CN215578537U

CN215578537U - Surface mount diode with hidden welding leg

Info

Publication number: CN215578537U
Application number: CN202121703645.3U
Authority: CN
Inventors: 李振兴
Original assignee: Heyuan Chuangji Electronic Technology Co ltd
Current assignee: Heyuan Chuangji Electronic Technology Co ltd
Priority date: 2021-07-26
Filing date: 2021-07-26
Publication date: 2022-01-18
Anticipated expiration: 2031-07-26

Abstract

The utility model provides a chip diode with hidden welding feet, which comprises a plastic package body, wherein a diode chip, a first current conducting plate and a second current conducting plate are arranged in the plastic package body, the first current conducting plate comprises a first current conducting part and a first bending part, a first sliding contact part is arranged in a first slide way, the lower end of the first sliding contact part is connected with a first welding part, the second current conducting plate comprises a second current conducting part and a second bending part, a second sliding contact part is arranged in a second slide way, and the lower end of the second sliding contact part is connected with a second welding part. According to the chip diode, the first welding part and the second welding part are arranged at the bottom of the plastic package body and can be hidden inside the first accommodating groove and the second accommodating groove after welding, so that the first welding part and the second welding part are prevented from being exposed outside, and the waterproof performance of the chip diode is improved.

Description

Surface mount diode with hidden welding leg

Technical Field

The utility model relates to the technical field of diodes, in particular to a surface mount diode with hidden welding pins.

Background

The diode is also called a crystal diode, and is called a diode for short. Among electronic components, a device having two electrodes allows current to flow only in a single direction, and many applications use the rectifying function thereof. The most common function of a diode is to allow current to pass in only one direction, known as forward bias, and to block in the reverse direction, known as reverse bias. Thus, the diode can be thought of as an electronic version of the check valve. A part of the semiconductor silicon or germanium is doped with a trace of trivalent element boron to form a P type semiconductor, and the other part of the semiconductor silicon or germanium is doped with a trace of pentavalent element phosphorus to form an N type semiconductor. A PN junction is formed at the junction of the P-type and N-type semiconductors. A PN junction is a diode, a lead wire of a P area is called an anode, and a lead wire of an N area is called a cathode. In the patch diode of the prior art, two pins are generally exposed outside, so that the waterproof performance of the patch diode is poor.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the utility model provides a surface mount diode with hidden solder tails, wherein a first welding part and a second welding part are arranged at the bottom of a plastic package body and can be hidden inside a first accommodating groove and a second accommodating groove after welding, so that the first welding part and the second welding part are prevented from being exposed outside, and the waterproof performance of the surface mount diode is improved.

In order to achieve the purpose, the utility model is solved by the following technical scheme:

a chip diode with hidden welding feet comprises a plastic package body, wherein a diode chip, a first current conducting plate and a second current conducting plate are arranged in the plastic package body, the lower end of the diode chip is connected with the first current conducting plate, a conducting wire is connected between the diode chip and the second current conducting plate, the first current conducting plate comprises a first current conducting part and a first bending part, a first slide way is arranged on one side of the first bending part, a first sliding contact part is arranged in the first slide way, the lower end of the first sliding contact part is connected with a first welding part, the upper end of the first sliding contact part is connected with a first sliding plate, a first screw hole is formed in one end of the first sliding plate, a first screw matched with the first screw hole is formed in the upper end of the plastic package body, the second current conducting plate comprises a second current conducting part and a second bending part, and a second slide way is arranged on one side of the second bending part, and a second sliding contact part is arranged in the second slide way, the lower end of the second sliding contact part is connected with a second welding part, the upper end of the second sliding contact part is connected with a second sliding plate, one end of the second sliding plate is provided with a second screw hole, and the upper end of the plastic package body is provided with a second screw matched with the second screw hole.

Specifically, first screw bottom is connected with first stopper, first screw outside cover is equipped with first spacing collar.

Specifically, a first cavity for the first sliding plate to slide is formed in the plastic package body.

Specifically, the bottom of the second screw is connected with a second limiting block, and a second limiting ring is sleeved on the outer side of the second screw.

Specifically, a second cavity for the second sliding plate to slide is arranged in the plastic package body.

Specifically, the lower end of the plastic package body is provided with a first accommodating groove and a second accommodating groove for accommodating the first welding part and the second welding part respectively.

Specifically, the bottom of the plastic package body is further provided with a waterproof gasket.

The utility model has the beneficial effects that:

according to the chip diode, the first welding part and the second welding part are arranged at the bottom of the plastic package body and can be hidden inside the first accommodating groove and the second accommodating groove after welding, so that the first welding part and the second welding part are prevented from being exposed outside, the waterproof gasket is additionally arranged at the bottom of the plastic package body, and the waterproof performance of the chip diode is improved.

Drawings

Fig. 1 is a first perspective view of a pad diode with hidden solder tails according to the present invention.

Fig. 2 is a second perspective view of a chip diode with hidden solder tails according to the present invention.

Fig. 3 is a top view of a hidden-leg chip diode according to the present invention.

Fig. 4 is a cross-sectional view taken along the plane a-a in fig. 3.

Fig. 5 is a schematic structural view of the first welding part and the second welding part after extending downwards, and the purpose of the extending state is to facilitate welding.

The reference signs are: the diode package structure comprises a plastic package body 1, a first cavity 11, a second cavity 12, a first accommodating groove 13, a second accommodating groove 14, a diode chip 2, a first conductive plate 3, a first conductive part 31, a first bent part 32, a second conductive plate 4, a second conductive part 41, a second bent part 42, a lead 5, a first sliding contact part 61, a first welding part 62, a first sliding plate 63, a first screw 64, a first limit block 65, a first limit ring 66, a second sliding contact part 71, a second welding part 72, a second sliding plate 73, a second screw 74, a second limit block 75, a second limit ring 76 and a waterproof gasket 8.

Detailed Description

The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1-5:

a chip diode with hidden welding feet comprises a plastic package body 1, a diode chip 2, a first current conducting plate 3 and a second current conducting plate 4 are arranged in the plastic package body 1, the lower end of the diode chip 2 is connected with the first current conducting plate 3, a lead 5 is connected between the diode chip 2 and the second current conducting plate 4, the first current conducting plate 3 comprises a first current conducting part 31 and a first bending part 32, one side of the first bending part 32 is provided with a first slide way, a first sliding contact part 61 is arranged in the first slide way, the lower end of the first sliding contact part 61 is connected with a first welding part 62, the upper end of the first sliding contact part 61 is connected with a first sliding plate 63, one end of the first sliding plate 63 is provided with a first screw hole, the upper end of the plastic package body 1 is provided with a first screw 64 matched with the first screw hole, the second current conducting plate 4 comprises a second current conducting part 41 and a second bending part 42, one side of the second bending part 42 is provided with a second slide way, a second sliding contact part 71 is arranged in the second slide way, the lower end of the second sliding contact portion 71 is connected with a second welding portion 72, the upper end of the second sliding contact portion 71 is connected with a second sliding plate 73, one end of the second sliding plate 73 is provided with a second screw hole, the upper end of the plastic package body 1 is provided with a second screw 74 matched with the second screw hole, the lower end of the plastic package body 1 is provided with a first accommodating groove 13 and a second accommodating groove 14 for accommodating the first welding portion 62 and the second welding portion 72 respectively, before welding, a screwdriver needs to be used for rotating the first screw 64 and the second screw 74 to enable the first welding portion 62 and the second welding portion 72 to extend out of the lower side of the plastic package body 1, so that the first welding portion 62 and the second welding portion 72 can be conveniently welded on a circuit board, and after welding is completed, the screwdriver rotates the first screw 64 and the second screw 74 to enable the first welding portion 62 and the second welding portion 72 to be hidden inside the first accommodating groove 13 and the second accommodating groove 14.

Preferably, the bottom of the first screw 64 is connected with a first limiting block 65, and the outer side of the first screw 64 is sleeved with a first limiting ring 66.

Preferably, the plastic package body 1 is provided with a first cavity 11 for the first sliding plate 63 to slide.

Preferably, the bottom of the second screw 74 is connected with a second limiting block 75, and a second limiting ring 76 is sleeved on the outer side of the second screw 74.

Preferably, the plastic package body 1 is provided with a second cavity 12 for the second sliding plate 73 to slide.

Preferably, in order to improve the waterproof capability of the bottom of the plastic package body 1, a waterproof gasket 8 is further arranged at the bottom of the plastic package body 1.

The above examples only show 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A patch diode with hidden welding feet is characterized by comprising a plastic package body (1), wherein a diode chip (2), a first conductive plate (3) and a second conductive plate (4) are arranged in the plastic package body (1), the lower end of the diode chip (2) is connected with the first conductive plate (3), a lead (5) is connected between the diode chip (2) and the second conductive plate (4), the first conductive plate (3) comprises a first conductive part (31) and a first bent part (32), a first slideway is arranged on one side of the first bent part (32), a first sliding contact part (61) is arranged in the first slideway, the lower end of the first sliding contact part (61) is connected with a first welding part (62), a first sliding plate (63) is connected to the upper end of the first sliding contact part (61), and a first screw hole is formed in one end of the first sliding plate (63), the plastic package body (1) upper end be equipped with first screw matched with first screw (64), second current conducting plate (4) are equipped with second sliding contact portion (71) including second conductive part (41), second kink (42) one side, be equipped with second sliding contact portion (71) in the second sliding way, second sliding contact portion (71) lower extreme is connected with second welding portion (72), second sliding contact portion (71) upper end is connected with second sliding plate (73), second sliding plate (73) one end is equipped with the second screw, plastic package body (1) upper end be equipped with second screw matched with second screw (74).

2. The chip diode with hidden solder tails according to claim 1, wherein a first limiting block (65) is connected to the bottom of the first screw (64), and a first limiting ring (66) is sleeved on the outer side of the first screw (64).

3. The hidden-leg chip diode according to claim 1, wherein the plastic package body (1) is provided with a first cavity (11) for the first sliding plate (63) to slide.

4. The chip diode with hidden solder tails according to claim 1, wherein a second limiting block (75) is connected to the bottom of the second screw (74), and a second limiting ring (76) is sleeved on the outer side of the second screw (74).

5. The hidden-leg chip diode according to claim 1, wherein the plastic package body (1) is provided with a second cavity (12) for the second sliding plate (73) to slide.

6. The chip diode with hidden solder tails according to claim 1, wherein the lower end of the plastic package body (1) is provided with a first receiving groove (13) and a second receiving groove (14) for receiving the first soldering portion (62) and the second soldering portion (72), respectively.

7. The hidden-leg patch diode as claimed in claim 1, wherein the bottom of the plastic package body (1) is further provided with a waterproof gasket (8).