CN210808069U - Just, install heat dissipation circuit board - Google Patents
Just, install heat dissipation circuit board Download PDFInfo
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- CN210808069U CN210808069U CN201921874146.3U CN201921874146U CN210808069U CN 210808069 U CN210808069 U CN 210808069U CN 201921874146 U CN201921874146 U CN 201921874146U CN 210808069 U CN210808069 U CN 210808069U
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- frame
- bottom plate
- heat dissipation
- circuit board
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Abstract
The utility model discloses a just, install heat dissipation circuit board, this circuit board includes the mainboard, and can supply this mainboard sliding insert fixed heat dissipation frame, this heat dissipation frame includes the bottom plate, set firmly in the first frame of this bottom plate first side perpendicularly, set firmly the second frame of this bottom plate second side perpendicularly, and set firmly plural fin in this bottom plate bottom surface perpendicularly, this first frame medial surface is equipped with parallel with this first frame length direction, and can supply the first side sliding insert's of this mainboard first spout, this second frame medial surface is equipped with parallel with this second frame length direction, and can supply this mainboard second side sliding insert's second spout, this mainboard angular position punishment all around do not is equipped with first fixed orifices, this bottom plate angular position punishment all around do not is equipped with the second fixed orifices with this first fixed orifices corresponding position punishment.
Description
Technical Field
The utility model relates to a just, install heat dissipation circuit board.
Background
Install a plurality of electrical components on the current circuit board usually, at the in-process of electrical components circular telegram operation, electrical components can continuously produce the heat and transmit to the circuit board, and current circuit board when being fixed in electrical components, the installing support gets into the butt in direct and the electrical components usually, causes the unable outside scattering and disappearing of heat of circuit board bottom surface, and the long-time accumulation of heat causes the circuit to damage easily.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to prior art's above-mentioned defect provides a just, install heat dissipation circuit board.
The utility model provides a technical scheme that its technical problem adopted is: the heat dissipation frame comprises a bottom plate, a first frame vertically and fixedly arranged on a first side of the bottom plate, a second frame vertically and fixedly arranged on a second side of the bottom plate, and a plurality of heat dissipation fins vertically and fixedly arranged on the bottom surface of the bottom plate, wherein a first sliding groove which is parallel to the length direction of the first frame and can be used for the sliding insertion of the first side of the main plate is arranged on the inner side surface of the first frame, a second sliding groove which is parallel to the length direction of the second frame and can be used for the sliding insertion of the second side of the main plate is arranged on the inner side surface of the second frame, first fixing holes are respectively arranged at the positions of the peripheral corners of the main plate, and second fixing holes are respectively arranged at the positions of the peripheral corners of the bottom plate corresponding to the first fixing holes.
Just, install heat dissipation circuit board in, the first end top surface of this bottom plate is equipped with the first support beam column of protrusion in this bottom plate top surface, this first support beam column is perpendicular with this first frame and second frame respectively, this bottom plate second end top surface is equipped with the second support beam column of protrusion in this bottom plate top surface, this second support beam column is perpendicular with this first frame and second frame respectively, this bottom plate middle part top surface is equipped with the third support beam column of protrusion in this bottom plate top surface, this third support beam column is perpendicular with this first frame and second frame respectively.
Just, install heat dissipation circuit board in, this first support beam column, second support beam column and third support beam column top surface all with this first spout diapire bottom surface parallel and level, this first support beam column, second support beam column and third support beam column top surface all with this second spout diapire bottom surface parallel and level, this second fixed orifices sets up respectively in this first support beam column both ends and second support beam column both ends.
Just, install radiating circuit board in, the first side of this bottom plate bottom surface is equipped with the first protruding roof beam of protrusion in this bottom plate bottom surface, this bottom plate bottom surface second side is equipped with the protruding roof beam of second in this bottom plate bottom surface, this first protruding roof beam and the protruding roof beam of second are all parallel with this first frame and second frame, this second fixed orifices runs through this first protruding roof beam and the protruding roof beam of second.
In the conveniently installed heat dissipating circuit board of the present invention, the height of the first protruding beam and the second protruding beam is higher than the height of the heat dissipating fin.
In the conveniently installed heat dissipation circuit board of the present invention, a plurality of heat dissipation holes are formed in the bottom plate to penetrate through the bottom plate.
In the conveniently installed heat dissipation circuit board of the present invention, the first end of the first chute and the second end of the first chute both extend to the end surfaces of the two ends of the first frame to form a first insertion hole for the first side of the main board to be inserted in a sliding manner;
the first end of the second sliding groove and the second end of the second sliding groove both extend to the end faces of the two ends of the second frame to form a second insertion hole for the second side of the main board to be inserted in a sliding manner.
Implement the utility model discloses a just, install heat dissipation circuit board has following beneficial effect: use the utility model discloses a when just installing the radiating circuit board, when installing the circuit board, at first with mainboard sliding insertion to first spout and second spout in, then use the screw to pass first fixed orifices, second fixed orifices after be fixed in electronic equipment with mainboard and heat dissipation frame. The utility model discloses in, through setting up heat dissipation frame, after fixed mainboard, leave the heat dissipation clearance between mainboard and heat dissipation frame's the bottom plate, be favorable to the mainboard bottom surface heat outwards to scatter and disappear. Furthermore, the radiating fins are arranged on the bottom surface of the radiating frame, so that heat on the bottom surface of the main board can be further promoted to be dissipated outwards, and a better radiating effect is achieved.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a schematic structural diagram of the heat dissipation circuit board of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
As shown in fig. 1, in a first embodiment of the heat dissipating circuit board for easy installation of the present invention, the circuit board 1 includes a main board 2 and a heat dissipating frame 3 for slidably inserting and fixing the main board 2, the heat dissipation frame 3 comprises a bottom plate 4, a first frame 5 vertically fixed on a first side of the bottom plate 4, a second frame 6 vertically fixed on a second side of the bottom plate 4, and a plurality of heat dissipation fins 7 vertically fixed on the bottom surface of the bottom plate 4, a first sliding groove 8 which is parallel to the length direction of the first frame 5 and can be inserted by the first side of the main board 2 in a sliding way is arranged on the inner side surface of the first frame 5, a second sliding groove 9 which is parallel to the length direction of the second frame 6 and can be inserted by the second side of the main board 2 in a sliding way is arranged on the inner side surface of the second frame 6, the main board 2 is provided with first fixing holes 10 at the peripheral corners, and the bottom board 4 is provided with second fixing holes 11 at the peripheral corners corresponding to the first fixing holes 10.
Use the utility model discloses a just, when installing heat dissipation circuit board 1, when installing circuit board 1, at first with mainboard 2 slip insert to first spout 8 and second spout 9 in, then use the screw to pass and be fixed in electronic equipment with mainboard 2 and heat dissipation frame 3 after first fixed orifices 10, second fixed orifices 11. The utility model discloses in, through setting up heat dissipation frame 3, after fixed mainboard 2, leave the heat dissipation clearance between mainboard 2 and heat dissipation frame 3's bottom plate 4, be favorable to 2 bottom surfaces of mainboard heat outwards scattering and disappearing. Furthermore, the radiating fins 7 are arranged on the bottom surface of the radiating frame 3, so that heat on the bottom surface of the main board 2 can be further promoted to be dissipated outwards, and a better radiating effect is achieved.
It can be understood that, the utility model discloses a mainboard 2 in be the mainboard 2 of comparatively regular shape, and the preferred rectangle of 2 shapes of mainboard.
Preferably, the heat dissipation frame 3 and the heat dissipation fins 7 are formed by integrally molding a metal material having high thermal conductivity, and preferably, the heat dissipation frame 3 and the heat dissipation fins 7 are made of a copper or aluminum alloy material.
Further, for better supporting the two ends and the middle part of the main board 2, the top surface of the first end of the bottom board 4 is provided with a first supporting beam column protruding out of the top surface of the bottom board 4, the first supporting beam column is perpendicular to the first frame 5 and the second frame 6 respectively, the top surface of the second end of the bottom board 4 is provided with a second supporting beam column 12 protruding out of the top surface of the bottom board 4, the second supporting beam column 12 is perpendicular to the first frame 5 and the second frame 6 respectively, the top surface of the middle part of the bottom board 4 is provided with a third supporting beam column 13 protruding out of the top surface of the bottom board 4, and the third supporting beam column 13 is perpendicular to the first frame 5 and the second frame 6 respectively.
Specifically, the top surfaces of the first support beam column, the second support beam column 12 and the third support beam column 13 are all flush with the bottom surface of the bottom wall of the first sliding groove 8, the top surfaces of the first support beam column, the second support beam column 12 and the third support beam column 13 are all flush with the bottom surface of the bottom wall of the second sliding groove 9, and the second fixing holes 11 are respectively arranged at two ends of the first support beam column and two ends of the second support beam column 12.
Furthermore, in order to fix the heat dissipation frame 3 in the electronic device, a first protruding beam 14 protruding from the bottom surface of the bottom plate 4 is disposed on a first side of the bottom surface of the bottom plate 4, a second protruding beam 15 protruding from the bottom surface of the bottom plate 4 is disposed on a second side of the bottom surface of the bottom plate 4, the first protruding beam 14 and the second protruding beam 15 are both parallel to the first frame 5 and the second frame 6, and the second fixing hole 11 penetrates through the first protruding beam 14 and the second protruding beam 15.
Preferably, the first and second convex beams 14 and 15 have a height higher than that of the heat sink 7.
Furthermore, the bottom plate 4 is provided with a plurality of heat dissipation holes penetrating through the bottom plate 4.
In the present embodiment, the first end of the first sliding chute 8 and the second end of the first sliding chute 8 both extend to the end surfaces of the two ends of the first frame 5 to form a first insertion opening 16 for the first side of the main board 2 to be inserted in a sliding manner; the first end of the second sliding slot 9 and the second end of the second sliding slot 9 both extend to the end surfaces of the two ends of the second frame 6 to form a second insertion opening 17 for the second side of the main board 2 to be inserted in a sliding manner.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.
Claims (7)
1. A heat dissipation circuit board convenient to mount is characterized in that the circuit board comprises a mainboard and a heat dissipation frame for the mainboard to be inserted and fixed in a sliding way, the heat dissipation frame comprises a bottom plate, a first frame vertically and fixedly arranged on the first side of the bottom plate, a second frame vertically and fixedly arranged on the second side of the bottom plate, and a plurality of heat dissipation fins vertically and fixedly arranged on the bottom surface of the bottom plate, a first sliding groove which is parallel to the length direction of the first edge frame and can be inserted by the first side of the main board in a sliding way is arranged on the inner side surface of the first edge frame, a second sliding groove which is parallel to the length direction of the second frame and can be used for the sliding insertion of the second side of the main board is arranged on the inner side surface of the second frame, first fixing holes are respectively formed in the positions of the peripheral corners of the main board, and second fixing holes are respectively formed in the positions of the peripheral corners of the bottom board, corresponding to the first fixing holes.
2. The circuit board convenient for installation and heat dissipation of claim 1, wherein the top surface of the first end of the bottom plate is provided with first supporting beams protruding from the top surface of the bottom plate, the first supporting beams are perpendicular to the first frame and the second frame, respectively, the top surface of the second end of the bottom plate is provided with second supporting beams protruding from the top surface of the bottom plate, the second supporting beams are perpendicular to the first frame and the second frame, respectively, the top surface of the middle part of the bottom plate is provided with third supporting beams protruding from the top surface of the bottom plate, and the third supporting beams are perpendicular to the first frame and the second frame, respectively.
3. The circuit board convenient for installation and heat dissipation of claim 2, wherein the top surfaces of the first support beam column, the second support beam column and the third support beam column are all flush with the bottom surface of the first sliding groove bottom wall, the top surfaces of the first support beam column, the second support beam column and the third support beam column are all flush with the bottom surface of the second sliding groove bottom wall, and the second fixing holes are respectively formed at two ends of the first support beam column and two ends of the second support beam column.
4. The circuit board convenient for installation and heat dissipation of claim 1, wherein a first protruding beam protruding from the bottom surface of the bottom plate is disposed on a first side of the bottom surface of the bottom plate, a second protruding beam protruding from the bottom surface of the bottom plate is disposed on a second side of the bottom surface of the bottom plate, the first protruding beam and the second protruding beam are parallel to the first frame and the second frame, and the second fixing hole penetrates through the first protruding beam and the second protruding beam.
5. The easy-to-mount heat dissipating circuit board of claim 4, wherein the first and second convex beams have a height higher than a height of the heat sink.
6. The circuit board of claim 1, wherein the base plate has a plurality of heat dissipation holes formed therethrough.
7. The circuit board of claim 1, wherein the first sliding slot first end and the first sliding slot second end extend to the end surfaces of the two ends of the first frame to form a first insertion opening for the first side of the motherboard to be inserted;
and the first end of the second sliding groove and the second end of the second sliding groove both extend to the end faces of the two ends of the second frame to form a second insertion hole for the sliding insertion of the second side of the main board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921874146.3U CN210808069U (en) | 2019-10-31 | 2019-10-31 | Just, install heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921874146.3U CN210808069U (en) | 2019-10-31 | 2019-10-31 | Just, install heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210808069U true CN210808069U (en) | 2020-06-19 |
Family
ID=71230338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921874146.3U Active CN210808069U (en) | 2019-10-31 | 2019-10-31 | Just, install heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210808069U (en) |
-
2019
- 2019-10-31 CN CN201921874146.3U patent/CN210808069U/en active Active
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