CN215735562U

CN215735562U - Embedded radiating fin and mounting structure of radiating fin and circuit board

Info

Publication number: CN215735562U
Application number: CN202122027051.1U
Authority: CN
Inventors: 余军舟
Original assignee: Taicang Xuanxu Precision Electronics Co ltd
Current assignee: Taicang Xuanxu Precision Electronics Co ltd
Priority date: 2021-08-26
Filing date: 2021-08-26
Publication date: 2022-02-01
Anticipated expiration: 2031-08-26

Abstract

The utility model discloses an embedded radiating fin and a radiating fin and circuit board mounting structure in the technical field of circuit boards, which comprises an embedded radiating fin and a circuit board, wherein clamping plates are arranged on the upper sides of four outer side walls of the embedded radiating fin, circular grooves are formed in the top of the clamping plates, clamping grooves matched with the clamping plates are formed in the upper sides of four inner side walls of the embedded grooves, threaded rods are arranged in the clamping grooves, and limiting plates matched with the through grooves are arranged at the top of the threaded rods. Thereby improving the yield of circuit board processing production.

Description

Embedded radiating fin and mounting structure of radiating fin and circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to an embedded radiating fin and an installation structure of the radiating fin and a circuit board.

Background

The circuit board is an integrated circuit module structure, and the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout. The circuit board is a component mounting carrier and a circuit connection structure in various electrical equipment, and many electronic components need to be mounted and fixed through the circuit board. Some electronic components generate more heat during working and need heat dissipation treatment, otherwise the electronic components can be burnt by self-generated high temperature, and for example, a chip needs heat dissipation treatment.

Embedding a heat sink in a circuit board to dissipate heat of an electronic component is a common heat dissipation method, and the heat sink is embedded in a cavity groove of the circuit board by mechanical pressure. Some of the existing embedded radiating fins are pressed in a cavity groove of a circuit board, and the radiating fins are not firmly installed on the circuit board and are easy to fall off from the circuit board, so that the heat dissipation of electronic components is influenced; some embedded copper heat sinks usually have wave-shaped copper teeth designed on four side walls of the heat sink to achieve the purpose of fastening in order to reinforce the heat sink and prevent the heat sink from falling off, but the wave-shaped copper teeth are extruded to remain on the surface of a circuit board during mechanical pressure assembly due to the structure, so that the yield of the circuit board is affected, and therefore, the embedded heat sink and the mounting structure of the heat sink and the circuit board are provided.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an embedded heat sink and a mounting structure of the heat sink and a circuit board to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme:

embedded radiating fin and mounting structure of radiating fin and circuit board, including embedded radiating fin and circuit board, four lateral wall upsides of embedded radiating fin all are provided with the cardboard, the circular slot has been seted up at the top of cardboard, logical groove has been seted up to the inner diapire of circular slot, the embedded groove with embedded radiating fin looks adaptation is seted up at the top of circuit board, four inside wall upsides of embedded groove all set up with the draw-in groove of cardboard looks adaptation, the inside of draw-in groove is provided with the threaded rod, the top of threaded rod is provided with and leads to the limiting plate of groove looks adaptation.

Further: the inner bottom wall of the clamping groove is provided with a threaded hole, and one end of the threaded rod is inserted in the threaded hole.

Further: the joint of the adjacent outer side walls of the embedded radiating fins is of a fillet structure.

Further: the diameter of the threaded rod is smaller than the width of the limiting plate.

Further: the two ends of the limiting plate are in a fillet structure.

Compared with the prior art, the utility model has the beneficial effects that:

1. when the embedded radiating fin is arranged in the embedded groove, the clamping plate is clamped into the clamping groove, so that the embedded radiating fin is convenient to install, meanwhile, when the clamping plate is clamped into the clamping groove, the limiting plate in the clamping groove can penetrate through the through groove formed in the clamping plate, then the limiting plate is screwed, so that the limiting plate is abutted against the inner bottom wall of the circular groove, the embedded radiating fin can be fixed, the embedded radiating fin is firmly installed, and the phenomenon of generating a tumor on the surface of a circuit board cannot occur in the installation structure, so that the yield of circuit board processing production is improved.

2. According to the utility model, after the embedded radiating fin is installed, the top of the limiting plate is flush with the top of the clamping plate, so that the flatness of the top surface of the circuit board is improved.

Drawings

FIG. 1 is a schematic view of an embedded heat sink and a structure for mounting the heat sink and a circuit board according to the present invention;

FIG. 2 is a schematic diagram of the structure of the circuit board of the embedded heat sink and the mounting structure of the heat sink and the circuit board of the present invention;

FIG. 3 is a schematic diagram of a limiting plate and a threaded rod of the mounting structure of the embedded heat sink and the circuit board according to the present invention;

in the figure: 1 embedded heat sink, 2 through grooves, 3 circular grooves, 4 clamping plates, 5 threaded rods, 6 limiting plates, 7 clamping grooves, 8 embedded grooves and 9 circuit boards.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1:

referring to fig. 1-3, the present invention provides a technical solution: the embedded radiating fin and the mounting structure of the radiating fin and the circuit board comprise the embedded radiating fin 1 and the circuit board 9, wherein the shape of the embedded radiating fin 1 is selected according to the requirement, for example, if an electronic component needing radiating is circular, the radiating fin body 1 can also be set to be a wafer-shaped structure; the electronic component needing heat dissipation is quadrilateral, the heat sink body 1 can be set to be quadrilateral sheet structure, in this embodiment, the heat sink body 1 with quadrilateral sheet structure is taken as an example for explanation, the upper sides of four outer side walls of the embedded heat sink 1 are all provided with the clamping plates 4, the clamping plates 4 are cuboid structures, the tops of the clamping plates 4 are provided with the circular grooves 3, the depths of the circular grooves 3 are equal to the thickness of the limiting plates 6, the inner bottom wall of the circular groove 3 is provided with the through groove 2, the top of the circuit board 9 is provided with the embedded groove 8 matched with the embedded heat sink 1, the upper sides of four inner side walls of the embedded groove 8 are all provided with the clamping grooves 7 matched with the clamping plates 4, the clamping grooves 7 are internally provided with the threaded rods 5, during installation, the embedded heat sink 1 is embedded into the embedded groove 8, the clamping plates 4 also enter into the corresponding clamping grooves 7, and the clamping plates 4 are installed in the clamping grooves 7, the limiting plate 6 in the clamping groove 7 penetrates through the through groove 2 formed in the clamping plate 4, after the clamping plate 4 is installed in the clamping groove 7, the bottom end face of the limiting plate 6 is higher than the inner bottom wall of the circular groove 3, the limiting plate 6 is screwed to enable the threaded rod 5 to rotate in the threaded hole, the limiting plate rotates along with the threaded rod 5 in the circular groove 3, the bottom end face of the limiting plate 6 is abutted against the inner bottom wall of the circular groove 3, the clamping plate 4 can be fixed, the embedded radiating fin 1 is fixed, the embedded radiating fin 1 can be installed more firmly by the aid of the installation structure, the phenomenon that a tumor body is generated on the surface of the circuit board 9 cannot occur by the aid of the installation structure, accordingly, the yield of processing and production of the circuit board 9 is improved, after the limiting plate 6 is screwed to enable the limiting plate 6 to abut against the inner bottom wall of the circular groove 3 (when the limiting plate 6 is screwed, the bottom of the limiting plate 6 is abutted against the inner bottom wall of the circular groove 3 by 90 degrees generally), the upper surface of limiting plate 6 and the upper surface parallel and level of cardboard 4 have improved the roughness at 9 tops of circuit board like this, and the top of threaded rod 5 is provided with the limiting plate 6 with leading to groove 2 looks adaptation.

Preferably, a threaded hole is formed in the inner bottom wall of the clamping groove 7, one end of the threaded rod 5 is inserted into the threaded hole in a threaded mode, the threaded rod 5 can be screwed down from the inside of the threaded hole, and therefore the limiting plate 6 can be detached from the circuit board 9.

Preferably, the diameter of the threaded rod 5 is smaller than the width of the limit plate 6.

Preferably, limiting plate 6 is the cuboid shape, and both ends are fillet structure, guarantees the both ends slick and sly of limiting plate 6, sets up like this and has made things convenient for twisting of limiting plate 6 to change, when twisting and changeing, only needs to press the both sides of holding limiting plate 6 and just can twist and change, sets up like this and can twist and change limiting plate 6 at any time to embedded fin 1 is conveniently dismantled at any time, has made things convenient for the dismouting of embedded fin 1.

Example 2:

referring to fig. 1-2, this embodiment differs from the first embodiment in that: the junction of the adjacent outer side walls of the embedded radiating fins 1 is of a fillet structure, so that the outer walls of the embedded radiating fins 1 are smooth, and the embedded radiating fins are easier to embed into the embedded grooves 8.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Embedded heat sink and mounting structure of fin and circuit board, including embedded fin (1) and circuit board (9), its characterized in that: four lateral wall upsides of embedded fin (1) all are provided with cardboard (4), circular slot (3) have been seted up at the top of cardboard (4), logical groove (2) have been seted up to the inner diapire of circular slot (3), embedded groove (8) with embedded fin (1) looks adaptation are seted up at the top of circuit board (9), draw-in groove (7) with cardboard (4) looks adaptation are all seted up to four inside wall upsides of embedded groove (8), the inside of draw-in groove (7) is provided with threaded rod (5), the top of threaded rod (5) is provided with limiting plate (6) with logical groove (2) looks adaptation.

2. The heat sink of claim 1, wherein: a threaded hole is formed in the inner bottom wall of the clamping groove (7), and one end of the threaded rod (5) is inserted into the threaded hole in a threaded mode.

3. The heat sink of claim 1, wherein: the joint of the adjacent outer side walls of the embedded radiating fins (1) is of a fillet structure.

4. The heat sink of claim 1, wherein: the diameter of the threaded rod (5) is smaller than the width of the limiting plate (6).

5. The heat sink of claim 1, wherein: and the two ends of the limiting plate (6) are of a fillet structure.