CN213028674U

CN213028674U - Novel ceramic circuit board

Info

Publication number: CN213028674U
Application number: CN202021757006.0U
Authority: CN
Inventors: 陈伦华; 毛军; 陈淑娟
Original assignee: Dongguan Huatuo Electronic Co ltd
Current assignee: Dongguan Huatuo Electronic Co ltd
Priority date: 2020-08-20
Filing date: 2020-08-20
Publication date: 2021-04-20
Anticipated expiration: 2030-08-20

Abstract

The utility model discloses a novel ceramic circuit board, including the ceramic plate, ceramic plate bottom laminating copper foil layer top, copper foil layer bottom laminating protective layer top, T type groove has been seted up at the ceramic plate top, T type inslot is provided with T type fin, T type fin top fixed connection connecting plate bottom, T type fin is close to connecting plate bottom fixed connection heat dissipation shell top, heat dissipation shell left side bottom fixed connection fixed strip right side, fixed strip bottom fixed connection sealing strip top, the mounting groove has been seted up to the ceramic plate corresponding sealing strip. This novel ceramic circuit board, through the T type fin that sets up, can be when carrying out heat conduction with the heat of ceramic plate through the quick leading-in to T type fin of heat dissipation silicone grease and the T type fin cooperation deep into in the ceramic plate on, thereby it dispels the heat to reach the quick through the convection current of T type fin and air to reach the purpose to the high-efficient heat conduction of ceramic plate.

Description

Novel ceramic circuit board

Technical Field

The utility model relates to a ceramic circuit board technical field specifically is a novel ceramic circuit board.

Background

With the gradual deepening of electronic technology in each application field, the high integration of circuit boards becomes a necessary trend, the high integration packaging module requires a good heat dissipation bearing system, and the disadvantages of the traditional circuit boards FR-4 and CEM-3 in TC (thermal conductivity coefficient) become a bottleneck restricting the development of electronic technology. In recent years, the LED industry has been developed rapidly, and higher requirements are also put on the TC index of the circuit board. In the field of high-power LED illumination, materials with good heat dissipation performance such as metal and ceramic are often adopted to prepare a circuit substrate, the heat conductivity coefficient of the high-heat-conductivity aluminum substrate is generally 1-4W/M.K, and the heat conductivity coefficient of the ceramic substrate can reach about 220W/M.K according to different preparation methods and material formulas.

The ceramic plate needs to be further matched with a radiating fin to further conduct out the heat of the ceramic plate when the heat is conducted effectively, but the existing ceramic plate only needs to be provided with the radiating fin on one surface for heat conduction, and the purpose of heat conduction cannot be efficiently achieved, so that improvement is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel ceramic circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel ceramic circuit board, includes the ceramic plate, ceramic plate bottom laminating copper foil layer top, copper foil layer bottom laminating protective layer top, T type groove has been seted up at the ceramic plate top, T type inslot is provided with T type fin, T type fin top fixed connection connecting plate bottom, T type fin is close to connecting plate bottom fixed connection heat dissipation shell top, heat dissipation shell left side bottom fixed connection fixed strip right side, fixed strip bottom fixed connection sealing strip top, the ceramic plate corresponds the sealing strip and has seted up the mounting groove, the ceramic plate passes through the mounting groove clearance fit sealing strip, heat dissipation shell left side is close to the fixed strip top and has seted up the injection hole, the heat dissipation shell passes through injection hole threaded connection thread sealing lid.

Preferably, the front side and the rear side of the inner top of the heat dissipation shell are fixedly connected with the bottom of the mounting bar, the front side of the mounting bar is fixedly connected with the top of the back of the sealing plate, the bottom of the back of the sealing plate is fixedly connected with the front and the back of the ceramic plate, the edge of the back of the sealing plate is coated with a sealant, the length of the sealing plate is equal to that of the heat dissipation shell, and the width of the sealing plate is greater than.

Preferably, the sealing plate is provided with screws near four corners, and the sealing plate is fixedly connected with the ceramic plate and the mounting bar through the screws.

Preferably, the T-shaped groove is communicated with the heat dissipation shell, and the heat dissipation shell and the T-shaped groove are filled with heat dissipation silicone grease.

Preferably, the T-shaped radiating fins are provided with six pieces of T-shaped radiating fins which are distributed at the bottom of the connecting plate and at the top of the ceramic plate at equal intervals, and the distance between the first piece and the sixth piece of T-shaped radiating fins is smaller than the length of the radiating shell.

Preferably, the fixed strip is provided with two bottoms that distribute on heat dissipation shell left side and right side, two the fixed strip front side and rear side all are provided with the countersunk screw, the fixed strip passes through countersunk screw fixed connection ceramic plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this novel ceramic circuit board, through the T type fin that sets up, can be when carrying out heat conduction with the heat of ceramic plate through the quick leading-in to T type fin of heat dissipation silicone grease and the T type fin cooperation deep into in the ceramic plate on, thereby it dispels the heat to reach the quick through the convection current of T type fin and air to reach the purpose to the high-efficient heat conduction of ceramic plate.

2. This novel ceramic circuit board, through the heat dissipation shell that sets up, can effectually distribute most ceramic plate with heat dissipation silicone grease, through the good heat conductivity of heat dissipation silicone grease, dispel the heat in the leading-in T type radiator that the heat of ceramic plate is further quick, this structure is connected through countersunk head screw and screw simultaneously, makes things convenient for demolising and the maintenance in later stage.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the front cross-sectional structure of the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 2;

FIG. 4 is a schematic view of the bottom of the heat dissipating housing and the T-shaped heat dissipating fins;

FIG. 5 is a schematic view of a seal plate back side view taken.

In the figure: 1. a fixing strip; 2. a connecting plate; 3. a T-shaped heat sink; 4. a sealing plate; 5. a ceramic plate; 6. a copper foil layer; 7. a heat dissipation housing; 8. mounting a bar; 9. heat dissipation silicone grease; 10. a T-shaped groove; 11. a thread sealing cover; 12. an injection hole; 13. a sealing strip; 14. sealing glue; 15. countersunk screws; 16. mounting grooves; 17. and a protective layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a novel ceramic circuit board comprises a ceramic plate 5, the bottom of the ceramic plate 5 is attached to the top of a copper foil layer 6, the bottom of the copper foil layer 6 is attached to the top of a protective layer 17, a T-shaped groove 10 is formed in the top of the ceramic plate 5, T-shaped radiating fins 3 are arranged in the T-shaped groove 10, six T-shaped radiating fins 3 are arranged at equal intervals and distributed at the bottom of a connecting plate 2 and the top of the ceramic plate 5, the distance from a first T-shaped radiating fin to a sixth T-shaped radiating fin 3 is smaller than the length of a radiating shell 7, the top of the T-shaped radiating fin 3 is fixedly connected with the bottom of the connecting plate 2, the T-shaped radiating fins 3 are close to the bottom of the connecting plate 2 and fixedly connected with the top of the radiating shell 7, the T-shaped grooves 10 are communicated with the radiating shell 7, radiating silicone grease 9 is filled in the radiating shell 7 and the T-shaped grooves 10, and heat of, the purpose of high-efficiency heat conduction of the ceramic plate 5 is achieved by means of convection of the T-shaped radiating fins 3 and air, the right side of a fixing strip 1 is fixedly connected to the bottom of the left side of a radiating shell 7, the fixing strip 1 is provided with two bottoms distributed on the left side and the right side of the radiating shell 7, countersunk screws 15 are arranged on the front side and the rear side of the two fixing strips 1, the fixing strip 1 is fixedly connected with the ceramic plate 5 through the countersunk screws 15, the top of a sealing strip 13 is fixedly connected to the bottom of the fixing strip 1, a mounting groove 16 is formed in the ceramic plate 5 corresponding to the sealing strip 13, the ceramic plate 5 is in clearance fit with the sealing strip 13 through the mounting groove 16, an injection hole 12 is formed in the left side of the radiating shell 7 close to the top of the fixing strip 1, the radiating shell 7 is in threaded connection with a threaded sealing cover 11 through the, through the arranged heat dissipation shell 7, most of the ceramic plates 5 can be effectively distributed with heat dissipation silicone grease 9, the heat of the ceramic plate 5 is further and rapidly led into the T-shaped radiating fin 3 for radiating through the good heat conductivity of the radiating silicone grease 9, this structure is connected through countersunk head screw 15 and screw simultaneously, make things convenient for demolising and the maintenance in later stage, 8 positive fixed connection closing plate 4 back tops of mounting bar, closing plate 4 can effectually prevent revealing of heat dissipation silicone grease 9, further make and be an inclosed space in the heat dissipation shell 7, 4 back bottom fixed connection ceramic plates of closing plate 5 openly and the back, 4 back edges of closing plate scribble sealed glue 14, 4 length of closing plate equals heat dissipation shell 7 length, 4 width of closing plate is greater than heat dissipation shell 7 width, closing plate 4 is close to the four corners and is provided with the screw, closing plate 4 passes through screw fixed connection ceramic plate 5 and mounting bar 8.

When using, through T type fin 3, can cooperate quick leading-in to T type fin 3 with the heat of ceramic plate 5 through heat dissipation silicone grease 9 and the T type fin 3 who gos deep into in the ceramic plate 5 when carrying out heat conduction, thereby the convection current through T type fin 3 and air reaches quick heat dissipation, thereby reach the purpose to the high-efficient heat conduction of ceramic plate 5, simultaneously through heat dissipation shell 7, can effectually distribute most ceramic plate 5 with heat dissipation silicone grease 9, through the good heat conductivity of heat dissipation silicone grease 9, dispel the heat in the leading-in T type fin 3 that the heat of ceramic plate 5 is further quick.

To sum up, this novel ceramic circuit board is through the T type fin 3 that sets up, can be when carrying out heat conduction with the heat of ceramic plate 5 through heat dissipation silicone grease 9 with deepen on the quick leading-in T type fin 3 of the T type fin 3 cooperation in the ceramic plate 5, thereby it dispels the heat to reach the quick convection current through T type fin 3 and air, thereby reach the purpose to the high-efficient heat conduction of ceramic plate 5, through the heat dissipation shell 7 that sets up, can effectually distribute most ceramic plate 5 with heat dissipation silicone grease 9, through the good heat conductivity of heat dissipation silicone grease 9, dispel the heat in the leading-in T type fin 3 that the heat of ceramic plate 5 is further quick, this structure is connected through countersunk screw 15 and screw simultaneously, make things convenient for demolising and maintaining in later stage.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A novel ceramic circuit board, includes ceramic plate (5), its characterized in that: the ceramic plate (5) bottom laminating copper foil layer (6) top, copper foil layer (6) bottom laminating protective layer (17) top, T type groove (10) have been seted up at ceramic plate (5) top, be provided with T type fin (3) in T type groove (10), T type fin (3) top fixed connection connecting plate (2) bottom, T type fin (3) are close to connecting plate (2) bottom fixed connection radiating shell (7) top, radiating shell (7) left side bottom fixed connection fixed strip (1) right side, fixed strip (1) bottom fixed connection sealing strip (13) top, ceramic plate (5) have seted up mounting groove (16) corresponding sealing strip (13), ceramic plate (5) are through mounting groove (16) clearance fit sealing strip (13), radiating shell (7) left side is close to fixed strip (1) top and has seted up injection hole (12), the heat dissipation shell (7) is in threaded connection with the threaded sealing cover (11) through the injection hole (12).

2. The novel ceramic circuit board of claim 1, wherein: the utility model discloses a heat dissipation shell, including heat dissipation shell (7), mounting bar (8) front fixed connection sealing plate (4) back top, sealing plate (4) back bottom fixed connection ceramic plate (5) are positive and the back, sealing plate (4) back edge scribbles sealed glue (14), sealing plate (4) length equals heat dissipation shell (7) length, sealing plate (4) width is greater than heat dissipation shell (7) width.

3. The novel ceramic circuit board of claim 2, wherein: the sealing plate (4) is provided with screws near four corners, and the sealing plate (4) is fixedly connected with the ceramic plate (5) and the mounting bar (8) through the screws.

4. The novel ceramic circuit board of claim 1, wherein: the T-shaped groove (10) is communicated with the heat dissipation shell (7), and the heat dissipation shell (7) and the T-shaped groove (10) are filled with heat dissipation silicone grease (9).

5. The novel ceramic circuit board of claim 1, wherein: the T-shaped radiating fins (3) are provided with six pieces of radiating fins which are distributed at the bottom of the connecting plate (2) and the top of the ceramic plate (5) at equal intervals, and the distance from the first piece to the sixth piece of T-shaped radiating fins (3) is smaller than the length of the radiating shell (7).

6. The novel ceramic circuit board of claim 1, wherein: fixed strip (1) is provided with two and distributes in the bottom on heat dissipation shell (7) left side and right side, two fixed strip (1) front side and rear side all are provided with countersunk screw (15), fixed strip (1) is through countersunk screw (15) fixed connection ceramic plate (5).