CN216014191U

CN216014191U - Heat pipe radiator for computer CPU

Info

Publication number: CN216014191U
Application number: CN202122192325.2U
Authority: CN
Inventors: 丁关华; 杨小红
Original assignee: Shenzhen Liyangpeng Technology Co ltd
Current assignee: Shenzhen Liyangpeng Technology Co ltd
Priority date: 2021-09-10
Filing date: 2021-09-10
Publication date: 2022-03-11
Anticipated expiration: 2031-09-10

Abstract

The utility model discloses a heat pipe radiator for computer CPU, which comprises a plurality of layers of radiating fins fixed by a plurality of heat pipes, the bottom of each heat pipe is connected with a heat conducting base for attaching a mainboard CPU, two sides of the heat conducting base comprise two profile grooves for installing a first fixing base and a second fixing base, wherein, two ends of the first fixing base and the second fixing base are provided with screw holes and can be detachably provided with spring screws, the surfaces of the radiating fins are provided with through holes for penetrating the plurality of layers of radiating fins, and the inner sides of the through holes independently arranged on each radiating fin are welded with downward air deflectors, the air deflectors are additionally arranged by the side surfaces of the radiating fans, the guide of wind can partially pass through the gaps among the radiating fins, and a small part of wind can be blocked by the air deflectors to ventilate up and down, and then the downward heat exchanging wind can blow to the mainboard when leaving the factory and is provided with the radiating fins, on one hand, the absorbed heat can be increased, the temperature in the case is reduced, and on the other hand, the heat dissipation of the radiating fins of the main board can be accelerated.

Description

Heat pipe radiator for computer CPU

Technical Field

The utility model belongs to the technical field of heat pipe radiator, concretely relates to heat pipe radiator for computer CPU.

Background

The heat pipe radiator is a new product produced by utilizing the heat pipe technology to make great improvement on many old radiators or heat exchange products and systems. The heat pipe radiator has two main types of natural cooling and forced air cooling. The thermal resistance of the air-cooled heat pipe radiator can be made smaller, and the air-cooled heat pipe radiator is commonly used in a high-power supply.

The existing computer mainboard is provided with a heat pipe radiator, as the heat dissipation of the CPU, the heat pipe is connected with radiating fins for heat dissipation, the mainboard is provided with radiating fins when leaving the factory, the radiating fins cannot be well utilized to further help the heat dissipation, the heat pipe radiator is attached to the CPU, the screws limit the shapes and sizes of the heat pipes and the radiating fins to the great degree of the installation position of the mainboard CPU, and the heat pipe radiator with large size is not convenient to disassemble and install.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a computer is heat pipe radiator for CPU has the characteristics of being convenient for cooperate mainboard fin and more making things convenient for the dismantlement of screw.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer is heat pipe radiator for CPU, includes that multilayer radiating fin is fixed through many heat pipes, the heat pipe bottom is connected with the heat conduction base that is used for mainboard CPU laminating, the both sides of heat conduction base are including the profile groove of seting up the first fixing base of two installations and second fixing base, and wherein, the both ends of first fixing base and second fixing base are seted up and are used for screw hole and demountable installation to have the spring screw.

Preferably, the top of each of the plurality of layers of the radiating fins is provided with a through hole.

Preferably, the inner sides of the through holes are all welded with downward air deflectors.

Preferably, the two sides of the radiating fins are provided with clamping interfaces for detachably mounting the radiating fan.

Preferably, the top of the heat conducting base comprises a plurality of cooling fins.

Compared with the prior art, the beneficial effects of the utility model are that: compared with the traditional heat pipe radiator for the computer CPU, the multilayer radiating fins are provided with the plurality of through holes, meanwhile, the air deflectors are welded on the inner sides of the through holes, and when the radiating fans are matched to blow air to gaps among the radiating fins, the air deflectors in the through holes can vertically guide air volume to convey, so that the radiating effect is improved.

1. The utility model discloses well heat pipe series connection is fixed with multilayer radiating fin, and radiating fin's surface sets up the through-hole that link up multilayer radiating fin, and the inboard decurrent aviation baffle that all welds of through-hole that every radiating fin independently seted up, the aviation baffle is installed additional by the radiator fan side, the direction of wind can partly pass the clearance between radiating fin, and the subtotal receives the hindrance of aviation baffle and ventilates from top to bottom, and then decurrent trades hot-blast can blow to the mainboard when dispatching from the factory and take the fin certainly, can increase on the one hand and be absorbed the heat, reduce quick-witted incasement portion temperature, on the other hand can accelerate the heat dissipation of mainboard fin.

2. The utility model discloses the profile modeling groove of two first fixing bases of installation and second fixing base is seted up to the both sides of heat conduction base, and first fixing base and the below that is located radiating fin, and the screw hole of first fixing base and wherein two through-hole mutually perpendicular, the spring screw can pass the through-hole through the long screwdriver, installs the spring screw, has improved when the radiator is bulky, also can demolish the spring screw, carries out the dismantlement of radiator.

Drawings

Fig. 1 is a schematic front view of the present invention;

fig. 2 is a schematic side view of the present invention;

fig. 3 is a schematic top view of the present invention;

fig. 4 is a schematic bottom view of the present invention;

in the figure: 1. a heat dissipating fin; 2. a heat pipe; 3. a thermally conductive base; 4. a first fixed seat; 5. a second fixed seat; 6. a heat radiation fan; 7. a heat dissipating through hole; 8. an air deflector; 9. a spring screw; 10. a card interface.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides the following technical solutions: a heat pipe radiator for a computer CPU comprises a plurality of layers of radiating fins 1 fixed through a plurality of heat pipes 2, wherein the bottom of each heat pipe 2 is connected with a heat conduction base 3 used for attaching a mainboard CPU, two sides of each heat conduction base 3 comprise an imitated groove provided with two first fixing seats 4 and two second fixing seats 5, and two ends of each first fixing seat 4 and two ends of each second fixing seat 5 are provided with screw holes and are detachably provided with spring screws 9;

through holes 7 are formed in the tops of the multiple layers of radiating fins 1;

the spring screw 9 can pass through the through hole 7 through a long screwdriver to install the spring screw 9, so that the problem that the radiator is large in size can be solved, and the spring screw 9 can be detached to detach the radiator.

And the inner sides of the through holes 7 are all welded with downward air deflectors 8.

When the cooling fan is used, the inner sides of the through holes 7 formed in the radiating fins 1 independently are welded with downward air deflectors 8, the air deflectors 8 are additionally arranged by means of the side surfaces of the radiating fans 6, and the air guide part penetrates through gaps among the radiating fins 1 and the small part is blocked by the air deflectors 8 to ventilate up and down.

The two sides of the radiating fin 1 are provided with clamping interfaces 10 for detachably mounting the radiating fan 6;

the radiating fins 1 are matched with the radiating fan 6, so that the air quantity can be influenced, the heat exchange rate in the case is increased, and meanwhile, heat exchange is carried out among the radiating fins 1 on each layer.

The top of the heat conduction base 3 is provided with a plurality of radiating fins; the surface area of the heat conduction base 3 is further increased, the heat dissipation effect is accelerated, and meanwhile, the bottom support can be provided for the heat dissipation fan 6.

The utility model discloses a theory of operation and use flow: when the utility model is used, firstly, the heat radiation fins 1 are provided with the heat radiation fans 6 through the fasteners and are provided with the clamping interfaces 10 through the fasteners, the heat conduction base 3 is provided with the first fixing seat 4 and the second fixing seat 5, and the spring screws 9 are respectively arranged at the two ends of the first fixing seat 4 and the second fixing seat 5, the spring screw 9 and the mainboard are installed through the through hole 7 by a long screwdriver, the inner side of the through hole 7 independently arranged on each radiating fin 1 is welded with a downward air deflector 8, the air deflector 8 is additionally arranged by the side surface of the radiating fan 6, the wind guide can partially pass through the gap between the radiating fins 1, and the small part is blocked by the air deflector 8 to ventilate up and down, and then the decurrent hot-blast heat that trades can blow to the mainboard and leave the factory and take the fin certainly, can increase on the one hand and be absorbed the heat, reduce quick-witted incasement portion temperature, on the other hand can accelerate the heat dissipation of mainboard fin.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a computer is heat pipe radiator for CPU, includes that multilayer radiating fin (1) is fixed through many heat pipes (2), its characterized in that: the heat pipe (2) bottom is connected with heat conduction base (3) that is used for mainboard CPU laminating, the both sides of heat conduction base (3) are including the profile modeling groove of seting up two first fixing bases (4) of installation and second fixing base (5), and wherein, the both ends of first fixing base (4) and second fixing base (5) are seted up and are used for the screw hole and demountable installation has spring screw (9).

2. The heat pipe radiator of claim 1, wherein: through holes (7) are formed in the tops of the multiple layers of radiating fins (1).

3. A heat pipe radiator for a computer CPU as claimed in claim 2, wherein: and the inner sides of the through holes (7) are all welded with downward air deflectors (8).

4. The heat pipe radiator of claim 1, wherein: and clamping interfaces (10) for detachably mounting the heat radiation fans (6) are arranged on two sides of the heat radiation fins (1).

5. The heat pipe radiator of claim 1, wherein: the top of the heat conduction base (3) comprises a plurality of radiating fins.