CN217506455U

CN217506455U - High-efficient heat dissipation integrated circuit board

Info

Publication number: CN217506455U
Application number: CN202220828306.6U
Authority: CN
Inventors: 李泉
Original assignee: Shenzhen Yisheng Technology Co ltd
Current assignee: Shenzhen Yisheng Technology Co ltd
Priority date: 2022-04-12
Filing date: 2022-04-12
Publication date: 2022-09-27
Anticipated expiration: 2032-04-12

Abstract

The utility model discloses a high-efficient heat dissipation integrated circuit board relates to circuit board technical field, which comprises a mounting bas, the top surface central authorities of mount pad have seted up flutedly, and the internally mounted of recess has graphite alkene fin, the integrated circuit board main part is installed to graphite alkene fin's top, and the top surface central authorities of integrated circuit board main part imbed there is the chip, the fixed plate is installed all around to the bottom surface of mount pad, be connected with the screw between fixed plate and the mount pad, and the external connection of fixed plate has the flexure strip. The utility model discloses in, the heat direction graphite alkene fin that the integrated circuit board main part during operation produced, rethread first radiating groove and second radiating groove discharge the heat, and the flexure strip of slope welding in outside one side of fixed plate can support the mount pad, can play the effect of buffering to the mount pad on the one hand, and on the other hand can increase the heat dissipation space of mount pad bottom, is favorable to the heat dissipation of mount pad for the radiating effect of integrated circuit board main part is better.

Description

High-efficient heat dissipation integrated circuit board

Technical Field

The utility model relates to a circuit board technical field especially relates to a high-efficient heat dissipation integrated circuit board.

Background

Along with the rapid development of the electronic industry, the trend of miniaturization of electronic products is increasingly obvious, a PCB not only fixes various small electronic parts, but also has the main function of providing mutual electrical connection of various electronic parts, along with the development of information technology, electronic equipment is more and more complex, the PCB is widely applied, and a high-efficiency heat dissipation board card is provided.

When an existing PCB (printed circuit board) is installed, a mounting seat used for bearing a board card main body is in direct contact with a machine shell, so that the heat dissipation space of the mounting seat is small, and the heat dissipation effect of the board card main body is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving current PCB integrated circuit board when the installation for the mount pad that bears the weight of the integrated circuit board main part is direct and casing contact, and the heat dissipation space that leads to the mount pad is less, makes the relatively poor shortcoming of radiating effect of integrated circuit board main part, and the high-efficient heat dissipation integrated circuit board that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme: an efficient heat dissipation board card, comprising: the mounting seat, the top surface central authorities of mounting seat have seted up the recess, and the internally mounted of recess has graphite alkene fin, the integrated circuit board main part is installed to graphite alkene fin's top, and the embedding of the top surface central authorities of integrated circuit board main part has the chip, the fixed plate is installed all around to the bottom surface of mounting seat, be connected with the screw between fixed plate and the mounting seat, and the externally connected of fixed plate has the flexure strip, first radiating groove has been seted up to the bottom surface central authorities of mounting seat, and the second radiating groove has been seted up to the bottom surface left and right sides of mounting seat.

Preferably, the welding of the top both sides of mount pad has the baffle, and the inside through connection of baffle has the movable rod, the inboard one end of movable rod is connected with splint, and the outside one end of movable rod installs spacing cap, the spring has been cup jointed to the outside of splint, and splint have the lantern ring through spring coupling.

Preferably, the fixing structure is formed between the elastic piece and the mounting seat through a fixing plate and a screw, and the elastic piece is welded on one side of the outer part of the fixing plate in an inclined mode.

Preferably, the graphene radiating fins are bonded with the grooves, and the size of the cross section of each opening of each groove is larger than that of the bottom surface of the board card main body.

Preferably, the limiting cap and the clamping plate are welded into an integrated structure through the movable rod, and the movable rod is in penetrating type sliding connection with the baffle plate.

Preferably, an elastic structure is formed between the clamping plate and the lantern ring through a spring, the lantern ring is in electric welding connection with the baffle, and the inner diameter of the lantern ring is larger than the diameter of the movable rod.

Preferably, the height of splint is greater than the thickness of integrated circuit board main part, and splint have two sets ofly about the central axis symmetric distribution of mount pad.

To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that: 1. the utility model discloses in, the heat direction graphite alkene fin that the integrated circuit board main part during operation produced, rethread first radiating groove and second radiating groove discharge the heat, and the flexure strip of slope welding in outside one side of fixed plate can support the mount pad, can play the effect of buffering to the mount pad on the one hand, and on the other hand can increase the heat dissipation space of mount pad bottom, is favorable to the heat dissipation of mount pad for the radiating effect of integrated circuit board main part is better. 2. The utility model discloses in, stimulate spacing cap towards the outside for the splint back of the body of both sides removes the external force of effect on spacing cap with integrated circuit board main part card in the inside of recess, and splint can fix the both sides of integrated circuit board main part under the spring force effect, and this installation and dismantlement are got up comparatively simply, and make the horizontal shock resistance of integrated circuit board main part better.

Drawings

Fig. 1 is a schematic view of the local three-dimensional structure of the present invention.

Fig. 2 is a schematic view of the overall cross-sectional structure of the present invention.

Fig. 3 is a schematic view of the bottom structure of the middle mounting seat of the present invention.

Fig. 4 is an enlarged schematic structural diagram of a point a in fig. 2 of the present invention.

Illustration of the drawings: 1. a baffle plate; 2. a board card main body; 3. a chip; 4. an elastic sheet; 5. a fixing plate; 6. a mounting seat; 7. a screw; 8. a first heat sink; 9. a second heat sink; 10. a spring; 11. a groove; 12. a graphene heat sink; 13. a limiting cap; 14. a movable rod; 15. a collar; 16. and (4) clamping the plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, a high-efficient heat dissipation board card, including mount pad 6, the top surface central authorities of mount pad 6 set up recess 11, and the internally mounted of recess 11 has graphite alkene fin 12, for bonding between graphite alkene fin 12 and the recess 11, and the opening cross sectional dimension of recess 11 is greater than the bottom surface size of board card main part 2, the graphite alkene fin 12 that bonds inside recess 11 is difficult for dropping, board card main part 2 leads heat to graphite alkene fin 12, rethread first radiating groove 8 and second radiating groove 9 discharge the heat, the opening cross sectional dimension of recess 11 is greater than the bottom surface size of board card main part 2, ensure that board card main part 2 can install the inside that gets into recess 11, board card main part 2 is installed to the top of graphite alkene fin 12, and the top surface central authorities of board card main part 2 have embedded chip 3.

Install fixed plate 5 around the bottom surface of mount pad 6, be connected with screw 7 between fixed plate 5 and the mount pad 6, and the external connection of fixed plate 5 has flexible piece 4, constitute fixed knot through fixed plate 5 and screw 7 between flexible piece 4 and the mount pad 6 and construct fixed knot and construct, and the slope welding of flexible piece 4 is in outside one side of fixed plate 5, fix fixed plate 5 in the bottom of mount pad 6 through screw 7, the flexible piece 4 of slope welding in outside one side of fixed plate 5 this moment can support mount pad 6, can play the effect of buffering to mount pad 6 on the one hand, on the other hand can increase the heat dissipation space of mount pad 6 bottom, be favorable to the heat dissipation of mount pad 6, first radiating groove 8 has been seted up to the bottom surface central authorities of mount pad 6, and second radiating groove 9 has been seted up to the bottom surface left and right sides of mount pad 6.

The welding of the top both sides of mount pad 6 has baffle 1, and the inside through connection of baffle 1 has movable rod 14, the inboard one end of movable rod 14 is connected with splint 16, and spacing cap 13 is installed to the outside one end of movable rod 14, weld into integral structure through movable rod 14 between spacing cap 13 and the splint 16, and be through-going formula sliding connection between movable rod 14 and the baffle 1, link together spacing cap 13 and splint 16 through movable rod 14, make spacing cap 13 and splint 16 can be injectd the both ends of movable rod 14 respectively, avoid movable rod 14 when the inside removal of baffle 1, the phenomenon that drops appears.

The spring 10 is sleeved outside the clamping plate 16, the clamping plate 16 is connected with the lantern ring 15 through the spring 10, an elastic structure is formed between the clamping plate 16 and the lantern ring 15 through the spring 10, the lantern ring 15 is in electric welding connection with the baffle 1, the inner diameter of the lantern ring 15 is larger than the diameter of the movable rod 14, the clamping plate 16 is connected with the lantern ring 15 through the spring 10, when the board card main body 2 is installed, the clamping plate 16 can fix the two sides of the board card main body 2 under the elastic force action of the spring 10, the shock resistance is good, the tightness of connection between the lantern ring 15 and the baffle 1 is ensured through electric welding connection, the inner diameter of the lantern ring 15 is larger than the diameter of the movable rod 14, the lantern ring 15 cannot cause movement interference to the movement of the movable rod 14, on the contrary, the movement of the movable rod 14 can be guided, the improvement of the stability of the movable rod 14 in the movement process is facilitated, and the height of the clamping plate 16 is larger than the thickness of the board card main body 2, and the two groups of the clamping plates 16 are symmetrically distributed about the central axis of the mounting seat 6, the height of the clamping plates 16 on the two sides of the symmetrical distribution is larger than the thickness of the board card main body 2, so that the clamping plates 16 and the two sides of the board card main body 2 are ensured to have a large enough contact area, and the clamping stability is ensured.

The working principle is as follows: towards outside pulling stop cap 13, make the splint 16 of both sides remove mutually, with 2 inside of card of integrated circuit board main part at recess 11, remove the external force of effect on stop cap 13, splint 16 can fix the both sides of integrated circuit board main part 2 under spring 10 spring action, and the shock resistance is better, heat direction graphite alkene fin 12 that integrated circuit board main part 2 during operation produced, rethread first radiating groove 8 and second radiating groove 9 discharge the heat, the flexure strip 4 of slope welding in outside one side of fixed plate 5 can support mount pad 6, on the one hand can play the effect of buffering to mount pad 6, on the other hand can increase the heat dissipation space of 6 bottoms of mount pad, be favorable to the heat dissipation of mount pad 6, make the radiating effect of integrated circuit board main part 2 better.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a high-efficient heat dissipation integrated circuit board which characterized in that includes: mount pad (6), the top surface central authorities of mount pad (6) set up fluted (11), and the internally mounted of recess (11) has graphite alkene fin (12), integrated circuit board main part (2) are installed to the top of graphite alkene fin (12), and the top surface central authorities of integrated circuit board main part (2) imbed there are chip (3), fixed plate (5) are installed all around to the bottom surface of mount pad (6), be connected with screw (7) between fixed plate (5) and mount pad (6), and the external connection of fixed plate (5) has flexible piece (4), first radiating groove (8) have been seted up to the bottom surface central authorities of mount pad (6), and second radiating groove (9) have been seted up to the bottom surface left and right sides of mount pad (6).

2. The efficient heat dissipation board card of claim 1, wherein: the welding of the top both sides of mount pad (6) has baffle (1), and the inside through connection of baffle (1) has movable rod (14), the inboard one end of movable rod (14) is connected with splint (16), and the outside one end of movable rod (14) installs stop cap (13), spring (10) have been cup jointed to the outside of splint (16), and splint (16) are connected with lantern ring (15) through spring (10).

3. The efficient heat dissipation board card of claim 1, wherein: a fixing structure is formed between the elastic sheet (4) and the mounting seat (6) through a fixing plate (5) and a screw (7), and the elastic sheet (4) is welded on one side of the outer portion of the fixing plate (5) in an inclined mode.

4. The efficient heat dissipation board card of claim 1, wherein: the graphene radiating fins (12) are bonded with the grooves (11), and the size of the opening section of each groove (11) is larger than that of the bottom surface of the board card main body (2).

5. The efficient heat dissipation board card of claim 2, wherein: the limiting cap (13) and the clamping plate (16) are welded into an integrated structure through the movable rod (14), and the movable rod (14) is in penetrating type sliding connection with the baffle (1).

6. The efficient heat dissipation board card of claim 2, wherein: an elastic structure is formed between the clamping plate (16) and the lantern ring (15) through a spring (10), the lantern ring (15) is in electric welding connection with the baffle (1), and the inner diameter of the lantern ring (15) is larger than the diameter of the movable rod (14).

7. The efficient heat dissipation board card of claim 2, wherein: the height of splint (16) is greater than the thickness of integrated circuit board main part (2), and splint (16) have two sets ofly about the central axis symmetric distribution of mount pad (6).