CN212485341U - Welding-free surface-mounted diode structure - Google Patents
Welding-free surface-mounted diode structure Download PDFInfo
- Publication number
- CN212485341U CN212485341U CN202020934581.7U CN202020934581U CN212485341U CN 212485341 U CN212485341 U CN 212485341U CN 202020934581 U CN202020934581 U CN 202020934581U CN 212485341 U CN212485341 U CN 212485341U
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- CN
- China
- Prior art keywords
- pole portion
- mounting hole
- diode structure
- screw
- packaging body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009434 installation Methods 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 3
- 238000005452 bending Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 5
- 238000003754 machining Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
Images
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides an exempt from welded paster diode structure, including chip, insulating packaging body, lead wire, terminal, the terminal includes kink, installation department, extension, be equipped with the contact site of undercut on the installation department, be equipped with the mounting hole that link up from top to bottom on the insulating packaging body, be equipped with the screw on the mounting hole, the screw includes head, first pole portion, second pole portion, screw thread portion, second pole portion outside still the cover is equipped with the lantern ring, lantern ring one end is connected with branch one end is connected with the depression bar, the depression bar is located directly over the contact site, still be equipped with the confession on the insulating packaging body the bar groove of branch activity from top to bottom, the bar groove with the mounting hole through connection. The utility model discloses a paster diode structure designs into the terminal and is connected with the mode that the conducting wire pushed down conflict to use the fix with screw paster diode, replaced traditional welding mode, install more easily, machining efficiency is high.
Description
Technical Field
The utility model relates to a diode technical field, concretely relates to exempt from welded paster diode structure.
Background
The diode is also called a crystal diode, and is called a diode for short. Among electronic components, a device having two electrodes allows current to flow only in a single direction, and many applications use the rectifying function thereof. The most common function of a diode is to allow current to pass in only one direction, known as forward bias, and to block in the reverse direction, known as reverse bias. Thus, the diode can be thought of as an electronic version of the check valve. A part of the semiconductor silicon or germanium is doped with a trace of trivalent element boron to form a P type semiconductor, and the other part of the semiconductor silicon or germanium is doped with a trace of pentavalent element phosphorus to form an N type semiconductor. A PN junction is formed at the junction of the P-type and N-type semiconductors. A PN junction is a diode, a lead wire of a P area is called an anode, and a lead wire of an N area is called a cathode.
The chip diode is composed of a chip, an insulating package and pins connected to two ends of the chip, and the pins are usually fixed on a circuit board in a welding manner, but the welding process is complex and the processing efficiency is extremely low.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a exempt from welded paster diode structure designs into the terminal and is connected with the mode that the conducting wire pushed down the conflict to use the fix with screw paster diode, replaced traditional welding mode, install more easily, machining efficiency is high.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a exempt from welded paster diode structure, is including chip, cladding the insulating packaging body of chip, connection are in the lead wire at chip both ends, connection are in the terminal of lead wire one end, the terminal include with kink, connection that lead wire one end is connected the installation department of kink lower extreme, connection are in the extension of installation department one end, be equipped with the contact site of undercut on the installation department, be equipped with four mounting holes that link up from top to bottom on the insulating packaging body, be equipped with the screw on the mounting hole, the screw includes the head, connects in first pole portion of head lower extreme, connect in second pole portion of first pole portion lower extreme, connect in screw thread portion of second pole portion lower extreme, the external diameter of first pole portion is greater than the external diameter of second pole portion, second pole portion outside still overlaps and is equipped with the lantern ring, lantern ring one end is, One end of the supporting rod is connected with a pressing rod, the pressing rod is located right above the contact portion, a strip-shaped groove for the supporting rod to move up and down is further formed in the insulating packaging body, and the strip-shaped groove is in through connection with the mounting hole.
Specifically, the inner side of the upper end of the mounting hole is further provided with a sealing ring.
Specifically, avoidance grooves for accommodating the extension parts are formed in two sides of the lower end of the insulating packaging body.
Specifically, the mounting hole comprises an upper hole matched with the first rod part and a lower hole matched with the second rod part, and the aperture of the upper hole is larger than that of the lower hole.
Specifically, the outer side surface of the bending part is coated with a waterproof coating.
The utility model has the advantages that:
the utility model discloses a paster diode is equipped with undercut's contact site on the installation department, increases the depression bar that is used for compressing tightly the contact site at the contact site upside, can prevent that the contact site is not hard up to utilize the screw to fix the paster diode on the circuit board, the structure is firm, and paster diode has reliable electric contact with the conducting wire, has replaced traditional welding mode, installs more easily, and machining efficiency is high.
Drawings
Fig. 1 is a schematic structural diagram of a welding-free patch diode structure of the present invention.
Fig. 2 is a schematic structural view of the middle screw, the sleeve ring, the supporting rod and the pressing rod of the present invention.
Fig. 3 is a schematic structural diagram of the patch diode of the present invention applied to the circuit board.
The reference signs are: the structure of the lead-in wire comprises an insulating packaging body 1, a mounting hole 11, a strip-shaped groove 12, a lead 2, a terminal 3, a bent part 31, a mounting part 32, an extending part 33, a contact part 34, a screw 4, a head part 41, a first rod part 42, a second rod part 43, a threaded part 44, a collar 5, a support rod 6, a pressure rod 7, a sealing ring 8, a circuit board 9 and a conductive circuit 91.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in FIGS. 1 to 3:
a welding-free patch diode structure comprises a chip, an insulating packaging body 1 covering the chip, leads 2 connected at two ends of the chip, and a terminal 3 connected at one end of each lead 2, wherein each terminal 3 comprises a bending part 31 connected with one end of each lead 2, an installation part 32 connected at the lower end of the bending part 31, and an extension part 33 connected at one end of the installation part 32, a contact part 34 recessed downwards is arranged on the installation part 32, four installation holes 11 penetrating up and down are formed in the insulating packaging body 1, screws 4 are arranged on the installation holes 11, each screw 4 comprises a head part 41, a first rod part 42 connected to the lower end of the head part 41, a second rod part 43 connected to the lower end of the first rod part 42, and a thread part 44 connected to the lower end of the second rod part 43, the outer diameter of the first rod part 42 is larger than that of the second rod part 43, 6 one end of branch is connected with depression bar 7, depression bar 7 is located directly over contact site 34, still be equipped with the strip groove 12 that supplies the activity from top to bottom of branch 6 on the insulating packaging body 1, strip groove 12 and mounting hole 11 through connection, during the installation use, place the paster diode on circuit board 9 earlier, make the contact site 34 at paster diode both ends and the conductive region contact on the conducting wire 91, then utilize four screws 4 to pass mounting hole 11 and fix the paster diode on circuit board 9, in the installation of screw 4, because the external diameter of the first pole portion 42 of screw 4 is greater than the external diameter of second pole portion 43, make lantern ring 5 remove downwards, consequently depression bar 7 can compress tightly contact site 34, in order to prevent that contact site 34 is not hard up, the electric contact reliability of contact site 34 with conducting wire 91 has been guaranteed.
Preferably, in order to prevent water from seeping into the gap between the screw 4 and the mounting hole 11 and causing water to accumulate in the mounting hole 11, a sealing ring 8 is further arranged on the inner side of the upper end of the mounting hole 11.
Preferably, in order to enable the extension portion 33 to be pressed by the insulating package 1 after the installation is completed, so as to prevent the contact portion 34 from deviating, both sides of the lower end of the insulating package 1 are provided with an avoiding groove for accommodating the extension portion 33.
Preferably, the mounting hole 11 includes an upper hole matched with the first rod portion 42 and a lower hole matched with the second rod portion 43, and the diameter of the upper hole is larger than that of the lower hole.
Preferably, in order to improve the waterproof capability of the terminal 3, the outer side surface of the bent portion 31 is further coated with a waterproof coating.
The above examples only represent 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The utility model provides a exempt from welded paster diode structure, its characterized in that is including the chip, the cladding insulating packaging body (1), the connection of chip are in lead wire (2) at chip both ends, connect terminal (3) of lead wire (2) one end, terminal (3) include with kink (31), the connection that lead wire (2) one end is connected install department (32), the connection of kink (31) lower extreme are in the extension (33) of installation department (32) one end, be equipped with contact site (34) of undercut on installation department (32), be equipped with four mounting hole (11) that link up from top to bottom on insulating packaging body (1), be equipped with screw (4) on mounting hole (11), screw (4) include head (41), connect first pole portion (42), the connection of head (41) lower extreme second pole portion (43) of first pole portion (42) lower extreme, Connect in screw thread portion (44) of second pole portion (43) lower extreme, the external diameter of first pole portion (42) is greater than the external diameter of second pole portion (43), second pole portion (43) outside is still overlapped and is equipped with lantern ring (5), lantern ring (5) one end is connected with branch (6) one end is connected with depression bar (7), depression bar (7) are located directly over contact portion (34), still be equipped with the confession on insulating packaging body (1) strip groove (12) of activity about branch (6), strip groove (12) with mounting hole (11) through connection.
2. A solder-free patch diode structure as claimed in claim 1, wherein the mounting hole (11) is further provided with a sealing ring (8) at the inner side of the upper end thereof.
3. The bonding-free patch diode structure as claimed in claim 1, wherein the insulating package (1) has an avoiding groove at both sides of the lower end for accommodating the extending portion (33).
4. A solder-free patch diode structure as claimed in claim 1, wherein the mounting hole (11) comprises an upper hole matching the first stem portion (42) and a lower hole matching the second stem portion (43), the upper hole having a larger diameter than the lower hole.
5. The soldering-free patch diode structure as claimed in claim 1, wherein the outer side of the bending part (31) is further coated with a waterproof coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020934581.7U CN212485341U (en) | 2020-05-28 | 2020-05-28 | Welding-free surface-mounted diode structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020934581.7U CN212485341U (en) | 2020-05-28 | 2020-05-28 | Welding-free surface-mounted diode structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212485341U true CN212485341U (en) | 2021-02-05 |
Family
ID=74412104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020934581.7U Expired - Fee Related CN212485341U (en) | 2020-05-28 | 2020-05-28 | Welding-free surface-mounted diode structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212485341U (en) |
-
2020
- 2020-05-28 CN CN202020934581.7U patent/CN212485341U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 517300 No. 10-4, Shenzhen Bao'an (Longchuan) industrial transfer industrial park, Dengyun Town, Longchuan County, Heyuan City, Guangdong Province Patentee after: HEYUAN CHUANGJI ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: No. 10-4, Shenzhen Nanshan (Longchuan) industrial transfer park, Heyuan City, Guangdong Province, 517300 Patentee before: HEYUAN CHUANGJI ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210205 |