with the positioning blocks, the mounting positions of the circuit boards can be more accurate by positioning the circuit boards, and the circuit boards can be better positioned by the symmetrically distributed limiting grooves 401.
The heat dissipation structure 5 comprises heat conduction silicone grease 501, a heat conduction plate 502 and heat dissipation fins 503, wherein the heat conduction silicone grease 501 is arranged at one end of the first circuit board main body 1, the heat conduction plate 502 is arranged at one end of the heat conduction silicone grease 501, and the heat dissipation fins 503 are fixed at one end of the heat conduction plate 502.
The heat dissipating fins 503 are provided in several groups, and the heat dissipating fins 503 are equally spaced at one end of the heat conducting plate 502.
When the structure is used, the first circuit board main body 1 and the second circuit board main body 2 can be cooled by utilizing the heat-conducting silicone grease 501, the heat-conducting plate 502 and the heat-radiating fins 503, and the first circuit board main body 1 and the second circuit board main body 2 can be prevented from being affected by temperature when the structure is used for a long time through heat-radiating treatment of the first circuit board main body 1 on the second circuit board main body 2, wherein the heat-radiating fins 503 distributed at equal intervals can be used for better cooling.
The working principle is as follows: when the circuit board is used, firstly, when the circuit board is transported, the rubber sleeve 301 can be installed at the corner of the first circuit board main body 1, the first circuit board main body 1 can be protected by the rubber sleeve 301, when the circuit board is impacted, the soft material of the rubber sleeve 301 can play a certain buffering role, so that the first circuit board main body 1 is protected from being damaged, the rubber sleeve 301 can be sleeved at the corner position of the first circuit board main body 1 only by the butt-joint groove 302, the top block 303 on the inner wall of the butt-joint groove 302 is tightly abutted against the first circuit board main body 1, and the rubber sleeve 301 can be stably installed at the corner position of the first circuit board main body 1;
secondly, when the circuit board is installed, the limiting grooves 401 on two sides inside the first circuit board main body 1 are clamped with the limiting blocks on the installation seat, the installation position of the first circuit board main body 1 can be positioned by utilizing the clamping between the limiting grooves 401 and the limiting blocks, meanwhile, the rubber rings 402 installed in the inner side walls of the limiting grooves 401 are directly contacted with the limiting blocks, the stability after the limiting grooves 401 are clamped with the limiting blocks can be improved by utilizing the anti-skidding lugs 403 fixed on the inner side walls of the rubber rings 402, and the problem that the first circuit board main body 1 shakes to influence the positioning effect of the first circuit board main body 1 due to the fact that the gaps of the connecting parts of the limiting grooves 401 and the limiting blocks are large after the limiting grooves 401 are clamped with the limiting blocks is solved to a certain extent;
finally, the heat-conducting silicone grease 501 has excellent heat-conducting performance, the heat inside the first circuit board main body 1 and the second circuit board main body 2 can be conducted out, the heat conducted through the heat-conducting silicone grease 501 can be dissipated to the air through the heat conducting plate 502 and the heat dissipation fins 503, the purpose of heat dissipation is achieved, the influence on the first circuit board main body 1 and the second circuit board main body 2 caused by high temperature is reduced to a certain extent through heat dissipation treatment on the first circuit board main body 1 and the second circuit board main body 2, and the use work of the multilayer printed circuit board with the positioning structure is finally completed.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. The utility model provides a multilayer printed wiring board with location structure, includes first circuit board main part (1) and second circuit board main part (2), its characterized in that: one end of the first circuit board main body (1) is provided with a second circuit board main body (2);
the other end of the first circuit board main body (1) is provided with a heat dissipation structure (5);
the corner position department of first circuit board main part (1) is provided with protective structure (3), the inside both sides of first circuit board main part (1) are provided with auxiliary structure (4).
2. The multilayer printed wiring board with a positioning structure according to claim 1, wherein: protective structure (3) include rubber sleeve (301), butt joint groove (302) and kicking block (303), rubber sleeve (301) set up in the corner position department of first circuit board main part (1), butt joint groove (302) have been seted up to the inside of rubber sleeve (301), the inside wall in butt joint groove (302) is fixed with kicking block (303).
3. The multilayer printed wiring board with a positioning structure according to claim 2, wherein: the internal diameter of butt joint groove (302) is greater than the external diameter of first circuit board main part (1), rubber sleeve (301) are through butt joint groove (302) card in the corner position department of first circuit board main part (1).
4. The multilayer printed wiring board with a positioning structure according to claim 1, wherein: auxiliary structure (4) include spacing groove (401), rubber ring (402) and skid proof block (403), the inside both sides in first circuit board main part (1) are seted up in spacing groove (401), the inside of spacing groove (401) is provided with rubber ring (402), the inside wall of rubber ring (402) is fixed with skid proof block (403).
5. The multilayer printed wiring board with a positioning structure according to claim 4, wherein: the limiting grooves (401) are provided with four groups, and the limiting grooves (401) are symmetrically distributed around the vertical central axis of the first circuit board main body (1).
6. The multilayer printed wiring board with a positioning structure according to claim 1, wherein: heat radiation structure (5) are including heat conduction silicone grease (501), heat-conducting plate (502) and radiating fin (503), heat conduction silicone grease (501) sets up in the one end of first circuit board main part (1), the one end of heat conduction silicone grease (501) is provided with heat-conducting plate (502), the one end of heat-conducting plate (502) is fixed with radiating fin (503).
7. The multilayer printed wiring board with a positioning structure according to claim 6, wherein: the heat dissipation fins (503) are provided with a plurality of groups, and the heat dissipation fins (503) are distributed at one end of the heat conduction plate (502) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220105711.5U CN216982193U (en) | 2022-01-17 | 2022-01-17 | Multilayer printed wiring board with location structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220105711.5U CN216982193U (en) | 2022-01-17 | 2022-01-17 | Multilayer printed wiring board with location structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216982193U true CN216982193U (en) | 2022-07-15 |
Family
ID=82351291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220105711.5U Active CN216982193U (en) | 2022-01-17 | 2022-01-17 | Multilayer printed wiring board with location structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216982193U (en) |
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2022
- 2022-01-17 CN CN202220105711.5U patent/CN216982193U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Dong Jiangang Inventor before: Huang Jiangang |