CN216017245U

CN216017245U - High-strength computer mainboard

Info

Publication number: CN216017245U
Application number: CN202121921426.2U
Authority: CN
Inventors: 胡丹龙; 王明贵
Original assignee: Suzhou Jiangzhi Electronic Technology Co ltd
Current assignee: Suzhou Jiangzhi Electronic Technology Co ltd
Priority date: 2021-08-16
Filing date: 2021-08-16
Publication date: 2022-03-11
Anticipated expiration: 2031-08-16

Abstract

The utility model discloses a high-strength computer mainboard which comprises an upper conductive pattern layer, a middle conductive pattern layer and a lower conductive pattern layer, wherein the middle conductive pattern layer is isolated from the upper conductive pattern layer and the lower conductive pattern layer through a first dielectric layer and a second dielectric layer respectively; the middle conductive pattern layer consists of a plurality of first middle conductive pattern sublayers and second middle conductive pattern sublayers which are positioned on the same plane and distributed at intervals, and the first middle conductive pattern sublayers and the second middle conductive pattern sublayers are alternately distributed; the upper conductive pattern layer is electrically connected with a first middle conductive pattern sublayer in the middle conductive pattern layer through a plurality of first blind holes, and the lower conductive pattern layer is electrically connected with a second middle conductive pattern sublayer in the middle conductive pattern layer through a plurality of second blind holes. The high-strength computer mainboard effectively prevents mutual interference among internal signals, and improves the accuracy, reliability and overall strength of circuit board transmission signals.

Description

High-strength computer mainboard

Technical Field

The utility model relates to a circuit main board, and belongs to the technical field of computers.

Background

In the prior art, as the functions of various electronic products are gradually comprehensive, multifunctional and complicated, and the design of the electronic products is gradually light, thin, short and small, higher requirements are put forward on the high-density and high-integration design of a circuit board. In order to improve the carrying capacity of the circuit board, a multilayer circuit is generally stacked on the surface of the circuit board to improve the density of the circuit, dielectric holes are formed between the multilayer circuits at interlayer interconnection positions by means of laser or mechanical drilling, and then an electrically-conducting electroplated layer is formed on the dielectric holes. However, the existing circuit board still has technical defects to be overcome.

Disclosure of Invention

The utility model aims to provide a high-strength computer mainboard which effectively prevents mutual interference among internal signals and improves the accuracy, reliability and overall strength of circuit board transmission signals.

In order to achieve the purpose, the utility model adopts the technical scheme that: a high-strength computer mainboard comprises an upper conductive pattern layer, a middle conductive pattern layer and a lower conductive pattern layer, wherein the middle conductive pattern layer is isolated from the upper conductive pattern layer and the lower conductive pattern layer through a first dielectric layer and a second dielectric layer respectively;

the middle conductive pattern layer consists of a plurality of first middle conductive pattern sublayers and second middle conductive pattern sublayers which are positioned on the same plane and distributed at intervals, and the first middle conductive pattern sublayers and the second middle conductive pattern sublayers are alternately distributed;

the upper conductive pattern layer is electrically connected with a first middle conductive pattern sublayer in the middle conductive pattern layer through a plurality of first blind holes, and the lower conductive pattern layer is electrically connected with a second middle conductive pattern sublayer in the middle conductive pattern layer through a plurality of second blind holes; the first medium layer and the second medium layer respectively contain a first glass fiber mesh cloth and a second glass fiber mesh cloth.

The further improved scheme in the technical scheme is as follows:

1. in the scheme, the thickness of the upper conductive pattern layer and the lower conductive pattern layer is 10-50 microns.

2. In the scheme, the thickness of the first dielectric layer and the second dielectric layer is 100-200 microns.

3. In the above scheme, the slope of the side wall of each of the first blind hole and the second blind hole to the plane is 75-85 degrees.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages and effects:

1. the high-strength computer mainboard comprises a conductive pattern layer, wherein the conductive pattern layer comprises a plurality of first middle conductive pattern sublayers and second middle conductive pattern sublayers which are positioned on the same plane and distributed at intervals, the first middle conductive pattern sublayers and the second middle conductive pattern sublayers are alternately distributed, an upper conductive pattern layer is electrically connected with a first middle conductive pattern sublayer in the middle conductive pattern layer through a plurality of first blind holes, and a lower conductive pattern layer is electrically connected with a second middle conductive pattern sublayer in the middle conductive pattern layer through a plurality of second blind holes.

2. According to the high-strength computer mainboard, the conductive pattern layer, the upper conductive pattern layer and the lower conductive pattern layer are isolated through the first dielectric layer and the second dielectric layer respectively, and the first dielectric layer and the second dielectric layer respectively contain the first glass fiber gridding cloth and the second glass fiber gridding cloth, so that the thickness of the circuit board is reduced, and the strength of the circuit board and the insulating property of the isolating layer are improved.

Drawings

FIG. 1 is a schematic diagram of a high-strength computer motherboard according to the present invention.

In the above drawings: 1. a first fiberglass mesh; 2. an upper conductive pattern layer; 3. a middle conductive pattern layer; 31. a first middle conductive pattern sublayer; 32. a second middle conductive pattern sublayer; 4. a lower conductive pattern layer; 5. a first dielectric layer; 6. a second dielectric layer; 7. a first blind hole; 8. a second blind hole; 9. and the second glass fiber mesh cloth.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: a high-strength computer mainboard comprises an upper conductive pattern layer 2, a middle conductive pattern layer 3 and a lower conductive pattern layer 4, wherein the middle conductive pattern layer 3 is isolated from the upper conductive pattern layer 2 and the lower conductive pattern layer 4 through a first dielectric layer 5 and a second dielectric layer 6 respectively;

the middle conductive pattern layer 3 is composed of a plurality of first middle conductive pattern sublayers 31 and second middle conductive pattern sublayers 32 which are positioned on the same plane and distributed at intervals, and the first middle conductive pattern sublayers 31 and the second middle conductive pattern sublayers 32 are alternately distributed;

the upper conductive pattern layer 2 is electrically connected with a first middle conductive pattern sublayer 31 in the middle conductive pattern layer 3 through a plurality of first blind holes 7, and the lower conductive pattern layer 4 is electrically connected with a second middle conductive pattern sublayer 32 in the middle conductive pattern layer 3 through a plurality of second blind holes 8; the first medium layer 5 and the second medium layer 6 respectively contain a first glass fiber mesh cloth 1 and a second glass fiber mesh cloth 9.

The thickness of the upper conductive pattern layer 2 and the lower conductive pattern layer 4 is 10 to 50 μm.

The thickness of the first dielectric layer 5 and the second dielectric layer 6 is 100-200 microns.

The slope of the side wall of each of the first blind hole 7 and the second blind hole 8 to the plane is 75-85 degrees.

Example 2: a high-strength computer mainboard comprises an upper conductive pattern layer 2, a middle conductive pattern layer 3 and a lower conductive pattern layer 4, wherein the middle conductive pattern layer 3 is isolated from the upper conductive pattern layer 2 and the lower conductive pattern layer 4 through a first dielectric layer 5 and a second dielectric layer 6 respectively;

When the high-strength computer mainboard is adopted, the problem of mutual interference caused by the increase of the line density and the layer number of the circuit board is effectively solved, so that the mutual interference among internal signals is effectively prevented, and the accuracy, reliability and stability of the signal transmission of the circuit board are improved; and the conductive pattern layer is isolated from the upper conductive pattern layer and the lower conductive pattern layer through a first dielectric layer and a second dielectric layer respectively, and the first dielectric layer and the second dielectric layer respectively contain a first glass fiber mesh cloth and a second glass fiber mesh cloth, so that the thickness of the circuit board is reduced, and the strength of the circuit board and the insulating property of the isolating layer are improved.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A high-strength computer motherboard, characterized in that: the multilayer printed circuit board comprises an upper conductive pattern layer (2), a middle conductive pattern layer (3) and a lower conductive pattern layer (4), wherein the middle conductive pattern layer (3) is isolated from the upper conductive pattern layer (2) and the lower conductive pattern layer (4) through a first dielectric layer (5) and a second dielectric layer (6) respectively;

the middle conductive pattern layer (3) consists of a plurality of first middle conductive pattern sublayers (31) and second middle conductive pattern sublayers (32) which are positioned on the same plane and distributed at intervals, and the first middle conductive pattern sublayers (31) and the second middle conductive pattern sublayers (32) are alternately distributed;

the upper conductive pattern layer (2) is electrically connected with a first middle conductive pattern sublayer (31) in the middle conductive pattern layer (3) through a plurality of first blind holes (7), and the lower conductive pattern layer (4) is electrically connected with a second middle conductive pattern sublayer (32) in the middle conductive pattern layer (3) through a plurality of second blind holes (8); the first medium layer (5) and the second medium layer (6) respectively contain a first glass fiber mesh cloth (1) and a second glass fiber mesh cloth (9).

2. The high strength computer motherboard of claim 1, wherein: the thickness of the upper conductive pattern layer (2) and the thickness of the lower conductive pattern layer (4) are 10-50 microns.

3. The high strength computer motherboard of claim 1, wherein: the thickness of the first dielectric layer (5) and the second dielectric layer (6) is 100-200 microns.

4. The high strength computer motherboard of claim 1, wherein: the slope of the side wall of each of the first blind hole (7) and the second blind hole (8) and the plane is 75-85 degrees.