CN216253653U - Integrated circuit board structure - Google Patents
Integrated circuit board structure Download PDFInfo
- Publication number
- CN216253653U CN216253653U CN202122176832.7U CN202122176832U CN216253653U CN 216253653 U CN216253653 U CN 216253653U CN 202122176832 U CN202122176832 U CN 202122176832U CN 216253653 U CN216253653 U CN 216253653U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- integrated circuit
- plate
- fixedly connected
- board main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated circuit board structure, which relates to the technical field of integrated circuits and comprises an integrated circuit board main body and a protective shell, wherein the integrated circuit board main body is arranged inside the protective shell, a heat dissipation mechanism is arranged inside the protective shell, a buffer mechanism is arranged inside the integrated circuit board main body, the heat dissipation mechanism comprises a graphite heat conduction plate, the outer surface of the graphite heat conduction plate is fixedly connected with the inner wall of the protective shell, and a silicon-aluminum heat dissipation plate is arranged at the top of the protective shell. According to the utility model, through the matching among the graphite heat conducting plate, the silicon-aluminum heat radiating plate, the heat radiating groove and the ventilation opening, firstly, the heat generated by the integrated circuit board main body is led out through the graphite heat conducting plate, and the heat exchange with the external environment is accelerated through the matching of the silicon-aluminum heat radiating plate, the heat radiating groove and the ventilation opening, so that the integrated circuit board main body is prevented from being in a high-temperature environment for a long time, and the aging speed of elements is reduced.
Description
Technical Field
The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit board structure.
Background
The printed circuit board is the basis of almost any electronic product, and with the rapid development of the electronic industry, the printed circuit board as the basic component of the electronic product is more and more widely applied, although the functions of the electronic product are not only enhanced, but also the application field is expanded, and particularly under the driving of the development of the high-speed information era, the requirements of the printed circuit board applied to the electronic product are more and more increased, and especially the requirements of the printed circuit board in the aspects of signal transmission quality, speed and the like are continuously improved.
The following problems exist in the prior art:
1. the existing circuit board can rapidly generate more heat in the using process, the heat dissipation performance is poor, and the aging speed of elements is high due to the fact that internal electronic components are in a high-temperature state for a long time;
2. the existing circuit board has the problem that the service life of the device is shortened due to the fact that internal electronic components are very precise and are easily damaged when the circuit board is slightly collided.
SUMMERY OF THE UTILITY MODEL
The utility model provides an integrated circuit board structure, which aims to have the capability of quickly radiating heat and solve the problem of high aging speed of elements caused by long-time high-temperature state of electronic components; the other purpose is to solve the problem that the device is easy to damage when being impacted, so as to achieve the effect of prolonging the service life of the device.
In order to solve the technical problems, the technical scheme adopted by the utility model is as follows:
the utility model provides an integrated circuit board structure, includes integrated circuit board main part and protecting sheathing, the integrated circuit board main part sets up in protecting sheathing's inside, protecting sheathing's inside is provided with heat dissipation mechanism, the inside of integrated circuit board main part is provided with buffer gear.
The heat dissipation mechanism comprises a graphite heat conduction plate, the outer surface of the graphite heat conduction plate is fixedly connected with the inner wall of the protection shell, and a silicon-aluminum heat dissipation plate is arranged at the top of the protection shell.
The buffer mechanism comprises a buffer shell, the lower surface of the buffer shell is fixedly connected with the bottom of the inner cavity of the integrated circuit board main body, and an X-shaped support frame is arranged inside the buffer shell.
The technical scheme of the utility model is further improved as follows: the lower surface of graphite heat-conducting plate and the upper surface swing joint of integrated circuit board main part, the radiating groove has been seted up on the surface of graphite heat-conducting plate, fixedly connected with filter screen on the inner wall of radiating groove, fixedly connected with fixed plate on the inner wall of graphite heat-conducting plate, fixedly connected with graphite conducting strip on the surface of fixed plate.
The technical scheme of the utility model is further improved as follows: the lower surface of the silicon-aluminum heat dissipation plate is fixedly connected with the upper surface of the graphite heat conduction plate, the silicon-aluminum heat conduction pipe is fixedly connected inside the silicon-aluminum heat dissipation plate, the honeycomb heat dissipation groove is formed in the outer surface of the silicon-aluminum heat dissipation plate, and the ventilation opening is formed in the outer surface of the protective shell.
The technical scheme of the utility model is further improved as follows: the buffer structure is characterized in that a connecting plate is movably connected to the bottom of an inner cavity of the buffer shell, the outer surface of the X-shaped support frame is fixedly connected with the outer surface of the connecting plate, a sliding rod is fixedly connected to the outer surface of the connecting plate, and a sliding sleeve is movably connected to the outer surface of the sliding rod.
The technical scheme of the utility model is further improved as follows: the outer surfaces of the sliding sleeve and the sliding rod are sleeved with springs, the outer surface of one end of each spring is fixedly connected with the upper surface of the connecting plate, and the outer surface of the other end of each spring is fixedly connected with the lower surface of the connecting plate.
The technical scheme of the utility model is further improved as follows: the integrated circuit board comprises an integrated circuit board main body and is characterized in that a soft clamping block is fixedly connected to the outer surface of the integrated circuit board main body, a hemispherical clamping groove is formed in the inner wall of the protective shell, and the outer surface of the soft clamping block is movably connected with the inner wall of the hemispherical clamping groove.
The technical scheme of the utility model is further improved as follows: the inner wall of the protective shell is provided with a sliding groove, the outer surface of the integrated circuit board main body is fixedly connected with a sliding block, and the outer surface of the sliding block is movably connected with the inner wall of the sliding groove.
Due to the adoption of the technical scheme, compared with the prior art, the utility model has the technical progress that:
1. the utility model provides an integrated circuit board structure, which adopts the matching among a graphite heat conducting plate, a silicon-aluminum heat radiating plate, a heat radiating groove and a vent, firstly leads out the heat generated by an integrated circuit board main body through the graphite heat conducting plate, and matches with the silicon-aluminum heat radiating plate, the heat radiating groove and the vent, thereby accelerating the heat exchange with the external environment, avoiding the integrated circuit board main body from being in the environment with higher temperature for a long time and slowing down the aging speed of elements.
2. The utility model provides an integrated circuit board structure, which adopts the matching among a buffer shell, a connecting plate, an X-shaped supporting frame, a sliding sleeve, a sliding rod, a spring, a soft clamping block and a hemispherical clamping groove.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic perspective sectional view of the heat dissipation mechanism of the present invention;
FIG. 3 is a schematic perspective cross-sectional view of a structural graphite heat-conducting plate of the present invention;
FIG. 4 is a schematic perspective cross-sectional view of a structural cushioning mechanism of the present invention;
FIG. 5 is a schematic perspective cross-sectional view of a structural integrated circuit board body according to the present invention;
fig. 6 is a schematic perspective cross-sectional view of a structural silicon-aluminum heat sink of the present invention.
In the figure: 1. an integrated circuit board main body; 11. a sliding groove; 12. a slider;
2. a protective housing;
3. a heat dissipation mechanism; 31. a graphite heat-conducting plate; 311. a graphite heat-conducting sheet; 312. a fixing plate;
32. a silicon-aluminum heat dissipation plate; 321. a silicon-aluminum heat conducting pipe; 322. a honeycomb heat dissipation groove; 33. a heat sink; 34. a filter screen; 35. a vent;
4. a buffer mechanism; 41. a buffer housing; 42. a connecting plate; 43. an X-shaped support frame; 44. a sliding sleeve; 45. a slide bar; 46. a spring; 47. a soft clamping block; 48. hemispherical neck.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
example 1
As shown in FIGS. 1-6, the present invention provides an integrated circuit board structure, which comprises an integrated circuit board main body 1 and a protective housing 2, wherein the integrated circuit board main body 1 is disposed inside the protective housing 2, a heat dissipation mechanism 3 is disposed inside the protective housing 2, a buffer mechanism 4 is disposed inside the integrated circuit board main body 1, the heat dissipation mechanism 3 comprises a graphite heat conduction plate 31, an outer surface of the graphite heat conduction plate 31 is fixedly connected with an inner wall of the protective housing 2, a silicon-aluminum heat dissipation plate 32 is disposed on a top portion of the protective housing 2, the buffer mechanism 4 comprises a buffer housing 41, a lower surface of the buffer housing 41 is fixedly connected with a bottom portion of an inner cavity of the integrated circuit board main body 1, an X-shaped support frame 43 is disposed inside the buffer housing 41, a lower surface of the graphite heat conduction plate 31 is movably connected with an upper surface of the integrated circuit board main body 1, a heat dissipation groove 33 is disposed on an outer surface of the graphite heat conduction plate 31, fixedly connected with filter screen 34 on the inner wall of radiating groove 33, fixedly connected with fixed plate 312 on the inner wall of graphite heat-conducting plate 31, fixedly connected with graphite conducting strip 311 on the surface of fixed plate 312, the lower surface of silicon-aluminum heat dissipation board 32 is connected with the upper surface fixed of graphite heat-conducting plate 31, the inside fixedly connected with silicon-aluminum heat pipe 321 of silicon-aluminum heat dissipation board 32, honeycomb radiating groove 322 has been seted up on the surface of silicon-aluminum heat dissipation board 32, vent 35 has been seted up on the surface of protecting sheathing 2.
In this embodiment, firstly, heat is conducted to the silicon-aluminum heat dissipation plate 32 through the graphite heat conduction plate 31, heat conduction is accelerated by matching with the graphite heat conduction sheet 311, meanwhile, the silicon-aluminum heat conduction pipe 321 and the honeycomb heat dissipation groove 322 are matched, finally, the contact area with the outside air is increased through the heat dissipation groove 33 and the ventilation opening 35, heat dissipation speed is accelerated, and dust in the outside air is isolated outside through the filter screen 34.
Example 2
As shown in fig. 1 to 6, on the basis of embodiment 1, the present invention provides a technical solution: preferably, the bottom of the inner cavity of the buffer housing 41 is movably connected with a connecting plate 42, the outer surface of the X-shaped support frame 43 is fixedly connected with the outer surface of the connecting plate 42, the outer surface of the connecting plate 42 is fixedly connected with a sliding rod 45, the outer surface of the sliding rod 45 is movably connected with a sliding sleeve 44, the outer surfaces of the sliding sleeve 44 and the sliding rod 45 are sleeved with a spring 46, the outer surface of one end of the spring 46 is fixedly connected with the upper surface of the connecting plate 42, and the outer surface of the other end of the spring 46 is fixedly connected with the lower surface of the connecting plate 42.
In this embodiment, integrated circuit board main part 1 and protective housing 2 joint, when receiving the striking, X shape support frame 43 cooperation slide bar 45 and slip sleeve 44 take place to slide the shrink, and the rethread spring 46's resilience effect restores deformation with X shape support frame 43, weakens the device and receives the striking when, the damage that causes the device.
Example 3
As shown in fig. 1 to 6, on the basis of embodiment 1, the present invention provides a technical solution: preferably, the soft fixture block 47 is fixedly connected to the outer surface of the integrated circuit board main body 1, the hemispherical clamping groove 48 is formed in the inner wall of the protection shell 2, the outer surface of the soft fixture block 47 is movably connected to the inner wall of the hemispherical clamping groove 48, the sliding groove 11 is formed in the inner wall of the protection shell 2, the sliding block 12 is fixedly connected to the outer surface of the integrated circuit board main body 1, and the outer surface of the sliding block 12 is movably connected to the inner wall of the sliding groove 11.
In this embodiment, at first through soft fixture block 47 and hemisphere draw-in groove 48 swing joint, with integrated circuit board main part 1 and protective housing 2 joint to for whole device provides cushioning effect, improve the stability of device, rethread sliding block 12 and sliding tray 11 swing joint, the cooperation is with integrated circuit board main part 1 and protective housing 2 joint.
The working principle of the integrated circuit board structure will be described in detail below.
As shown in fig. 1-6, the flexible fixture blocks 47 and the hemispherical fixture grooves 48 are movably connected, the sliding block 12 and the sliding groove 11 are movably connected, the integrated circuit board body 1 is connected with the protection housing 2 in a clamping manner, when the device starts to work to generate heat, the heat is firstly conducted out to the silicon-aluminum heat dissipation plate 32 through the graphite heat conduction plate 31, the heat conduction is accelerated by matching with the graphite heat conduction plate 311, the silicon-aluminum heat conduction pipe 321 and the honeycomb heat dissipation groove 322 are matched, finally, the contact area with the outside air is increased through the heat dissipation groove 33 and the ventilation opening 35, the heat dissipation speed is accelerated, when the device is impacted, the X-shaped support frame 43 is matched with the sliding rod 45 and the sliding sleeve 44 to generate sliding shrinkage, and then the X-shaped support frame 43 is restored to be deformed by the resilience of the spring 46, so that the damage to the device caused by the impact is reduced.
The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, modifications or improvements are within the scope of the utility model without departing from the spirit of the inventive concept.
Claims (7)
1. An integrated circuit board structure, includes integrated circuit board main part (1) and protecting sheathing (2), integrated circuit board main part (1) sets up in the inside of protecting sheathing (2), its characterized in that: a heat dissipation mechanism (3) is arranged inside the protective shell (2), and a buffer mechanism (4) is arranged inside the integrated circuit board main body (1);
the heat dissipation mechanism (3) comprises a graphite heat conduction plate (31), the outer surface of the graphite heat conduction plate (31) is fixedly connected with the inner wall of the protective shell (2), and a silicon-aluminum heat dissipation plate (32) is arranged at the top of the protective shell (2);
buffer gear (4) including buffer housing (41), the lower surface of buffer housing (41) and the inner chamber bottom fixed connection of integrated circuit board main part (1), the inside of buffer housing (41) is provided with X shape support frame (43).
2. An integrated circuit board structure according to claim 1, characterized in that: the lower surface of graphite heat-conducting plate (31) and the upper surface swing joint of integrated circuit board main part (1), radiating groove (33) have been seted up on the surface of graphite heat-conducting plate (31), fixedly connected with filter screen (34) on the inner wall of radiating groove (33), fixedly connected with fixed plate (312) on the inner wall of graphite heat-conducting plate (31), fixedly connected with graphite conducting strip (311) on the surface of fixed plate (312).
3. An integrated circuit board structure according to claim 1, characterized in that: the lower surface of silicon-aluminum heating panel (32) and the upper surface fixed connection of graphite heat-conducting plate (31), the inside fixedly connected with silicon-aluminum heat-conducting pipe (321) of silicon-aluminum heating panel (32), honeycomb radiating groove (322) have been seted up on the surface of silicon-aluminum heating panel (32), vent (35) have been seted up on the surface of protecting sheathing (2).
4. An integrated circuit board structure according to claim 1, characterized in that: the buffer structure is characterized in that a connecting plate (42) is movably connected to the bottom of an inner cavity of the buffer shell (41), the outer surface of the X-shaped supporting frame (43) is fixedly connected with the outer surface of the connecting plate (42), a sliding rod (45) is fixedly connected to the outer surface of the connecting plate (42), and a sliding sleeve (44) is movably connected to the outer surface of the sliding rod (45).
5. An integrated circuit board structure according to claim 4, characterized in that: the outer surface of sliding sleeve (44) and sliding rod (45) is overlapped and is equipped with spring (46), the one end surface of spring (46) is connected with the last fixed surface of connecting plate (42), the other end surface of spring (46) is connected with the lower fixed surface of connecting plate (42).
6. An integrated circuit board structure according to claim 1, characterized in that: the integrated circuit board is characterized in that a soft clamping block (47) is fixedly connected to the outer surface of the integrated circuit board main body (1), a hemispherical clamping groove (48) is formed in the inner wall of the protective shell (2), and the outer surface of the soft clamping block (47) is movably connected with the inner wall of the hemispherical clamping groove (48).
7. An integrated circuit board structure according to claim 1, characterized in that: sliding tray (11) have been seted up on the inner wall of protecting sheathing (2), fixedly connected with sliding block (12) on the surface of integrated circuit board main part (1), the surface of sliding block (12) and the inner wall swing joint of sliding tray (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122176832.7U CN216253653U (en) | 2021-09-09 | 2021-09-09 | Integrated circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122176832.7U CN216253653U (en) | 2021-09-09 | 2021-09-09 | Integrated circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216253653U true CN216253653U (en) | 2022-04-08 |
Family
ID=80983456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122176832.7U Active CN216253653U (en) | 2021-09-09 | 2021-09-09 | Integrated circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216253653U (en) |
-
2021
- 2021-09-09 CN CN202122176832.7U patent/CN216253653U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216253653U (en) | Integrated circuit board structure | |
| CN213694291U (en) | Flexible circuit board with heat dissipation layer | |
| CN212062082U (en) | Shock attenuation heat dissipation shell of planar transformer | |
| CN211880861U (en) | Integrated image processing device convenient to install | |
| CN211880712U (en) | Circuit board that shock resistance is good | |
| CN216650276U (en) | Impact-resistant packaging type PCBA circuit board | |
| CN214378389U (en) | Metal oxide semiconductor field effect transistor | |
| CN214204070U (en) | Circular high-low frequency type photoelectric mixed connector | |
| CN213518186U (en) | Water-cooled heat abstractor for main frame shell | |
| CN213457884U (en) | Computer noise reduction device | |
| CN220139576U (en) | Gateway convenient to it is fixed | |
| CN215345664U (en) | Anti-interference silica gel gasket based on communication | |
| CN218163125U (en) | Anti-falling video converter | |
| CN212463436U (en) | Dustproof radiating switch | |
| CN212873358U (en) | Shockproof structure machine case | |
| CN216820261U (en) | Wireless communication device based on optical network communication | |
| CN217037688U (en) | High-speed transmission data module | |
| CN215498582U (en) | Motor housing with shock-absorbing structure | |
| CN214753722U (en) | Energy-saving bluetooth chip architecture | |
| CN212364996U (en) | Protector of computer module for engineering | |
| CN211011266U (en) | Direct insertion type panel lamp 2.4G power supply | |
| CN217088417U (en) | Circuit board with electric leakage self-breaking function | |
| CN215898190U (en) | Medical instrument accessory convenient for machine tool machining | |
| CN219164611U (en) | Waterproof structure of mobile phone shell | |
| CN219777994U (en) | SFP optical module junction component base |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220622 Address after: 518000 floor 6, building 1, Yicheng Huanzhi center, the intersection of Renmin Road and Bayi Road, Jinglong community, Longhua street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Huaxin Holding Co.,Ltd. Address before: 036000 No. 1, Antai East Street, Shuocheng District, Shuozhou City, Shanxi Province Patentee before: Gao Di |