CN215581871U - Press fit structure of small-spacing LED module board - Google Patents

Abstract

The utility model discloses a press-fit structure of a small-spacing LED module board, which comprises a core board, a first inner copper layer, a second inner copper layer, a device surface copper layer, a second PP layer and a lamp bead surface copper layer, wherein the core board is provided with a first inner copper layer and a second inner copper layer; the first inner copper layer is laminated on the front surface of the core board, and the second inner copper layer is laminated on the back surface of the core board; the first PP layer is pressed on one surface of the first inner copper layer, which is back to the core plate; the device surface copper layer is laminated on one surface of the first PP layer, which is back to the first inner layer copper layer; according to the utility model, the residual copper rate of the device surface and the bead mounting surface is reasonably designed, PP layers with different thicknesses are designed on the inner layer, an asymmetric pressing structure is obtained, and a unidirectional acting force opposite to the original bending direction of the product is provided for the product, so that the purpose of balancing the warping of the PCB is achieved, and the service life of the product is ensured.

Description

Press fit structure of small-spacing LED module board

Technical Field

The utility model belongs to the technical field of LED modules, and particularly relates to a pressing structure of small-spacing LED module plates.

Background

The LED lamp panel module is widely applied to LED large screens of commercial performances, stadiums, finger control centers and the like. The large screen is generally formed by seamlessly splicing a plurality of single plates, and the size of each single plate is generally more than 300 mm. Along with the promotion of people to the electronic product definition requirement, the lamp pearl of the same area design develops towards denser direction on the LED lamp plate, and this just leads to bearing the residual copper rate difference that the top face (device face) of the PCB board that lamp pearl and device used and bottom face (lamp pearl subsides dress face) are different bigger and bigger.

Especially on the booth apart from the module, the intensive degree of lamp pearl design is high, leads to the bottom face to walk and can't promote incomplete copper rate through spreading copper between the line. For example, on a PCB board with the distance between adjacent lamp beads pitch being 1.25mm, the copper residue rate on the top surface is 94%, the copper residue rate on the bottom surface is 46%, and the difference between the copper residue rates on the two surfaces is close to 50%. This can lead to the PCB to be heated, the deformation degree difference of cooling in-process two sides is big toasting, finally causes the board to warp and can't satisfy 0.5%, can't satisfy seamless concatenation's requirement. In addition, 6 to 7 ten thousand LED lamp pearls are generally welded on the single board, the lamp pearls are lightened, operated and extinguished in the using process of a product along with the change of temperature, if the PCB is used as a bearing plate, the service life of the product can be influenced by the bending resistance, and higher requirements are provided for the bending resistance and the bending resistance of the PCB of the LED module.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a small-spacing LED module board laminating structure, by reasonably designing the residual copper rate of a device surface and a lamp bead attaching surface, PP layers with different thicknesses are designed on an inner layer, the PP layers with different thicknesses have different thermal expansion coefficients, the obtained asymmetric laminating structure can provide a one-way acting force for a product, and the acting force is opposite to the original bending direction of the product, so that the purpose of balancing the warping of a PCB is achieved, and the problem provided by the background technology is solved.

In order to achieve the purpose, the utility model provides the following technical scheme:

a pressfitting structure of booth apart from LED module board includes:

the front surface of the core board is provided with a first inner copper layer, and the back surface of the core board is provided with a second inner copper layer;

the first PP layer is arranged on one surface, opposite to the core board, of the first inner copper layer;

the device surface copper layer is arranged on one surface, back to the first inner layer copper layer, of the first PP layer;

the second PP layer is arranged on one surface, opposite to the core board, of the second inner copper layer;

the lamp bead surface copper layer is arranged on one surface, back to the second inner copper layer, of the second PP layer.

In the press-fit structure of the small-spacing LED module board, preferably, the residual copper rate of the device surface copper layer after etching is 86-96%.

According to the press-fit structure of the small-spacing LED module board, the residual copper rate after the copper layer of the lamp bead surface-mounted surface is etched is preferably 34% -50%.

Further, the thickness of the first PP layer (2) is smaller than that of the second PP layer (6).

Above-mentioned pressfitting structure of close apart from LED module board, preferred, the thickness of first PP layer is 35-45 um.

In the press-fit structure of the small-spacing LED module board, preferably, the thickness of the second PP layer is 60-100 um.

The press fit structure of the small-spacing LED module board is further characterized in that the thickness of the first inner copper layer and the thickness of the second inner copper layer are both 27-37 um.

Compared with the prior art, the utility model has the beneficial effects that:

the utility model provides a small-spacing LED module board pressing structure which is composed of a core board, a first inner copper layer, a second inner copper layer, a device surface copper layer, a second PP layer and a lamp bead mounting surface copper layer, wherein the residual copper rate of the device surface copper layer after etching is 86% -96%, the residual copper rate of the lamp bead mounting surface copper layer after etching is 34% -50%, the thickness of the first PP layer is 35-45um, the thickness of the second PP layer is 60-100um, the thickness of the first inner copper layer and the thickness of the second copper layer are both 27-37um, PP layers with different thicknesses are designed on the inner layers by reasonably designing the residual copper rates of the device surface and the lamp bead mounting surface, the asymmetric pressing structure can provide a unidirectional acting force, and the acting force is opposite to the original bending direction of a product, so that the purpose of balancing a PCB board is achieved, thereby ensuring the service life of the product.

Drawings

Fig. 1 is a schematic structural diagram of a pressing structure of a small-pitch LED module board according to the present invention.

In the figure: 1. a device surface copper layer; 2. a first PP layer; 3. a first inner copper layer; 4. a core board; 5. a second inner copper layer; 6. a second PP layer; 7. the lamp bead is provided with a surface copper layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the present invention provides the following technical solutions:

as shown in fig. 1, a press-fit structure of a small-pitch LED module board includes: the lamp bead surface copper layer comprises a core plate 4, a first inner copper layer 3, a second inner copper layer 5, a device surface copper layer 1, a second PP layer 6 and a lamp bead surface copper layer 7.

Wherein, the first inner copper layer 3 is pressed on the front surface of the core plate 4, and the second inner copper layer 5 is pressed on the back surface of the core plate 4;

the first PP layer 2 is pressed on one surface of the first inner copper layer 3, which is back to the core plate 4;

the device surface copper layer 1 is pressed on one surface of the first PP layer 2 back to the first inner layer copper layer 3;

the second PP layer 6 is pressed on one surface of the second inner copper layer 5, which is back to the core plate 4;

and a lamp bead attaching surface copper layer 7 is pressed on one surface of the second PP layer 6, which is back to the second inner copper layer 5.

Specifically, in order to eliminate the warpage degree by utilizing the difference of acting force between the device surface copper layer 1 and the lamp bead mounting surface copper layer 7 with different residual copper rates, the residual copper rate of the device surface copper layer 1 after etching is limited to 86% -96%, and the residual copper rate of the lamp bead mounting surface copper layer 7 after etching is limited to 34% -50%.

In order to utilize the difference of the thermal expansion coefficients of the PP layers with different thicknesses, the thickness of the first PP layer 2 is set to be 35-45um, and the thickness of the second PP layer 6 is set to be 60-100um, so that the obtained asymmetric pressing structure can provide a one-way acting force for a product, and the acting force is opposite to the original bending direction of the product.

In order to ensure the thickness of the first inner copper layer 3 and the conductivity of the second inner copper layer 5, the thickness of the first inner copper layer 3 and the thickness of the second inner copper layer 5 are both set to be 27-37 um.

In the embodiment of the utility model, when the residual copper rate after etching the device surface copper layer 1 is set to 94%, the residual copper rate after etching the lamp bead attaching surface copper layer 7 is set to 46%, at this time, the thickness of the first PP layer 2 is set to 40um, the thickness of the second PP layer 6 is 62um, the thickness of the first inner layer copper layer 3 is set to 30um, the thickness of the second inner layer copper layer 5 is 30um, the LED module board with the asymmetric pressing structure can provide a unidirectional acting force for a product, and the acting force is opposite to the original bending direction of the product, so that the purpose of balancing the warping of the PCB board is achieved, and the service life of the product is ensured.

The parts not involved in the present invention are the same as or can be implemented by the prior art. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a pressfitting structure of booth apart from LED module board which characterized in that includes:

the core plate (4), the front of the core plate (4) is provided with a first inner copper layer (3), and the back of the core plate (4) is provided with a second inner copper layer (5);

a first PP layer (2), wherein the first PP layer (2) is arranged on one surface, facing away from the core plate (4), of the first inner copper layer (3);

the device surface copper layer (1), wherein the device surface copper layer (1) is arranged on one surface of the first PP layer (2) opposite to the first inner layer copper layer (3);

a second PP layer (6), wherein the second PP layer (6) is arranged on one surface, facing away from the core plate (4), of the second inner copper layer (5);

the lamp bead is provided with a surface copper layer (7), and the surface copper layer (7) is arranged on one surface of the second PP layer (6) back to the second inner copper layer (5).

2. The small-pitch LED module board press-fit structure according to claim 1, wherein: the residual copper rate of the device surface copper layer (1) after etching is 86% -96%.

3. The small-pitch LED module board press-fit structure according to claim 2, wherein: the residual copper rate of the copper layer (7) of the bead mounting surface after etching is 34-50%.

4. The small-pitch LED module board press-fit structure according to claim 3, wherein: the thickness of the first PP layer (2) is less than the thickness of the second PP layer (6).

5. The small-pitch LED module board pressing structure according to claim 4, wherein: the thickness of the first PP layer (2) is 35-45 um.

6. The pressing structure of the small-pitch LED module board as claimed in claim 4 or 5, wherein: the thickness of the second PP layer (6) is 60-100 um.

7. The small-pitch LED module board press-fit structure according to claim 6, wherein: the thickness of the first inner copper layer (3) and the thickness of the second inner copper layer (5) are both 27-37 um.

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