CN214852535U

CN214852535U - High density rigidity HDI circuit board

Info

Publication number: CN214852535U
Application number: CN202121465417.7U
Authority: CN
Inventors: 张晓亮; 严军; 袁金钟; 赵灿辉
Original assignee: Suichuan Xincheng Ruijia Electronics Co ltd
Current assignee: Suichuan Xincheng Ruijia Electronics Co ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2021-11-23
Anticipated expiration: 2031-06-30

Abstract

The utility model discloses a high-density rigid HDI circuit board, which comprises an HDI circuit board, wherein supporting plates are symmetrically arranged at the two sides of the bottom of the HDI circuit board, a heat dissipation mechanism and a protection mechanism are arranged between the supporting plates, the heat dissipation mechanism is arranged above the protection mechanism, a first threaded hole and a limiting plate are symmetrically arranged at the front side and the rear side of the supporting plate respectively, a first bolt is arranged at the front side of the limiting plate, the tail end of the first bolt penetrates through the limiting plate to be in threaded connection with the first threaded hole, a second bolt is arranged at the top of the HDI circuit board, a second threaded hole is symmetrically arranged at the two sides of the top of the supporting plate, the HDI circuit board can be dissipated heat through the heat dissipation mechanism, and the HDI circuit board can be better protected by matching with the supporting plates and rubber pads, and the mounting and dismounting between each part are convenient, thereby the maintenance is better carried out.

Description

High density rigidity HDI circuit board

Technical Field

The utility model relates to a high density rigidity HDI circuit board belongs to circuit board technical field.

Background

The HDI circuit board is very commonly used and important part composition in an engineering, it can make the circuit miniize, the visualization, the circuit board generally has single-sided board, this three big classification of double-sided board and multilayer circuit board, the extensive application of HDI circuit board makes the integrated level of circuit board constantly improve, circuit board structure becomes more accurate, to high density rigidity HDI circuit board, will dispel the heat and reduce the damage that vibrations led to the fact the HDI circuit board to it, and will be convenient for install the dismantlement between each part, make things convenient for the staff to overhaul it, for this, a high density rigidity HDI circuit board is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high density rigidity HDI circuit board to solve the problem of proposing in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a high density rigidity HDI circuit board, includes the HDI circuit board, HDI circuit board bottom bilateral symmetry is provided with the backup pad, be provided with heat dissipation mechanism and safeguard mechanism between backup pad and the backup pad, just heat dissipation mechanism sets up in safeguard mechanism top, both sides symmetry respectively are provided with first screw hole and limiting plate around the backup pad, the limiting plate front side is provided with first bolt, first bolt tail end runs through limiting plate and first screw hole threaded connection, HDI circuit board top is provided with the second bolt, second screw hole has been seted up to backup pad top bilateral symmetry, second bolt tail end runs through HDI circuit board and second screw hole threaded connection.

Further, heat dissipation mechanism includes heat-conducting plate, fin and mounting groove, the mounting groove is seted up in backup pad and the corresponding one side top of backup pad, the heat-conducting plate sets up between backup pad and backup pad, just the heat-conducting plate both ends all are in the mounting groove, the fin equidistance sets up in the heat-conducting plate bottom.

Further, the protection mechanism comprises a protection frame plate, a protection net and a connecting groove, the connecting groove is formed in one side, corresponding to the supporting plate, of the supporting plate, the left end and the right end of the protection frame plate are arranged in the connecting groove, and the protection net is arranged between the protection frame plates.

Furthermore, the bottom of the supporting plate is provided with a fixing bolt, and the tail end of the fixing bolt penetrates through the protective frame plate and is in threaded connection with the supporting plate.

Further, a gap is reserved between the protective net and the radiating fin.

Furthermore, a rubber pad is arranged at the bottom of the supporting plate, and a gap is reserved between the rubber pad and the fixing bolt.

The utility model has the advantages that:

1. through heat dissipation mechanism, can dispel the heat to the HDI circuit board to cooperation backup pad and rubber pad, the circuit board of protecting the HDI that can be better, and be convenient for install the dismantlement between each part, thereby better overhauls.

2. Through setting up protection machanism, can protect heat dissipation mechanism, make it be difficult for receiving the damage, through setting up limiting plate and first bolt, can restrict the heat-conducting plate, make better being in between backup pad and the backup pad of heat-conducting plate.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a schematic view of the overall structure of a high-density rigid HDI circuit board according to the present invention;

fig. 2 is a schematic diagram of an internal structure of a high-density rigid HDI circuit board according to the present invention;

FIG. 3 is a schematic view of a supporting plate of a high density rigid HDI circuit board according to the present invention;

FIG. 4 is a schematic view of a protective frame plate of a high density rigid HDI circuit board according to the present invention;

FIG. 5 is an enlarged schematic view of part A of a high density rigid HDI circuit board according to the present invention;

reference numbers in the figures: 1. HDI circuit board; 2. a support plate; 3. a first threaded hole; 4. a limiting plate; 5. a first bolt; 6. a second bolt; 7. a second threaded hole; 8. a heat conducting plate; 9. a heat sink; 10. mounting grooves; 11. a protective frame plate; 12. a protective net; 13. connecting grooves; 14. a fixing bolt; 15. a rubber pad; 16. a heat dissipation mechanism; 17. a guard mechanism.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a high density rigidity HDI circuit board, includes

HDI circuit board

1, 1 bottom bilateral symmetry of HDI circuit board is provided with backup pad 2, be provided with heat dissipation mechanism 16 and safeguard mechanism 17 between backup pad 2 and the backup pad 2, just heat dissipation mechanism 16 sets up in safeguard mechanism 17 top, both sides symmetry respectively are provided with first screw hole 3 and limiting plate 4 around the

backup pad

2, 4 front sides of limiting plate are provided with

first bolt

5, 5 tail ends of first bolt run through limiting

plate

4 and 3 threaded connection of first screw hole, 1 top of HDI circuit board is provided with second bolt 6, second screw hole 7 has been seted up to 2 top bilateral symmetry of backup pad, 6 tail ends of second bolt run through

HDI circuit board

1 and 7 threaded connection of second screw hole.

Specifically, as shown in fig. 1, fig. 2 and fig. 5, heat dissipation mechanism 16 includes heat-conducting plate 8, fin 9 and mounting groove 10, one side top that backup pad 2 and backup pad 2 correspond is seted up to mounting groove 10, heat-conducting plate 8 sets up between backup pad 2 and backup pad 2, just 8 both ends of heat-conducting plate all are in mounting groove 10, fin 9 equidistance sets up in 8 bottoms of heat-conducting plate, dispels the heat to HDI circuit board 1.

Specifically, as shown in fig. 2, fig. 4 and fig. 5, the protection mechanism 17 includes a protection frame plate 11, a protection net 12 and a connection groove 13, the connection groove 13 is provided on one side of the support plate 2 corresponding to the support plate 2, both ends are provided in the connection groove 13 about the protection frame plate 11, the protection net 12 is provided between the protection frame plates 11, a gap is left between the protection net 12 and the heat dissipation fins 9, the heat dissipation mechanism 16 is protected, and the heat dissipation mechanism 16 is not easily damaged.

Specifically, as shown in fig. 2 and 5, a fixing bolt 14 is disposed at the bottom of the supporting plate 2, and a tail end of the fixing bolt 14 penetrates through the protective frame plate 11 and is in threaded connection with the supporting plate 2, so as to fix the protective frame plate 11 and the supporting plate 2.

Specifically, as shown in fig. 2 and 5, a rubber pad 15 is arranged at the bottom of the supporting plate 2, and a gap is left between the rubber pad 15 and the fixing bolt 14, so that the HDI circuit board 1 is better protected.

The utility model discloses the theory of operation: set up HDI circuit board 1 at two backup pad 2 tops, and through second bolt 6 and second screw hole 7, fix HDI circuit board 1 and backup pad 2, operate heat dissipation mechanism 16, make 8 both ends of heat-conducting plate be in mounting groove 10, operate protection machanism 17, make 11 both ends of protection framed panel be in spread groove 13, and use first bolt 5 and second bolt 6, fix between 4 and the backup pad 2 with limiting plate, thereby restrict 8 heat-conducting plate, use gim peg 14, fix between 11 and the backup pad 2 with protecting framed panel, thereby strengthen the stability between 11 and the backup pad 2 of protection framed panel.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. The utility model provides a high density rigidity HDI circuit board, includes HDI circuit board (1), its characterized in that: supporting plates (2) are symmetrically arranged on two sides of the bottom of the HDI circuit board (1), a heat dissipation mechanism (16) and a protection mechanism (17) are arranged between the supporting plate (2) and the supporting plate (2), the heat dissipation mechanism (16) is arranged above the protection mechanism (17), the front side and the rear side of the support plate (2) are respectively and symmetrically provided with a first threaded hole (3) and a limiting plate (4), a first bolt (5) is arranged on the front side of the limiting plate (4), the tail end of the first bolt (5) penetrates through the limiting plate (4) and is in threaded connection with the first threaded hole (3), a second bolt (6) is arranged at the top of the HDI circuit board (1), second threaded holes (7) are symmetrically formed in two sides of the top of the supporting plate (2), the tail end of the second bolt (6) penetrates through the HDI circuit board (1) and is in threaded connection with the second threaded hole (7).

2. A high density rigid HDI wiring board according to claim 1 wherein: heat dissipation mechanism (16) include heat-conducting plate (8), fin (9) and mounting groove (10), one side top that backup pad (2) and backup pad (2) are corresponding is seted up in mounting groove (10), heat-conducting plate (8) set up between backup pad (2) and backup pad (2), just heat-conducting plate (8) both ends all are in mounting groove (10), fin (9) equidistance sets up in heat-conducting plate (8) bottom.

3. A high density rigid HDI wiring board according to claim 2 wherein: protection machanism (17) are including protection framed panel (11), protection network (12) and spread groove (13), one side that backup pad (2) and backup pad (2) are corresponding is seted up in spread groove (13), both ends set up in spread groove (13) about protection framed panel (11), protection network (12) set up between protection framed panel (11).

4. A high density rigid HDI wiring board according to claim 3 wherein: the bottom of the supporting plate (2) is provided with a fixing bolt (14), and the tail end of the fixing bolt (14) penetrates through the protective frame plate (11) and is in threaded connection with the supporting plate (2).

5. A high density rigid HDI wiring board according to claim 4 wherein: gaps are reserved between the protective net (12) and the radiating fins (9).

6. A high density rigid HDI wiring board according to claim 5, wherein: a rubber pad (15) is arranged at the bottom of the supporting plate (2), and a gap is reserved between the rubber pad (15) and the fixing bolt (14).