CN215819206U

CN215819206U - Heat radiator

Info

Publication number: CN215819206U
Application number: CN202121845672.4U
Authority: CN
Inventors: 殷玉婷; 张尧; 秦富娟; 魏磊; 肖淑黔; 钱丽云
Original assignee: Jiangsu Leizidun Material Technology Co ltd
Current assignee: Jiangsu Leizidun Material Technology Co ltd
Priority date: 2021-08-09
Filing date: 2021-08-09
Publication date: 2022-02-11
Anticipated expiration: 2031-08-09

Abstract

The utility model discloses a radiator which comprises a PCB, wherein heating chips are arranged on the top of the PCB, a shielding cover is sleeved outside the heating chips, pits are formed in the surface of the shielding cover, and a second heat conducting pad is arranged above the pits. This kind of radiator, the clearance of shield cover and chip can be reduced through the pit on the shield cover, can use thinner heat conduction pad to reduce the thermal resistance, simultaneously can effectual reinforcing heat transfer, when reducing the clearance through the pit structure on the shield cover, can hold high device on every side, according to chip high design through the pit degree of depth on the shield cover, can compatible not co-altitude chip, the punching press board is according to the pit degree of depth design of shield cover, can reduce the clearance between punching press board and the shield cover, can use thinner heat conduction pad, reduce the thermal resistance, the reinforcing heat transfer, can make the heat of punching press board pit bottom transmit the aluminium fast and crowd, thereby realize quick heat transfer.

Description

Heat radiator

Technical Field

The utility model relates to the technical field of radiators for the electronic information industry, in particular to a radiator.

Background

In the electronic information trade, need use the PCB board to control the product, along with the miniaturization of product, the chip on the PCB board is also more and more miniaturized, and the consequence is the density that generates heat and increases along with it, and the overheated problem that has become the urgent need of solving in this type of product of PCB board, and current heat dissipation scheme is to paste heat conduction pad, aluminium crowded on the shielding piece, through the crowded radiating fin of aluminium and air convection, outside transmission heat, for the PCB board cooling.

The existing heat dissipation scheme causes a gap between the chip and the shielding piece, heat transfer failure can be caused, the heat conducting pad is pasted between the chip and the shielding piece, the thermal resistance can be reduced, but the gap of some designs is larger, even if the heat conducting pad is pasted, the thermal resistance is still larger, the chip height is inconsistent, the heat conducting pad with different thicknesses needs to be pasted above the chip to artificially create a plane, so that the heat radiator is suitable for aluminum extrusion, if the chip height is greatly different, the needed heat conducting pad is thicker, the thermal resistance can be increased, and heat transfer is not facilitated.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a radiator to solve the problems that the existing radiating scheme proposed in the background art causes a gap between a chip and a shielding part to cause poor heat transfer, a heat conducting pad is pasted between the chip and the shielding part to reduce the thermal resistance, but the gap of some designs is larger, even if the heat conducting pad is pasted, the thermal resistance is still larger, the chip heights are inconsistent, so that heat conducting pads with different thicknesses need to be pasted above to artificially create a plane to adapt to an aluminum extruded radiator, and if the chip heights are different greatly, the thicker the heat conducting pad is needed, the thermal resistance is increased, and the heat transfer is not facilitated.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a radiator, includes the PCB board, the top of PCB board is arranged and is provided with the chip that generates heat, the outside cover of the chip that generates heat is equipped with the shield cover, the surface of shield cover is provided with the pit, the top of pit is provided with the second heat conduction pad, the top of second heat conduction pad is provided with the punching press board, the top of punching press board is provided with the crowded radiator of aluminium.

Preferably, a separation cavity is arranged on the surface of the aluminum extruded radiator and is distributed along the surface of the aluminum extruded radiator.

Preferably, the surface of the stamping plate is provided with clamping openings, and the clamping openings are arranged along the surface of the stamping plate and correspond to the heating chips.

Preferably, the welding surface of the stamping plate and the aluminum extruded radiator is provided with through holes in a surrounding manner.

Preferably, the surface of the heating chip is provided with a first heat conduction pad, and the first heat conduction pad and the second heat conduction pad are tightly attached to the concave pit.

Compared with the prior art, the utility model has the beneficial effects that:

this kind of radiator, can reduce the clearance of shield cover and chip through the pit on the shield cover, can use thinner heat conduction pad to reduce the thermal resistance, simultaneously can effectual reinforcing heat transfer, when reducing the clearance through the pit structure on the shield cover, can hold high device in every side, design according to chip height through the pit degree of depth on the shield cover, can compatible not co-altitude chip, the ram plate is according to the pit degree of depth design of shield cover, can reduce the clearance between ram plate and the shield cover, can use thinner heat conduction pad, reduce the thermal resistance, the reinforcing heat transfer, the cavity between ram plate and the crowded radiator of aluminium is filled water, simultaneously the evacuation, and cut off between the cavity, can make the heat of ram plate pit bottom transmit to the crowded aluminium fast, thereby realize quick heat transfer.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a side view of the present invention;

fig. 4 is a cross-sectional view of the present invention.

In the figure: 1. separating the cavities; 2. an aluminum extruded heat sink; 3. stamping the plate; 4. a second thermally conductive pad; 5. a pit; 6. a shield case; 7. a heat generating chip; 8. a PCB board; 9. clamping the opening; 10. a first thermal pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a radiator comprises a PCB (printed circuit board) 8, wherein heating chips 7 are arranged at the top of the PCB 8, a shielding cover 6 is sleeved outside the heating chips 7, a pit 5 is arranged on the surface of the shielding cover 6, the gap between the shielding cover 6 and the heating chips 7 is reduced, a thinner heat conducting pad can be used, the thermal resistance is reduced, the heat transfer is enhanced, a second heat conducting pad 4 is arranged above the pit 5, a stamping plate 3 is arranged above the second heat conducting pad 4, an aluminum extruded radiator 2 is arranged at the top of the stamping plate 3, a separation cavity 1 is arranged on the surface of the aluminum extruded radiator 2, the separation cavity 1 is arranged along the surface of the aluminum extruded radiator 2, the radiating range can be effectively improved, the integral performance of the radiating is greatly improved, a clamping opening 9 is arranged on the surface of the stamping plate 3, the clamping opening 9 is arranged along the surface of the stamping plate 3 and corresponds to the heating chips 7, through holes are arranged around the welding surfaces of the stamping plate 3 and the aluminum extruded radiator 2, can make things convenient for the later stage to take out into vacuum state with the radiator is inside, and the surface of the chip 7 that generates heat is provided with first heat conduction pad 10, and first heat conduction pad 10 and second heat conduction pad 4 all closely laminate each other with pit 5, can effectually be used for absorbing the machining tolerance of the chip 7 that generates heat and shield 6.

The working principle is as follows: when the radiator is used for heat dissipation, all parts can be spliced and combined together in real time, then real-time welding and limiting fixing are carried out, the radiator is integrally installed at a corresponding equipment position through bolts and punching holes, a plurality of heating chips 7 are arranged on a PCB 8, a first heat conducting pad 10 is pasted on the heating chips 7 and used for absorbing the processing tolerance of the heating chips 7 and a shielding cover 6, a pit 5 is punched on the shielding cover 6 and is tightly pasted with the heat conducting pad, a second heat conducting pad 4 is pasted above the shielding cover 6 and the pit 5 and used for absorbing the processing tolerance of the shielding cover 6 and a punching plate 3, the punching plate 3 and an aluminum extruded radiator 2 are welded for a circle at the periphery, a small opening is reserved for vacuumizing, then the small opening is sealed, all cavities are separated through welding, so that the phenomenon that after the radiator works, the water distribution among the cavities is uneven, and part of the cavities fails, thus, high-efficiency phase change heat transfer can be formed, and the heat transfer efficiency is enhanced.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat sink comprising a PCB board (8), characterized in that: the PCB is characterized in that heating chips (7) are arranged at the top of the PCB (8), a shielding cover (6) is sleeved on the outer side of each heating chip (7), pits (5) are formed in the surface of the shielding cover (6), second heat conducting pads (4) are arranged above the pits (5), stamping plates (3) are arranged above the second heat conducting pads (4), and aluminum extruded radiators (2) are arranged at the tops of the stamping plates (3).

2. A heat sink according to claim 1, wherein: the surface of the aluminum extruded radiator (2) is provided with a separation cavity (1), and the separation cavity (1) is distributed along the surface of the aluminum extruded radiator (2).

3. A heat sink according to claim 1, wherein: clamping openings (9) are formed in the surface of the stamping plate (3), and the clamping openings (9) are distributed along the surface of the stamping plate (3) and correspond to the heating chips (7).

4. A heat sink according to claim 1, wherein: and through holes are formed on the welding surfaces of the stamping plate (3) and the aluminum extruded radiator (2) in a surrounding manner.

5. A heat sink according to claim 1, wherein: the surface of the heating chip (7) is provided with a first heat-conducting pad (10), and the first heat-conducting pad (10) and the second heat-conducting pad (4) are tightly attached to the concave pits (5).