CN106445023A - Case, cooling method and structure of case and cabinet formed by cooling structure of case - Google Patents
Case, cooling method and structure of case and cabinet formed by cooling structure of case Download PDFInfo
- Publication number
- CN106445023A CN106445023A CN201610392779.5A CN201610392779A CN106445023A CN 106445023 A CN106445023 A CN 106445023A CN 201610392779 A CN201610392779 A CN 201610392779A CN 106445023 A CN106445023 A CN 106445023A
- Authority
- CN
- China
- Prior art keywords
- support
- heat
- cabinet
- case body
- machine case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a case. The case comprises a case body, wherein the case body is internally provided with a support; a spacing distance is arranged between the support and each of side panels on two sides of the case body; a line groove or line cavity and a circuit socket are formed in the support; the support is used for fixing a computer mainboard; and the support forms a heat exchanger which is used for collecting heat and externally carrying out heat exchange. The invention furthermore discloses a cooling structure of the case, a cooling method of the thin-walled case and a cabinet formed according to the cooling structure of the case. The case disclosed by the invention is small in volume and few in external circuits so that benefit is brought to the manufacture of an ultra-thin case and benefit is brought to the cooling.
Description
Technical field
The present invention relates to computer equipment technical field, a kind of specifically technology of cabinet.
Background technology
Existing computer housing generally comprises left plate, right plate, top-side panel, bottom side plate, front side board and back side panel and logical
The three-dimensional cavity of skeleton composition is crossed, computer main board work is fixed on left plate side or right plate side, computer main board and computer housing
Other each sides constitute a big chassis space, install hard disk, light by arranging interlayer in this big chassis space
Drive, hard disk, CD-ROM drive are usually horizontally disposed, are to be vertically arranged with left plate, right plate.General setting wind on back side panel
Fan, had arranges fan on left plate or right plate, carries out wind-cooling heat dissipating, and some computers adopt water-cooled, and at this
Arrangement hot channel in big chassis space.Existing this cabinet, volume is big, and weight is big, chaotic, cabinet more than external circuit
Inside it is easy to into dust and pollutes the electronic devices and components of the inside.For requiring to make ultra-thin case, existing this cabinet is
Cannot realize, particularly heat dissipation problem, become people to develop the technical barrier of ultra-thin case.
Content of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide one kind is conducive to making ultra-thin case, and
And be conducive to cabinet and its method and the structure of radiating.
Further objective is that the external circuit of minimizing.
Further objective is that good dustproof effect.
The present invention is achieved through the following technical solutions.
A kind of cabinet, including machine case body, it is characterised in that：Support is provided with the machine case body, is supported and cabinet sheet
Spacing distance is equipped between the side panel of the both sides of body, supports for computer main board is fixed, support itself also constitutes receipts
Heat-collecting capacity simultaneously externally carries out the heat exchanger of heat exchange.
Wire casing or line chamber and circuit socket mouth is provided with support,
Described support is an aluminium alloy heat radiator, and aluminium alloy heat radiator is provided with the fin being vertically arranged, each fin
Vertical heat dissipation channel is constituted, wind-cooling heat dissipating is carried out by radiator fan.
Described support is provided with radiating tube for filling liquid, carries out heat exchange by liquid, liquid flow through liquid
Press pump drives.
Described support is provided with radiating tube for filling liquid, carries out heat exchange by liquid, liquid flow through liquid
Press pump drives.
Full-closed structure is carried out between the side panel of the both sides of the support and machine case body, prevent dust from entering.
The support is made up of supportive body, the top of supportive body and bottom, and the top of supportive body and/or bottom are prolonged
It is stretched into machine case body face, the side panel of the both sides of machine case body is fixed by supporting, or the top of supportive body and bottom is divided
Not Gu Ding the top panel of machine case body and bottom panel, the side panel of the both sides of machine case body is carried out solid by top panel and bottom panel
Fixed, described support constitutes machine case body support frame, carries out totally-enclosed knot between the side panel of the both sides of support and machine case body
Structure, prevents dust from entering.
The card of the hard disk that installs in the cabinet is be arranged in parallel with mainboard, and is radiated by supporting.
The video card that installs in the cabinet is be arranged in parallel with mainboard.
The board-like power supply is be arranged in parallel with mainboard.
The CD-ROM drive that installs in the cabinet is be arranged in parallel with mainboard.
A kind of radiator structure of cabinet, including the support for arranging in cabinet, supports the side panel with the both sides of machine case body
Between be equipped with spacing distance, support is provided with wire casing or line chamber and circuit socket mouth, the top and bottom of support structure respectively
Become top surface and the bottom surface of cabinet, support itself constitutes one and collects heat and externally carry out the heat exchanger of heat exchange, computer master
Plate, hard disk and/or video card are sealed in machine case body, the heat that heat that the CPU on computer main board and mainboard sends, hard disk send
The heat of the chip in amount and/or video card all supports collection heat externally to carry out heat exchange, support in wiring or
Circuit board or winding displacement are set in support.
The top and bottom of the support directly extends the top surface for respectively constituting cabinet and radiating is realized in bottom surface, or logical
Cross that heat is conducted to the top surface of cabinet by liquid radiating pipe or vacuum heat conduction pipe and bottom surface is radiated, wherein on computer main board
Chip on heat that heat that CPU sends, hard disk send and/or video card is combined by liquid radiating pipe or vacuum heat conduction pipe and is dissipated
Backing or heat dissipation base pass to heat to support, then carry out heat exchange by supporting externally, and support is provided with directly and air
The radiator structure of contact, or increase fan or increase liquid radiating pipe or vacuum heat conduction pipe, the CPU on computer main board, hard disk
And/or the chip on video card is in a kind of closed state all the time, computer main board is fixed on above a side of support, hard disk
And/or the fixation parallel with another side for supporting of the chip on video card or contact are fixed, and are correspondingly provided with for holding in support
The pit of the electronic devices and components of each protrusion that receives on computer main board or hole, and the part for becoming cabinet will be supported, propping up
Radiator structure is also set up in support, that is, include fin, liquid radiating pipe or vacuum heat conduction pipe.
A kind of heat dissipating method of thin-walled cabinet, it is characterised in that：1) arrange in cabinet and support, radiating knot is set in support
Structure and extraneous radiating；2) be provided in support accommodate computer main board on each protrusion heating electronic component pit or
Hole, is arranged the cavity for being contacted with hard disk, or first passes through radiating seat, fin, liquid radiating pipe or vacuum heat conduction pipe pair
Major heat producing components in cabinet include that the chip on CPU on mainboard, hard disk and/or video card is collected being conducted to support,
Support and again heat is distributed；3) mainboard, hard disk and/or the video card installed are mutually parallel or parallel to support, and seal
Close in cabinet, the radiator structure in support includes fin, fan and the heat radiation conduit of straight forming.
The rack that a kind of radiator structure according to aforementioned cabinet is made, it is characterised in that：Using arranged in the cabinet
The part for directly constituting rack is supported, the part is used for radiating and/or the chip on fixing circuit board, hard disk and/or video card.
The invention has the advantages that：
1) present invention changes the conventional mode for installing computer main board, arranges and support in machine case body, and support with
Spacing distance is equipped between the side panel of the both sides of machine case body, and computer main board is fixed in support, so, can also be utilized
Support and come Fixed disk, video card, board-like power supply and CD-ROM drive, and be arranged in parallel with mainboard, be to make ultra-thin case to provide skill
Art is supported, that is provide new condition for fixing computer hardware.
2) wire casing or line chamber and circuit socket mouth are provided with support, you can with by various line concealings in supporting, only
Socket is stayed, the external circuit of minimizing is not only improved, be conducive to people's assembling computer again.
3) as support itself also constitutes a heat exchanger that collects heat and externally carry out heat exchange, printed words can lead to
The heat exchanger for supporting as a centralized collection heat and externally carrying out heat exchange is crossed, various radiatings are all completed in support,
Particularly full-closed structure being carried out between the side panel of the both sides of support and machine case body, so just can prevent dust completely and enter
Enter, play good dust-proof effect.
4) radiating due to computer is carried out by supporting, therefore develops ultra-thin case for people, solves the technology hardly possible of radiating
Topic.
Description of the drawings
Fig. 1 is casing structure schematic diagram (one) of the present invention；Fig. 2 is casing structure schematic diagram (two) of the present invention.
Specific embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail.
As shown in Figure 1, Figure 2, cabinet of the present invention, including machine case body, is provided with support 3 in machine case body, supports and cabinet sheet
Spacing distance 10,101 is respectively equipped between the side panel of the both sides of body, and support is provided with wire casing or line chamber and circuit socket
Mouthful, supporting for fixing computer main board 5, support itself also constitutes one and collects heat and externally carry out the heat exchange of heat exchange
Device.
The embodiment for supporting as heat exchanger is presented herein below：
Embodiment 1：Support as an aluminium alloy heat radiator, aluminium alloy heat radiator is provided with the fin 9 being vertically arranged, each dissipate
Backing constitutes vertical heat dissipation channel, carries out wind-cooling heat dissipating by radiator fan.The radiating being additionally provided with support for filling liquid
Pipe, carries out heat exchange by liquid, liquid flow through hydraulic pump drive.
Embodiment 2：The radiating tube 31 being provided with support for filling liquid, carries out heat exchange, the stream of liquid by liquid
Move by hydraulic pump drive.
Full-closed structure is carried out between the side panel of the both sides of present invention support and machine case body, prevent dust from entering.Its
Middle support is made up of top 2 and the bottom of supportive body, supportive body, and the top of supportive body and/or bottom extend into cabinet
This dignity, the side panel of the both sides of machine case body is fixed by supporting, or the top of supportive body and bottom fix machine respectively
The top panel 21 of case body and bottom panel, the side panel 1 of the both sides of machine case body is fixed by top panel and bottom panel, institute
Stating support and machine case body support frame is constituted, full-closed structure is carried out between the side panel of the both sides of support and machine case body, prevent
Only dust is entered.
Make ultra-thin case to carry, after it make use of the aforementioned support of the present invention to solve heat dissipation problem, can also be using support
To fix other related hardware of computer, mainly it is also advantageous that in the consideration of radiating：The card of the hard disk that installs in cabinet and master
Plate be arranged in parallel, and is radiated by supporting.The video card that installs in cabinet is be arranged in parallel with mainboard.Board-like power supply 7 is put down with mainboard
Row is arranged.The CD-ROM drive that installs in cabinet is be arranged in parallel with mainboard.
Except being provided with support in cabinet of the present invention, support for fixing computer main board, support itself also constitutes a collection
Heat is simultaneously externally carried out the heat exchanger of heat exchange and constitutes the heat that the computer heater members such as collection hard disk, a CPU send
And heat exchange is carried out by going to the bottom with the external world in itself and cabinet, special heat collection plate can also be set in cabinet
Or circuit line collecting plate, for special.
For example the application provides another structure：First parallel with mainboard for hard disk being fixed in machine case body is formed one
Thin-walled host computer, has the then equally fixation parallel with mainboard of video card 6, CD-ROM drive, then arranges heat collection plate in machine case body
And/or circuit line collecting plate, heat collection plate 81 itself can form a radiator, it is also possible to arrange other radiator structures, such as
The radiating tube of aforementioned dress liquid or fin and fan, heat collection plate is provided with groove or boss face for contacting with hard disk,
Boss face 81 is additionally provided with heat collection plate for contacting heat with CPU and other chips, be wherein used for CPU and other
Chip contact boss can also be independently arranged, then by the radiating tube or other radiator structures of dress liquid by heat collection to heat
On amount collecting board, circuit line collecting plate is by various electric wire concentrated settings on one block of plate, is onboard provided with the grafting of plug and play
Mouthful, the mode of various electric wire concentrated settings can be arranged line using wire casing or line chamber, or just each line is made electricity
The form of road plate is configured.Radiator structure in heat collection plate or arrange that other radiator structures directly carry out hot friendship with the external world
Change, and hard disk, mainboard and video card are sealings, are provided with can also sealing for CD-ROM drive, same CD-ROM drive radiating mode also with hard disk
Identical, and power supply can be external, if built-in, adopts board-like power supply.
The radiator structure of cabinet of the present invention, including the support for arranging in cabinet, supports the side with the both sides of machine case body
Spacing distance is equipped between plate, support is provided with wire casing or line chamber and circuit socket mouth, the top and bottom of support is respectively
Top surface and the bottom surface of cabinet is constituted, support itself constitutes one and collects heat and externally carry out the heat exchanger of heat exchange, computer
Mainboard, hard disk 4 and/or video card are sealed in machine case body, and the heat that the CPU on computer main board and mainboard sends, hard disk send
Heat and/or video card on the heat of chip all support collection heat externally to carry out heat exchange, support in wiring or
Circuit board or winding displacement are set in supporting.
Directly extend in the top and bottom for supporting and the top surface for respectively constituting cabinet and bottom surface realization radiating is constituted, or
By liquid radiating pipe or heat is conducted to vacuum heat conduction pipe the top surface of cabinet and bottom surface is radiated, wherein on computer main board
The heat that sends of CPU, the chip on the heat that sends of hard disk and/or video card combined by liquid radiating pipe or vacuum heat conduction pipe
Fin or heat dissipation base pass to heat to support, then carry out heat exchange by supporting externally, support be provided with direct with empty
The radiator structure of gas contact, or increase fan or increase liquid radiating pipe or vacuum heat conduction pipe is CPU on computer main board, hard
Chip on disk and/or video card is in a kind of closed state all the time, can be sealing state further, support and tie for metal plate-like
Structure, such computer main board is fixed on above a side of support, another side of the chip on hard disk and/or video card and support
The parallel fixation in face or contact are fixed, and are correspondingly provided with for the electronic devices and components that accommodate each protrusion on computer main board in support
Pit or hole, be so both easy to the components and parts of contact heating to be radiated, and also beneficial to manufacture thin-walled cabinet, and support were done
Becoming a part for cabinet, radiator structure also set up in support, that is, includes fin, liquid radiating pipe or vacuum heat conduction pipe,
Heat dissipation capacity is so greatly strengthen, is conducive to the radiating of powerful device.
The heat dissipating method of thin-walled cabinet of the present invention, it is characterised in that：1) arrange in cabinet and support, radiating is set in support
Structure and extraneous radiating；2) it is provided in support accommodating the pit of the heating electronic component of each protrusion on computer main board
Or hole, the cavity for being contacted with hard disk is set, or first passes through radiating seat, fin, liquid radiating pipe or vacuum heat conduction pipe
Major heat producing components in cabinet are included with the chip on the CPU on mainboard, hard disk and/or video card is collected being conducted to prop up
Support, supports and distributes heat again；3) mainboard, hard disk and/or the video card installed are mutually parallel or parallel to support, and
It is enclosed in cabinet, dust-proof dye, the radiator structure in support includes that fin, fan and the radiating of straight forming is led
Pipe.
The rack that the radiator structure of the aforementioned cabinet of the present invention is made, directly constitutes machine using the support for arranging in the cabinet
A part for cabinet, the part is used for radiating and/or the chip on fixing circuit board, hard disk and/or video card.
Claims (10)
1. a kind of cabinet, including machine case body, it is characterised in that：Support is provided with the machine case body, is supported and machine case body
Both sides side panel between be equipped with spacing distance, support for fixing computer main board, support itself also constitutes a collection
Heat simultaneously externally carries out the heat exchanger of heat exchange.
2. cabinet according to claim 1, it is characterised in that：Described support is an aluminium alloy heat radiator, aluminium alloy heat radiator
The fin being vertically arranged is provided with, and each fin constitutes vertical heat dissipation channel, wind-cooling heat dissipating carried out by radiator fan.
3. cabinet according to claim 1, it is characterised in that：The support is provided with the radiating tube for filling liquid, passes through
Liquid carries out heat exchange, liquid flow through hydraulic pump drive, or described support is provided with vacuum heat conduction pipe.
4. cabinet according to claim 1, it is characterised in that：The support is provided with wire casing or line chamber and circuit socket
Mouthful.
5. cabinet according to claim 4, it is characterised in that：The support is by supportive body, the top of supportive body and bottom
End is constituted, and the top of supportive body and/or bottom extend into machine case body face, and the side panel of the both sides of machine case body is by supporting
Fixing, or the top of supportive body and bottom fix top panel and the bottom panel of machine case body, the both sides of machine case body respectively
Side panel be fixed by top panel and bottom panel, described support constitute machine case body support frame, support with cabinet sheet
Full-closed structure is carried out between the side panel of the both sides of body, prevent dust from entering.
6. cabinet according to claim 1-5 any one claim, it is characterised in that：The hard disk that installs in the cabinet
Card, video card and/or CD-ROM drive and mainboard be arranged in parallel, and are radiated by supporting.
7. a kind of radiator structure of cabinet, including the support for arranging in cabinet, support with the side panel of the both sides of machine case body it
Between be equipped with spacing distance, support itself constitutes one and collects heat and externally carry out the heat exchanger of heat exchange, computer main board
And the heat of the heat that sends of the heat that sends of the CPU on mainboard, hard disk and/or the chip on video card collects heat by supporting
And externally carry out heat exchange.
8. a kind of radiator structure of cabinet, including the support for arranging in cabinet, support with the side panel of the both sides of machine case body it
Between be equipped with spacing distance, support itself constitutes one and collects heat and externally carry out the heat exchanger of heat exchange, the support
Top and bottom directly extend the top surface for respectively constituting cabinet and radiating is realized in bottom surface, or by liquid radiating pipe or true
Heat is conducted to empty heat pipe the top surface of cabinet and bottom surface is radiated, heat that wherein CPU on computer main board sends, hard
Chip on heat that disk sends and/or video card combines fin or heat dissipation base by liquid radiating pipe or vacuum heat conduction pipe
Heat being passed to support, then heat exchange being carried out by supporting externally, support is provided with radiator structure directly with air contact, or
Increase fan or increase liquid radiating pipe or vacuum heat conduction pipe.
9. a kind of heat dissipating method of thin-walled cabinet, it is characterised in that：Arrange in cabinet and support, or support is become cabinet
A part, computer main board is fixed on above a side of support, the chip on hard disk and/or video card with support another
The parallel fixation in side or contact are fixed, and arrange radiator structure with extraneous radiating in support.
10. the rack that a kind of radiator structure of cabinet according to claim 7 is made, it is characterised in that：Using the cabinet
The support of interior setting directly constitutes a part for rack, and the part is used for radiating and/or fixing circuit board, hard disk and/or video card
On chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520370011 | 2015-05-25 | ||
| CN2015203700119 | 2015-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106445023A true CN106445023A (en) | 2017-02-22 |
Family
ID=58183868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610392779.5A Pending CN106445023A (en) | 2015-05-25 | 2016-05-24 | Case, cooling method and structure of case and cabinet formed by cooling structure of case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106445023A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108363474A (en) * | 2018-05-02 | 2018-08-03 | 昆山莹帆精密五金有限公司 | A kind of video card boxlike evaporation structure |
-
2016
- 2016-05-24 CN CN201610392779.5A patent/CN106445023A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108363474A (en) * | 2018-05-02 | 2018-08-03 | 昆山莹帆精密五金有限公司 | A kind of video card boxlike evaporation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Liang Lijun Document name: Notification of before Expiration of Request of Examination as to Substance |
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| DD01 | Delivery of document by public notice | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170222 |
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| WD01 | Invention patent application deemed withdrawn after publication |