CN216057605U - Flexible circuit board packaging structure - Google Patents
Flexible circuit board packaging structure Download PDFInfo
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- CN216057605U CN216057605U CN202121363321.XU CN202121363321U CN216057605U CN 216057605 U CN216057605 U CN 216057605U CN 202121363321 U CN202121363321 U CN 202121363321U CN 216057605 U CN216057605 U CN 216057605U
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Abstract
The utility model discloses a flexible circuit board packaging structure, wherein a second elastic circuitous strip is arranged at the tail part of a second arc-shaped pressure bearing strip, a second cavity is formed by a cavity hole between the second elastic circuitous strip and the second arc-shaped pressure bearing strip, a placing groove is formed by the cavity hole between the second arc-shaped pressure bearing strip and a cavity hole between the first arc-shaped pressure bearing strips, a first opening is formed at the upper end of two adjacent first arc-shaped pressure bearing strips, and a second opening is formed between two adjacent first arc-shaped pressure bearing strips. The utility model discloses a flexible circuit board packaging structure, which belongs to the field of flexible circuit board packaging, wherein arc-shaped bearing strips, elastic circuitous strips and cavities are arranged, so that the bearing and buffering of the edge of a flexible circuit board consisting of a CU layer, an A layer and a PI layer can be realized, the buffering performance of the edge of the flexible circuit board consisting of the CU layer, the A layer and the PI layer is improved to a certain extent, and a notch is formed between every two adjacent arc-shaped bearing strips, so that the bending of the arc-shaped bearing strips can be realized.
Description
Technical Field
The utility model relates to the field of flexible circuit board packaging, in particular to a flexible circuit board packaging structure.
Background
A Flexible Printed Circuit (FPC), which is a circuit board mainly composed of CU (e.d. or r.a. copper foil), a (acryl and epoxy thermosetting adhesive), and PI (polyimide film), has many advantages such as space saving, weight reduction, high flexibility, and the like, and is widely used in production and life, and the market is expanding;
in the edge packaging process of the flexible circuit board, the used edge sealing structure has insufficient buffering protection performance and poor use effect.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a flexible printed circuit package structure, which can effectively solve the problems of the related art.
In order to achieve the purpose, the utility model adopts the technical scheme that:
a structure for packaging a flexible circuit board comprises a CU layer, an A layer and a PI layer, wherein the A layer is arranged at the lower end of the CU layer, the PI layer is arranged at the lower end of the A layer, the edge of the flexible circuit board consisting of the CU layer, the A layer and the PI layer is packaged through an improved flexible edge sealing structure, the improved flexible edge sealing structure comprises a placing groove, a first arc-shaped pressure-bearing strip, a first elastic circuitous strip, a first cavity, a second arc-shaped pressure-bearing strip, a second elastic circuitous strip, a second cavity, a first notch and a second notch, the first elastic circuitous strip is arranged at the tail part of the first arc-shaped pressure-bearing strip, a cavity hole between the first arc-shaped pressure-bearing strip and the first elastic circuitous strip forms the first cavity, the second arc-shaped pressure-bearing strip is arranged at the lower end of the first arc-shaped pressure-bearing strip, the second elastic circuitous strip is arranged at the tail part of the second arc-shaped pressure-bearing strip, and a second arc-shaped pressure-bearing hole forms the second cavity hole, and the cavity hole forms the standing groove between second arc bearing strip and the first arc bearing strip, and adjacent two first arc bearing strip upper end has seted up first opening, and adjacent two the second opening has been seted up between the first arc bearing strip.
Preferably, the first arc-shaped pressure bearing strip and the second arc-shaped pressure bearing strip have the same structure, and are symmetrically arranged by the central line of the rear end of the assembly of the first arc-shaped pressure bearing strip and the second arc-shaped pressure bearing strip;
preferably, the first arc-shaped pressure bearing strip and the first elastic roundabout strip are integrally arranged, and the tail part of the first elastic roundabout strip faces the center of the first cavity;
preferably, the improved flexible edge sealing structure further comprises a first buffer strip and a second buffer strip, the first buffer strip is arranged at the upper part in the placing groove, and the second buffer strip is arranged at the lower part in the placing groove;
preferably, a gap is formed between the first elastic circuitous strip and the first buffer strip, and a gap is formed between the second elastic circuitous strip and the second buffer strip;
preferably, the edge of the flexible circuit board composed of the CU layer, the a layer and the PI layer is placed in the placing groove, and the edge of the flexible circuit board composed of the CU layer, the a layer and the PI layer is connected with the contact surface in an adhesion manner.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the edge of the flexible circuit board composed of the CU layer, the A layer and the PI layer is packaged by the improved flexible edge sealing structure, the arc-shaped bearing strips, the elastic circuitous strips and the cavity are arranged, so that the bearing and buffering of the edge of the flexible circuit board composed of the CU layer, the A layer and the PI layer can be realized, the buffering performance of the edge of the flexible circuit board composed of the CU layer, the A layer and the PI layer is improved to a certain extent, and the bending of the arc-shaped bearing strips can be realized due to the opening formed between every two adjacent arc-shaped bearing strips, the buffering strips are in contact with the edge of the flexible circuit board composed of the CU layer, the A layer and the PI layer, so that the protection performance of the edge of the flexible circuit board composed of the CU layer, the A layer and the PI layer is further improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a first illustrative view of an improved flexible edge seal configuration of the present invention;
FIG. 3 is a second illustration of the improved flexible edge seal configuration of the present invention;
fig. 4 is an exploded view of the improved flexible edge seal of the present invention.
In the figure: 1. a CU layer; 2. a layer; 3. a PI layer; 4. an improved flexible edge sealing structure; 401. a first buffer strip; 402. a second buffer bar; 403. a placement groove; 404. a first arc-shaped pressure-bearing strip; 405. a first resilient circuitous strip; 406. a first cavity; 407. a second arc-shaped pressure bearing strip; 408. a second elastic circuitous strip; 409. a second cavity; 410. a first gap; 411. a second gap.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
As shown in fig. 1-4, a flexible printed circuit package structure includes a CU layer 1, an a layer 2, and a PI layer 3, where the a layer 2 is disposed at the lower end of the CU layer 1, and the PI layer 3 is disposed at the lower end of the a layer 2;
the edge of the flexible circuit board composed of the CU layer 1, the a layer 2 and the PI layer 3 is encapsulated by an improved flexible edge sealing structure 4, and the improved flexible edge sealing structure 4 includes a placement groove 403, a first arc-shaped pressure-bearing strip 404, a first elastic circuitous strip 405, a first cavity 406, a second arc-shaped pressure-bearing strip 407, a second elastic circuitous strip 408, a second cavity 409, a first opening 410 and a second opening 411, the tail of the first arc-shaped pressure-bearing strip 404 is provided with a first elastic circuitous strip 405, a cavity hole between the first arc-shaped pressure-bearing strip 404 and the first elastic circuitous strip 405 forms the first cavity 406, the lower end of the first arc-shaped pressure-bearing strip 404 is provided with the second arc-shaped pressure-bearing strip 407, the tail of the second arc-shaped pressure-bearing strip 407 is provided with a second elastic circuitous strip 408, a cavity hole between the second elastic circuitous strip 408 and the second arc-shaped pressure-bearing strip 407 forms the second cavity hole 409, and a placement groove 403 is formed between the second arc-shaped pressure-bearing strip 407 and the first arc-shaped pressure-bearing strip 404, a first gap 410 is opened at the upper end of two adjacent first arc-shaped pressure-bearing strips 404, and a second gap 411 is opened between two adjacent first arc-shaped pressure-bearing strips 404.
In a further preferable scheme of the utility model, the first arc-shaped pressure-bearing strip 404 and the second arc-shaped pressure-bearing strip 407 have the same structure, the first arc-shaped pressure-bearing strip 404 and the second arc-shaped pressure-bearing strip 407 are symmetrically arranged with respect to the central line of the rear end of the assembly of the first arc-shaped pressure-bearing strip 404 and the second arc-shaped pressure-bearing strip 407, the first arc-shaped pressure-bearing strip 404 and the first elastic roundabout strip 405 are integrally arranged, the tail part of the first elastic roundabout strip 405 faces the center of the cavity of the first cavity 406, the edge of the flexible circuit board composed of the CU layer 1, the a layer 2 and the PI layer 3 is arranged in the groove of the placement groove 403, the edge of the flexible circuit board composed of the CU layer 1, the a layer 2 and the PI layer 3 is adhesively connected with the contact surface, the improved flexible edge sealing structure 4 encapsulates the edge of the flexible circuit board composed of the CU layer 1, the a layer 2 and the PI layer 3, the arrangement of the arc-shaped pressure-bearing strips, the elastic roundabout strips and the cavity can realize the pressure-bearing and the buffer of the edge of the flexible circuit board composed of the CU layer 1, the a layer 2 and the PI layer 3, the buffer performance of the edge of the flexible circuit board consisting of the CU layer 1, the A layer 2 and the PI layer 3 is improved to a certain extent, and bending of the arc-shaped pressure-bearing strips can be realized due to the fact that a notch is formed between every two adjacent arc-shaped pressure-bearing strips;
in a further preferable aspect of the present invention, the improved flexible edge sealing structure 4 further includes a first buffer strip 401 and a second buffer strip 402, the first buffer strip 401 is disposed at an upper portion of the inside of the placing groove 403, the second buffer strip 402 is disposed at a lower portion of the inside of the placing groove 403, a gap is formed between the first elastic meandering strip 405 and the first buffer strip 401, a gap is formed between the second elastic meandering strip 408 and the second buffer strip 402, an edge of the flexible circuit board formed by the CU layer 1, the a layer 2, and the PI layer 3 is disposed in the placing groove 403, an edge of the flexible circuit board formed by the CU layer 1, the a layer 2, and the PI layer 3 is bonded to the contact surface, and the buffer strip contacts an edge of the circuit board formed by the CU layer 1, the a layer 2, and the PI layer 3, so as to further improve the protective performance of the edge of the flexible circuit board formed by the CU layer 1, the a layer 2, and the PI layer 3.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. The utility model provides a structure of flexible circuit board encapsulation, includes CU layer (1), A layer (2) and PI layer (3), the lower extreme on CU layer (1) is provided with A layer (2), and the lower extreme on A layer (2) is provided with PI layer (3), its characterized in that: the edge of a flexible circuit board consisting of the CU layer (1), the A layer (2) and the PI layer (3) is packaged through an improved flexible edge sealing structure (4), the improved flexible edge sealing structure (4) comprises a placing groove (403), a first arc-shaped pressure bearing strip (404), a first elastic circuitous strip (405), a first cavity (406), a second arc-shaped pressure bearing strip (407), a second elastic circuitous strip (408), a second cavity (409), a first notch (410) and a second notch (411), a first elastic circuitous strip (405) is arranged at the tail part of the first arc-shaped pressure bearing strip (404), a first cavity (406) is formed by a cavity hole between the first arc-shaped pressure bearing strip (404) and the first elastic circuitous strip (405), a second arc-shaped pressure bearing strip (407) is arranged at the lower end of the first arc-shaped pressure bearing strip (404), and a second elastic circuitous strip (408) is arranged at the tail part of the second arc-shaped pressure bearing strip (407), a second cavity (409) is formed in a cavity hole between the second elastic circuitous strip (408) and the second arc-shaped pressure bearing strip (407), a placing groove (403) is formed in a cavity hole between the second arc-shaped pressure bearing strip (407) and the first arc-shaped pressure bearing strip (404), a first opening (410) is formed in the upper end of each adjacent two of the first arc-shaped pressure bearing strips (404), and a second opening (411) is formed between each adjacent two of the first arc-shaped pressure bearing strips (404).
2. The structure of claim 1, wherein: the structure of the first arc-shaped pressure bearing strip (404) is the same as that of the second arc-shaped pressure bearing strip (407), and the first arc-shaped pressure bearing strip (404) and the second arc-shaped pressure bearing strip (407) are symmetrically arranged by the central line of the rear end of the assembly of the first arc-shaped pressure bearing strip (404) and the second arc-shaped pressure bearing strip (407).
3. The structure of claim 2, wherein: the first arc-shaped pressure bearing strip (404) and the first elastic circuitous strip (405) are integrally arranged, and the tail part of the first elastic circuitous strip (405) faces the center of the cavity of the first cavity (406).
4. The structure of claim 1, wherein: the improved flexible edge sealing structure (4) further comprises a first buffer strip (401) and a second buffer strip (402), the first buffer strip (401) is arranged on the upper portion of the inner side of the placing groove (403), and the second buffer strip (402) is arranged on the lower portion of the inner side of the placing groove (403).
5. The structure of claim 4, wherein: a gap is arranged between the first elastic circuitous strip (405) and the first buffer strip (401), and a gap is arranged between the second elastic circuitous strip (408) and the second buffer strip (402).
6. The structure of a flexible printed circuit package according to any one of claims 1 to 5, wherein: the edge of the flexible circuit board composed of the CU layer (1), the A layer (2) and the PI layer (3) is arranged in the groove of the placing groove (403), and the edge of the flexible circuit board composed of the CU layer (1), the A layer (2) and the PI layer (3) is connected with the contact surface in an adhesion mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121363321.XU CN216057605U (en) | 2021-06-19 | 2021-06-19 | Flexible circuit board packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121363321.XU CN216057605U (en) | 2021-06-19 | 2021-06-19 | Flexible circuit board packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216057605U true CN216057605U (en) | 2022-03-15 |
Family
ID=80616130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121363321.XU Active CN216057605U (en) | 2021-06-19 | 2021-06-19 | Flexible circuit board packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216057605U (en) |
-
2021
- 2021-06-19 CN CN202121363321.XU patent/CN216057605U/en active Active
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