CN212322980U - Dustproof paster diode of easy equipment - Google Patents
Dustproof paster diode of easy equipment Download PDFInfo
- Publication number
- CN212322980U CN212322980U CN202021335966.8U CN202021335966U CN212322980U CN 212322980 U CN212322980 U CN 212322980U CN 202021335966 U CN202021335966 U CN 202021335966U CN 212322980 U CN212322980 U CN 212322980U
- Authority
- CN
- China
- Prior art keywords
- diode
- dustproof
- insulating plastic
- chip
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000428 dust Substances 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a paster diode of dustproof easy equipment, including the insulating plastic-sealed body, be equipped with the diode chip in the insulating plastic-sealed body, diode chip both sides are equipped with the pin respectively, the pin includes conductive part, kink, contact site, be equipped with a locating hole on the contact site, be equipped with the mounting hole that link up from top to bottom on the insulating plastic-sealed body, the mounting hole is located directly over the locating hole, still be equipped with the locating pin in the mounting hole, the locating pin lower extreme passes the locating hole, insulating plastic-sealed body upper end still is equipped with the shield, four edges of shield all are equipped with and are the collection dirt portion of upwards buckling. The utility model discloses a paster diode through the cooperation installation of screw on locating pin and the circuit board, has replaced traditional welded type structure, and the packaging efficiency is higher to increased a shield, had excellent dustproof effect.
Description
Technical Field
The utility model relates to a diode technical field, concretely relates to dustproof paster diode of easily assembling.
Background
The diode is also called a crystal diode, and is called a diode for short. Among electronic components, a device having two electrodes allows current to flow only in a single direction, and many applications use the rectifying function thereof. The most common function of a diode is to allow current to pass in only one direction, referred to as forward bias, and to block in the reverse direction, referred to as reverse bias. Thus, the diode can be thought of as an electronic version of the check valve. A part of the semiconductor silicon or germanium is doped with a trace of trivalent element boron to form a P type semiconductor, and the other part of the semiconductor silicon or germanium is doped with a trace of pentavalent element phosphorus to form an N type semiconductor. A PN junction is formed at the junction of the P-type and N-type semiconductors. A PN junction is a diode, a lead wire of a P area is called an anode, and a lead wire of an N area is called a cathode.
The chip diode is one of the diodes, the chip diode in the prior art usually comprises a diode chip, two pins and a plastic package shell, the two pins are required to be welded on a circuit board during installation, the welding process is complex, the processing efficiency is low, the chip diode and the circuit board are connected into a whole after welding, and if the chip diode is damaged and needs to be replaced, the replacement difficulty is high. On the other hand, after the chip diode is mounted, in order to prevent dust from being accumulated on the surface of the chip diode, the plastic package casing is usually designed to have a structure with an inclined plane at the edge of the upper end, so that the dust accumulation prevention effect is achieved, however, dust is easy to deposit in a gap between the chip diode and the circuit board after falling, and is difficult to clean.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a dustproof paster diode of easy equipment has replaced traditional welded type structure through the cooperation installation of screw on locating pin and the circuit board, and packaging efficiency is higher to increased a shield, had excellent dustproof effect.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a paster diode of dustproof easy equipment, includes the insulating plastic-sealed body, be equipped with the diode chip in the insulating plastic-sealed body, diode chip both sides are equipped with the pin respectively, the pin include with diode chip electric connection's conductive part, connect conductive part one end and the kink of buckling downwards, connect the kink lower extreme just lean on to the contact site of diode chip lateral buckling, be equipped with a locating hole in the contact site, be equipped with the mounting hole that link up from top to bottom on the insulating plastic-sealed body, the mounting hole is located directly over the locating hole, still be equipped with the locating pin in the mounting hole, the locating pin lower extreme passes the locating hole, insulating plastic-sealed body upper end still is equipped with the shield, four edges of shield all are equipped with the collection dirt portion that is upwards buckling.
Specifically, the inner side of the dustproof cover is further provided with a guide lug, and the outer side of the insulation plastic package body is provided with a guide groove for the guide lug to slide.
Specifically, an avoiding groove for the positioning pin to pass through is formed in one end of the conductive part.
Specifically, the locating pin includes the head, connects first pole portion, the connection of head lower extreme are in second pole portion of first pole portion lower extreme, the external diameter of first pole portion is greater than the external diameter of second pole portion, second pole portion lower extreme outside still is equipped with the external screw thread.
Specifically, the diode chip is connected with the pins through gold wires.
The utility model has the advantages that:
the utility model discloses a paster diode through the cooperation installation of screw on locating pin and the circuit board, has replaced traditional welded type structure, and packaging efficiency is higher to increased a shield, four edges of shield all are equipped with the collection dirt portion that is upwards buckling, utilize collection dirt portion to collect the dust, prevent that the dust from dropping in the clearance between paster diode and the circuit board, have excellent dustproof effect.
Drawings
Fig. 1 is a schematic structural diagram of a dustproof patch diode easy to assemble according to the present invention.
Fig. 2 is a schematic structural diagram of a dustproof patch diode easy to assemble according to the present invention.
Fig. 3 is the structure diagram of the middle diode chip, the pin, and the positioning pin of the present invention.
Fig. 4 is a schematic structural diagram of the chip diode and the circuit board of the present invention.
The reference signs are: the diode chip comprises an insulating plastic package body 1, a guide groove 11, a diode chip 2, a pin 3, a conductive part 31, an avoiding groove 311, a bending part 32, a contact part 33, a positioning hole 331, a positioning pin 4, a head part 41, a first rod part 42, a second rod part 43, a dust cover 5, a dust collection part 51, a guide bump 52, a circuit board 6, a circuit 61 and a screw hole 62.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in FIGS. 1-4:
a dustproof patch diode easy to assemble comprises an insulating plastic package body 1, a diode chip 2 is arranged in the insulating plastic package body 1, two sides of the diode chip 2 are respectively provided with a pin 3, the pin 3 comprises a conductive part 31 electrically connected with the diode chip 2, a bending part 32 connected with one end of the conductive part 31 and bent downwards, and a contact part 33 connected with the lower end of the bending part 32 and bent towards one side of the diode chip 2, the contact part 33 is provided with a positioning hole 331, the insulating plastic package body 1 is provided with a mounting hole which is communicated up and down, the mounting hole is positioned right above the positioning hole 331, a positioning pin 4 is further arranged in the mounting hole, the lower end of the positioning pin 4 passes through the positioning hole 331, the upper end of the insulating plastic package body 1 is further provided with a dustproof cover 5, four edges of the dustproof cover 5 are respectively provided with a dust collecting part 51 bent upwards, and two screw holes, place insulating plastic-sealed body 1 on circuit board 6 earlier, utilize the cooperation of locating pin 4 and screw 62, make insulating plastic-sealed body 1's rigidity, accomplish insulating plastic-sealed body 1's fixed back, pad position contact on two contact site 33 and the circuit 61, thereby realize that the electrical property of two contact sites 33 and circuit 61 switches on, install shield 5 in insulating plastic-sealed body 1 upper end at last, in the practical application process, because collection dirt portion 51 is the structure of upwards buckling, can collect the dust in collection dirt portion 51 upside, prevent that the dust from dropping to in the clearance between paster diode and the circuit board 6, thereby made things convenient for paster diode's washing.
Preferably, in order to make the dust cap 5 easier to mount and less likely to fall off, the inner side of the dust cap 5 is further provided with a guide projection 52, and the outer side of the insulating plastic package 1 is provided with a guide groove 11 for the guide projection 52 to slide.
Preferably, the positioning pin 4 is made of a metal material, and in order to avoid the positioning pin 4 from affecting the normal conduction of the pin 3, one end of the conductive portion 31 is provided with a relief groove 311 for the positioning pin 4 to pass through.
Preferably, the positioning pin 4 includes a head portion 41, a first rod portion 42 connected to the lower end of the head portion 41, and a second rod portion 43 connected to the lower end of the first rod portion 42, the outer diameter of the first rod portion 42 is larger than the outer diameter of the second rod portion 43, the outer side of the lower end of the second rod portion 43 is further provided with an external thread, the diameter of the mounting hole is also larger than the diameter of the positioning hole 331, when the positioning pin 4 is inserted downwards for mounting, the contact portion 33 can be attached to the circuit 61 of the circuit board 6 more closely by the pushing action of the first rod portion 42, and thus the stability of the electrical contact between the pin 3 and the circuit 61.
Preferably, the diode chip 2 and the lead 3 are connected by gold wire.
The above examples only represent 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. A dustproof and easily-assembled surface mount diode is characterized by comprising an insulating plastic package body (1), wherein a diode chip (2) is arranged in the insulating plastic package body (1), pins (3) are respectively arranged on two sides of the diode chip (2), each pin (3) comprises a conductive part (31) electrically connected with the diode chip (2), a bent part (32) connected with one end of the conductive part (31) and bent downwards, and a contact part (33) connected with the lower end of the bent part (32) and bent towards one side of the diode chip (2), a positioning hole (331) is formed in the contact part (33), a vertically-through mounting hole is formed in the insulating plastic package body (1), the mounting hole is located right above the positioning hole (331), a positioning pin (4) is further arranged in the mounting hole, and the lower end of the positioning pin (4) penetrates through the positioning hole (331), the upper end of the insulation plastic package body (1) is further provided with a dustproof cover (5), and four edges of the dustproof cover (5) are provided with dust collecting parts (51) which are bent upwards.
2. The dustproof and easy-to-assemble chip diode according to claim 1, wherein a guide protrusion (52) is further provided on the inner side of the dustproof cover (5), and a guide groove (11) for the guide protrusion (52) to slide is provided on the outer side of the insulation plastic package body (1).
3. The dustproof and easy-to-assemble chip diode according to claim 1, wherein an avoiding groove (311) for the positioning pin (4) to pass through is formed at one end of the conductive portion (31).
4. The dustproof and easy-to-assemble patch diode according to claim 1, wherein the positioning pin (4) comprises a head portion (41), a first rod portion (42) connected to the lower end of the head portion (41), and a second rod portion (43) connected to the lower end of the first rod portion (42), the outer diameter of the first rod portion (42) is larger than that of the second rod portion (43), and the outer side of the lower end of the second rod portion (43) is further provided with an external thread.
5. The dustproof and easy-to-assemble chip diode as claimed in claim 1, wherein the diode chip (2) and the leads (3) are connected by gold wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021335966.8U CN212322980U (en) | 2020-07-09 | 2020-07-09 | Dustproof paster diode of easy equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021335966.8U CN212322980U (en) | 2020-07-09 | 2020-07-09 | Dustproof paster diode of easy equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212322980U true CN212322980U (en) | 2021-01-08 |
Family
ID=74026993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021335966.8U Active CN212322980U (en) | 2020-07-09 | 2020-07-09 | Dustproof paster diode of easy equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212322980U (en) |
-
2020
- 2020-07-09 CN CN202021335966.8U patent/CN212322980U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105957888B (en) | Crimping type IGBT sub-module and IGBT module packaging structure | |
| CN103824853A (en) | Integrated circuit module applied to switch type regulator | |
| CN212322980U (en) | Dustproof paster diode of easy equipment | |
| EP3179627B1 (en) | Photovoltaic junction box | |
| CN214428628U (en) | Height-adjustable schottky diode | |
| KR100698350B1 (en) | Receiving optics and photosemiconductor device having the same | |
| CN113192938B (en) | Large-current non-polar Schottky diode | |
| CN205723548U (en) | A kind of compression joint type IGBT submodule group and IGBT module encapsulating structure | |
| CN210956687U (en) | Long-life paster diode structure | |
| CN212485341U (en) | Welding-free surface-mounted diode structure | |
| CN215578537U (en) | Surface mount diode with hidden welding leg | |
| CN104600175A (en) | Flip LED (light-emitting diode) substrate component and flip LED packaging component | |
| CN219246668U (en) | Novel double-crystal frame structure of diode | |
| CN219610417U (en) | Combined type patch diode | |
| CN213716890U (en) | Stable in structure's schottky diode | |
| CN218957715U (en) | Plug-in positioning type diode structure | |
| CN212322978U (en) | Paster diode that many pins selectivity switched on | |
| CN211719574U (en) | Paster diode component easy to install | |
| CN214384751U (en) | High-power diode easy to process | |
| CN215731734U (en) | Patch diode capable of being welded in multiple directions | |
| CN212322983U (en) | Radiating paster diode | |
| CN212517189U (en) | Novel common cathode diode packaging structure | |
| CN117457612A (en) | Chip packaging structure and chip packaging body | |
| CN215731676U (en) | Ultra-thin type paster diode | |
| CN218849462U (en) | Diode structure with pins capable of being repeatedly installed |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231124 Address after: 523430 Building 1 and 2, No. 70, Liaobu Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee after: Xianzhike semiconductor technology (Dongguan) Co.,Ltd. Address before: 523430 Room 102, building 1, 76 Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee before: Mutual Creation (Dongguan) Electronic Technology Co.,Ltd. |