CN215769634U - Heat radiation structure and all-in-one machine - Google Patents
Heat radiation structure and all-in-one machine Download PDFInfo
- Publication number
- CN215769634U CN215769634U CN202121499571.6U CN202121499571U CN215769634U CN 215769634 U CN215769634 U CN 215769634U CN 202121499571 U CN202121499571 U CN 202121499571U CN 215769634 U CN215769634 U CN 215769634U
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- China
- Prior art keywords
- heat
- heat pipe
- flow channel
- cpu
- conduction plate
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- Expired - Fee Related
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- 230000005855 radiation Effects 0.000 title description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 238000005452 bending Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 4
- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation structure, which comprises a heat conduction plate and a heat pipe, wherein the front surface of the heat conduction plate faces a CPU (central processing unit) component, a window is formed in the heat conduction plate, and a flow channel is formed in the back surface of the heat conduction plate; and the back surface of the heat conducting plate is attached to the back shell of the all-in-one machine, one end of the heat pipe is attached to the CPU component, and the other end of the heat pipe penetrates through the window and extends into the flow channel on the back surface of the heat conducting plate. The utility model further provides an all-in-one machine, which comprises a heat dissipation structure and a back shell, wherein the back shell is made of a metal material, and the back surface of the heat conduction plate is tightly attached to the inner wall of the back shell.
Description
Technical Field
The utility model relates to the technical field of all-in-one machines, in particular to a heat dissipation structure and an all-in-one machine.
Background
Compared with a common computer, the structure of the all-in-one computer is more compact, the heat dissipation structure of the all-in-one computer needs corresponding adjustment and change, copper pipes are adopted for heat dissipation in more all-in-one computers in the prior art, the heat dissipation efficiency is lower, and the reality scene with higher and higher power consumption is difficult to meet.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation structure and an all-in-one machine, which are good in heat dissipation effect.
The technical scheme adopted by the heat dissipation structure disclosed by the utility model is as follows:
a heat dissipation structure comprises a heat conduction plate and a heat pipe, wherein the front surface of the heat conduction plate faces a CPU component, a window is formed in the heat conduction plate, and a flow channel is formed in the back surface of the heat conduction plate; and the back surface of the heat conducting plate is attached to the back shell of the all-in-one machine, one end of the heat pipe is attached to the CPU component, and the other end of the heat pipe penetrates through the window and extends into the flow channel on the back surface of the heat conducting plate.
As a preferred scheme, the heat pipe comprises a first horizontal segment, a second horizontal segment and a bending segment, the first horizontal segment is arranged on the front surface of the heat conducting plate and is attached to the CPU component, one end of the bending segment is connected with the first horizontal segment, the other end of the bending segment penetrates through the window and extends to the back surface of the heat conducting plate, one end of the second horizontal segment is connected with the bending segment, the other end of the second horizontal segment extends to the flow channel, and the second horizontal segment continues to extend along the flow channel.
Preferably, the flow passage comprises an arc-shaped section connecting the windows and a straight section connecting the arc-shaped section.
Preferably, the thickness of the heat pipe does not exceed the depth of the flow channel.
Preferably, the heat pipe is a flat pipe body, and the upper surface and the lower surface of the heat pipe are planes.
As the preferred scheme, the heat pipe is made for the copper product, the heat-conducting plate is made for the aluminum alloy.
The utility model also discloses an integrated machine which comprises a heat dissipation structure and a back shell, wherein the back shell is made of a metal material, and the back surface of the heat conduction plate is tightly attached to the inner wall of the back shell.
Preferably, the all-in-one machine further comprises a CPU assembly, the CPU assembly comprises a CPU and an installation frame, a heat conduction block is arranged on the installation frame, one surface of the heat conduction block is tightly attached to the CPU, and one end of the heat pipe is tightly attached to the other surface, opposite to the heat conduction block, of the heat conduction block.
According to the preferable scheme, the middle of the mounting frame is sunken to form a containing groove, the middle of the containing groove is provided with a through groove, the heat conducting block is clamped in the through groove, and one end of the heat pipe is arranged in the containing groove.
The heat radiation structure and the all-in-one machine disclosed by the utility model have the beneficial effects that: the heat generated in the working process of the CPU component enters one end of the self-heating pipe and is transferred to the other end of the self-heating pipe, and the heat generated can be directly conducted and dissipated through the heat conducting plate and the back shell of the all-in-one machine due to the fact that the other end of the self-heating pipe is located on the back face of the heat conducting plate and the back face of the heat conducting plate is attached to the back shell of the all-in-one machine. Meanwhile, the other end of the heat pipe extends in the flow channel on the back of the heat conducting plate, the heat transfer area between the heat pipe and the heat conducting plate is increased due to the flow channel, the front temperature of the heat conducting plate is lower than that of the back due to the arrangement, and the heat dissipation and cooling effects are improved.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of the present invention.
Fig. 2 is a rear view of the heat dissipation structure of the present invention.
Fig. 3 is a bottom view of the heat dissipating structure of the present invention.
Fig. 4 is a schematic structural diagram of the all-in-one machine of the utility model.
Fig. 5 is a schematic view of the internal structure of the all-in-one machine of the present invention.
Fig. 6 is a schematic view of the internal structure of the all-in-one machine of the utility model (with the heat-conducting plate removed).
Detailed Description
The utility model will be further elucidated and described with reference to the embodiments and drawings of the specification:
referring to fig. 1, 2 and 3, a heat dissipation structure includes a heat conducting plate 10 and a heat pipe 20. The front surface of the heat conducting plate 10 faces the CPU component 30, a window 11 is arranged on the heat conducting plate 10, and a flow channel 12 is arranged on the back surface of the heat conducting plate 10. The back of the heat conducting plate 10 is attached to the back shell of the all-in-one machine, one end of the heat pipe 20 is attached to the CPU component 30, and the other end of the heat pipe passes through the window 11 and extends into the flow channel 12 on the back of the heat conducting plate 10.
The heat generated in the working process of the CPU component 30 is transferred from one end of the heat pipe 20 to the other end, and since the other end is located on the back of the heat conducting plate 10 and the back of the heat conducting plate 10 is attached to the back shell of the all-in-one machine, the generated heat can be directly conducted and dissipated via the heat conducting plate 10 and the back shell of the all-in-one machine. Meanwhile, the other end of the heat pipe 20 extends in the flow channel 12 on the back surface of the heat conducting plate 10, the heat transfer area between the heat pipe 20 and the heat conducting plate 10 is increased due to the arrangement of the flow channel 12, the front surface temperature of the heat conducting plate 10 is lower than that of the back surface due to the arrangement, and the heat dissipation and cooling effects are improved.
Wherein the window 11 is arranged in a staggered manner with respect to the CPU component 30.
The heat pipe 20 includes a first horizontal segment 21, a second horizontal segment 22 and a bending segment 23, the first horizontal segment 21 is disposed on the front surface of the heat conducting plate 10 and is attached to the CPU component 30, one end of the bending segment 23 is connected to the first horizontal segment 21, the other end of the bending segment passes through the window 11 and extends to the back surface of the heat conducting plate 10, one end of the second horizontal segment 22 is connected to the bending segment 23, the other end of the second horizontal segment extends to the flow channel 12, and the flow channel 12 continues to extend. In one embodiment, the heat pipe 20 is filled with a heat conducting medium. In another embodiment, the heat pipe 20 is a solid tube made of copper.
The thickness of the heat pipe 20 does not exceed the depth of the flow channel 12, so as to prevent the top surface of the heat pipe 20 from exceeding the back surface of the heat conducting plate 10. The heat pipe 20 is a flat pipe. The upper and lower surfaces of the heat pipe 20 are flat. The heat pipe 20 is made of copper material, and the heat conducting plate 10 is made of aluminum alloy. Wherein the window 11 is located in the middle area of the heat-conducting plate 10.
The flow channel 12 comprises an arc-shaped section 121 connecting the windows 11 and a straight section 122 connecting the arc-shaped section 121. In this embodiment, the arc-shaped segment 121 and the straight line segments 122 are respectively provided with two sets, and the two straight line segments 122 are respectively provided at two sides of the window 11 and are parallel to each other.
Referring to fig. 4, 5 and 6, the present invention further discloses an all-in-one machine, which includes a heat dissipation structure and a back shell 40, wherein the back shell 40 is made of a metal material, and the back surface of the heat conduction plate 10 is tightly attached to the inner wall of the back shell 40.
The all-in-one machine further comprises a CPU assembly 30, the CPU assembly 30 comprises a CPU and an installation frame 31, a heat conduction block 33 is arranged on the installation frame 31, one surface of the heat conduction block 33 is tightly attached to the CPU, and one end of the heat pipe 20 is tightly attached to the other surface of the heat conduction block 33. Specifically, the middle of the mounting frame 31 is recessed to form a receiving groove 311, a through groove is formed in the middle of the receiving groove 311, the heat conducting block 33 is clamped in the through groove, and one end of the heat pipe 20 is arranged in the receiving groove 311. The heat pipe 20 is avoided by the containing groove 311, and the heat pipe 20 is prevented from directly contacting the front surface of the heat conducting plate 10.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. A heat dissipation structure is characterized by comprising a heat conduction plate and a heat pipe, wherein the front surface of the heat conduction plate faces a CPU component, a window is formed in the heat conduction plate, and a flow channel is formed in the back surface of the heat conduction plate;
and the back surface of the heat conducting plate is attached to the back shell of the all-in-one machine, one end of the heat pipe is attached to the CPU component, and the other end of the heat pipe penetrates through the window and extends into the flow channel on the back surface of the heat conducting plate.
2. The heat dissipation structure of claim 1, wherein the heat pipe comprises a first horizontal section, a second horizontal section and a bending section, the first horizontal section is disposed on the front surface of the heat conduction plate and attached to the CPU component, one end of the bending section is connected to the first horizontal section, the other end extends to the back surface of the heat conduction plate through the window, one end of the second horizontal section is connected to the bending section, the other end extends to the flow channel, and the second horizontal section continues to extend along the flow channel.
3. The heat dissipating structure of claim 1, wherein the flow channel comprises an arcuate segment connecting the windows and a straight segment connecting the arcuate segments.
4. The heat dissipation structure of claim 1, wherein the thickness of the heat pipe does not exceed the depth of the flow channel.
5. The heat dissipating structure of claim 4, wherein the heat pipe is a flat pipe body, and the upper surface and the lower surface of the heat pipe are flat.
6. The heat dissipating structure of claim 4, wherein the heat pipe is made of copper material and the heat conducting plate is made of aluminum alloy.
7. An all-in-one machine is characterized by comprising the heat dissipation structure as claimed in any one of claims 1 to 6 and a back shell, wherein the back shell is made of a metal material, and the back surface of the heat conduction plate is tightly attached to the inner wall of the back shell.
8. The integrated machine of claim 7, further comprising a CPU assembly, wherein the CPU assembly comprises a CPU and a mounting bracket, the mounting bracket is provided with a heat conducting block, one side of the heat conducting block is tightly attached to the CPU, and one end of the heat pipe is tightly attached to the other side of the heat conducting block.
9. The integrated machine according to claim 8, wherein the mounting frame is recessed at a middle portion thereof to form a receiving groove, a through groove is formed at a middle portion of the receiving groove, the heat conducting block is clamped in the through groove, and one end of the heat pipe is disposed in the receiving groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121499571.6U CN215769634U (en) | 2021-06-30 | 2021-06-30 | Heat radiation structure and all-in-one machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121499571.6U CN215769634U (en) | 2021-06-30 | 2021-06-30 | Heat radiation structure and all-in-one machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215769634U true CN215769634U (en) | 2022-02-08 |
Family
ID=80103620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121499571.6U Expired - Fee Related CN215769634U (en) | 2021-06-30 | 2021-06-30 | Heat radiation structure and all-in-one machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215769634U (en) |
-
2021
- 2021-06-30 CN CN202121499571.6U patent/CN215769634U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220208 |