CN215345235U

CN215345235U - Circuit board with heat dissipation function structure

Info

Publication number: CN215345235U
Application number: CN202121338634.XU
Authority: CN
Inventors: 夏炜; 刘根; 刘喜科; 蔡志浩
Original assignee: MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD
Current assignee: MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD
Priority date: 2021-06-16
Filing date: 2021-06-16
Publication date: 2021-12-28
Anticipated expiration: 2031-06-16

Abstract

The utility model discloses a circuit board with a heat dissipation function structure, which comprises: at least one group of copper-clad base plate and outer copper layer which are arranged in a laminated mode; the outer copper layer is arranged above one side of the copper-clad base plate; the outer copper layer is provided with a through-current copper layer region, and the through-current copper layer region is not connected with the outer copper layer; an inductance pad area is arranged above the through-current copper layer area and is connected with the through-current copper layer area; a plurality of through holes which are distributed in a rectangular shape are formed in the inductance bonding pad area, and the through holes are connected with the outer copper layer; explosion-proof grids which are distributed in a rectangular shape are arranged in the area, located on the periphery of the inductance pad area, of the through-flow copper layer area, and each explosion-proof grid is composed of a plurality of uniformly distributed through hole lattice points. The utility model can increase the through-current path of current, balance current transmission, reduce the temperature of through-current via holes, reduce the probability of plate burning and plate explosion and improve the reliability of products.

Description

Circuit board with heat dissipation function structure

Technical Field

The utility model relates to the technical field of printed circuit boards, in particular to a circuit board with a heat dissipation function structure.

Background

As electronic products gradually evolve toward high performance and high density integration, power consumption of the electronic products is larger and larger, and current on a PCB (Printed Circuit Board), which is an important medium for carrying current, is also larger and larger.

As is known, if a large current does not have a good transmission path, the current is insufficient, so that the electronic component chip and the like cannot work normally, and in severe cases, the PCB may burn. The poor heat dissipation is one of the important reasons for the layering and board explosion of the multilayer board, and under the condition that the used materials of the circuit board are not changed, the heat dissipation design is considered to be an effective method for solving the board explosion. The transmission channel of electric current on the circuit board comprises a copper layer and a via hole, wherein the copper layer is used for horizontal transmission of electric current, the via hole is used for vertical transmission of electric current, and the through-current balance of the horizontal path and the vertical path ensures the transmission requirement of large current. However, on a high-density circuit board, the space is limited, and the conventional PCB cannot meet the requirement of large current, so that some via holes have overlarge bearing current and form hot spots with local overhigh temperature.

Therefore, how to provide a PCB with a new structure to solve the above technical problems of the prior art is one of the important issues.

The above information is given as background information only to aid in understanding the present disclosure, and no determination or admission is made as to whether any of the above is available as prior art against the present disclosure.

SUMMERY OF THE UTILITY MODEL

The utility model provides a circuit board with a heat dissipation function structure, which aims to overcome the defects in the prior art.

In order to achieve the above purpose, the present invention provides the following technical solutions:

a circuit board with a heat dissipation function structure, the circuit board comprising:

at least one group of copper-clad base plate and outer copper layer which are arranged in a laminated mode;

the outer copper layer is arranged above one side of the copper-clad base plate;

the outer copper layer is provided with a through-current copper layer region, and the through-current copper layer region is not connected with the outer copper layer;

an inductance pad area is arranged above the through-current copper layer area and is connected with the through-current copper layer area;

a plurality of through holes which are distributed in a rectangular shape are formed in the inductance bonding pad area, and the through holes are connected with the outer copper layer;

explosion-proof grids which are distributed in a rectangular shape are arranged in the area, located on the periphery of the inductance pad area, of the through-flow copper layer area, and each explosion-proof grid is composed of a plurality of uniformly distributed through hole lattice points.

Furthermore, in the circuit board with the heat dissipation function structure, the via hole is filled with the hole by resin and then is electroplated and filled in the hole of the cover.

Furthermore, in the circuit board with the heat dissipation function structure, the via holes are uniformly distributed in a three-by-three or four-by-three rectangular shape.

Furthermore, in the circuit board with the heat dissipation function structure, the via hole dots are plugged and cured by active copper paste.

Furthermore, in the circuit board with the heat dissipation function structure, the rectangular sides of the explosion-proof grids are parallel to the rectangular sides of the corresponding via holes.

Furthermore, in the circuit board with the heat dissipation function structure, an included angle theta formed by the edge of the explosion-proof lattice and the board edge of the circuit board is 30-60 degrees.

According to the circuit board with the heat dissipation function structure, the through holes are uniformly distributed in the rectangular shape in the inductance bonding pad area, then the inductance bonding pad area is finally connected to the outer copper layer through the through holes, and the explosion-proof grids are distributed in the rectangular shape in the through-flow copper layer area on the periphery of the inductance bonding pad area, so that the through-flow path of current can be increased, the current transmission is balanced, the temperature of the through-flow through holes is reduced, the board burning and board explosion probability is reduced, and the product reliability is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic cross-sectional structural diagram of a circuit board having a heat dissipation structure according to an embodiment of the present invention;

fig. 2 is a schematic top view of a circuit board with a heat dissipation structure according to an embodiment of the present invention.

Reference numerals:

the copper-clad base plate 11, the outer copper layer 12, the through-current copper layer region 13, the inductance pad region 14, the via hole 15, the explosion-proof grid 16 and the via hole lattice point 17.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.

Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention, but do not indicate or imply that the referred devices or elements must have the specific orientations, be configured to operate in the specific orientations, and thus are not to be construed as limitations of the present invention.

The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.

Example one

In view of the above-mentioned drawbacks of the conventional circuit board structure, the inventor of the present invention has made extensive practical experience and professional knowledge for many years based on the design and manufacture of such products, and has actively studied and innovated in combination with the application of theory to create a circuit board with a novel structure, which can improve the conventional circuit board structure and make it more practical. After continuous research and design and repeated trial production and improvement, the utility model with practical value is finally created.

Referring to fig. 1 to 2, an embodiment of the present invention provides a circuit board with a heat dissipation structure, where the circuit board 10 includes:

at least one set of copper-clad base plate 11 and outer copper layer 12 which are arranged in a stacked mode;

the outer copper layer 12 is disposed above one side of the copper-clad base layer board 11;

the outer copper layer 12 is provided with a through-current copper layer region 13, and the through-current copper layer region 13 is not connected with the outer copper layer 12;

an inductance pad area 14 is arranged above the through-current copper layer area 13, and the inductance pad area 14 is connected with the through-current copper layer area 13;

a plurality of through holes 15 which are distributed in a rectangular shape are formed in the inductance pad area 14, and the through holes 15 are connected with the outer copper layer 12;

explosion-proof grids 16 which are distributed in a rectangular shape are arranged in the area, located on the periphery of the inductance pad area 14, of the through-current copper layer area 13, and the explosion-proof grids 16 are composed of a plurality of uniformly distributed via hole mesh points 17.

In the present embodiment, the through holes 15 are uniformly distributed in a three-by-three or four-by-three rectangular shape, and are filled with resin through the hole plugging rear cover hole by electroplating.

Preferably, the via dots 17 are cured by plugging with an active copper paste.

The rectangular sides of the explosion-proof grids 16 are parallel to the corresponding rectangular sides of the through holes 15. That is, the direction of the rectangular distribution of the explosion-proof grids 16 is consistent with the direction of the rectangular distribution of the via holes 15.

In this embodiment, an included angle θ formed between the edge of the explosion-proof grille 16 and the board edge of the circuit board 10 is 30 ° to 60 °. Illustratively, the included angle θ may be, for example, 45 °.

It should be noted that, in the present embodiment, only some structures on the circuit board 10 are innovated, that is, the contents of the discharge position of the via hole 15 and the arrangement of the explosion-proof grid 16 are innovated, so that the problem of excessive current flowing through the local via hole 15 on the circuit board 10 is solved, the current path of large current is widened or balanced, and the other structures on the circuit board 10 are not the same as the prior art, and in view of the fact that the contents are implemented in the prior art and are not the key point of the design of the present solution, deep description is not made here.

Although the terms copper-clad substrate, outer copper layer, through-flow copper layer area, etc. are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

The foregoing description of the embodiments has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same elements or features may also vary in many respects. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous details are set forth, such as examples of specific parts, devices, and methods, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In certain example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are intended to be inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless explicitly indicated as an order of performance. It should also be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on" … … "," engaged with "… …", "connected to" or "coupled to" another element or layer, it can be directly on, engaged with, connected to or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on … …," "directly engaged with … …," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship of elements should be interpreted in a similar manner (e.g., "between … …" and "directly between … …", "adjacent" and "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Unless clearly indicated by the context, use of terms such as the terms "first," "second," and other numerical values herein does not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms, such as "inner," "outer," "below," "… …," "lower," "above," "upper," and the like, may be used herein for ease of description to describe a relationship between one element or feature and one or more other elements or features as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below … …" can encompass both an orientation of facing upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted.

Claims

1. A circuit board with a heat dissipation function structure, characterized in that, the circuit board includes:

2. The circuit board with a heat dissipation function of claim 1, wherein the via hole is filled by resin via hole and then plated and filled by cover hole.

3. The circuit board with the heat dissipation function structure as claimed in claim 1, wherein the vias are uniformly distributed in a three-by-three or four-by-three rectangular shape.

4. The circuit board with a heat dissipation function as claimed in claim 1, wherein the via dots are cured by plugging with an active copper paste.

5. The circuit board with the heat dissipation function structure as claimed in claim 3, wherein the rectangular sides of the explosion-proof grids are parallel to the rectangular sides of the corresponding via holes.

6. The circuit board with the heat dissipation function structure as claimed in claim 1, wherein an included angle θ formed between the edge of the explosion-proof lattice and the board edge of the circuit board is 30 ° to 60 °.