CN215404485U

CN215404485U - Magnetron sputtering cavity with good metal oxide film uniformity

Info

Publication number: CN215404485U
Application number: CN202121323236.0U
Authority: CN
Inventors: 陆桥宏; 曹俊
Original assignee: Jiangsu Zishuo Technology Co ltd
Current assignee: Jiangsu Zishuo Technology Co ltd
Priority date: 2021-06-15
Filing date: 2021-06-15
Publication date: 2022-01-04
Anticipated expiration: 2031-06-15

Abstract

The utility model discloses a magnetron sputtering cavity with a metal oxide film with better uniformity, which relates to the technical field of magnetron sputtering and comprises a cavity body, wherein a rotating shaft is installed on the inner wall of the cavity body, a heater is arranged at the top end of the rotating shaft, a substrate is placed on the surface of the heater, and a first positioning mechanism for preliminarily positioning the substrate is arranged on the surface of the heater. According to the utility model, through the mutual matching of the structures, the self-centering clamping is carried out on the base materials of different models, so that the base materials are positioned at the center of the heater, the base materials can be stably limited to prevent the base materials from loosening when the rotating shaft rotates to drive the heater to rotate, the base materials are ensured to be over against particles falling from the upper side of the base materials and fully received, the effect of coating efficiency is ensured, and the problems that the traditional magnetron sputtering equipment cannot be well suitable for fixing the base materials to be coated of different sizes, and the base materials to be coated need to be manually aligned, so that the operation process is troublesome in the actual operation process are solved.

Description

Magnetron sputtering cavity with good metal oxide film uniformity

Technical Field

The utility model relates to the technical field of magnetron sputtering, in particular to a magnetron sputtering cavity with a metal oxide film with better uniformity.

Background

Magnetron sputtering refers to a process of bombarding the surface of a target material by ionized gas particles, so that the target material is sputtered and deposited on the surface of a substrate in the form of atoms or molecules to form a coating.

The magnetron sputtering cavity for improving the uniformity of the metal oxide film is disclosed in Chinese patent CN202020319044.1, the device divides the gas device through adopting the sieve shape, make the more even distribution of gas above the substrate plane, the gas distribution uniformity is improved, the uniformity of the film is effectively improved, in addition, the sputtered particles pass through the filtration of the inner circle surface of the sieve shape gas device, the round hole can make the particles with more uniform directions deposit on the substrate rotating at a certain rotating speed, the uniformity of the metal oxide film is further improved, the heater is arranged on and the uniform rotation is driven by the rotating shaft, in the film deposition process, the particles deposited at different moments fall on different areas of the substrate, and the uniformity of the metal oxide film is improved.

Before the device uses, the substrate passes through the base clamping ring and installs on the heater and place in the space that the backplate encloses, in the in-service use process, treat that the size and dimension of coating film substrate differs, the different size of adaptation that above-mentioned mode can't be fine treats that the coating film substrate is fixed, and treat that the coating film substrate needs the manual work to align, thereby divide gas device under with its setting at the screen shape, and then can fully receive the particle that falls through the screen shape and divide gas device, it is comparatively troublesome in the actual operation process.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a magnetron sputtering cavity with a metal oxide film with better uniformity, which is capable of carrying out self-centering clamping on substrates of different types to enable the substrates to be positioned at the center of a heater, stably limiting the substrates to prevent the substrates from loosening when a rotating shaft rotates to drive the heater to rotate, ensuring that the substrates are over against particles falling from the upper side of the substrates to be fully received, ensuring the effect of coating efficiency, and solving the problems that the traditional magnetron sputtering equipment cannot be well suitable for fixing substrates to be coated of different sizes, and the substrates to be coated need to be manually aligned, and are troublesome in the actual operation process.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a magnetron sputtering cavity that metal oxide film homogeneity is preferred, includes the cavity, the pivot is installed to the inner wall of cavity, the top of pivot is provided with the heater, the substrate has been placed on the surface of heater, the surface of heater is provided with the first positioning mechanism who is used for tentatively fixing a position the substrate.

The first positioning mechanism comprises two limiting grooves, wherein the groove walls of the limiting grooves are fixedly connected with springs, the opposite ends of the springs are fixedly connected with positioning blocks, the surfaces of the positioning blocks slide along the groove walls of the limiting grooves respectively, and the first positioning mechanism further limits the base material.

Optionally, the second positioning mechanism includes plate body one, the opening has all been seted up at the both ends of plate body one, plate body one is through two openings dead axle rotation respectively and is connected with cylinder one and cylinder two, the armshaft of cylinder one and cylinder two dead axle rotation respectively is connected with plate body two and plate body three, plate body two and plate body three the bottom surface all with the surface of heater is articulated, plate body two and plate body three the tip dead axle rotation respectively is connected with cylinder three and cylinder four, the surface dead axle rotation of cylinder three is connected with plate body four, the confession has been seted up to plate body four's tip the cylinder four passes and rotates the perforation of being connected with it dead axle.

Optionally, a sliding groove is formed in the surface of the heater, a sliding block is connected to the groove wall of the sliding groove in a sliding mode, a threaded hole is formed in the surface of the sliding block, the sliding block is connected with a threaded rod through threads of the threaded hole, and the end portion of the threaded rod is connected with the surface of the plate body IV in a fixed-axis rotating mode.

Optionally, the surface of the threaded rod is fixedly connected with a handle, and anti-skid grains are formed in the surface of the handle.

Optionally, a partition plate is fixedly connected to the inner wall of the cavity, and a through groove is formed in the surface of the partition plate in a penetrating mode.

Optionally, the inner diameter of the through groove is matched with the size of the heater.

Compared with the prior art, the utility model has the following beneficial effects:

firstly, the two positioning blocks are pulled towards two sides, so that the two positioning blocks respectively slide along the two limiting grooves in a back-to-back manner, then the base material is placed between the two positioning blocks, the two positioning blocks are loosened, the two positioning blocks are respectively abutted against two sides of the base material through the elastic restoring force of the two springs, the base material is preliminarily centered and positioned while being preliminarily limited, after the base material is further limited by the second positioning mechanism, the rotating shaft rotates to drive the heater to rotate, the base material is driven to synchronously rotate, the base material can uniformly receive particles sputtered above, and the uniformity of a metal oxide coating film is ensured.

The substrate is pushed to move towards the center of the heater by the plate body four and the plate body one and then is abutted against the upper side and the lower side of the substrate, so that the substrates of different types can be clamped in a self-centering manner through the process, the substrates are positioned at the center of the heater, the substrates can be stably limited to prevent the substrates from loosening when the rotating shaft rotates to drive the heater to rotate, the substrates are ensured to be fully received by particles falling from the substrates, and the film coating efficiency is ensured.

Drawings

FIG. 1 is a front cross-sectional view of the structure of the present invention;

FIG. 2 is a top view of a portion of the structure of FIG. 1 in accordance with the present invention;

fig. 3 is a schematic diagram of the motion state of the structure of fig. 2 according to the present invention.

In the figure: 1. a cavity; 2. a rotating shaft; 3. a heater; 4. a substrate; 5. a limiting groove; 6. a spring; 7. positioning blocks; 8. a first plate body; 9. a second plate body; 10. a third plate body; 11. a column III; 12. a first column body; 13. a second column body; 14. a cylinder IV; 15. a plate body IV; 16. a chute; 17. a slider; 18. a threaded rod; 19. a handle; 21. a partition plate; 22. and (6) penetrating through the groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, the present invention provides a technical solution: a magnetron sputtering cavity with a better metal oxide film uniformity comprises a cavity 1, wherein a rotating shaft 2 is installed on the inner wall of the cavity 1, a heater 3 is arranged at the top end of the rotating shaft 2, a substrate 4 is placed on the surface of the heater 3, the cavity 1, the rotating shaft 2 and the heater 3 respectively correspond to the cavity, the rotating shaft and the heater in a comparison case mentioned in the background of the utility model, the device only modifies the mode of fixing the substrate in the comparison case, the rest scheme is not improved, and therefore the description is omitted, and a first positioning mechanism for primarily positioning the substrate 4 is arranged on the surface of the heater 3.

The first positioning mechanism comprises two limiting grooves 5, springs 6 are fixedly connected to the groove walls of the two limiting grooves 5, positioning blocks 7 are fixedly connected to the opposite ends of the two springs 6, the surfaces of the two positioning blocks 7 respectively slide along the groove walls of the two limiting grooves 5, the first positioning mechanism further limits the position of the substrate 4, an operator firstly pulls the two positioning blocks 7 towards two sides to enable the two positioning blocks 7 to respectively slide along the two limiting grooves 5 in a back-to-back manner, then places the substrate 4 between the two positioning blocks 7, releases the two positioning blocks 7, enables the two positioning blocks 7 to respectively abut against two sides of the substrate 4 through the elastic restoring force of the two springs 6, preliminarily limits the substrate 4, simultaneously conducts preliminary centering positioning on the substrate 4, and further limits the substrate by the second positioning mechanism, the rotating shaft 2 rotates to drive the heater 3 to rotate and drive the substrate 4 to synchronously rotate, so that the substrate 4 can uniformly receive particles sputtered from the upper part, and the uniformity of the metal oxide coating film is ensured.

Further, the second positioning mechanism comprises a first plate body 8, openings are formed in two ends of the first plate body 8, the first plate body 8 is respectively connected with a first cylinder 12 and a second cylinder 13 in a fixed-axis rotation mode through the two openings, shaft arms of the first cylinder 12 and the second cylinder 13 are respectively connected with a second plate body 9 and a third plate body 10 in a fixed-axis rotation mode, bottom surfaces of the second plate body 9 and the third plate body 10 are hinged to the surface of the heater 3, end portions of the second plate body 9 and the third plate body 10 are respectively connected with a third cylinder 11 and a fourth cylinder 14 in a fixed-axis rotation mode, the surface of the third cylinder 11 is connected with a fourth plate body 15 in a fixed-axis rotation mode, a perforation for the fourth cylinder 14 to penetrate through and be connected with the fixed-axis rotation mode is formed in the end portion of the fourth plate body 15, translation is performed in the direction close to the substrate 4 while right-side movement is performed on the fourth plate body 15, and the second plate body 9 and the third plate body 10 are driven to rotate under the transmission of the third cylinder 11 and the fourth cylinder 14, thereby drive plate body 8 to the direction that is close to substrate 4 and carry out the translation under the transmission of cylinder one 12 and cylinder two 13, make plate body four 15 and plate body 8 promote the central department removal back of substrate 4 to heater 3 through the above-mentioned process, with the upper and lower side butt of substrate 4, can carry out self-centering clamp to the substrate 4 of different models through the above-mentioned process, make it be in the central department of heater 3, can carry out stable spacing to substrate 4 when pivot 2 rotates and drives heater 3 rotatory and prevent it not hard up, and guaranteed that substrate 4 is just to the particle that falls its top, fully receive, the coating efficiency has been guaranteed.

Further, spout 16 has been seted up on the surface of heater 3, the cell wall sliding connection of spout 16 has slider 17, threaded hole has been seted up on the surface of slider 17, slider 17 has threaded rod 18 through threaded hole threaded connection, the tip of threaded rod 18 with the fixed axle rotation of the surface of four 15 of plate body is connected, threaded rod 18's fixed surface is connected with handle 19, anti-skidding line has been seted up on handle 19's surface, like in the motion process of fig. 2 to 3, operating personnel rotates handle 19, and handle 19 rotates and drives threaded rod 18 and rotate, thereby threaded rod 18 rotates and moves to the direction that is close to four 15 of plate body, promotes four 15 of plate body and carries out the right side and remove.

Further, the inner wall of the cavity 1 is fixedly connected with a partition plate 21, a through groove 22 penetrates through the surface of the partition plate 21, the inner diameter of the through groove 22 is matched with the size of the heater 3, and by arranging the partition plate 21 and matching the inner diameter of the through groove 22 with the size of the heater 3, falling particles can be prevented from falling on the inner wall of the cavity 1 to cause infection of the inner wall of the cavity 1.

The working principle is as follows: when the magnetron sputtering cavity with the better metal oxide film uniformity is used, an operator firstly pulls the two positioning blocks 7 towards two sides to enable the two positioning blocks 7 to respectively slide along the two limiting grooves 5 in a back-to-back manner, then the substrate 4 is placed between the two positioning blocks 7, the two positioning blocks 7 are loosened, the two positioning blocks 7 are respectively abutted against two sides of the substrate 4 through the elastic restoring force of the two springs 6, the substrate 4 is preliminarily centered and positioned while the substrate 4 is preliminarily limited, after the substrate is further limited by the second positioning mechanism, the rotating shaft 2 rotates to drive the heater 3 to rotate, the substrate 4 is driven to synchronously rotate, the substrate 4 can uniformly receive particles sputtered above the substrate 4, and the uniformity of a metal oxide film is ensured;

as shown in the movement process of fig. 2 to 3, an operator rotates the handle 19, the handle 19 rotates to drive the threaded rod 18 to rotate, the threaded rod 18 rotates to move towards the direction close to the plate body four 15, the plate body four 15 is pushed to move towards the right side, the plate body four 15 moves towards the right side and simultaneously translates towards the direction close to the substrate 4 according to the parallelogram principle, the plate body two 9 and the plate body three 10 are driven to rotate under the transmission of the cylinder body three 11 and the cylinder body four 14, the plate body one 8 is driven to translate towards the direction close to the substrate 4 under the transmission of the cylinder body one 12 and the cylinder body two 13, the plate body four 15 and the plate body one 8 push the substrate 4 to move towards the center of the heater 3 and then abut against the upper side and the lower side of the substrate 4, and the substrates 4 of different models can be clamped in the center of the heater 3 by self-centering through the process, when the rotating shaft 2 rotates to drive the heater 3 to rotate, the substrate 4 can be stably limited to prevent the substrate from loosening, the substrate 4 is ensured to be fully received by particles falling from the upper side of the substrate 4, and the film coating efficiency is ensured.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a magnetron sputtering cavity that metal oxide film homogeneity is preferred, includes cavity (1), pivot (2) are installed to the inner wall of cavity (1), the top of pivot (2) is provided with heater (3), substrate (4), its characterized in that have been placed on the surface of heater (3): the surface of the heater (3) is provided with a first positioning mechanism for preliminarily positioning the base material (4);

first positioning mechanism includes two spacing groove (5), two equal fixedly connected with spring (6) of cell wall of spacing groove (5), two the equal fixedly connected with locating piece (7) of the looks remote site of spring (6), two the surface of locating piece (7) is respectively along two the cell wall of spacing groove (5) slides, still including carrying out further spacing second positioning mechanism to substrate (4).

2. The magnetron sputtering chamber for forming a metal oxide film with better uniformity according to claim 1, wherein: second positioning mechanism includes plate body (8), the opening has all been seted up at the both ends of plate body (8), plate body (8) through two openings dead axle rotation respectively are connected with cylinder (12) and cylinder two (13), the axle arm of cylinder (12) and cylinder two (13) dead axle rotation respectively is connected with plate body two (9) and plate body three (10), the bottom surface of plate body two (9) and plate body three (10) all with the surface of heater (3) is articulated, the tip of plate body two (9) and plate body three (10) dead axle rotation respectively is connected with cylinder three (11) and cylinder four (14), the surface dead axle rotation of cylinder three (11) is connected with plate body four (15), the confession has been seted up to the tip of plate body four (15) cylinder four (14) pass and the dead axle rotation perforation of being connected with it.

3. The magnetron sputtering chamber for forming a metal oxide film with better uniformity according to claim 2, wherein: the surface of the heater (3) is provided with a sliding groove (16), the groove wall of the sliding groove (16) is connected with a sliding block (17) in a sliding mode, the surface of the sliding block (17) is provided with a threaded hole, the sliding block (17) is connected with a threaded rod (18) through a threaded hole in a threaded mode, and the end portion of the threaded rod (18) is connected with the surface of the plate body four (15) in a fixed-axis rotating mode.

4. The magnetron sputtering chamber for forming a metal oxide film with better uniformity according to claim 3, wherein: the surface of the threaded rod (18) is fixedly connected with a handle (19), and anti-skid grains are arranged on the surface of the handle (19).

5. The magnetron sputtering chamber for forming a metal oxide film according to any one of claims 1, 2, 3 or 4, wherein the magnetron sputtering chamber comprises: the inner wall of the cavity (1) is fixedly connected with a partition plate (21), and a through groove (22) penetrates through the surface of the partition plate (21).

6. The magnetron sputtering chamber for forming a metal oxide film with better uniformity according to claim 5, wherein: the inner diameter of the through groove (22) is matched with the size of the heater (3).