CN215988714U - Electronic chip packaging structure - Google Patents

Abstract

The utility model discloses an electronic chip packaging structure which comprises a PCB body, a chip body, a packaging cover and a stable frame cover, wherein the chip body, the packaging cover and the stable frame cover are arranged on the PCB body, welding balls are arranged at the lower end of the chip body, a top heat conduction layer is arranged at the upper end of the chip body, the packaging cover and the top heat conduction layer are covered and connected with the outside of the chip body, bottom filling glue is arranged in an inner cavity of the packaging cover, structural glue and a heat dissipation groove are arranged on the stable frame cover, and a heat dissipation fin is embedded in the heat dissipation groove in an inserted mode. The external protection performance of the whole packaging structure of the chip body welded on the PCB body is improved, the stable pressing effect of the stable frame cover on the top of the chip body is realized, the stability of the whole structure packaged by the chip body is effectively improved, the situation that the whole chip packaging structure is rocked to fall off due to the fact that the packaging structure is subjected to side deformation and warping tin cracking is avoided, and the heat dissipation effect of the chip body packaging structure is greatly improved.

Description

Electronic chip packaging structure

Technical Field

The utility model belongs to the technical field of chip packaging, and particularly relates to an electronic chip packaging structure.

Background

With the continuous development of scientific technology, more and more electronic devices are widely applied to daily life and work of people, the core component of the electronic device for realizing various functions is an electronic chip, and the electronic chip needs to be packaged and protected to form an electronic chip packaging structure.

However, the conventional electronic chip package structure has low external protection performance for the whole package structure of the chip body soldered on the PCB body, and the whole structure of the chip body package has poor stability, and in addition, the heat dissipation effect of the chip body package structure is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an electronic chip packaging structure, which aims to solve the problems that the external protection performance of the whole packaging structure of a chip body welded on a PCB body is lower, the stability of the whole packaging structure of the chip body is poorer, and the heat dissipation effect of the chip body packaging structure is lower in the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an electronic chip packaging structure, includes the PCB body to and locate chip body, encapsulation cover, the stable frame cover on the PCB body, the lower extreme of chip body is equipped with the welding ball, the chip body passes through welding ball and PCB body welded fastening, and encapsulation cover and top heat-conducting layer cover with the outside of chip body and cup joint, it glues, heat dissipation recess to be equipped with the structure on the frame cover to stabilize, it has the fin to inlay the grafting in the heat dissipation recess.

Preferably, the encapsulation cover is of a cover body structure with a through-type from top to bottom, underfill is arranged in an inner cavity of the encapsulation cover, the underfill is a curing underfill commonly used for chip bonding, and the underfill has low elastic modulus, so that the effect of bonding with the PCB body through the underfill can be realized while the chip body is integrally encapsulated.

Preferably, the top heat conduction layer is arranged at the upper end of the chip body, the top heat conduction layer is made of organic silicone as a main raw material, and a material with excellent heat resistance and heat conduction performance is added, so that the prepared heat conduction type organic silicone grease solid-state compound has excellent heat conduction performance.

Preferably, the cross-section of stabilizing the frame cover is the structure of falling the U-shaped, and the body adopts the aluminium material to make, and matter is light, and intensity is high, and the lower terminal surface of this structure of falling the U-shaped is provided with the structure and glues, and the structure is glued for the silicone structure, guarantees to stabilize that the frame cover is stable and this body bonding of PCB board is fixed.

Preferably, the depression surface of the heat dissipation groove is of a rectangular structure, the area of the rectangular structure is matched with the area of the chip body, and the heat dissipation effective area of the chip body is guaranteed.

Preferably, the fin is rectangular sheet structure, and its quantity is for overlooking thirty of vertical arrangement, and the fin is the aluminium material, has improved heat radiating area to its body heat capacity is little, and combines the effect that hot-air upwards flows, dispels the heat very easily, has improved chip body packaging structure's radiating effect.

Preferably, the top corner of the stable frame cover is a circular arc surface, so that smoothness of the top corner of the stable frame cover is improved, and the condition that hand skin is abraded by operators and hard ninety-degree corners on the stable frame cover during welding is avoided.

Compared with the prior art, the utility model has the beneficial effects that:

through the stable frame cover structure that sets up, improved the outside protectiveness to the whole packaging structure of the chip body of welding on the PCB board body to, glue and combine the inside underfill who sets up of packaging cover through the structure that sets up, realized stabilizing the frame cover and pressing down the effect to the stability at chip body top, effectively improved the overall structure stability of chip body encapsulation, avoid packaging structure to take place the side and warp warpage tin and split and cause the whole condition that rocks and drop of chip packaging structure.

Through the heat dissipation groove structure that has the fin that sets up on stabilizing the frame cover top to set up the top heat-conducting layer between stabilizing the frame cover inner wall and chip body top, very big improvement chip body packaging structure's radiating effect.

Drawings

FIG. 1 is an elevational cross-sectional view of the overall construction of the present invention;

fig. 2 is a schematic top view of the overall structure of the present invention.

In the figure: the PCB comprises a PCB body 1, a chip body 2, a solder ball 21, a packaging cover 3, underfill 31, a stable frame cover 4, structural adhesive 41, a heat dissipation groove 42, a heat conduction layer at the top 5 and a heat dissipation sheet 6.

Detailed Description

Referring to fig. 1, an electronic chip package structure includes a PCB body 1, and a chip body 2, a package cover 3, and a stable frame cover 4 disposed on the PCB body 1, wherein a solder ball 21 is disposed at a lower end of the chip body 2, the chip body 2 is fixed to the PCB body 1 by the solder ball 21, and the chip body 2 is an electronic chip and integrally forms the chip package structure with the package cover 3.

Referring to fig. 1 and 2, a top heat conducting layer 5 is adhered to the upper end of a chip body 2, a package cover 3 and the top heat conducting layer 5 are in covering connection with the outside of the chip body 2, the package cover 3 is of a cover body structure with a through top and bottom, underfill 31 is arranged in an inner cavity of the package cover 3, a heat dissipation groove 42 is arranged on a stable frame cover 4, a downward-looking surface of the heat dissipation groove 42 is of a rectangular structure, heat dissipation fins 6 are embedded in the heat dissipation groove 42 in an interference fit manner and are stably inserted, the heat dissipation fins 6 are of a long-strip sheet structure, the number of the heat dissipation fins is thirty, the number of the heat dissipation fins is vertically arranged, the heat dissipation areas of the plurality of heat dissipation fins 6 is increased, the heat capacity of the chip body is small, and the effect of upward flowing of hot air is combined, heat is easily dissipated, and the heat dissipation effect of the package structure of the chip body 2 is improved.

Referring to fig. 1 and 2, a structural adhesive 41 is adhered to the stable frame cover 4, the cross section of the stable frame cover 4 is an inverted U-shaped structure, and the structural adhesive 41 is adhered to the lower end surface of the inverted U-shaped structure, so as to ensure stable adhesion and fixation of the stable frame cover 4 and the PCB board body 1.

Referring to fig. 1 and 2, the top corner of the stabilizing frame cover 4 is a circular arc surface, so as to avoid hand skin abrasion between the operator and the hard ninety-degree corner on the stabilizing frame cover 4 during welding.

The working principle of the scheme is as follows: firstly, inserting the chip body 2 into the inner cavity of the packaging cover 3 and welding the chip body 2 to the PCB body 1 through the welding balls 21, then filling bottom filling glue 31 into the inner cavity of the packaging cover 3, then adhering the top heat conduction layer 5 to the top end of the chip body 2, then covering the whole packaging structure of the chip body 2 by the stable frame cover 4, and stably adhering the chip body 2 to the PCB body 1 through the structural glue 41;

this is novel through the stable frame cover 4 structure that sets up, has improved the outside protectiveness to the whole packaging structure of welding chip body 2 on PCB board body 1 to, realized stabilizing frame cover 4 and pressing down the effect to the stability at 2 tops of chip body, improved the overall structure stability of 2 encapsulation of chip body, avoid packaging structure to take place the side and warp the warpage tin and split and cause the whole condition that rocks and drop of chip packaging structure.

Claims (7)

1. The utility model provides an electronic chip packaging structure, includes PCB body (1) to and locate chip body (2), encapsulation cover (3), stable frame cover (4) on PCB body (1), its characterized in that: the lower extreme of chip body (2) is equipped with welding ball (21), the upper end of chip body (2) is equipped with top heat-conducting layer (5), and encapsulation cover (3) and top heat-conducting layer (5) cover with the outside cladding of chip body (2) and connect, be equipped with underfill (31) in the inner chamber of encapsulation cover (3), be equipped with structure glue (41), heat dissipation recess (42) on stabilizing frame cover (4), it has fin (6) to inlay the grafting in heat dissipation recess (42).

2. The electronic chip package structure of claim 1, wherein: the packaging cover (3) is of a cover body structure which is vertically through.

3. The electronic chip package structure of claim 1, wherein: the chip body (2) is fixedly welded with the PCB body (1) through the welding balls (21).

4. The electronic chip package structure of claim 1, wherein: the cross section of the stable frame cover (4) is of an inverted U-shaped structure, and structural glue (41) is arranged on the lower end face of the inverted U-shaped structure.

5. The electronic chip package structure of claim 1, wherein: the plane of the heat dissipation groove (42) is of a rectangular structure.

6. The electronic chip package structure of claim 1, wherein: the radiating fins (6) are of strip-shaped sheet structures, and the number of the radiating fins is thirty in vertical arrangement when overlooking.

7. The electronic chip package structure of claim 1, wherein: the top corner of the stable frame cover (4) is a circular arc surface.

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