CN221707996U - Heat pipe heat dissipation formula machine case - Google Patents

Abstract

The utility model discloses a heat pipe heat dissipation type chassis, comprising a chassis, a heat pipe and a heat dissipation plate. The chassis comprises a front panel, an upper panel, a lower panel, a right side panel, a left side panel and a rear panel, and a number of power modules and computing modules are arranged in the chassis; the heat pipe heat dissipation type chassis of the utility model buries the heat pipes in the outer sides of the upper panel and the lower panel, and the heat pipes are covered with the heat dissipation plate, and the power modules and computing modules in the chassis are closely attached to the guide grooves on the inner sides of the upper and lower panels, and the heat is transferred to the heat pipes through the upper and lower panels, and the heat pipes transfer the heat to the heat dissipation plate quickly, and the heat is naturally dissipated through the contact between the heat dissipation teeth of the heat dissipation plate and the air, and the heat generated by the power modules and computing modules in the chassis is taken away, and the heat dissipation problem of the high-power power modules and computing modules is effectively solved.

Description

Heat pipe heat dissipation type chassis

Technical Field

The utility model relates to the technical field of electronic chassis, in particular to a heat pipe heat dissipation chassis.

Background Art

At present, electronic equipment such as rack-mounted general-purpose computers and servers usually use a standard 19-inch wide chassis, and the heat dissipation methods include natural heat dissipation, forced air cooling, and liquid cooling. Generally, computers and servers with low-power intensive computing functions and general-purpose intensive computing functions can use natural heat dissipation, forced air cooling and other heat dissipation methods to solve the heat dissipation problem. When a sealed chassis is used, the heat dissipation methods mainly use conduction natural heat dissipation and liquid cooling. Since the liquid cooling method will greatly increase the cost of the chassis, conduction natural heat dissipation is generally used for computers and servers with low-power intensive computing functions and general-purpose intensive computing functions.

Computers and servers with low-power intensive computing functions and general-purpose intensive computing functions integrate many computing modules with low-power intensive computing functions and general-purpose intensive computing functions, so two high-power power modules are required. When the conduction natural heat dissipation cooling method is adopted, due to the large heat generated by the power module, local heat islands will be formed on the upper and lower plates of the chassis, reducing the heat dissipation efficiency. Therefore, the conventional conduction natural heat dissipation method cannot solve the heat dissipation problem of high-power power modules and computing modules.

Summary of the invention

The utility model aims to solve the deficiencies of the prior art and provide a heat pipe heat dissipation type chassis which can solve the technical problem of poor heat dissipation between high-power power supply modules and computing modules at a low cost.

In order to solve the above technical problems, the purpose of the utility model is achieved as follows:

A heat pipe heat dissipation type chassis comprises a chassis body, a heat pipe and a heat dissipation plate.

The box body includes a front panel, an upper panel, a lower panel, a right panel, a left panel, and a rear panel, and a number of power modules and computing modules are arranged in the box body;

The heat pipes are fixedly mounted on the outer sides of the upper plate and the lower plate of the box body, and are arranged in a horizontal parallel manner. The heat dissipation plate is covered on the heat pipes, and the power module and the computing module are closely attached to the guide grooves on the inner sides of the upper plate and the lower plate.

The contact surface between the heat sink and the heat pipe is flat and smooth, and the contact surface between the heat sink and the air adopts a dense strip-shaped toothed structure to increase the heat dissipation area.

On the basis of the above scheme and as a preferred scheme of the above scheme, an upper heat pipe mounting groove is provided on the outer side of the upper plate, which is arranged horizontally and in parallel, and a lower heat pipe mounting groove is provided on the outer side of the lower plate, which is arranged horizontally and in parallel, and the smooth surface of the heat dissipation plate is in close contact with the heat pipes in the upper and lower plates.

The guide grooves on the inner sides of the upper and lower plates, the heat pipes in the upper and lower plates, and the heat dissipation plates on the upper and lower plates close to the heat pipes form a continuous heat conduction channel, and the heat dissipation teeth of the heat dissipation plates contact the air to naturally dissipate heat, thereby achieving the purpose of cooling.

On the basis of the above scheme and as a preferred scheme of the above scheme, the front panel, upper panel, lower panel, left panel, right panel, rear panel and heat sink are all made of aluminum alloy, and the heat pipe is made of copper.

On the basis of the above scheme and as a preferred scheme of the above scheme, the front panel, upper panel, lower panel, left panel, right panel, rear panel and heat sink are all rectangular flat plate structures, which are connected by screws to form a chassis; the heat pipe is welded and connected to the upper and lower plates by brazing.

The beneficial effects of the utility model are:

Compared with the prior art, the heat pipe cooling chassis of the utility model buries the heat pipes into the outer sides of the upper and lower plates, and the power module and computing module inside the chassis are in close contact with the guide grooves on the inner sides of the upper and lower plates. The heat is conducted to the heat pipes through the upper and lower plates, and the heat pipes quickly conduct the heat to the heat dissipation plate. The heat is naturally dissipated through the heat dissipation teeth of the heat dissipation plate in contact with the air, taking away the heat generated by the power module and computing module in the chassis, effectively solving the heat dissipation problem of high-power power modules and computing modules.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 is a schematic diagram of the overall structure of the utility model;

Fig. 2 is a front view of the utility model;

Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2;

Fig. 4 is a left side view of Fig. 2;

FIG. 5 is a top view of FIG. 2 (part 3 is removed).

In the figure, 1-box; 2-heat pipe; 3-heat sink; 4-power module; 5-computing module; 11-front panel; 12-upper panel; 13-lower panel; 14-right side panel; 15-left side panel; 16-rear panel.

Implementation

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

As shown in FIGS. 1 to 5 , a heat pipe cooling type chassis includes a chassis body, a heat pipe and a heat dissipation plate.

The box body includes a front panel, an upper panel, a lower panel, a right panel, a left panel, and a rear panel, and a number of power modules and computing modules are arranged in the box body;

Specifically, the heat pipes are installed and fixed on the outer sides of the upper plate and the lower plate of the box body, and are arranged in parallel in a horizontal manner. The heat dissipation plate is covered on the heat pipes, and the power module and the computing module are closely attached to the guide grooves on the inner sides of the upper plate and the lower plate.

The contact surface between the heat sink and the heat pipe is flat and smooth, and the contact surface between the heat sink and the air adopts a dense strip-shaped toothed structure to increase the heat dissipation area.

On the basis of the above scheme and as a preferred scheme of the above scheme, the upper plate is provided with an upper heat pipe installation groove on the outside, the number of which can be determined according to actual needs, and is arranged in parallel horizontally; the lower plate is provided with a lower heat pipe installation groove on the outside, the number of which can be determined according to actual needs, and is arranged in parallel horizontally; the smooth surface of the heat sink is in close contact with the heat pipes in the upper and lower plates. The guide grooves on the inner sides of the upper and lower plates, the heat pipes in the upper and lower plates, and the heat sinks on the upper and lower plates that are in close contact with the heat pipes form a continuous heat conduction channel, and the heat dissipation is naturally dissipated through the contact between the heat dissipation teeth of the heat sink and the air, thereby achieving the purpose of cooling.

On the basis of the above scheme and as a preferred scheme of the above scheme, the front panel, upper panel, lower panel, left panel, right panel, rear panel and heat sink are all made of aluminum alloy, and the heat pipe is made of copper, which has the characteristics of high thermal conductivity and is conducive to accelerated cooling.

On the basis of the above scheme and as a preferred scheme of the above scheme, the front panel, upper panel, lower panel, left panel, right panel, rear panel and heat dissipation plate are all rectangular flat plate structures, which are connected by screws to form a chassis; the heat pipe is welded to the upper plate and the lower plate by brazing, so the processing technology of the chassis is simple and the structure is stable, thereby ensuring the normal operation of the heat pipe cooling chassis.

The working principle of this utility model:

The utility model discloses a 19-inch 6U heat pipe heat dissipation type chassis, comprising a chassis body, a heat pipe and a heat dissipation plate.

The box body includes a front panel, an upper panel, a lower panel, a right panel, a left panel, and a rear panel, and a number of power modules and computing modules are arranged in the box body;

The heat pipe heat dissipation chassis of the utility model buries the heat pipes into the outer sides of the upper plate and the lower plate, and the power module and the computing module inside the chassis are in close contact with the guide grooves on the inner sides of the upper and lower plates. The heat is conducted to the heat pipes through the upper and lower plates, and the heat pipes quickly conduct the heat to the heat dissipation plate, which naturally dissipates the heat through the contact between the heat dissipation teeth of the heat dissipation plate and the air, thereby taking away the heat generated by the power module and the computing module in the chassis, and effectively solving the heat dissipation problem of the high-power power module and the computing module.

The above describes in detail the preferred specific embodiments of the utility model. It should be understood that ordinary technicians in this field can make many modifications and changes based on the concept of the utility model without creative work. Therefore, all technical solutions that can be obtained by technicians in this technical field based on the concept of the utility model through logical analysis, reasoning or limited experiments on the basis of the existing technology should be within the scope of protection determined by the claims.

Claims (6)

1. The utility model provides a heat pipe heat dissipation formula machine case, includes box, heat pipe and heating panel, its characterized in that:

The box body comprises a front panel, an upper plate, a lower plate, a right side plate, a left side plate and a rear panel, and a plurality of power modules and calculation modules are arranged in the box body;

the heat pipes are fixedly arranged on the outer sides of the upper plate and the lower plate of the box body, are transversely arranged in parallel, the heat pipes are covered with the heat dissipation plates, and the power supply module and the computing module are tightly attached to guide grooves on the inner sides of the upper plate and the lower plate.

2. The heat pipe cooling type case according to claim 1, wherein the heat radiation plate has a flat and smooth contact surface with the heat pipe, and the contact surface with air adopts a dense strip tooth-shaped structure.

3. The heat pipe cooling type case according to claim 1, wherein an upper heat pipe installation groove is formed in the outer side of the upper plate, the upper heat pipe installation groove is formed in the outer side of the lower plate in a transverse parallel arrangement, the lower heat pipe installation groove is formed in the outer side of the lower plate, and the smooth plane of the heat dissipation plate is tightly attached to the heat pipes in the upper plate and the lower plate in a transverse parallel arrangement.

4. The heat pipe cooling type case according to claim 1, wherein the heat pipes in the upper and lower plates are formed by guiding grooves on the inner sides of the upper and lower plates, and the heat dissipation plates attached to the heat pipes on the upper and lower plates form a continuous heat conduction channel.

5. The heat pipe cooling type case according to claim 1, wherein the front panel, the upper plate, the lower plate, the left plate, the right plate, the rear panel and the heat dissipation plate are all made of aluminum alloy materials, and the heat pipe is made of red copper materials.

6. The heat pipe cooling type case according to claim 1, wherein the front panel, the upper plate, the lower plate, the left side plate, the right side plate, the rear panel and the heat dissipation plate are all rectangular flat plate structures, and are connected by screws to form the case; the heat pipe is welded with the upper plate and the lower plate by adopting a brazing process.