CN218939674U

CN218939674U - Multi-chip assembled patch diode

Info

Publication number: CN218939674U
Application number: CN202220637236.6U
Authority: CN
Inventors: 黄志平
Original assignee: Heyuan Chuangji Electronic Technology Co ltd
Current assignee: Heyuan Chuangji Electronic Technology Co ltd
Priority date: 2022-03-22
Filing date: 2022-03-22
Publication date: 2023-04-28
Anticipated expiration: 2032-03-22

Abstract

The utility model provides a multi-chip assembled patch diode which comprises a plastic package shell, a first chip, a first pin and a second pin, wherein the left end and the right end of the first chip are respectively connected with a first conducting plate and a second conducting plate, a first groove and a second groove are formed in the plastic package shell, one end of the first conducting plate is connected with a first elastic contact part, the first elastic contact part is positioned at the inner side of the first groove, one end of the first pin, which is close to the first chip, is connected with a second elastic contact part, the second elastic contact part is positioned at the inner side of the first groove, a second chip is further arranged in the first groove, and the second chip is clamped between the first elastic contact part and the second elastic contact part. According to the patch diode, the second chip and the third chip are installed in an assembling mode, so that the second chip and the third chip have the characteristic of being detachable, and the patch diode can be suitable for different circuit application scenes.

Description

Multi-chip assembled patch diode

Technical Field

The utility model relates to the technical field of diodes, in particular to a multi-chip assembled patch diode.

Background

The diode is also called a transistor diode. The patch diode is one of the diodes, and the structure of the patch diode consists of an insulating plastic package body, a diode chip, a cathode pin and an anode pin. For part of the circuit, a plurality of diodes are required to be connected in series, and the conventional means is to directly weld the plurality of diodes on the circuit board, so that the cost is high.

Disclosure of Invention

In view of the above problems, the present utility model provides a multi-chip assembled chip diode, in which a second chip and a third chip are assembled, so that the second chip and the third chip have detachable characteristics and can be adapted to different circuit application scenarios.

In order to achieve the above purpose, the present utility model solves the problems by the following technical scheme:

the utility model provides a multi-chip assembled paster diode, includes the plastic envelope shell, is located the first chip in the inboard middle part of plastic envelope shell, be located first chip left and right sides, second pin, both ends are connected with first conducting strip, second conducting strip respectively about the first chip, be formed with first recess, second recess on the plastic envelope shell, first conducting strip one end is connected with first elastic contact portion, first elastic contact portion is located first recess is inboard, first pin lean on to first chip one end is connected with second elastic contact portion, second elastic contact portion is located first recess is inboard, still be equipped with the second chip in the first recess, the second chip centre gripping in between first elastic contact portion with second elastic contact portion, second conducting strip one end is connected with the third elastic contact portion, third elastic contact portion is located second recess is inboard, the second pin leans on to first chip one end is connected with the second elastic contact portion, the second chip centre gripping is located between the third elastic contact portion, the second chip is still located the fourth elastic contact portion.

Preferably, a first cover plate is arranged at the upper end of the first groove, and the second chip is fixed at the lower end of the first cover plate.

Preferably, the first cover plate is fixedly connected with the plastic package shell through a first screw.

Preferably, a second cover plate is arranged at the upper end of the second groove, and the third chip is fixed at the lower end of the second cover plate.

Preferably, the second cover plate is fixedly connected with the plastic package shell through a second screw.

Preferably, two opposite end surfaces of the first elastic contact part and the second elastic contact part are covered with a layer of first conductive adhesive.

Preferably, two opposite end surfaces of the third elastic contact portion and the fourth elastic contact portion are covered with a layer of second conductive adhesive.

The beneficial effects of the utility model are as follows:

according to the patch diode, the second chip and the third chip are designed to be of the detachable structure, the second chip and the third chip can be installed or removed according to actual circuit requirements, and after the second chip and the third chip are removed, the first elastic contact part is in elastic contact with the second elastic contact part, and the third elastic contact part is in elastic contact with the fourth elastic contact part, so that the whole patch diode can still be conducted, and the patch diode can be suitable for different circuit application scenes.

Drawings

Fig. 1 is a perspective view of a multi-chip assembled chip diode according to the present utility model.

Fig. 2 is a top view of a multi-chip assembled chip diode according to the present utility model.

FIG. 3 is a cross-sectional view taken along the A-A plane in FIG. 2.

The reference numerals are: the plastic package comprises a plastic package shell 1, a first groove 11, a second groove 12, a first cover plate 13, a first screw 14, a second cover plate 15, a second screw 16, a first conductive adhesive 17, a second conductive adhesive 18, a first chip 2, a first pin 3, a second elastic contact portion 31, a second pin 4, a fourth elastic contact portion 41, a first conductive sheet 5, a first elastic contact portion 51, a second conductive sheet 6, a third elastic contact portion 61, a second chip 7 and a third chip 8.

Detailed Description

The present utility model will be described in further detail with reference to examples and drawings, but embodiments of the present utility model are not limited thereto.

As shown in fig. 1-3:

the utility model provides a multi-chip assembled paster diode, including plastic envelope 1, be located the first chip 2 at the inboard middle part of plastic envelope 1, be located the first pin 3 of first chip 2 left and right sides, the second pin 4, both ends are connected with first conducting strip 5 respectively about the first chip 2, the second conducting strip 6, be formed with first recess 11 on the plastic envelope 1, the second recess 12, first conducting strip 5 one end is connected with first elastic contact portion 51, first elastic contact portion 51 is located first recess 11 inboard, first pin 3 lean on to first chip 2 one end and be connected with second elastic contact portion 31, second elastic contact portion 31 is located first recess 11 inboard, still be equipped with second chip 7 in the first recess 11, second chip 7 centre gripping is in between first elastic contact portion 51 and second elastic contact portion 31, after second chip 7 demolishs, because first elastic contact portion 51, second elastic contact portion 31 all have elasticity, both are because elasticity and are contradicted each other, thereby realize that first conducting strip 5 one end is connected with first elastic contact portion 51, first elastic contact portion 51 is located first recess 11 inboard, first elastic contact portion 51 is located first elastic contact portion 11 inboard, first elastic contact portion 31 is located the second elastic contact portion 8, second chip 7 is located the second elastic contact portion 8, the fourth chip 8 is located the inboard because of second elastic contact portion 8, the second elastic contact portion is located the fourth elastic contact portion is 8, and the fourth chip 8 is located the elastic contact portion is located the fourth elastic contact portion is 8, and is 8, between the fourth elastic contact portion is located the fourth elastic contact portion is 8, and between the fourth chip is 8, and between the fourth elastic contact portion is 8, and between the fourth chip is 8.

Preferably, the upper end of the first groove 11 is provided with a first cover plate 13, and the second chip 7 is fixed at the lower end of the first cover plate 13.

Preferably, the first cover plate 13 is fixedly connected with the plastic package housing 1 through a first screw 14.

Preferably, a second cover plate 15 is arranged at the upper end of the second groove 12, and the third chip 8 is fixed at the lower end of the second cover plate 15.

Preferably, the second cover plate 15 is fixedly connected with the plastic package housing 1 through a second screw 16.

Preferably, two opposite end surfaces of the first elastic contact portion 51 and the second elastic contact portion 31 are covered with a layer of first conductive adhesive 17, and the first conductive adhesive 17 has good elasticity, so that electrical connection between the first conductive adhesive and the second chip 7 can be ensured.

Preferably, two opposite end surfaces of the third elastic contact portion 61 and the fourth elastic contact portion 41 are covered with a layer of second conductive adhesive 18, and the second conductive adhesive 18 has good elasticity and can ensure electrical connection between the third conductive adhesive and the third chip 8.

The above examples only represent 1 embodiment of the present utility model, which is described in more detail and is not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The multi-chip assembled patch diode is characterized by comprising a plastic package shell (1), a first chip (2) positioned in the middle of the inner side of the plastic package shell (1), a first pin (3) and a second pin (4) positioned at the left side and the right side of the first chip (2), wherein the left end and the right end of the first chip (2) are respectively connected with a first conducting plate (5) and a second conducting plate (6), a first groove (11) and a second groove (12) are formed in the plastic package shell (1), one end of the first conducting plate (5) is connected with a first elastic contact part (51), the first elastic contact part (51) is positioned at the inner side of the first groove (11), the first pin (3) is connected with a second elastic contact part (31) towards one end of the first chip (2), the second elastic contact part (31) is positioned at the inner side of the first groove (11), a second chip (7) is further arranged in the first groove (11), the second chip (7) is connected with the second elastic contact part (61) at the inner side of the second elastic contact part (61), the second pin (4) is connected with a fourth elastic contact part (41) towards one end of the first chip (2), the fourth elastic contact part (41) is located at the inner side of the second groove (12), a third chip (8) is further arranged in the second groove (12), and the third chip (8) is clamped between the third elastic contact part (61) and the fourth elastic contact part (41).

2. The multi-chip assembled patch diode according to claim 1, wherein a first cover plate (13) is disposed at an upper end of the first recess (11), and the second chip (7) is fixed at a lower end of the first cover plate (13).

3. A multi-chip assembled chip mounted diode according to claim 2, wherein the first cover plate (13) is fixedly connected to the plastic package housing (1) by means of a first screw (14).

4. The multi-chip assembled patch diode according to claim 1, wherein a second cover plate (15) is disposed at an upper end of the second recess (12), and the third chip (8) is fixed at a lower end of the second cover plate (15).

5. The multi-chip assembled chip mounted diode according to claim 4, wherein the second cover plate (15) is fixedly connected with the plastic package housing (1) through a second screw (16).

6. A multi-chip assembled chip diode as claimed in claim 1, wherein the first elastic contact portion (51) and the second elastic contact portion (31) are covered with a layer of first conductive adhesive (17) on opposite end surfaces.

7. A multi-chip assembled chip diode as claimed in claim 1, wherein the opposite end surfaces of the third elastic contact portion (61) and the fourth elastic contact portion (41) are covered with a layer of second conductive adhesive (18).