CN113784605B - PCB board with shielding structure - Google Patents
PCB board with shielding structure Download PDFInfo
- Publication number
- CN113784605B CN113784605B CN202111074175.3A CN202111074175A CN113784605B CN 113784605 B CN113784605 B CN 113784605B CN 202111074175 A CN202111074175 A CN 202111074175A CN 113784605 B CN113784605 B CN 113784605B
- Authority
- CN
- China
- Prior art keywords
- shielding
- cover
- pcb
- groove
- shielding cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 238000005338 heat storage Methods 0.000 claims abstract description 6
- 239000012528 membrane Substances 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000011232 storage material Substances 0.000 claims abstract description 6
- 239000012212 insulator Substances 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000000806 elastomer Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920002323 Silicone foam Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000013514 silicone foam Substances 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000006260 foam Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The invention discloses a PCB with a shielding structure, and relates to the technical field of electronic products. Including PCB board body and shield cover, set up the constant head tank on the PCB board body, the shield cover passes through the constant head tank with PCB board body joint, the shield cover includes first shield cover and second shield cover, the second shield cover is located the first shield cover outside, first shield cover and second shield cover pass through conductive adhesive linkage and connect, set up the metal shielding membrane in the first shield cover, first shield cover top sets up the buffering cavity, set up heat storage material in the second shield cover, second shield cover top sets up the heat dissipation lid. According to the PCB with the shielding structure, the two layers of shielding covers are arranged, the first shielding cover is used for absorbing electromagnetic waves, the second shielding cover is used for absorbing heat and storing heat, and the heat dissipation cover body at the top is used for dissipating heat, so that the shielding is realized, the heat dissipation function is realized, and the service life of the PCB is prolonged.
Description
Technical Field
The invention relates to the technical field of electronic products, in particular to a PCB with a shielding structure.
Background
The PCB board is also called a printed circuit board, is made of a core board and a prepreg through lamination, is widely applied to various fields, and has an immovable shaking position in the electronic industry. When the circuit is used, the circuit components are concentrated on the PCB for connection, so that the working efficiency can be effectively improved, the circuit volume is reduced, and the time cost is saved. Along with the continuous development of society, electronic chip modules integrated in a PCB become denser, and meanwhile, the frequency of electronic signals becomes higher and higher, so that electromagnetic interference becomes serious, and the normal work of the PCB is greatly influenced by the electromagnetic interference.
In the prior art, in order to overcome the problem of electromagnetic interference, a shielding cover is generally arranged to surround an electronic chip, but various components integrated on a PCB (printed circuit board) can generate a large amount of heat during working, and after the shielding cover surrounds the electronic chip, the heat is not easy to dissipate, and the service life of the electronic chip can be influenced if the heat is not timely dissipated. Therefore, there is a need to design a PCB board with a shielding structure to solve the above-mentioned technical problems.
Disclosure of Invention
The invention provides a PCB with a shielding structure, which solves the problems in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a from PCB board of taking shielding structure, includes PCB board body and shield cover, set up the constant head tank on the PCB board body, the shield cover passes through the constant head tank with this joint of PCB board, the shield cover includes first shield cover and second shield cover, the second shield cover is located the first shield cover outside, first shield cover and second shield cover are connected through electrically conductive adhesive linkage, set up the metal shielding membrane in the first shield cover, first shield cover top sets up the buffering cavity, set up heat storage material in the second shield cover, second shield cover top sets up the heat dissipation lid.
Further, an electronic chip is further arranged on the PCB body, the positioning groove is formed around the electronic chip, and the first shielding cover is sleeved on the outer side of the electronic chip.
Further, a limit groove is formed in the top of the second shielding cover, and the detachable cover of the heat dissipation cover body is arranged in the limit groove.
Further, a clamping groove is formed in the side wall of the limiting groove, a groove is formed in the top of the heat dissipation cover body, a sliding block is arranged in the groove, a spring is arranged at one end of the sliding block, a clamping block is arranged at the other end of the sliding block, the spring is fixedly connected to the side wall of the groove, the clamping block penetrates through the side wall of the groove and is inserted into the clamping groove, and a push rod is arranged at the top of the sliding block.
Further, a plurality of heat dissipation holes are distributed on the heat dissipation cover body at intervals.
Further, a conductive buckle is arranged at the clamping part of the bottom of the first shielding cover and the PCB body, and the conductive buckle is made of conductive resin.
Further, the recess depth of the buffer cavity is set to be 0.3 mm-0.5 mm.
Furthermore, high-temperature resistant silica gel foam is arranged in the buffer cavity.
Further, the bottom of the PCB body is provided with a grounding conductive elastomer.
Compared with the prior art, the PCB with the shielding structure has the following beneficial effects:
the double-layer shielding cover is arranged, the first shielding cover is used for absorbing electromagnetic waves, the second shielding cover is used for absorbing heat and storing heat, and the heat dissipation cover body at the top is used for dissipating heat, so that the shielding is realized, the heat dissipation function is realized, and the service life of the PCB is prolonged;
through setting up the buffering cavity, absorb outside impact for it is less to the electronic chip impact, and then plays the effect of improving the chip atress, promotes the life of electronic chip.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic structural view of a first shielding case according to the present invention.
Fig. 3 is a schematic structural view of a second shielding case according to the present invention.
Fig. 4 is a schematic view of a heat dissipating cover according to the present invention.
Fig. 5 is a schematic view of the structure of the grounding conductive elastomer of the present invention.
The PCB comprises a 1-PCB body, 11-positioning grooves, 12-electronic chips, 2-shielding cases, 21-first shielding cases, 211-conductive buckles, 212-buffer cavities, 22-second shielding cases, 23-conductive bonding layers, 3-limiting grooves, 31-clamping grooves, 4-heat dissipation covers, 41-grooves, 42-sliding blocks, 43-springs, 44-clamping blocks, 45-push rods, 5-grounding conductive elastomers, 51-PI shielding films, 52-elastic insulators, 53-openings and 54-gaps.
Detailed Description
The technical scheme of the invention is further described below through the attached drawings and the embodiments.
Referring to fig. 1 to 5, the invention provides a PCB board with a shielding structure, comprising a PCB board body 1 and a shielding cover 2, wherein a positioning groove 11 is arranged on the PCB board body 1, the shielding cover 2 is clamped with the PCB board body 1 through the positioning groove 11, the shielding cover 2 comprises a first shielding cover 21 and a second shielding cover 22, the second shielding cover 22 is sleeved outside the first shielding cover 21, the first shielding cover 21 and the second shielding cover 22 are connected through a conductive adhesive layer 23, a metal shielding film is arranged in the first shielding cover 21, a buffer cavity 212 is arranged at the top of the first shielding cover 21, a heat storage material is arranged in the second shielding cover 22, and a heat dissipation cover 4 is arranged at the top of the second shielding cover 22. The first shielding case 21 is used for absorbing electromagnetic waves, has good electromagnetic shielding performance, and the heat storage material in the second shielding case 22 can absorb and store heat emitted by the electronic chip 12 and dissipate heat by using the heat dissipation cover 4 at the top.
Preferably, the PCB body 1 is further provided with an electronic chip 12, the positioning groove 11 is disposed around the electronic chip 12, so that the shielding case 2 is convenient to be installed, and the first shielding case 21 is sleeved outside the electronic chip 12.
Preferably, the top of the second shielding cover 22 is provided with a limit groove 3, the detachable cover of the heat dissipation cover body 4 is arranged in the limit groove 3, and a plurality of heat dissipation holes are distributed on the heat dissipation cover body 4 at intervals. The heat dissipation cover body is characterized in that the clamping groove 31 is formed in the side wall of the limiting groove 3, the groove 41 is formed in the top of the heat dissipation cover body 4, the sliding block 42 is arranged in the groove 41, the spring 43 is arranged at one end of the sliding block 42, the clamping block 44 is arranged at the other end of the sliding block, the spring 43 is fixedly connected to the side wall of the groove 41, the clamping block 44 penetrates through the side wall of the groove 41 and is inserted into the clamping groove 31, and the push rod 45 is arranged at the top of the sliding block 42. When the heat dissipation cover 4 needs to be removed, the push rod 45 is pushed, the sliding block 42 compresses the spring 43, the clamping block 44 slides out of the limiting groove 3, and the push rod 45 is pulled upwards, so that the heat dissipation cover 4 is removed from the second shielding cover 22, and at the moment, the heat storage material in the second shielding cover 22 can be replaced.
Preferably, a conductive buckle 211 is disposed at a clamping position between the bottom of the first shielding cover 21 and the PCB body 1, and the conductive buckle 211 is made of conductive resin.
Preferably, the recess depth of the buffer cavity 212 is set to be 0.3 mm-0.5 mm, and high temperature resistant silica gel foam is arranged in the buffer cavity 212. When the PCB receives the impact, if the impact position is just in the layout projection area of the electronic chip 12, the impact firstly contacts the second shielding cover 22, the impact force is transmitted to the first shielding cover 21 after being dispersed by the second shielding cover 22, at the moment, the buffer cavity 212 at the top of the first shielding cover 21 can play a role in buffering, the high-temperature resistant silica gel foam inside the buffer cavity 212 can further absorb the impact, the impact on the electronic chip 12 is finally reduced, the stress effect on the electronic chip 12 is further improved, and the service life of the electronic chip 12 is prolonged.
The first shield shell 21 and the second shield shell 22 are made of copper foil, which has excellent corrosion resistance, weldability, cold workability, ductility, fatigue resistance, shielding performance, and the like.
Preferably, the bottom of the PCB board body 1 is provided with a grounding conductive elastomer 5. The grounding conductive elastic body 5 comprises a PI shielding film 51 and an elastic insulator 52, the PI shielding film 51 and the elastic insulator 52 are connected through a high-temperature-resistant adhesive tape, the PI shielding film 51 wraps the periphery of the elastic insulator 52, an opening 53 is formed in one side of the PI shielding film 51, and a gap 54 is formed between the other side of the PI shielding film and the elastic insulator 52. The grounding conductive elastomer 5 is arranged, so that the electromagnetic wave interference absorbing capacity is realized, and the SMT chip type production process is also realized.
The elastic insulator 52 may be rubber, silica gel, etc., and the structure may be a porous or hollow structure, and for the elastic insulator 52 with a porous or hollow structure, more pressure can be released during extrusion to reduce rebound stress, the elastic insulator 52 is resistant to temperatures above 300 ℃ and has a fire rating of UL94V0. The PI shielding film 51 is a plated metal PI shielding film, specifically, a metal plating layer on the surface of the PI shielding film 51 is a tin plating layer, and can be directly soldered with the PCB board body 1.
Working principle: firstly, an electronic chip 12 is welded on the upper surface of a PCB board body 1, positioning grooves 11 are formed around the electronic chip 12, a first shielding cover 21 and a second shielding cover 22 are connected through a conductive bonding layer 23 to form a shielding cover 2, the shielding cover 2 is clamped with the PCB board body 1 through the positioning grooves 11, then a heat dissipation cover body 4 is installed in a limiting groove 3 at the top of the second shielding cover 22 to push a push rod 45, a sliding block 42 compresses a spring 43 to put the heat dissipation cover body 4 into the limiting groove 3, the push rod 45 is released, the spring 43 resets to drive the sliding block 42 to move, and the sliding block 42 drives a clamping block 44 to enter a clamping groove 31 on the side wall of the limiting groove 3.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention still fall within the scope of the technical solutions of the present invention.
Claims (6)
1. The PCB with the shielding structure is characterized by comprising a PCB body and a shielding cover, wherein a positioning groove is formed in the PCB body, the shielding cover is clamped with the PCB body through the positioning groove, the shielding cover comprises a first shielding cover and a second shielding cover, the second shielding cover is sleeved on the outer side of the first shielding cover, the first shielding cover is connected with the second shielding cover through a conductive bonding layer, a metal shielding film is arranged in the first shielding cover, a buffer cavity is formed in the top of the first shielding cover, a heat storage material is arranged in the second shielding cover, and a heat dissipation cover body is arranged at the top of the second shielding cover;
the top of the second shielding cover is provided with a limit groove, and the heat dissipation cover body is detachably covered in the limit groove; the side wall of the limit groove is provided with a clamping groove, the top of the heat dissipation cover body is provided with a groove, a sliding block is arranged in the groove, one end of the sliding block is provided with a spring, the other end of the sliding block is provided with a clamping block, the spring is fixedly connected to the side wall of the groove, the clamping block penetrates through the side wall of the groove and is inserted into the clamping groove, and the top of the sliding block is provided with a push rod;
the PCB body bottom sets up the electrically conductive elastomer of ground connection, and the electrically conductive elastomer of ground connection includes PI shielding membrane and elastic insulator, and PI shielding membrane and elastic insulator pass through high temperature resistant sticky tape and connect, and PI shielding membrane parcel is around elastic insulator, and PI shielding membrane one side sets up the opening, has the clearance between opposite side and the elastic insulator.
2. The PCB board with the shielding structure of claim 1, wherein the PCB board body further includes an electronic chip, the positioning slot is disposed around the electronic chip, and the first shielding cover is sleeved outside the electronic chip.
3. The PCB with shielding structure of claim 1, wherein a plurality of heat dissipation holes are formed in the heat dissipation cover at intervals.
4. The PCB board with the shielding structure of claim 1, wherein a conductive buckle is disposed at a clamping portion between the bottom of the first shielding case and the PCB board body, and the conductive buckle material is conductive resin.
5. The PCB with shielding structure of claim 1, wherein the recess depth of the buffer cavity is set to 0.3 mm-0.5 mm.
6. The PCB with shielding structure of claim 1, wherein the buffer cavity is filled with a high temperature resistant silicone foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111074175.3A CN113784605B (en) | 2021-09-14 | 2021-09-14 | PCB board with shielding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111074175.3A CN113784605B (en) | 2021-09-14 | 2021-09-14 | PCB board with shielding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113784605A CN113784605A (en) | 2021-12-10 |
| CN113784605B true CN113784605B (en) | 2024-04-02 |
Family
ID=78843835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111074175.3A Active CN113784605B (en) | 2021-09-14 | 2021-09-14 | PCB board with shielding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113784605B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260388A (en) * | 2013-04-24 | 2013-08-21 | 常州碳元科技发展有限公司 | Highly thermally conductive graphite film structure with function of shielding case |
| CN105246314A (en) * | 2015-10-14 | 2016-01-13 | 小米科技有限责任公司 | Shielding case, PCB (Printed Circuit Board) board and terminal equipment |
| CN207969294U (en) * | 2017-12-27 | 2018-10-12 | 苏州鸿鼎合精密电子有限公司 | A kind of quick detachable shielding case |
| CN211656718U (en) * | 2019-12-27 | 2020-10-09 | 维沃移动通信有限公司 | Heat dissipation device and electronic equipment |
| CN212725820U (en) * | 2020-08-21 | 2021-03-16 | 东莞市志德电子科技有限公司 | High-speed high-density connector with double shielding function |
-
2021
- 2021-09-14 CN CN202111074175.3A patent/CN113784605B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260388A (en) * | 2013-04-24 | 2013-08-21 | 常州碳元科技发展有限公司 | Highly thermally conductive graphite film structure with function of shielding case |
| CN105246314A (en) * | 2015-10-14 | 2016-01-13 | 小米科技有限责任公司 | Shielding case, PCB (Printed Circuit Board) board and terminal equipment |
| CN207969294U (en) * | 2017-12-27 | 2018-10-12 | 苏州鸿鼎合精密电子有限公司 | A kind of quick detachable shielding case |
| CN211656718U (en) * | 2019-12-27 | 2020-10-09 | 维沃移动通信有限公司 | Heat dissipation device and electronic equipment |
| CN212725820U (en) * | 2020-08-21 | 2021-03-16 | 东莞市志德电子科技有限公司 | High-speed high-density connector with double shielding function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113784605A (en) | 2021-12-10 |
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