CN215487410U - Ultra-high temperature resistant LED chip carrier plate - Google Patents
Ultra-high temperature resistant LED chip carrier plate Download PDFInfo
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- CN215487410U CN215487410U CN202121234295.0U CN202121234295U CN215487410U CN 215487410 U CN215487410 U CN 215487410U CN 202121234295 U CN202121234295 U CN 202121234295U CN 215487410 U CN215487410 U CN 215487410U
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Abstract
The utility model discloses an ultra-high temperature resistant LED chip carrier plate, which relates to the technical field of chip carrier plates, and comprises a carrier plate body, wherein connecting blocks are arranged on two sides of the carrier plate body, and the upper end surface of each connecting block is provided with a connecting hole; a fixing component is arranged on the connecting block; the fixing assembly comprises a first connecting plate correspondingly and fixedly connected to the upper end surface, the lower end surface and the connecting hole of the connecting block, a compression spring is fixedly connected to the upper end surface of the first connecting plate, and a second connecting plate is fixedly connected to the other end of the compression spring; a fixed bolt is fixedly screwed in the connecting hole, and the bottom of the fixed bolt is abutted against a second connecting plate; a nut is screwed on the outer wall of the fixing bolt; the utility model can effectively reduce the influence of external vibration on the carrier plate body, indirectly protect the safety of the LED chip on the carrier plate body and avoid the damage of the carrier plate body and the LED chip caused by vibration.
Description
Technical Field
The utility model relates to the technical field of chip carrier plates, in particular to an ultra-high temperature resistant LED chip carrier plate.
Background
The LED chip is also called an LED light-emitting chip and is a core component of the LED lamp, namely a P-N junction. The main functions are as follows: the electric energy is converted into light energy, and the main material of the chip is monocrystalline silicon. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When current acts on the wafer through a lead, electrons are pushed to a P area, the electrons are compounded with holes in the P area, and then energy is emitted in the form of photons, which is the principle of LED light emission, the wavelength of light, namely the color of light, is determined by a material forming a P-N junction, the light is mainly applied to high-power LED chips, automatic driving and charging piles, and the high-power LED chips, automatic driving and charging piles become development trends nowadays, which means that the integrated circuit carrier plate has a good application prospect.
The LED chip is mainly installed on the carrier plate when being installed, the existing ultra-high temperature resistant LED chip carrier plate is mainly applied to automatic driving and charging pile use, but the existing ultra-high temperature resistant LED chip carrier plate is easily affected by external vibration when being used, and the LED chip carrier plate can be damaged when being serious, so that the overall working efficiency is affected;
for this purpose, we propose an ultra-high temperature resistant LED chip carrier.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an ultrahigh temperature resistant LED chip carrier plate, which aims to solve the problem that the conventional ultrahigh temperature resistant LED chip carrier plate in the background art is easily influenced by external vibration when in use, and the LED chip carrier plate can be damaged seriously, so that the whole working efficiency is influenced.
In order to achieve the purpose, the utility model provides the following technical scheme:
resistant ultra-high temperature LED chip support plate includes:
the carrier plate assembly comprises a carrier plate body, connecting blocks are arranged on two sides of the carrier plate body, and connecting holes are formed in the upper end surface of each connecting block;
and a fixing component is arranged on the connecting block.
As a further scheme of the utility model, the fixing assembly comprises a first connecting plate correspondingly and fixedly connected to the upper end surface, the lower end surface and the connecting hole of the connecting block, a compression spring is fixedly connected to the upper end surface of the first connecting plate, and a second connecting plate is fixedly connected to the other end of the compression spring;
a fixed bolt is fixedly screwed in the connecting hole, and the bottom of the fixed bolt is abutted against a second connecting plate;
and a nut is screwed on the outer wall of the fixing bolt.
As a further scheme of the utility model, the solar cell module further comprises a heat dissipation assembly, wherein the heat dissipation assembly comprises threaded holes symmetrically formed in two ends of the carrier plate body, and the carrier plate body is connected with a third connecting plate through the threaded holes in a matching manner with the threaded rods;
a limit ring which is in contact with the third connecting plate is screwed on the threaded rod;
and the heat-conducting plate is fixedly connected to the bottom of the third connecting plate and is contacted with the bottom of the carrier plate body.
As a further scheme of the utility model, the device also comprises a cleaning assembly, wherein the cleaning assembly comprises a first adjusting column fixedly connected to the surface of the upper end of the carrier plate body, and a second adjusting column is movably sleeved in the first adjusting column;
the outer walls of the first adjusting column and the second adjusting column are correspondingly provided with a first clamping hole and a second clamping hole;
the first adjusting column and the second adjusting column are clamped and fixed through the first clamping hole and the second clamping hole in a matched mode.
As a further scheme of the utility model, a cleaning strip is fixedly connected to the surface of the upper end of the second adjusting column, a sliding groove is formed in one side of the cleaning strip, a sliding block is installed in the sliding groove, and a cleaning rod is fixedly connected to one end, far away from the sliding groove, of the sliding block;
and a cleaning brush is arranged on the outer wall of the cleaning rod.
As a further scheme of the utility model, a push handle is fixedly connected to the cleaning rod.
Compared with the prior art, the utility model has the beneficial effects that:
according to the LED chip carrier plate, the compression spring is fixedly connected between the first connecting plate and the second connecting plate, when the carrier plate body is connected with the outside through the fixing bolt, if the outside vibrates, the compression spring can buffer and weaken the vibration, so that the influence of the vibration on the carrier plate body is reduced, the safety of the LED chip on the carrier plate body is indirectly protected, the damage of the carrier plate body and the LED chip caused by the vibration is avoided, the integral working efficiency is not influenced, and the cost input is reduced.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of a fixing assembly according to the present invention;
FIG. 3 is a schematic view of a cleaning assembly according to the present invention;
FIG. 4 is an enlarged view of the structure at A in FIG. 3 according to the present invention.
In the figure: 100. a carrier plate assembly; 101. a carrier plate body; 102. connecting blocks; 200. a fixing assembly; 201. a first connecting plate; 202. a compression spring; 203. a second connecting plate; 204. fixing the bolt; 205. a nut; 300. a heat dissipating component; 301. a threaded rod; 302. a third connecting plate; 303. a heat conducting plate; 304. a limiting ring; 400. cleaning the assembly; 401. a first conditioning column; 402. a first card hole; 403. a second conditioning column; 404. a second card hole; 405. clamping the column; 406. cleaning the strips; 407. a chute; 408. a slider; 409. cleaning the rod; 410. cleaning a brush; 411. and (6) pushing the handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
referring to fig. 1 and 2, the present invention provides a technical solution: the ultra-high temperature resistant LED chip carrier plate and the carrier plate assembly 100 comprise a carrier plate body 101, wherein connecting blocks 102 are arranged on two sides of the carrier plate body 101, and the upper end surface of each connecting block 102 is provided with a connecting hole;
a fixing assembly 200 is arranged on the connecting block 102, the fixing assembly 200 comprises a first connecting plate 201 which is correspondingly and fixedly connected with the upper end surface and the lower end surface of the connecting block 102 and the connecting hole, a compression spring 202 is fixedly connected with the upper end surface of the first connecting plate 201, and the other end of the compression spring 202 is fixedly connected with a second connecting plate 203;
a fixing bolt 204 is screwed and fixed in the connecting hole, and the bottom of the fixing bolt 204 is abutted against a second connecting plate 203;
a nut 205 is screwed on the outer wall of the fixing bolt 204.
Specifically, when using, at first the user makes support plate body 101 be connected with the external world through fixing bolt 204 cooperation connecting hole, user rotates nut 205 afterwards and makes it fixed, second connecting plate 203 this moment respectively with fixing bolt 204, the external world is contradicted, when the external world receives vibrations, through fixedly connected with compression spring 202 between first connecting plate 201 and second connecting plate 203, compression spring 202 can cushion and weaken vibrations, thereby reduce the influence of vibrations to support plate body 101, the safety of LED chip on the indirect protection support plate body 101, avoid vibrations to cause the damage to support plate body 101 and LED chip, guarantee that holistic work efficiency is not influenced, reduce the input of cost.
Example 2:
referring to fig. 1, the present invention provides a technical solution: the ultrahigh-temperature-resistant LED chip carrier plate further comprises a heat dissipation assembly 300, wherein the heat dissipation assembly 300 comprises threaded holes symmetrically formed in two ends of the carrier plate body 101, and the carrier plate body 101 is connected with a third connecting plate 302 through the threaded holes in cooperation with a threaded rod 301;
a limit ring 304 which is in contact with the third connecting plate 302 is screwed on the threaded rod 301;
a heat conducting plate 303 contacting with the bottom of the carrier body 101 is fixedly connected to the bottom of the third connecting plate 302.
Specifically, firstly, the user passes through third connecting plate 302 cooperation threaded rod 301 with heat-conducting plate 303, the screw hole is connected with support plate body 101, rotate spacing ring 304 again afterwards and carry out further fixed to heat-conducting plate 303, wherein the heat that the LED chip of installation on support plate body 101 sent at the during operation can be through timely the distributing away of heat-conducting plate 303, and the heat on support plate body 101 can be conducted to heat-conducting plate 303 the very first time, reduce the time of heat on support plate body 101, thereby ensure that support plate body 101 and LED chip can not receive too high thermal influence, improve support plate body 101's life and LED chip's work efficiency.
Example 3:
referring to fig. 1, 3 and 4, the present invention provides a technical solution: the ultrahigh-temperature-resistant LED chip carrier plate further comprises a cleaning assembly 400, wherein the cleaning assembly 400 comprises a first adjusting column 401 fixedly connected to the upper end surface of the carrier plate body 101, and a second adjusting column 403 is movably sleeved in the first adjusting column 401;
the outer walls of the first adjusting column 401 and the second adjusting column 403 are correspondingly provided with a first clamping hole 402 and a second clamping hole 404;
the first adjusting column 401 and the second adjusting column 403 are clamped and fixed through a first clamping hole 402 and a second clamping hole 404 which are matched with a clamping column 405;
a cleaning strip 406 is fixedly connected to the surface of the upper end of the second adjusting column 403, a sliding groove 407 is formed in one side of the cleaning strip 406, a sliding block 408 is installed in the sliding groove 407, and a cleaning rod 409 is fixedly connected to one end, far away from the sliding groove 407, of the sliding block 408;
a cleaning brush 410 is arranged on the outer wall of the cleaning rod 409, and a push handle 411 is fixedly connected on the cleaning rod 409.
Specifically, when regularly cleaning dust on the surface of the carrier plate body 101, firstly, a user enables the cleaning rod 409 to move back and forth on the cleaning strip 406 by matching the push handle 411 with the sliding block 408 and the sliding groove 407, wherein when the cleaning rod 409 moves, the cleaning brush 410 arranged on the outer wall of the cleaning rod 409 can clean the dust on the carrier plate body 101 and the LED chip, and the dust is prevented from excessively influencing the working efficiency of the LED chip.
The working principle is as follows: for the present invention, when in use, firstly, a user connects the carrier plate body 101 with the outside through the fixing bolt 204 and the connecting hole, then the user rotates the nut 205 to make the nut 205 contact with the outside to complete the fixation, at this time, the second connecting plate 203 contacts with the fixing bolt 204 and the outside respectively, when the outside is vibrated, the compression spring 202 is fixedly connected between the first connecting plate 201 and the second connecting plate 203, the compression spring 202 will buffer and weaken the vibration, thereby reducing the influence of the vibration on the carrier plate body 101, wherein the user connects the heat conducting plate 303 with the carrier plate body 101 through the third connecting plate 302 and the threaded rod 301, the threaded hole, and then rotates the limiting ring 304 to further fix the heat conducting plate 303, wherein the heat generated by the LED chip installed on the carrier plate body 101 during working can be timely dissipated through the heat conducting plate 303, and heat on the support plate body 101 can be conducted to the heat conducting plate 303 at the first time, the time of the heat on the support plate body 101 is reduced, thereby ensuring that the support plate body 101 and the LED chip cannot be influenced by too high heat, and finally, when dust on the surface of the support plate body 101 is cleaned regularly, a user enables the cleaning rod 409 to move back and forth on the cleaning strip 406 through the push-pull handle 411 matched with the sliding block 408 and the sliding groove 407, wherein when the cleaning rod 409 moves, the cleaning brush 410 arranged on the outer wall of the cleaning rod 409 can clean the dust on the support plate body 101 and the LED chip, and the influence of the excessive dust on the working efficiency of the LED chip is prevented.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. Resistant ultra-high temperature LED chip carrier plate, its characterized in that includes:
the carrier plate assembly (100) comprises a carrier plate body (101), wherein connecting blocks (102) are arranged on two sides of the carrier plate body (101), and connecting holes are formed in the upper end surface of each connecting block (102);
the connecting block (102) is provided with a fixing component (200).
2. The ultra-high temperature resistant LED chip carrier plate according to claim 1, wherein the fixing assembly (200) comprises a first connecting plate (201) fixedly connected to the upper and lower end surfaces of the connecting block (102) at the connecting hole, a compression spring (202) is fixedly connected to the upper end surface of the first connecting plate (201), and a second connecting plate (203) is fixedly connected to the other end of the compression spring (202);
a fixing bolt (204) is fixedly screwed in the connecting hole, and the bottom of the fixing bolt (204) is abutted against a second connecting plate (203);
and a nut (205) is screwed on the outer wall of the fixing bolt (204).
3. The ultra-high temperature resistant LED chip carrier plate according to claim 1, further comprising a heat dissipation assembly (300), wherein the heat dissipation assembly (300) comprises threaded holes symmetrically formed at two ends of the carrier plate body (101), and the carrier plate body (101) is connected with a third connecting plate (302) through the threaded holes in cooperation with the threaded rod (301);
a limit ring (304) which is abutted against the third connecting plate (302) is screwed on the threaded rod (301);
and a heat-conducting plate (303) which is in contact with the bottom of the carrier plate body (101) is fixedly connected to the bottom of the third connecting plate (302).
4. The ultra-high temperature resistant LED chip carrier plate according to claim 1, further comprising a cleaning assembly (400), wherein the cleaning assembly (400) comprises a first adjusting column (401) fixedly connected to the upper end surface of the carrier plate body (101), and a second adjusting column (403) is movably sleeved inside the first adjusting column (401);
the outer walls of the first adjusting column (401) and the second adjusting column (403) are correspondingly provided with a first clamping hole (402) and a second clamping hole (404);
the first adjusting column (401) and the second adjusting column (403) are clamped and fixed through a first clamping hole (402) and a second clamping hole (404) in a matching mode with a clamping column (405).
5. The ultra-high temperature resistant LED chip carrier plate according to claim 4, wherein a cleaning strip (406) is fixedly connected to the surface of the upper end of the second adjusting column (403), a sliding groove (407) is formed in one side of the cleaning strip (406), a sliding block (408) is installed in the sliding groove (407), and a cleaning rod (409) is fixedly connected to one end, away from the sliding groove (407), of the sliding block (408);
and a cleaning brush (410) is arranged on the outer wall of the cleaning rod (409).
6. The ultra-high temperature resistant LED chip carrier plate according to claim 5, characterized in that a push handle (411) is fixedly connected to the cleaning rod (409).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121234295.0U CN215487410U (en) | 2021-06-03 | 2021-06-03 | Ultra-high temperature resistant LED chip carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121234295.0U CN215487410U (en) | 2021-06-03 | 2021-06-03 | Ultra-high temperature resistant LED chip carrier plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215487410U true CN215487410U (en) | 2022-01-11 |
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ID=79782513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121234295.0U Active CN215487410U (en) | 2021-06-03 | 2021-06-03 | Ultra-high temperature resistant LED chip carrier plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215487410U (en) |
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2021
- 2021-06-03 CN CN202121234295.0U patent/CN215487410U/en active Active
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