CN212322978U - Paster diode that many pins selectivity switched on - Google Patents
Paster diode that many pins selectivity switched on Download PDFInfo
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- CN212322978U CN212322978U CN202021336606.XU CN202021336606U CN212322978U CN 212322978 U CN212322978 U CN 212322978U CN 202021336606 U CN202021336606 U CN 202021336606U CN 212322978 U CN212322978 U CN 212322978U
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- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 241000218202 Coptis Species 0.000 claims abstract description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
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Abstract
The utility model provides a many pins selectivity conduction's paster diode, be in including ceramic base, cover the insulating plastic-sealed body of ceramic base upside, ceramic base upper end middle part is equipped with a storage tank, diode chip has been placed in the storage tank, diode chip includes P district, N district, ceramic base upper end left and right sides is equipped with a first open slot, a second open slot respectively, and an is more than or equal to 2's integer, first open slot internal fixation has the positive pole pin, the positive pole pin by to P district one side sets up, second open slot internal fixation has the negative pole pin, the negative pole pin by to N district one side sets up, P district with all be connected with first gold thread between the positive pole pin, N district with all be connected with the second gold thread between the negative pole pin. The utility model discloses a patch diode is applicable to and carries out the rectification to the circuit that three parallelly connected needs selectivity switched on, occupies smallly and the cost is reduced.
Description
Technical Field
The utility model relates to a diode technical field, concretely relates to paster diode that many pins selectivity switched on.
Background
The diode is also called a crystal diode, and is called a diode for short. Among electronic components, a device having two electrodes allows current to flow only in a single direction, and many applications use the rectifying function thereof. The most common function of a diode is to allow current to pass in only one direction, referred to as forward bias, and to block in the reverse direction, referred to as reverse bias. Thus, the diode can be thought of as an electronic version of the check valve. A part of the semiconductor silicon or germanium is doped with a trace of trivalent element boron to form a P type semiconductor, and the other part of the semiconductor silicon or germanium is doped with a trace of pentavalent element phosphorus to form an N type semiconductor. A PN junction is formed at the junction of the P-type and N-type semiconductors. A PN junction is a diode, a lead wire of a P area is called an anode, and a lead wire of an N area is called a cathode.
The chip diodes are common electronic elements on the circuit board, along with the development of the circuit board, circuits on the circuit board are more and more complex, partial circuits such as three parallel circuits needing to be selectively conducted need to be rectified by the chip diodes, the common means is that the chip diodes are connected in series on each circuit, a plurality of chip diodes occupy more volume on the circuit board on one aspect, the miniaturization development trend of the circuit board is not facilitated, and on the other hand, the required cost of the chip diodes is higher, and the defect is larger.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a paster diode that many pins selectivity switched on is applicable to and carries out the rectification to the circuit that three parallelly connected needs selectivity switched on, occupies smallly and the cost is reduced.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a many pins selectivity paster diode that switches on, includes ceramic base, covers the insulating plastic-sealed body of ceramic base upside, ceramic base upper end middle part is equipped with a storage tank, diode chip has been placed in the storage tank, diode chip includes P district, N district, the ceramic base upper end left and right sides is equipped with a first open slot, a second open slot respectively, and an is more than or equal to 2's integer, first open slot internal fixation has the positive pole pin, the positive pole pin by to P district one side sets up, the second open slot internal fixation has the negative pole pin, the negative pole pin by to N district one side sets up, P district with all be connected with first gold thread between the positive pole pin, N district with all be connected with the second gold thread between the negative pole pin.
Specifically, a is 3, and the number of the anode pins and the number of the cathode pins are 3.
Specifically, an inclined plane notch is further formed in one corner of the upper end of the insulating plastic package body, and the inclined plane notch is arranged close to one side of the anode pin.
Specifically, both sides all are equipped with the arch around the ceramic pad seat upper end, insulating plastic-sealed body lower extreme be equipped with protruding matched with recess.
Specifically, all be equipped with spacing post in first open slot, the second open slot, be equipped with on positive pole pin, the negative pole pin and supply spacing post male spacing hole.
The utility model has the advantages that:
the utility model discloses a paster diode is equipped with three positive pole pin and three negative pole pin respectively in diode chip both sides, all is connected through the gold thread between diode chip and positive pole pin, the negative pole pin, can weld on the circuit that three parallelly connected needs selectivity switched on the circuit board, and the break-make electricity of cooperation circuit switch can carry out the rectification to three parallel circuit selectively, occupies small and the cost is reduced.
Drawings
Fig. 1 is an exploded view of the multi-pin selectively conducting patch diode of the present invention.
Fig. 2 is a schematic structural diagram of a multi-pin selectively conducting patch diode of the present invention.
Fig. 3 is a schematic diagram of the structure of the chip diode of the present invention mounted on the circuit board.
Fig. 4 is a schematic circuit diagram of the patch diode of the present invention mounted on a circuit board.
The reference signs are: the LED chip packaging structure comprises a ceramic base 1, a containing groove 11, a first open groove 12, a second open groove 13, a bulge 14, an insulating plastic packaging body 2, a slope notch 21, a groove 22, a diode chip 3, a P area 31, an N area 32, an anode pin 4, a cathode pin 5, a limiting column 6, a limiting hole 7, a circuit board 8 and a circuit 81.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in FIGS. 1-4:
a multi-pin selectively-conducted surface mount diode comprises a ceramic pad seat 1 and an insulating plastic package body 2 covering the upper side of the ceramic pad seat 1, wherein a containing groove 11 is arranged in the middle of the upper end of the ceramic pad seat 1, a diode chip 3 is placed in the containing groove 11, the diode chip 3 comprises a P area 31 and an N area 32, 3 first open grooves 12 and 3 second open grooves 13 are respectively arranged on the left side and the right side of the upper end of the ceramic pad seat 1, an anode pin 4 is fixed in the first open groove 12, the anode pin 4 is arranged close to one side of the P area 31, a cathode pin 5 is fixed in the second open groove 13, the cathode pin 5 is arranged close to one side of the N area 32, first gold wires are connected between the P area 31 and the anode pin 4, second gold wires are connected between the N area 32 and the cathode pin 5, during installation, the three anode pins 4 and the three cathode pins 5 are respectively welded on three circuits 81 of a circuit board 8, when the circuit board 8 works, one of the switches is controlled to be closed and the other two switches are controlled to be opened by the control system, so that one of the lines 81 is connected, the other two lines 81 are disconnected, and the connected line 81 only allows current to pass in a single direction when the current passes through the PN junction of the diode chip 3, so that the line 81 can be rectified.
Preferably, in order to facilitate the user to identify the cathode and the anode of the patch diode, an inclined notch 21 is further formed in one corner of the upper end of the insulating plastic package body 2, and the inclined notch 21 is arranged close to one side of the anode pin 4.
Preferably, in order to improve the matching degree of the ceramic pad holder 1 and the insulating plastic package body 2 and further improve the structural stability of the surface mount diode, the front side and the rear side of the upper end of the ceramic pad holder 1 are provided with the protrusions 14, and the lower end of the insulating plastic package body 2 is provided with the grooves 22 matched with the protrusions 14.
Preferably, in order to prevent the anode pin 4 and the cathode pin 5 from falling off, the first opening groove 12 and the second opening groove 13 are both provided with the limiting columns 6, and the anode pin 4 and the cathode pin 5 are provided with the limiting holes 7 for the limiting columns 6 to be inserted into.
The above examples only represent 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The multi-pin selectively-conducted patch diode is characterized by comprising a ceramic pad seat (1) and an insulating plastic package body (2) covering the upper side of the ceramic pad seat (1), wherein a containing groove (11) is formed in the middle of the upper end of the ceramic pad seat (1), a diode chip (3) is placed in the containing groove (11), the diode chip (3) comprises a P area (31) and an N area (32), a first open groove (12) and a second open groove (13) are respectively formed in the left side and the right side of the upper end of the ceramic pad seat (1), a is an integer larger than or equal to 2, an anode pin (4) is fixed in the first open groove (12), the anode pin (4) is arranged towards one side of the P area (31), a cathode pin (5) is fixed in the second open groove (13), the cathode pin (5) is arranged towards one side of the N area (32), first gold threads are connected between the P area (31) and the anode pin (4), and second gold threads are connected between the N area (32) and the cathode pin (5).
2. The multi-pin selectively-conducting patch diode according to claim 1, wherein a is 3, and the number of the anode pins (4) and the number of the cathode pins (5) are 3.
3. The multi-pin selective-on patch diode according to claim 1, wherein a bevel notch (21) is further formed at one corner of the upper end of the insulating plastic package body (2), and the bevel notch (21) is disposed close to one side of the anode pin (4).
4. The multi-pin selective-conduction patch diode according to claim 1, wherein protrusions (14) are arranged on the front side and the rear side of the upper end of the ceramic pad seat (1), and grooves (22) matched with the protrusions (14) are arranged at the lower end of the insulating plastic package body (2).
5. The multi-pin selectively-conducting patch diode according to claim 1, wherein the first opening groove (12) and the second opening groove (13) are respectively provided with a limiting post (6), and the anode pin (4) and the cathode pin (5) are respectively provided with a limiting hole (7) for the limiting post (6) to be inserted into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021336606.XU CN212322978U (en) | 2020-07-09 | 2020-07-09 | Paster diode that many pins selectivity switched on |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021336606.XU CN212322978U (en) | 2020-07-09 | 2020-07-09 | Paster diode that many pins selectivity switched on |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212322978U true CN212322978U (en) | 2021-01-08 |
Family
ID=74027035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021336606.XU Active CN212322978U (en) | 2020-07-09 | 2020-07-09 | Paster diode that many pins selectivity switched on |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212322978U (en) |
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2020
- 2020-07-09 CN CN202021336606.XU patent/CN212322978U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231030 Address after: 523430 Building 1 and 2, No. 70, Liaobu Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee after: Xianzhike semiconductor technology (Dongguan) Co.,Ltd. Address before: 523430 Room 102, building 1, 76 Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee before: Mutual Creation (Dongguan) Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |