CN101515550A - Radiating modular structure of semiconductor package and manufacturing method thereof - Google Patents
Radiating modular structure of semiconductor package and manufacturing method thereof Download PDFInfo
- Publication number
- CN101515550A CN101515550A CNA2008100805522A CN200810080552A CN101515550A CN 101515550 A CN101515550 A CN 101515550A CN A2008100805522 A CNA2008100805522 A CN A2008100805522A CN 200810080552 A CN200810080552 A CN 200810080552A CN 101515550 A CN101515550 A CN 101515550A
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- semiconductor package
- package part
- heat sink
- chip
- semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a radiating modular structure of a semiconductor package and a manufacturing method. At least one semiconductor semiconductor package comprising a chip carrying piece, a semiconductor chip arranged on the chip carrying piece, and a first radiating piece arranged on the semiconductor chip is provided, so that the semiconductor package is electrically connected to an external electronic device through the chip carrying piece; and then at least one second radiating piece is arranged on the first radiating piece of the semiconductor package, and the size of the second radiating piece is larger than that of the first radiating piece; therefore, the semiconductor package, the first radiating piece, the external electronic device and the second radiating piece are combined in a modular mode to improve the radiating efficiency of the semiconductor package.
Description
Technical field
The present invention relates to a kind of radiating modular structure and manufacture method thereof, particularly relate to a kind of radiating modular structure and manufacture method thereof of semiconductor package part.
Background technology
At present the soft loading plate of utilization as the packaged chip carrier with in the prior art with chip and flexible base plate electric connection, it can approximately be divided into winding carrying encapsulation (Tape Carrier Package, TCP) and flip-chip film (Chip on Film, technology such as COF), the drive IC packaging technology of display wherein, with TCP support plate and COF soft board packing bearing body, be the application of present correlation technique maximum as drive IC.
Will supervene a large amount of heats during the semiconductor chip of highly integrated yet (Integration) operation,, will seriously shorten the performance and the life-span of semiconductor chip as the untimely effective loss of heat that semiconductor chip is produced.
Therefore, for improving the radiating efficiency of semiconductor package part, there is the conception of in packaging part, setting up radiator structure to arise at the historic moment then.
In view of this, as shown in Figure 1, be U.S. Pat 6,238,954 disclosed a kind of flip-chip thin film semiconductor encapsulating structures that are integrated with heat sink, it mainly is that semiconductor chip 11 is arranged on the chip bearing member 10, and is formed with packing colloid (molding compound) 12 to coat two sides of this semiconductor chip 11, again integrated heat sink (dissipationmember) 13 is attached at the surface of this semiconductor chip 11, uses the heat of loss semiconductor chip 11.
But in this encapsulating structure, the attaching mode of heat sink is subject to the encapsulating structure size, thereby limits its heat-sinking capability.
Another U.S. Pat 5; 866; 953 disclose a kind of semiconductor package with thermal paste material; as shown in Figure 2; its primary structure is with flip chip semiconductor chip 21 to be set earlier on chip bearing member 20; and being formed with the bottom fills out body (under-fill encapsulant) 22 and is filled in 20 of this semiconductor chip 21 and chip bearing members; around this semiconductor chip 21, form reeded resistance barrier glue material (barrier glob top) 23 to seal and to protect this semiconductor chip 21; in the groove of this resistance barrier glue material 23, insert a thermal paste material (heat-dissipatingglob top) 24 again, use the heat of loss semiconductor chip 21.
But in aforementioned encapsulating structure, this thermal paste material 24 is the back side that is arranged at semiconductor chip 21, and its radiating effect still is subject to the size of semiconductor chip 21, can't effectively significantly promote radiating efficiency, and the execution mode complexity.
Other sees also Fig. 3, be disclosed another kind of semiconductor package among the Japan Patent JP11-251483, mainly be to attach film fin (thin heat sink) 32 with opening 320 at the back side of semiconductor chip 31, this opening 320 exposes outside this semiconductor chip 31 back sides, the heat that is produced with this semiconductor chip 31 of loss by this film fin 32 and opening 320.
But, this kind semiconductor package, heat-sinking capability still obviously is subject to the package dimension size, and the heat that semiconductor chip 31 is produced not is directly to take away from this semiconductor chip 31, but it is most of in heat conducting mode, conduct loss by the metal strengthening spare (metalstiffener) 33 in the encapsulating structure indirectly, its radiating efficiency is obviously not good.
The heat dissipation element of institute's combination in the above-mentioned semiconductor package, its size all is subject to package dimensions size own, and for the semiconductor package that is applied to winding carrying encapsulation or flip-chip thin film technique, all have small size, high-power characteristic, the heat dissipation element area that tends to be subject to encapsulating structure itself is too small, and can't reach the effect of efficiently radiates heat.
Therefore, how to propose a kind of radiating modular structure of semiconductor package part, existing be subject to the encapsulating structure size and cause that the heat sink area is too small, the real present industry problem anxious to be solved that become of the problem of poor heat radiation to overcome.
Summary of the invention
In view of the defective of above-mentioned prior art, a purpose of the present invention provides a kind of radiating modular structure and manufacture method thereof of semiconductor package part, to promote the radiating efficiency of semiconductor package part.
Another object of the present invention provides a kind of radiating modular structure and manufacture method thereof of semiconductor package part, to promote semiconductor chip usefulness.
A further object of the present invention provides a kind of radiating modular structure and manufacture method thereof of semiconductor package part, to simplify technology and to be beneficial to modularization.
Another purpose of the present invention provides a kind of radiating modular structure and manufacture method thereof of semiconductor package part, can be not limited to the size of packaging part and strengthens area of dissipation.
Another purpose of the present invention provides a kind of radiating modular structure and manufacture method thereof of semiconductor package part, can adopt easy means combined package and external electronic, promotes heat dissipation simultaneously.
For achieving the above object, the radiating modular structure of semiconductor package part of the present invention comprises: an external electronic; At least one semiconductor package part, this semiconductor package part includes chip bearing member, be arranged at the semiconductor chip on this chip bearing member and be arranged at first heat sink on this semiconductor chip, and this semiconductor package part is to be electrically connected to this external electronic by its chip bearing member; And at least one second heat sink, be mounted on first heat sink of this semiconductor package part, wherein the size of this second heat sink is greater than the size of this first heat sink.
The present invention also provides a kind of manufacture method of radiating modular structure of semiconductor package part, comprising: the semiconductor package part that provides at least one and include chip bearing member, be arranged at the semiconductor chip on this chip bearing member and be arranged at first heat sink on this semiconductor chip; This semiconductor package part is electrically connected on the external electronic by its chip bearing member; At least one second heat sink is mounted on first heat sink of this semiconductor package part, and wherein the size of this second heat sink is greater than the size of this first heat sink.Thereby by modular mode in conjunction with this semiconductor package part, first heat sink, external electronic and second heat sink, to promote the radiating efficiency of semiconductor package part.
This external electronic is for example to be a liquid crystal display (LCD) panel; This semiconductor package part for example is winding carrying encapsulation or flip-chip thin film semiconductor packaging part.
This first and second heat sink can be by the good metal or alloy manufacturing of heat-sinking capability, and this first and second heat sink can adopt the convenient combination of for example concavo-convex relatively embedded structure, also or the thermal paste that between this first and second heat sink, adds a tool radiating effect carry out bonding; In addition this second heat sink can be bonded on first heat sink of a plurality of semiconductor package parts and forms the radiating module structure of an enhance heat usefulness, and the quantity of this second heat sink is not limited to single, visual real space limits and is divided into a plurality of, certainly this second heat sink also can correspondingly one to one be arranged on first heat sink of semiconductor package part, and the size of this second heat sink is greater than the size of first heat sink, to promote heat dissipation.
Therefore, the radiating modular structure of semiconductor package part of the present invention and manufacture method thereof, provide at least one semiconductor package part, this semiconductor package part includes chip bearing member, be arranged at the semiconductor chip on this chip bearing member, and be arranged at first heat sink on this semiconductor chip, so that this semiconductor package part is electrically connected on the external electronic by its chip bearing member, and at least one second heat sink group is established to first heat sink of this semiconductor package part, wherein the size of this second heat sink is greater than the size of this first heat sink, thereby by modular mode in conjunction with this semiconductor package part, first heat sink, the external electronic and second heat sink, to promote the radiating efficiency of semiconductor package part, guarantee that simultaneously its heat-sinking capability can not be confined to the size of semiconductor package part, and then promote semiconductor chip usefulness.
Moreover, by the radiating modular structure and the manufacture method thereof of semiconductor package part of the present invention, can make its heat-sinking capability can not be confined to the size of semiconductor package part, and can pass through this second heat sink, to strengthen area of dissipation in conjunction with space outerpace.
In addition, in the radiating modular structure of this semiconductor package part, the radiating requirements of the visual integral heat sink modular construction of the size of second heat sink and setting, and can be in desiring to be electrically connected to the semiconductor package part of this external electronic first heat sink of setting up standard, so one even a plurality of semiconductor package part with different chip sizes can be combined with second heat sink by this first heat sink, and need not be customized one by one because of different die size, so can strengthen the shared property and the compatibility of first heat sink, and the production cost and the process complexity that reduce semiconductor package part, thereby realize with modularization production purpose.The heat-sinking capability of radiating modular structure is after combined semiconductor packaging part and external electronic in addition, just by second heat sink decision that adds, so can avoid on semiconductor package part, being provided with earlier second heat sink of a size greater than this semiconductor package part, cause packing and carrying the problem of inconvenience and process complications.
Description of drawings
Fig. 1 is a U.S. Pat 6,258, the 954 disclosed semiconductor device generalized sections that are integrated with heat sink;
Fig. 2 is a U.S. Pat 5,866,953 disclosed packaged semiconductor devices generalized sections with thermal paste material;
Fig. 3 is the disclosed semiconductor device generalized section of Japan Patent JP11-251483;
Fig. 4 A to Fig. 4 C is the radiating modular structure and the manufacture method generalized section thereof of semiconductor package part of the present invention; And
Fig. 5 A and Fig. 5 B are the radiating modular structure floor map of semiconductor package part of the present invention.
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented or be used by other different specific embodiments, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
See also Fig. 4 A to Fig. 4 C, be the radiating modular structure of semiconductor package part of the present invention and the generalized section of manufacture method thereof.
Shown in Fig. 4 A, at least one semiconductor package part 4 is provided, this semiconductor package part 4 comprises: a chip bearing member 40; At least one semiconductor chip 41 is provided with and electrically connects this chip bearing member 40; First heat sink 42 is arranged on this semiconductor chip 41 and has first joint portion 421.
It for example is the chip bearing member 40 of soft board or film that the manufacture method of this semiconductor package part 4 provides one, wherein these chip bearing member 40 surfaces are provided with a plurality of weld pads 401, are electrically connected to this chip bearing member 40 with flip chip by solder bump 44 for semiconductor chip 41.This semiconductor chip 41 has an active surface 411 and relative non-active surface 412, and this semiconductor chip 41 is to be arranged at this chip bearing member 40 with the solder bump 44 on its active surface 411, and is electrically connected to the weld pad 401 on these chip bearing member 40 surfaces.
Flip-chip bottom filler (underfill) 45 can then be inserted again in the gap of 40 of this semiconductor chip 41 and this chip bearing members, with thermal expansion difference that suppresses 40 of this semiconductor chip 41 and this chip bearing members and the stress that reduces this solder bump 44.
Then be arranged at first heat sink 42 on the non-active surface 412 of this semiconductor chip 41 by a heat conduction adhesion coating 46, wherein, the material of this first heat sink 42 is the metal or alloy good as the heat-sinking capability of copper or aluminium, and this first heat sink 42 is provided with first joint portion 421.
Shown in Fig. 4 B, with at least one this semiconductor package part 4 by it for example for the chip bearing member 40 of soft board or film is provided with and is electrically connected on the external electronic 51, this external electronic 51 for example is a display panels.
Shown in Fig. 4 C, provide at least one second heat sink 52, so that this second heat sink 52 is arranged on first heat sink 42 of this semiconductor package part 4.
Wherein one of the metal that this second heat sink 52 is copper and aluminium or its alloy, it has second joint portion 521, and this second joint portion 521 is to be provided with respect to first joint portion 421 of this first heat sink 42, in the present embodiment, first joint portion 421 of this first heat sink 42 is relative concavo-convex embedded structure with second joint portion 521 of this second heat sink 52, so that this second heat sink 52 is incorporated on first heat sink 42 of this semiconductor package part 4, also or can a heat-conducting glue (not shown) be set for mutual bonding in this first heat sink 42 and 52 of second heat sinks.
In addition, the size of this second heat sink 52 is greater than these first heat sink, 42 sizes, so this second heat sink 52 can design in conjunction with one or more first heat sinks 42.
Please cooperate again and consult Fig. 5 A and Fig. 5 B, the floor map for the radiating modular structure of semiconductor package part of the present invention includes an external electronic 51; Semiconductor package part 4, this semiconductor package part 4 are to be electrically connected to this external electronic 51 by its chip bearing member 40; And second heat sink 52, be mounted on first heat sink 42 of this semiconductor package part 4, wherein the size of this second heat sink 52 is greater than the size of this first heat sink 42.
This external electronic 51 is for example to be a display panels in the present embodiment, other provides the semiconductor package part 4 of many group tool first heat sinks 42 (to be provided with 4 semiconductor package parts in the present embodiment, but it is non-as limit), be provided with and be electrically connected to this external electronic 51 for described semiconductor package part 4 by for example chip bearing member 40, and second heat sink 52 is mounted on first heat sink 42 of this semiconductor package part 4 for soft board or film.
This second heat sink 52 can be bonded on first heat sink 42 of a plurality of semiconductor package parts 4 and form the radiating module structure of an enhance heat usefulness, and the quantity of this second heat sink 52 is not limited to single, these second heat sink, 52 visual real spaces dispose and only establish single (shown in Fig. 5 A) or a plurality of (shown in Fig. 5 B) are set, certainly this second heat sink 52 also can be arranged on first heat sink 42 of semiconductor package part 4 one to one, and the size of this second heat sink 52 is greater than the size of first heat sink 42, to promote heat dissipation.
In addition, the radiating requirements of the visual integral heat sink modular construction of the size of this second heat sink 52 and setting, and can be in desiring to be electrically connected to the semiconductor package part 4 of this external electronic 51 first heat sink 42 (no matter whether the semiconductor chip specification respectively in this semiconductor package part identical) of setting up standard, so one even a plurality of semiconductor package part with different chip sizes 4 can be combined with second heat sink 52 by this first heat sink 42, and need not be customized one by one because of different die size, use the shared property and the compatibility that increase this first heat sink 42, and the production cost and the process complexity that reduce semiconductor package part 4, thereby reach modularization production purpose.
Moreover, in the present invention, the heat-sinking capability of radiating modular structure is after combined semiconductor packaging part 4 and external electronic 51, just by second heat sink, 52 decisions that add, so can avoid on semiconductor package part 4, being provided with earlier second heat sink of a size greater than this semiconductor package part 4, cause packing and carrying the problem of inconvenience and process complications.
Therefore, the radiating modular structure of semiconductor package part of the present invention and manufacture method thereof, provide at least one semiconductor package part, this semiconductor package part includes chip bearing member, be arranged at the semiconductor chip on this chip bearing member, and be arranged at first heat sink on this semiconductor chip, so that this semiconductor package part is electrically connected on the external electronic by its chip bearing member, and at least one second heat sink group is established to first heat sink of this semiconductor package part, wherein the size of this second heat sink is greater than the size of this first heat sink, thereby by modular mode in conjunction with this semiconductor package part, first heat sink, the external electronic and second heat sink, to promote the radiating efficiency of semiconductor package part, guarantee that simultaneously its heat-sinking capability can not be confined to the size of semiconductor package part, and then promote the semiconductor core piece performance.
In addition, by the radiating modular structure and the manufacture method thereof of semiconductor package part of the present invention, can make its heat-sinking capability can not be confined to the size of semiconductor package part, and can strengthen area of dissipation in conjunction with the external device (ED) space.
Moreover, because the present invention is being provided with for example first junction surface and second junction surface of embedded structure on first heat sink of semiconductor package part and on second heat sink, so the person of being easy to use is being incorporated into this second heat sink on first heat sink of this semiconductor package part easily.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be foundation with the scope of claims.
Claims (18)
1, a kind of manufacture method of radiating modular structure of semiconductor package part is characterized in that, this manufacture method comprises:
The semiconductor package part that provides at least one and include chip bearing member, be arranged at the semiconductor chip on this chip bearing member and be arranged at first heat sink on this semiconductor chip;
This semiconductor package part is electrically connected on the external electronic by its chip bearing member; And
At least one second heat sink is mounted on first heat sink of this semiconductor package part, and the size of this second heat sink is greater than the size of this first heat sink.
2, the manufacture method of the radiating modular structure of semiconductor package part according to claim 1 is characterized in that: this external electronic is a display floater.
3, the manufacture method of the radiating modular structure of semiconductor package part according to claim 1 is characterized in that: this chip bearing member is provided with a plurality of weld pads and is arranged on this chip bearing member with flip chip for this semiconductor chip.
4, the manufacture method of the radiating modular structure of semiconductor package part according to claim 1 is characterized in that: this semiconductor package part is wherein one of winding carrying encapsulation or a flip-chip thin film semiconductor packaging part.
5, the manufacture method of the radiating modular structure of semiconductor package part according to claim 1 is characterized in that: this chip bearing member is wherein one of soft board or a film.
6, the manufacture method of the radiating modular structure of semiconductor package part according to claim 1 is characterized in that: this second heat sink select with one to one or one-to-many manner be arranged on first heat sink of this semiconductor package part.
7, the manufacture method of the radiating modular structure of semiconductor package part according to claim 1 is characterized in that: this first heat sink and second heat sink have first and second relative joint portion.
8, the manufacture method of the radiating modular structure of semiconductor package part according to claim 7 is characterized in that: first and second joint portion of this first and second heat sink is relative concavo-convex embedded structure.
9, the manufacture method of the radiating modular structure of semiconductor package part according to claim 1, it is characterized in that: this external electronic and a plurality of semiconductor package part electrically connect, first heat sink of the semiconductor chip of this semiconductor package part tool different size and setting up standard respectively combines with second heat sink by this first heat sink for this semiconductor package part respectively.
10, a kind of radiating modular structure of semiconductor package part is characterized in that, this structure comprises:
One external electronic;
At least one semiconductor package part, this semiconductor package part includes chip bearing member, be arranged at the semiconductor chip on this chip bearing member and be arranged at first heat sink on this semiconductor chip, and this semiconductor package part is to be electrically connected to this external electronic by its chip bearing member; And
At least one second heat sink is mounted on first heat sink of this semiconductor package part, and wherein the size of this second heat sink is greater than the size of this first heat sink.
11, the radiating modular structure of semiconductor package part according to claim 10 is characterized in that: this external electronic is a display floater.
12, the radiating modular structure of semiconductor package part according to claim 10 is characterized in that: this chip bearing member is provided with a plurality of weld pads and is arranged on this chip bearing member with flip chip for this semiconductor chip.
13, the radiating modular structure of semiconductor package part according to claim 10 is characterized in that: this semiconductor package part is wherein one of winding carrying packaging part or a flip-chip thin film semiconductor packaging part.
14, the radiating modular structure of semiconductor package part according to claim 10 is characterized in that: this chip bearing member is wherein one of soft board or a film.
15, the radiating modular structure of semiconductor package part according to claim 10 is characterized in that: this second heat sink select with one to one or one-to-many manner be arranged on first heat sink of this semiconductor package part.
16, the radiating modular structure of semiconductor package part according to claim 10 is characterized in that: this first heat sink and second heat sink have first and second relative joint portion.
17, the radiating modular structure of semiconductor package part according to claim 16 is characterized in that: first and second joint portion of this first and second heat sink is relative concavo-convex embedded structure.
18, the radiating modular structure of semiconductor package part according to claim 10, it is characterized in that: this external electronic and a plurality of semiconductor package part electrically connect, first heat sink of the semiconductor chip of this semiconductor package part tool different size and setting up standard respectively combines with second heat sink by this first heat sink for this semiconductor package part respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100805522A CN101515550A (en) | 2008-02-22 | 2008-02-22 | Radiating modular structure of semiconductor package and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100805522A CN101515550A (en) | 2008-02-22 | 2008-02-22 | Radiating modular structure of semiconductor package and manufacturing method thereof |
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| CN101515550A true CN101515550A (en) | 2009-08-26 |
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| CNA2008100805522A Pending CN101515550A (en) | 2008-02-22 | 2008-02-22 | Radiating modular structure of semiconductor package and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898587A (en) * | 2015-12-17 | 2017-06-27 | 颀邦科技股份有限公司 | Heat dissipation packaging structure |
| CN110060712A (en) * | 2018-01-19 | 2019-07-26 | 创意电子股份有限公司 | Solid state storage device |
| CN112447635A (en) * | 2019-09-02 | 2021-03-05 | 矽品精密工业股份有限公司 | Electronic package |
-
2008
- 2008-02-22 CN CNA2008100805522A patent/CN101515550A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898587A (en) * | 2015-12-17 | 2017-06-27 | 颀邦科技股份有限公司 | Heat dissipation packaging structure |
| CN110060712A (en) * | 2018-01-19 | 2019-07-26 | 创意电子股份有限公司 | Solid state storage device |
| US11201100B2 (en) | 2018-01-19 | 2021-12-14 | Global Unichip Corporation | Solid-state storage device |
| CN112447635A (en) * | 2019-09-02 | 2021-03-05 | 矽品精密工业股份有限公司 | Electronic package |
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Open date: 20090826 |