CN218587147U - Junction box and photovoltaic module - Google Patents

Abstract

The utility model provides a terminal box and photovoltaic module, wherein, the terminal box includes the box body, locates metal substrate in the box body, locate the diode of metal substrate top, press from both sides and locate heat conduction structure between metal substrate and the diode. Through the structure of the junction box, on one hand, the heat conducting structure conducts the heat of the diode to the metal substrate quickly, and the heat is dissipated quickly through the metal substrate, so that the heat dissipation efficiency of the junction box is improved, the junction box is in a safe temperature range, and the safety performance of the junction box is ensured.

Description

Junction box and photovoltaic module

Technical Field

The utility model relates to a photovoltaic technology field especially relates to a terminal box and photovoltaic module.

Background

The junction box is an important part of a photovoltaic module, the conventional diode comprises a box body, a copper sheet arranged in the box body and a diode connected with the copper sheet in a welding mode, wherein the diode and the copper sheet are welded in a tin soldering mode, after a tin paste is melted, X-R inspection shows that more than 30% of cavities exist in the tin paste, when the diode works, air in the cavities is heated and expanded, and the cavity area cannot conduct heat effectively. Particularly, the size of the photovoltaic module is getting larger, the current output by the photovoltaic module is correspondingly increased, and the heat dissipation requirement on the junction box is also getting higher, so that the junction box with the conventional structure cannot meet the use requirement of the large-size photovoltaic module at present.

In view of the above, there is a need for a new junction box and photovoltaic module to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a terminal box and photovoltaic module solve above-mentioned problem.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a junction box, the junction box includes the box body, locates metal substrate in the box body, locate the diode of metal substrate top, wherein, the junction box is still including pressing from both sides the heat conduction structure of locating between metal substrate and the diode.

Furthermore, the heat conducting structure is in a sheet shape, the upper side and the lower side of the heat conducting structure are respectively bonded to the diode and the metal substrate, and the heat conducting structure comprises a bonding layer and a heat conductor arranged in the bonding layer.

Further, the heat conductor is heat conducting particles dispersed in the bonding layer or metal sheets embedded in the bonding layer.

Further, the size of the heat conducting structure along the width direction of the metal substrate is not less than one half of the width size of the metal substrate, and the size of the heat conducting structure along the length direction of the metal substrate is not less than the corresponding size of the diode.

Furthermore, the metal substrate is provided with an accommodating groove for accommodating the heat conducting structure and a fixing groove communicated with the accommodating groove, the depth of the accommodating groove is greater than that of the fixing groove, the diode comprises a main body positioned above the heat conducting structure and a fixing part connected to the side part of the main body and positioned above the fixing groove, and the fixing part is welded with the metal substrate.

Furthermore, the metal substrate is provided with an accommodating groove for accommodating the heat conducting structure, the junction box comprises a base located at the bottom of the metal substrate, and an avoiding groove which is concave towards the direction away from the metal substrate is arranged at the position, corresponding to the accommodating groove, of one side of the base adjacent to the metal substrate.

Furthermore, the junction box further comprises a heat dissipation block, and the heat dissipation block and the metal substrate are respectively arranged on two sides of the base.

Furthermore, one side of the base, which is far away from the metal substrate, is provided with a mounting groove which is sunken towards the direction of the metal substrate, the radiating block is arranged in the mounting groove, and the radiating block and the base are flush.

Furthermore, the radiating block and the diode are arranged in a vertically corresponding mode, and the projection area of the radiating block on the base is larger than that of the diode on the base.

The utility model also provides a photovoltaic module, photovoltaic module includes the lamination piece, locates the foretell terminal box at the lamination piece back.

Compared with the prior art, the utility model discloses a terminal box's beneficial effect lies in: the utility model discloses a terminal box presss from both sides between metal substrate and diode and is equipped with heat conduction structure for heat conduction structure can be with the heat quick conduction to the metal substrate of diode, dispels the heat fast through the metal substrate, and then promotes the radiating efficiency of terminal box.

Drawings

Fig. 1 is a schematic perspective view of a junction box according to an embodiment of the junction box of the present invention.

Fig. 2 is a schematic perspective view of another angle junction box in the embodiment of fig. 1.

Fig. 3 is an exploded view of the components of the junction box of the embodiment of fig. 1.

Fig. 4 is a schematic structural diagram of an embodiment of the heat conducting structure in fig. 1.

Fig. 5 is a schematic structural diagram of another embodiment of the heat conducting structure in fig. 1.

Fig. 6 is a schematic front view of the junction box in fig. 1.

Fig. 7 isbase:Sub>A schematic sectional view of the junction box of fig. 6 along the directionbase:Sub>A-base:Sub>A.

Fig. 8 is an enlarged view of a portion of a structure shown in fig. 7.

Fig. 9 is an exploded view of the components of fig. 7.

Fig. 10 is a schematic structural diagram of a photovoltaic module according to an embodiment of the present invention.

The LED module comprises a junction box 1, a box body 10, a containing cavity 11, a side wall 12, a base 13, an avoidance groove 131, a mounting groove 132, a metal substrate 20, a containing groove 21, a fixing groove 22, a lead hole 23, a diode 30, a main body 31, a fixing part 32, a heat conducting structure 40, an adhesive layer 41, a heat conductor 42, a welding layer 50, a heat dissipation block 60 and a laminated part 2.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It should be noted that the directions or positional relationships indicated in the present invention are based on the directions or positional relationships shown in the auxiliary drawings, and are only for the convenience of simplifying the description of the present invention, and the indication or suggestion that the indicated device must have a specific direction, be constructed in a specific direction and be operated is not understood as the limitation of the scope of the present invention.

In the various drawings of the present invention, certain dimensions of structures or portions may be exaggerated relative to other structural portions for ease of illustration and, thus, are provided only to illustrate the basic structure of the subject matter of the present invention.

The utility model provides a terminal box 1 establishes diode 30's terminal box 1 in being particularly useful for, as shown in fig. 1 to fig. 9, terminal box 1 includes box body 10, locates metal substrate 20 in the box body 10, locate the diode 30 of metal substrate 20 top, terminal box 1 still includes to press from both sides and locates heat conduction structure 40 between metal substrate 20 and the diode 30, the utility model discloses a heat conduction structure 40 of terminal box 1 can give metal substrate 20 with diode 30 heat fast transfer to realize promoting the radiating efficiency's of terminal box mesh, make the terminal box be in safe temperature range, ensure the security performance of terminal box.

The box body 10 comprises a base 13 and a side wall 12 arranged around the base 13, the base 13 and the side wall 12 form an accommodating cavity 11, and the metal substrate 20 is arranged in the accommodating cavity 11 and positioned on the upper part of the base 13.

The metal substrates 20 are provided with two metal substrates 20, the two metal substrates 20 are arranged at intervals, as shown in fig. 3, each metal substrate 20 is provided with a lead hole 23 corresponding to the base 13 for a bus bar on the photovoltaic module lamination part 2 to pass through, so as to electrically connect the metal substrate 20 with the circuit of the lamination part 2, the diode 30 is fixed on one of the metal substrates 20, and the diode 30 is connected with the other metal substrate 20 through a pin, so as to connect the diode 30 in the circuit of the lamination part 2 for the purpose of protecting the circuit.

The diode 30 includes a body 31, and a fixing portion 32 connected to a side portion of the body 31, and the body 31 and the fixing portion 32 are arranged along a width direction of the metal substrate 20. The main body 31 and the metal substrate 20 are fixed by the heat conducting structure 30, and the fixing portion 32 and the metal substrate 20 are fixed by solder paste.

The dimension of the heat conducting structure 40 along the width direction of the metal substrate 20 is not less than one half of the width dimension of the metal substrate 20, and the dimension of the heat conducting structure 40 along the length direction of the metal substrate 20 is not less than the dimension of the diode 30, so that the heat conducting structure 40 has a sufficient dimension to transfer the heat of the diode 30 to the metal substrate 20, and at the same time, the fixed connection between the diode 30 and the metal substrate 20 is realized.

Further, the heat conducting structure 40 is sheet-shaped, and the upper and lower sides thereof are respectively bonded to the diode 30 and the metal substrate 20, as shown in fig. 4 and 5, the heat conducting structure 40 includes an adhesive layer 41 and a heat conductor 42 disposed in the adhesive layer 41, the adhesive layer 41 in the heat conducting structure 40 plays a role of fixing the diode 30 and the metal substrate 20, and meanwhile, the heat conductor 42 in the heat conducting structure 40 can rapidly transfer heat generated by the diode 30 to the metal substrate 20.

Specifically, the adhesive layer 41 serves as a base material to perform an adhesive function, and may be formed of EVA or PE or a pre-crosslinked material having the same effect, which has high fluidity after heat treatment, and is further favorable for filling between the metal substrate 20 and the diode 30, and has wide application and low cost.

Preferably, the thermal conductor 42 is uniformly disposed in the bonding layer 41, as shown in fig. 4 and 5, so that the thermal conductive structure 40 has a relatively uniform thermal conductive effect. It is understood that the heat conductor 42 may be a metal sheet embedded in the adhesive layer 41, or may be heat conductive particles or heat conductive powder dispersed in the adhesive layer 41, which all can achieve the technical effect of uniform heat conduction. In this embodiment, the heat conductor 42 is made of metal or PA material with good heat conduction effect.

The process of bonding the heat conducting structure 40 with the diode 30 and the metal substrate 20 is as follows: before the diode 30 is combined with the metal substrate 20, the raw material of the heat conducting structure 40 is pre-placed on the metal substrate 20, and is welded with the metal substrate 20 and the diode 30, the raw material of the heat conducting structure 40 starts to be cross-linked and melted after being heated, and is fully filled between the diode 30 and the metal substrate 20, and the heat conducting structure 40 between the diode 30 and the metal substrate 20 is formed after being cooled and solidified.

As a preferred embodiment of the present invention, as shown in fig. 7 to fig. 9, the metal substrate 20 is provided with an accommodating groove 21 for accommodating the heat conducting structure 40, the accommodating groove 21 is used for pre-placing the raw material of the heat conducting structure 40, and is favorable for positioning the heat conducting structure 40 and cooling and forming after high temperature melting.

The receiving slot 41 is located below the main body 31, a dimension of the receiving slot 41 along the width of the metal substrate 20 is not less than one half of the width of the metal substrate 20, a dimension of the receiving slot 41 along the length of the metal substrate 20 is not less than a corresponding dimension of the diode 30, so that a dimension of the molded heat conducting structure 40 along the width of the metal substrate 20 is not less than one half of the width of the metal substrate 20, and a dimension along the length of the metal substrate 20 is not less than a corresponding dimension of the diode 30.

The side wall of the receiving groove 21 along the width direction of the metal substrate 20 is inclined, on one hand, the receiving groove 21 is easy to punch and form, on the other hand, the raw material of the heat conducting structure 40 is convenient to place, and after the heat conducting structure 40 in the receiving groove 21 is melted at high temperature, the inclined space can be used for collecting the redundant heat conducting structure 40 in a molten state.

Further, the metal substrate 20 is further provided with a fixing groove 22 communicated with the accommodating groove 21, the fixing groove 22 is located below the fixing portion 32, before the diode 30 and the metal substrate 20 are welded, solder paste is placed in the fixing groove 22 in advance, and in the welding process, the solder paste is melted by heat and filled between the fixing portion 32 and the metal substrate 20 to form a welding layer 50, so that the fixing portion 22 is connected with the metal substrate 20 in a welding mode.

Preferably, the depth of the receiving groove 21 is greater than the depth of the fixing groove 22, so that the receiving groove 21 is convenient for pre-placing raw materials of heat conductive materials, and meanwhile, the heat conductive structure 40 formed by cooling has a certain thickness, which improves the heat conductive performance and the bonding strength between the diode 30 and the metal substrate 20.

In this embodiment, a position of one side of the base 13 adjacent to the metal substrate 20 corresponding to the receiving groove 21 is provided with a relief groove 131 recessed in a direction away from the metal substrate 20. When the metal substrate 20 is located on the base 13, a part of the structure of the metal substrate 20 forming the receiving slot 21 is located in the avoiding slot 131, so that the metal substrate 20 and the base 13 are tightly combined, and the heat dissipation effect of the metal substrate 20 is improved.

As another preferred embodiment of the present invention, as shown in fig. 3, 6 to 9, the junction box 1 further includes a heat dissipation block 60, the heat dissipation block 60 and the metal substrate 20 are respectively disposed on two sides of the base 13, and the heat of the diode 30 is conducted to the metal substrate 20 and then passes through the heat dissipation block 60 to rapidly dissipate the heat.

In this embodiment, one side of the base 13 away from the metal substrate 20 has a mounting groove 132 recessed toward the metal substrate 20, the heat dissipation block 60 is disposed in the mounting groove 132, and the heat dissipation block 60 and the diode 30 are correspondingly disposed up and down, that is, the diode 30, the heat conduction structure 40, the metal substrate 20, the base 13, and the heat dissipation block 60 are sequentially attached from top to bottom, so that the heat dissipation path of the heat generated by the diode 30 is as follows: heat conduction structure 40, metal substrate 20, base 13, radiating block 60 reduce the route of heat conduction, moreover, dodge groove 131 and mounting groove 132 on the base 13 and correspond the setting, make the thickness of base 13 is less, promotes the heat-sinking capability of base 13, and then realize the quick radiating purpose of terminal box 1.

Preferably, the projection area of the heat dissipation block 60 on the base 13 is larger than the projection area of the diode 30 on the base 13, so as to improve the heat dissipation effect of the heat dissipation block 60.

The heat dissipation block 60 and the base 13 are arranged in a flush manner, so that the bottom of the junction box 1 is neat, and when the junction box 1 and the laminated part 2 are fixed, no gap exists between the junction box 1 and the laminated part 2, and the sealing and waterproof performance of the junction box 1 is realized.

In this embodiment, the heat dissipation block 60 is made of a material with good heat dissipation performance, so as to achieve a good heat dissipation effect, and the heat dissipation block 60 is preferably an aluminum block and is formed in the installation groove 132 in a cold pressing manner.

The utility model provides a photovoltaic module, as shown in fig. 10, photovoltaic module includes lamination piece 2, locates the foretell terminal box 1 in the 2 backs of lamination piece extends the outside busbar of 2 external lamination pieces and passes through pin hole 23 and metal substrate 20 welded connection and then connect into the circuit of lamination piece 2 with diode 30, realizes the protection of diode 30 circuit in to lamination piece 2.

To sum up, the utility model discloses a terminal box 1 presss from both sides between metal substrate 20 and diode 30 and is equipped with heat conduction structure 40 for heat conduction structure 40 can be with diode 30's heat conduction to metal substrate 20 fast, and then dispel the heat fast through metal substrate 20, in order to promote the radiating effect of terminal box 1 makes terminal box 1 be in safe temperature range, ensures the security performance of terminal box 1.

It should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art will be able to make the description as a whole, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The above detailed description of a series of embodiments is only for the purpose of illustration, and is not intended to limit the scope of the invention, which is intended to include all equivalent embodiments or modifications that do not depart from the spirit of the invention.

Claims (10)

1. The junction box is characterized by further comprising a heat conduction structure clamped between the metal substrate and the diode.

2. The junction box of claim 1, wherein said heat conducting structure is in the form of a sheet, and both sides of said heat conducting structure are bonded to said diode and said metal substrate, respectively, said heat conducting structure comprising an adhesive layer, and a heat conductor disposed in said adhesive layer.

3. The junction box according to claim 2, wherein the heat conductor is heat conductive particles dispersed in the adhesive layer or a metal sheet embedded in the adhesive layer.

4. The junction box of claim 1, wherein a dimension of the heat conducting structure in a width direction of the metal substrate is not less than one-half of a width dimension of the metal substrate, and a dimension of the heat conducting structure in a length direction of the metal substrate is not less than a corresponding dimension of the diode.

5. The junction box according to any one of claims 1 to 4, wherein the metal substrate is provided with a receiving groove for receiving the heat conducting structure and a fixing groove communicating with the receiving groove, the receiving groove has a depth greater than that of the fixing groove, the diode includes a main body positioned above the heat conducting structure, and a fixing portion connected to a side portion of the main body and positioned above the fixing groove, and the fixing portion is welded to the metal substrate.

6. The terminal box according to any one of claims 1 to 4, wherein the metal substrate is provided with a receiving groove for receiving the heat conducting structure, the terminal box comprises a base at the bottom of the metal substrate, and an avoiding groove recessed in a direction away from the metal substrate is provided at a position corresponding to the receiving groove on a side of the base adjacent to the metal substrate.

7. The connector of claim 6, further comprising a heat slug, wherein the heat slug and the metal substrate are disposed on opposite sides of the base.

8. The junction box of claim 7, wherein a side of the base facing away from the metal substrate has a mounting groove recessed toward the metal substrate, the heat slug is disposed in the mounting groove, and the heat slug and the base are flush.

9. The junction box of claim 7, wherein the heat slug is disposed in an up-down correspondence with the diode, and a projected area of the heat slug on the base is larger than a projected area of the diode on the base.

10. A photovoltaic module comprising a laminate and the junction box of any one of claims 1 to 9 disposed on the back of the laminate.

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