CN215819213U - High heat conduction shielding structure - Google Patents
High heat conduction shielding structure Download PDFInfo
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- CN215819213U CN215819213U CN202121882710.3U CN202121882710U CN215819213U CN 215819213 U CN215819213 U CN 215819213U CN 202121882710 U CN202121882710 U CN 202121882710U CN 215819213 U CN215819213 U CN 215819213U
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Abstract
The utility model discloses a high-heat-conduction shielding structure which comprises a plurality of heat conduction layers and a plurality of shielding layers; the heat conduction layers and the shielding layers are alternately arranged, and the heat conduction layers are arranged on the upper side and the lower side of the shielding layers; a plurality of through holes are formed in the thickness direction of the shielding layer; through the mode, the heat conduction layers respectively arranged on the two sides of the shielding layer can be contacted in the Z direction through the through holes which are arranged in a staggered mode, so that the thermal resistance in the Z direction is greatly reduced, and heat can be quickly conducted in the Z direction. When the filling of a narrow space is carried out, the heat generated by the chip at the bottom and the heat converted by shielding can be quickly conducted to the upper layer; and this utility model's structure can contain absorbing layer and shielding layer simultaneously, and the shielding layer can reflect electromagnetic noise, and probably remaining few part noises are absorbed when passing absorbing layer, and this kind of combination setting can more high-efficient shielding magnetic noise.
Description
Technical Field
The utility model relates to the technical field of high-heat-conductivity shielding, in particular to a high-heat-conductivity shielding structure.
Background
Along with the more powerful integrated processing function of the chip, the accompanying electromagnetic shielding and heat dissipation efficiency is higher, at present, the heat conduction and wave absorption material is in a metal mesh or metal film and heat conduction material composite mode in CN112519347A, or the heat conduction material and the wave absorption material are stacked and compounded at intervals in CN208874751U, so that the functions of heat conduction and wave absorption are achieved, or the magnetic conduction powder and the heat conduction powder are mixed and then formed into a film in CN 105462135A.
If the material with the metal net structure is used, electromagnetic waves can penetrate through the net holes, the metal film can reflect the electromagnetic waves, and if the metal film is not grounded, the reflected electromagnetic waves still cause interference; if the heat conduction material and the wave-absorbing material are stacked and attached for use, although electromagnetic interference can be absorbed and converted into heat energy, in practical application, the heat conduction layer of the material is attached to the surface of the chip and can rapidly conduct heat in the XY direction, but the heat resistance in the Z direction is blocked by the wave-absorbing material, so that the heat resistance is high, and the heat dissipation effect is poor in an application scene with a small chip area; if the magnetic conductive powder and the heat conductive powder are mixed to form a film, the poor heat conduction effect of the magnetic conductive powder is limited, and if the magnetic conductive effect is good, the addition content of the heat conductive powder is low, and the heat conduction effect is poor.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the problems that the existing heat conducting and shielding structure can form interference, can not carry out heat dissipation in all directions, has poor heat dissipation effect and mutually reverse influences of magnetic conduction and heat conduction.
In order to solve the above problems, the present invention adopts a technical solution that: provided is a high thermal conductive shielding structure, including: a plurality of heat conducting layers and a plurality of shielding layers; the heat conduction layers and the shielding layers are alternately arranged, and the heat conduction layers are arranged on the upper side and the lower side of the shielding layers; and a plurality of through holes are formed in the thickness direction of the shielding layer.
Furthermore, a plurality of through holes penetrate through the shielding layer, and the through holes adjacent to the shielding layer are arranged in a staggered mode.
Furthermore, the shielding layers comprise metal shielding layers and/or magnetic conduction wave absorption layers;
when the metal shielding layer and the magnetic conduction wave absorption layer are arranged in the plurality of shielding layers, the metal shielding layer and the magnetic conduction wave absorption layer can be arranged at intervals.
Further, the heat conduction layer and the shielding layer are connected through hot rolling or an anisotropic conductive adhesive layer.
Further, the upper surface and the lower surface of the heat conduction layer are provided with treatment layers.
Further, the treatment layer is formed by coating a silica gel treatment agent, or by plasma corona treatment.
Further, the heat conduction layer comprises one of a graphene layer, a graphene metal composite layer and a silica gel heat conduction layer.
Furthermore, the area of the through holes on the shielding layer is 10-50% of the area of the shielding layer.
Further, the metal shielding layer comprises one of a copper foil shielding layer, an aluminum foil shielding layer and a copper mesh shielding layer.
Further, the magnetic conduction wave absorbing layer comprises one of a ferrite hard sheet wave absorbing layer and a soft magnetic alloy flexible wave absorbing layer.
The utility model has the beneficial effects that:
according to the high-heat-conductivity shielding structure, the heat conduction layers respectively arranged on the two sides of the shielding layer can be contacted in the Z direction through the through holes which are arranged in a staggered mode, so that the heat resistance in the Z direction is greatly reduced, and heat can be quickly conducted in the Z direction. When the filling of a narrow space is carried out, the heat generated by the chip at the bottom and the heat converted by shielding can be quickly conducted to the upper layer; and this utility model's structure can contain absorbing layer and shielding layer simultaneously, and the shielding layer can reflect electromagnetic noise, and probably remaining few part noises are absorbed when passing absorbing layer, and this kind of combination setting can more high-efficient shielding magnetic noise.
Drawings
Fig. 1 is a structural diagram of a high thermal conductivity shielding structure in an embodiment of the present invention.
The parts in the drawings are numbered as follows:
10. a first thermally conductive layer; 11. a second thermally conductive layer; 12. a third heat conducting layer; 20. a first double-sided adhesive layer; 21. a second double-sided adhesive layer; 22. a third double-sided adhesive layer; 23. a fourth double-sided adhesive layer; 30. a first shielding layer; 31. a first through hole; 40. a second shielding layer; 41. a second via.
Detailed Description
In order that the utility model may be more readily understood, a more complete description of the utility model now follows, with reference to the accompanying drawings, in which preferred embodiments of the utility model are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present disclosure is set forth herein for the purpose of providing a thorough understanding thereof.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise explicitly specified or limited, a first feature may be directly contacting a second feature at the "upper end" or "middle" of the second feature, or the first and second features may be indirectly contacting each other through an intermediate. Also, a first feature "on" or "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature.
It will be understood that when an element is referred to as being "mounted on" or "provided on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "corresponding," "upper," "lower," "front," "back," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of the feature.
It should be noted that, in the description of the present invention using the new model,
shore is a standard of hardness of a material and shore00 is a hardness of the standard.
Example 1
The present embodiment provides a high thermal conductivity shielding structure, as shown in fig. 1, including a first thermal conductive layer 10, a second thermal conductive layer 11, a third thermal conductive layer 12, a first shielding layer 30, and a second shielding layer 40.
In this high heat conduction shielding structure, the number of layers of shielding layer is 2N, and the number of layers of the heat-conducting layer that so corresponds is 2N +1, and N is the natural number, and the heat-conducting layer sets up the upper and lower both sides of shielding layer all the time, as shown in fig. 1, first heat-conducting layer 10, second heat-conducting layer 11, third heat-conducting layer 12 and first shielding layer 30, second shielding layer 40 set up in turn, as shown in fig. 1, first shielding layer 30 is located between first heat-conducting layer 10 and second heat-conducting layer 11, and second shielding layer 40 is located between second heat-conducting layer 11 and third heat-conducting layer 12.
The shielding layer includes metal class shielding layer and or magnetic conduction and inhale the ripples layer, metal class shielding layer can be copper foil shielding layer, aluminium foil shielding layer, in the copper mesh shielding layer, magnetic conduction and inhale ripples layer and include ferrite hard piece and inhale ripples layer, one in the soft magnetic alloy flexible ripples layer, but metal class shielding layer and magnetic conduction and inhale the ripples layer interval setting, promptly in this embodiment, first shielding layer 30 and second shielding layer 40 can all be metal class shielding layer, also can all be magnetic conduction and inhale the ripples layer, perhaps first shielding layer 30 is metal class shielding layer, second shielding layer 40 is the magnetic conduction and inhale the ripples layer, or first shielding layer 30 is the magnetic conduction and inhale the ripples layer again, the second shielding layer is metal class shielding layer.
The heat conduction layer can be one of a graphene layer, a graphene metal composite layer, a silica gel heat conduction layer and a silica gel heat conduction layer containing glass fibers, or other high-efficiency heat dissipation layers, in the embodiment, the first heat conduction layer 10, the second heat conduction layer 11 and the third heat conduction layer 12 are made of silica gel filled high-heat-conductivity powder materials, and the materials have the heat conduction coefficient of 5.0 w/m.k, the thickness of 0.1mm and the hardness of shore 0060; it should be noted that the selection of the material of the heat conductive layer is only used for illustrating the present invention, and the protection scope of the present invention is not limited thereby.
The heat conduction layer and the shielding layer are connected in a hot rolling manner or by using an anisotropic conductive adhesive layer, so as to enhance the bonding force between the heat conduction layer and the shielding layer, in this embodiment, the heat conduction layer and the shielding layer are connected by a double-sided adhesive layer, as shown in fig. 1, a first double-sided adhesive layer 20 is disposed at a contact surface of the first heat conduction layer 10 and the first shielding layer 30, a second double-sided adhesive layer 21 is disposed at a contact surface of the first shielding layer 30 and the second heat conduction layer 11, a third double-sided adhesive layer 22 is disposed at a contact surface of the second heat conduction layer 11 and the second shielding layer 40, and a fourth double-sided adhesive layer 23 is disposed at a contact surface of the second shielding layer 40 and the third heat conduction layer 12.
In order to ensure that the heat conduction layer and the shielding layer do not fall off, a treatment layer is arranged on one side of the heat conduction layer connected with the opposite conductive adhesive layer, and the treatment layer can be a silica gel surface treatment agent or plasma corona treatment.
In order to ensure that the shielding layer and the heat conducting layer can be contacted in the Z direction and reduce the thermal resistance in the Z direction, the heat can be quickly conducted in the Z direction, a plurality of through holes are formed in the shielding layer, and meanwhile, in order to prevent electromagnetic noise from leaking through the through holes, the through holes in the adjacent shielding layers need to be arranged in a staggered mode.
In the present embodiment, the first shielding layer 30 has a plurality of first through holes 31, and the second shielding layer 40 has a plurality of second through holes 41.
The plurality of first through holes 31 and the plurality of second through holes 41 are regularly distributed on the first shielding layer 30 and the second shielding layer 40 respectively, and the first through holes 31 and the second through holes 41 are arranged in a staggered manner; the diameters of the surfaces of the first through holes 31 and the second through holes 41 are 0.1-1 mm, and the distances between the first through holes 31 and the distances between the second through holes 41 are 10-50 mm.
The novel high-heat-conduction shielding structure can be well contacted with the heat conduction layer in the Z direction, so that lower thermal resistance in the Z direction can be obtained, and meanwhile, the through holes of the adjacent shielding layers are staggered, so that external magnetic noise can be effectively shielded; through the alternative stack setting of heat-conducting layer and magnetic conduction layer, holistic heat conductivility and magnetic conduction performance of increase that can further be fit for near using at the integrated chip very much, can effectually prevent near the integrated chip to have a large amount of thermal accumulations and have the interference of magnetic noise.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the specification and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. A high thermal conductivity shielding structure, comprising: a plurality of heat conducting layers and a plurality of shielding layers; the heat conduction layers and the shielding layers are alternately arranged, and the heat conduction layers are arranged on the upper side and the lower side of the shielding layers; and a plurality of through holes are formed in the thickness direction of the shielding layer.
2. The high thermal conductivity shielding structure according to claim 1, wherein:
the through holes penetrate through the shielding layer, and the through holes adjacent to the shielding layer are arranged in a staggered mode.
3. A high thermal conductivity shielding structure according to claim 2, wherein:
the shielding layers comprise metal shielding layers and/or magnetic conduction wave absorption layers;
when the metal shielding layer and the magnetic conduction wave absorption layer are arranged in the plurality of shielding layers, the metal shielding layer and the magnetic conduction wave absorption layer can be arranged at intervals.
4. A high thermal conductivity shielding structure according to claim 2, wherein:
the heat conduction layer and the shielding layer are connected through hot rolling or an anisotropic conductive adhesive layer.
5. The high thermal conductivity shielding structure according to claim 4, wherein:
the upper surface and the lower surface of the heat conduction layer are both provided with treatment layers.
6. The high thermal conductivity shielding structure according to claim 5, wherein:
the treatment layer is formed by coating a silica gel treatment agent or by plasma corona treatment.
7. A high thermal conductivity shielding structure according to claim 2, wherein:
the heat conduction layer comprises one of a graphene layer, a graphene metal composite layer and a silica gel heat conduction layer.
8. A high thermal conductivity shielding structure according to claim 2, wherein:
the area of the through holes on the shielding layer is 10-50% of the area of the shielding layer.
9. A high thermal conductivity shielding structure according to claim 3, wherein:
the metal shielding layer comprises one of a copper foil shielding layer, an aluminum foil shielding layer and a copper mesh shielding layer.
10. A high thermal conductivity shielding structure according to claim 3, wherein:
the magnetic conduction wave absorbing layer comprises one of a ferrite hard sheet wave absorbing layer and a soft magnetic alloy flexible wave absorbing layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121882710.3U CN215819213U (en) | 2021-08-12 | 2021-08-12 | High heat conduction shielding structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121882710.3U CN215819213U (en) | 2021-08-12 | 2021-08-12 | High heat conduction shielding structure |
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| CN215819213U true CN215819213U (en) | 2022-02-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024190345A1 (en) * | 2023-03-15 | 2024-09-19 | 株式会社小糸製作所 | Measurement device, method for manufacturing measurement device, structure, method for manufacturing structure, and fastening structure |
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2021
- 2021-08-12 CN CN202121882710.3U patent/CN215819213U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024190345A1 (en) * | 2023-03-15 | 2024-09-19 | 株式会社小糸製作所 | Measurement device, method for manufacturing measurement device, structure, method for manufacturing structure, and fastening structure |
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